CN114277341B - Power supply assembly, power supply control method and sputtering equipment - Google Patents
Power supply assembly, power supply control method and sputtering equipment Download PDFInfo
- Publication number
- CN114277341B CN114277341B CN202111601804.3A CN202111601804A CN114277341B CN 114277341 B CN114277341 B CN 114277341B CN 202111601804 A CN202111601804 A CN 202111601804A CN 114277341 B CN114277341 B CN 114277341B
- Authority
- CN
- China
- Prior art keywords
- power supply
- target
- power
- current
- switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The application discloses a power supply assembly, a power supply control method and sputtering equipment, wherein the power supply assembly comprises a first power supply, a second power supply, a dial switch and a current measuring piece, the first power supply and the second power supply are arranged in parallel, the first power supply is configured to be in communication connection with a control host, and the second power supply is in master-slave connection with the first power supply through the dial switch; the anodes of the first power supply and the second power supply are grounded, and the cathodes of the first power supply and the second power supply are electrically connected with a target material of a chamber installed in sputtering equipment; the current measuring piece is configured to be electrically connected with the target, and is in communication connection with the control host so as to transmit the actual current of the target to the control host. The power supply assembly can timely find the condition of power failure as a slave power supply.
Description
Technical Field
The application belongs to the technical field of semiconductor processing, and particularly relates to a power supply assembly, a power supply control method and sputtering equipment.
Background
In the sputtering process, for the semiconductor with the structure of through silicon via, copper barrier layer and the like, the required sputtering power is relatively large, the power of the current direct current sputtering power supply is relatively small, and a plurality of power supplies are required to be connected in parallel so as to provide the sputtering power for the sputtering process at the same time. When the power supplies are assembled, one of the power supplies is usually set as a main power supply, and the other power supply is set as a secondary power supply by utilizing a dial switch, so that the two power supplies form a master-slave mode. The main power supply is in communication connection with the control host, so that the control host and the main power supply can perform operations such as data exchange, logic control, alarm information output and the like, and the output voltage and the output current of the secondary power supply are consistent with those of the main power supply.
In the process of controlling sputtering power, parameters such as power and the like are generally converted into 2 n The bit computer data takes two power supplies as an example, the total power of the two power supplies is converted into corresponding computer data, and the computer is assigned to the main power supply, namely, the power represented by the computer data corresponding to the main power supply is actually the sum of the power of the main power supply and the power of the auxiliary power supply. In actual operation, the target sputtering work can be correspondingly determined according to the required thickness and other parameters of the sputtered filmThe control host can convert the target sputtering power into corresponding computer data, and transmit the corresponding computer data to the main power supply, so that the main power supply and the auxiliary power supply work together and output target power.
However, in the working process, the situation that communication between the secondary power supply and the main power supply is interrupted, or the secondary power supply circuit is disconnected or the like may occur, so that the main power supply is automatically switched from the secondary mode to the single power supply mode, the computer data is switched from the sum of the power originally corresponding to the main power supply and the power of the secondary power supply to the power corresponding to the main power supply only, further, although the main power supply can work according to the corresponding computer data and feed back the same computer data to the control host when receiving the computer data sent by the control host, the control mode of the power supply is switched due to failure of the secondary power supply, the actually output sputtering power is only half of the target power, and the value of the computer data interacted between the control host and the main power supply is not changed, so that the control host and a worker cannot find the condition that the secondary power supply fails, and the thickness of a sputtering film formed by the process cannot meet the preset thickness, and the wafer is failed or even scrapped.
Disclosure of Invention
An object of an embodiment of the present application is to provide a power supply assembly, a power supply control method, and a sputtering apparatus, which can timely find out the failure of a power supply as a slave power supply.
In a first aspect, an embodiment of the present application discloses a power supply assembly, which is applied to a sputtering apparatus, where the power supply assembly includes a first power supply, a second power supply, a dial switch, and a current measurement element, where the first power supply and the second power supply are arranged in parallel, the first power supply is configured to be in communication connection with a control host, and the second power supply is in master-slave connection with the first power supply through the dial switch; the anodes of the first power supply and the second power supply are grounded, and the cathodes of the first power supply and the second power supply are electrically connected with a target material of a chamber installed in sputtering equipment; the current measuring piece is configured to be electrically connected with the target, and is in communication connection with the control host so as to transmit the actual current of the target to the control host.
In a second aspect, an embodiment of the present application discloses a power supply assembly for use in a sputtering apparatus, the power supply assembly including a first power supply, a second power supply, a third power supply, a dial switch, a current measurement member and a voltage measurement member,
the first power supply, the second power supply and the third power supply are all arranged in parallel, the first power supply and the third power supply are both configured to be in communication connection with a control host, and the second power supply is in master-slave connection with the first power supply through the dial switch;
the anodes of the first power supply and the second power supply are grounded, and the cathodes of the first power supply and the second power supply are electrically connected with a target material of a chamber installed in sputtering equipment; the positive electrode of the third power supply is grounded through the first switch, the negative electrode of the third power supply is configured to be electrically connected with a target material arranged in a chamber of the sputtering equipment through the second switch,
the current measuring piece and the voltage measuring piece are both configured to be electrically connected with the target, and the current measuring piece and the voltage measuring piece are both in communication connection with the control host so as to respectively transmit the actual current and the actual voltage of the target to the control host, and the first switch and the second switch are used for being closed under the condition that the second difference value between the target power and the actual power of the target is larger than a second preset difference value so as to compensate the actual power of the target to the target power.
In a third aspect, an embodiment of the present application discloses a power supply control method, which is applied to the power supply assembly according to the first aspect, and includes:
acquiring the actual current of the target;
and sending out an alarm signal under the condition that the first difference value between the target current and the actual current is larger than a first preset difference value.
In a fourth aspect, an embodiment of the present application discloses a power supply control method applied to the power supply assembly according to the second aspect, where the power supply control method includes:
acquiring actual current and actual voltage of the target;
and when the second difference value between the target power and the actual power is larger than a second preset difference value, sending an alarm signal, controlling the first switch and the second switch to be closed, and controlling the third power supply to output the power with the second difference value.
In a fifth aspect, an embodiment of the present application discloses a sputtering apparatus, which includes a control host, a chamber, and the power supply assembly according to any one of the first aspect and the second aspect, wherein a first power supply of the power supply assembly is communicatively connected to the control host, the chamber is grounded, and the power supply assembly is configured to provide a power signal to a target of the chamber.
The embodiment of the application discloses a power supply assembly, wherein a first power supply is in communication connection with a control host, a second power supply is arranged in parallel with the first power supply, and a master-slave connection relationship is formed between the first power supply and the second power supply through a dial switch so as to provide energy for a sputtering process through the first power supply and the second power supply. And moreover, the actual current of the target can be measured by utilizing the current measuring piece in the power supply assembly, so that the target current obtained based on the target power of the control host is compared with the measured actual current value, and whether the second power supply serving as the slave power supply has a fault or not can be judged, so that under the condition that the second power supply fails, the control host and staff can be ensured to find the fault at the first time, corresponding measures are taken, and the yield of the wafer is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic diagram of an assembled power supply assembly according to an embodiment of the present application;
FIG. 2 is a flow chart of a power control method according to an embodiment of the present application;
FIG. 3 is a flow chart of another power control method according to an embodiment of the present application;
FIG. 4 is an equivalent circuit diagram of a power supply assembly according to an embodiment of the present application;
fig. 5 is a schematic flow chart of a power control method according to an embodiment of the present application. .
Reference numerals illustrate:
110-first power supply, 120-second power supply, 130-third power supply, 141-communication bus, 142-communication cable, 143-communication bus, 151-first conductor, 152-second conductor, 153-third conductor, 154-fourth conductor, 155-fifth conductor, 161-first switch, 162-second switch, and,
210-current measuring element, 220-voltage measuring element,
300-control host,
410-chamber, 420-target, 430-confluence box.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that some, but not all embodiments of the application are described. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The folding mechanism and the electronic device provided by the embodiment of the application are described in detail below through specific embodiments and application scenes thereof with reference to the accompanying drawings.
As shown in fig. 1, an embodiment of the present application discloses a power supply assembly that can be applied in a sputtering apparatus to provide energy for a sputtering process. The power supply assembly includes a first power supply 110, a second power supply 120, a dial switch, and a current measurement 210.
The first power source 110 and the second power source 120 are arranged in parallel to provide power to the sputtering process to meet the demand. Specifically, the models of the first power supply 110 and the second power supply 120 may be the same, so as to reduce the difficulty in adjusting the first power supply 110 and the second power supply 120 in the process. Of course, the types of the first power source 110 and the second power source 120 may be different, and by providing the voltage of at least one of the two with the capability of adjusting, the same output voltage of the first power source 110 and the second power source 120 may be achieved during the process.
During assembly of the power supply assembly, the first power supply 110 is configured to be communicatively coupled to the control host 300 to enable data interaction between the first power supply 110 and the control host 300, and the like. Specifically, the first power source 110 and the control host 300 may be connected through the communication bus 141. And, the second power supply 120 is connected with the first power supply 110 in a master-slave mode through the dial switch, so that the first power supply 110 and the second power supply 120 form a master-slave connection relationship, and further the output voltage and the output current of the second power supply 120 are correspondingly consistent with those of the first power supply 110, and bombarding energy is provided for the sputtering process together. Of course, the connection between the first power source 110 and the second power source 120 is also implemented through the communication cable 142, which is not described in detail herein for brevity.
During installation of the power supply assembly, the positive poles of both the first power supply 110 and the second power supply 120 are grounded. Specifically, the anodes of the first power source 110 and the second power source 120 may be connected to the chamber 410 of the sputtering apparatus through wires, and by grounding the chamber 410, the anodes of the first power source 110 and the second power source 120 are grounded and are at the same potential as the chamber 410; alternatively, the positive electrode of the first power source 110, the positive electrode of the second power source 120 and the chamber 410 may be respectively grounded, so that the positive electrodes of the first power source 110 and the second power source 120 are both the same as the potential of the chamber 410, and the purpose of grounding may be achieved.
And, the cathodes of the first power supply 110 and the second power supply 120 are electrically connected to the target 420 installed in the chamber 410 of the sputtering apparatus, so that sputtering power can act on the target 420, and the target 420 is bombarded to generate particles and deposit on the wafer, thereby forming a deposited film. Accordingly, the cathodes of the first power source 110 and the second power source 120 may be electrically connected to the target 420 through wires. Specifically, the cathodes of the first power source 110 and the second power source 120 may be connected in parallel by using a wire, and the other end of the wire is connected to the target 420, so as to achieve the purpose of connecting the cathodes of the first power source 110 and the second power source 120 with the target 420.
In order to achieve the purpose of acquiring the working condition of the second power supply 120, as shown in fig. 1, the power supply assembly disclosed in the embodiment of the present application further includes a current measurement member 210, where the current measurement member 210 is configured to be electrically connected to the target 420. Specifically, the current measuring element 210 may be a current sensor or the like, and the current measuring element 210 may be mounted on the target 420, so that the current measuring element 210 is electrically connected to the target 420, so as to measure the current on the target 420 through the current measuring element 210; at the same time, the current measurement member 210 is communicatively coupled to the control host 300, which enables the current measurement member 210 to transmit the actual current of the target 420 to the control host 300, enabling the control host 300 and the personnel to obtain the actual current on the target 420.
In detail, regardless of the transmission loss of the electric power, the product of the measured current of the current measuring part 210 and the voltage of the target 420 should be equal to the output power corresponding to the computer data transmitted from the control host 300 to the first power source 110 (the power is equal to the sum of the output powers of the first and second power sources 110 and 120). When the second power source 120 fails and cannot work normally, the actual current of the target 420 measured by the current measuring element 210 should be half of the target current corresponding to the output power corresponding to the computer data sent by the control host 300. Based on this, the control host 300 and the staff member can determine whether the second power source 120 has a fault according to the actual current value of the target 420 measured by the current measuring member 210. Of course, when there is a failure of the first power supply 110, the control host 300 can find out that the first power supply 110 has failed through a communication process with the first power supply 110. Wherein, based on the specific material of the target 420 and the sum of the target powers of the first power source 110 and the second power source 120, the current value on the target 420 of the determined material can be obtained. Accordingly, when the materials of the targets 420 are different, the theoretical current value, that is, the target current, of the targets 420 when the sum of the target powers is applied can be determined correspondingly.
The embodiment of the application discloses a power supply assembly, wherein a first power supply 110 is in communication connection with a control host 300, a second power supply 120 is arranged in parallel with the first power supply 110, and the first power supply 110 and the second power supply 120 form a master-slave connection relationship through a dial switch so as to provide energy for a sputtering process through the first power supply 110 and the second power supply 120 together. And, the current measuring part 210 in the power supply assembly is used to measure the actual current of the target 420, so that the target current obtained based on the target power of the control host 300 is compared with the measured actual current value, and it can be determined whether the second power supply 120 as the slave power supply has a fault or not, so that in the case that the second power supply 120 has a fault, it can be ensured that the control host 300 and the staff can find the fault at the first time, and corresponding measures are taken to improve the yield of the wafer.
In the assembly mounting process, optionally, the negative electrode of the first power source 110 may be electrically connected to the target 420 through the first conductive wire 151, and the negative electrode of the second power source 120 may be electrically connected to the target 420 through the second conductive wire 152. That is, the first power source 110 and the second power source 120 are directly connected to the target 420 through wires, respectively, in which case the burning out of the wires due to the large total current of the first power source 110 and the second power source 120 can be prevented.
More specifically, the power supply assembly disclosed in the embodiment of the present application may further include a junction box 430, where the junction box 430 is provided with two input ends and two output ends, the negative electrode of the first power supply 110 may be configured to be connected to one input end of the junction box 430 through the first conductive wire 151, the negative electrode of the second power supply 120 may be configured to be connected to the other input end of the junction box 430 through the second conductive wire 152, and the two output ends of the junction box 430 are electrically connected to the target 420 through the third conductive wire 153 and the fourth conductive wire 154, so as to provide the effect of collecting and carding the conductive wires by using the junction box 430, prevent the conductive wires from being disordered, reduce the assembly difficulty, and improve the safety.
In the case where the second power source 120 is independently connected to the target 420 through the second wire 152, the junction box 430, and the fourth wire 154, further, the current measuring part 210 may be installed on the fourth wire 154, and the current on the fourth wire 154 may be measured using the current measuring part 210 on the fourth wire 154. In this case, if the second power source 120 fails, the current on the fourth wire 154 may be measured by the current measuring part 210 to find out whether the second power source 120 fails.
In the above embodiment, the first power source 110 and the second power source 120 may be indirectly connected to the target 420 through the junction box 430, in this case, if the measured value of the current measuring element 210 connected to the fourth wire 154 is not zero in the case that the first power source 110 is operating normally, but the measured value is still less than half of the current value corresponding to the target power of the control host 300, which may also ensure that the control host 300 and the staff can find that the second power source 120 has a fault.
Further, the current measuring element 210 is mounted on the third wire 153, in which case the actual current on the third wire 153 can also be obtained. Of course, in the case where the current measuring element 210 is mounted on the third wire 153, whether or not the second power source 120 has a fault may be determined by the measured value of the current measuring element 210 on the third wire 153; in the case where the current measuring element 210 is provided on the fourth wire 154, the reliability of the failure of the second power supply 120 may be verified by the current measuring element 210 on the third wire 153.
Specifically, the current measuring elements 210 on the third wire 153 and the fourth wire 154 may be current sensors, and in another embodiment of the application, the current measuring elements 210 on the third wire 153 and the fourth wire 154 are hall current sensors, so as to reduce the difficulty of current measurement and improve the accuracy of the current measurement.
Further, the power supply assembly disclosed in the embodiment of the present application may further include a third power supply 130, where the third power supply 130 may be communicatively connected to the control host 300 through the communication bus 143, and an anode of the third power supply 130 is grounded through the first switch 161. Specifically, the positive electrode of the third power supply 130 may be connected to the chamber 410 of the sputtering apparatus, and the chamber 410 may be grounded; alternatively, the positive electrode of the third power supply 130 and the chamber 410 may be grounded, respectively, so that the potentials of the two may be the same, thereby achieving the purpose of grounding. The negative electrode of the third power supply 130 is electrically connected to the target 420 mounted in the chamber 410 of the sputtering apparatus through the second switch 162, so that the third power supply 130 can load current to the target 420 when both the first switch 161 and the second switch 162 are closed.
Based on the above technical solution, the first switch 161 and the second switch 162 of the third power supply 130 may be both closed when the first difference between the target current and the actual current of the target 420 is greater than the first preset difference, so that the third power supply 130 compensates the actual current of the target 420 to the target current. Specifically, the output voltage of the third power supply 130 may be made the same as the output voltage of the first power supply 110. And, depending on the material of the target 420 and the target power, the value of the current required to be compensated for by the third power supply 130 can be obtained. The specific value of the first preset difference may be determined according to the actual situation, which is not limited herein, specifically, the first preset difference may be 0, and considering the situation that the electric energy inevitably generates loss in the transmission process, the first preset difference may be determined to be a value greater than zero according to the actual situation of the power supply assembly.
In the case where the power supply assembly includes the third power supply 130, alternatively, the negative electrode of the third power supply 130 may be directly connected to the target 420 through a wire, and in another embodiment of the present application, both the positive and negative electrodes of the third power supply 130 may be connected to the wire of the second power supply 120. Specifically, the positive electrode of the second power source 120 may be grounded through the fifth wire 155, and the negative electrode of the second power source 120 may be electrically connected to the target 420 through the sixth wire. In this case, the positive electrode of the third power supply 130 may be connected to the fifth wire 155 through the first switch 161, and the negative electrode of the third power supply 130 may be connected to the sixth wire through the second switch 162, which may reduce the amount of wires in the power supply assembly, and may reduce the difficulty in assembling the power supply assembly, and improve the safety of the power supply assembly. More specifically, an end of the first switch 161 facing away from the third power supply 130 may be connected to the third wire through a connection terminal, and correspondingly, an end of the second switch 162 facing away from the third power supply 130 may also be connected to the fourth wire through a connection terminal. In addition, the sixth wire may include the second wire 152 and the fourth wire 154 in the above-described embodiments.
Based on the power supply assembly including the current detecting member disclosed in the above embodiment, the present application may also disclose a power supply control method that may be applied to the above power supply assembly. As shown in fig. 2, the power control method includes:
s1, acquiring the actual current of the target 420. Specifically, during the sputtering process, the actual current of the target 420 can be obtained by measurement using the current measuring member 210 in the power supply assembly.
The power supply control method further comprises the following steps:
s2, when the first difference value between the target current and the actual current is larger than a first preset difference value, an alarm is sent out.
Specifically, since the transmission structure such as the conductive wire has a resistance, a certain loss is generated during the transmission process of the electric energy, so that even if the second power supply 120 fails, the actual current of the target 420 is smaller than the target current corresponding to the target power loaded on the target 420, based on this, a preset difference is set for the loss of the current, if the first difference between the target current and the actual current of the target 420 is smaller than or equal to the first preset difference, the second power supply 120 can be considered to work normally, and if the first difference between the target current and the actual current is larger than the first preset difference, it is indicated that the second power supply 120 fails. And, in case of a failure of the second power source 120, an alarm signal is issued. The alarm signal can be an acousto-optic signal or alarm information display. In this case, the first preset difference is a positive value other than zero; of course, in other embodiments of the present application, the first preset difference may also be 0, which may improve the accuracy of loading power on the target and improve the sputtering effect.
As described above, the power supply assembly may include the third power supply 130, and the specific case of the power supply assembly of the foregoing structure has been described in detail based on the above-described embodiments, and the description will not be repeated here. In this case, the power control method disclosed in the embodiment of the present application further includes:
in a case where the first difference between the target current and the actual current is greater than a first preset difference, the first switch 161 and the second switch 162 are controlled to be closed, and the third power supply 130 is controlled to output a current with the first difference.
That is, when the first difference between the target current and the actual current determines that the second power supply 120 has a fault and cannot normally provide the output current, the third power supply 130 may be controlled to participate in the sputtering process under the condition of sending out the alarm signal, so that the actual current of the target 420 reaches the target current under the action of the complementary current of the third power supply 130. The voltage of the third power supply 130 is equal to the voltage of the first power supply 110, and based on the first difference between the target current and the actual current and the voltage of the first power supply 110, the output current of the third power supply 130 can be obtained, so that the actual current of the target 420 reaches the target current.
The embodiment of the application also discloses a power supply assembly which is applied to sputtering equipment, wherein the power supply assembly comprises a first power supply, a second power supply, a third power supply, a dial switch, a current measuring member and a voltage measuring member, wherein other parts except the voltage measuring member in the power supply assembly in the embodiment can be the same as or similar to the corresponding parts in the power supply assembly disclosed in the embodiment, and the description is not repeated here in consideration of brevity of the text.
The voltage measuring element 220 in the power supply assembly disclosed in this embodiment may be a voltage transmitter. The voltage measuring member 220 is configured to be electrically connected to the target 420, so as to measure the actual voltage of the target 420 by using the voltage measuring member 220. The voltage measuring unit 220 is also connected to the control host 300 in a communication manner, so that the voltage measuring unit 220 can transmit the measured actual voltage of the target 420 to the control host 300, and the control host 300, the staff, etc. can obtain the actual voltage of the target 420. Meanwhile, the current measuring element 210 can be used to measure the actual current on the target 420, and the actual power of the target 420 can be obtained by means of the actual current and the actual voltage of the target 420, and whether the second power supply 120 fails can be obtained by comparing the target power with the actual power.
Under the condition that the above technical solution is adopted, the actual power of the target 420 can be obtained by using the actual voltage and the actual current of the target 420 measured by the current measuring element 210 and the voltage measuring element 220, and then the third power supply 130 can be used to provide the compensation power for the target 420 under the condition that the second difference between the target power and the actual power of the target 420 is greater than the second preset difference.
Specifically, the first switch 161 and the second switch 162 of the third power supply 130 may be both closed, and the output power of the third power supply 130 is determined according to the target power and the second difference, so as to compensate the actual power of the target 420 to the target power by using the compensation power of the third power supply 130, thereby solving the problem that the thickness of the sputtered film cannot reach the preset thickness due to the failure of the second power supply 120, and ensuring the process continuity.
Under the condition of adopting the technical scheme, the working condition of the target can be accurately determined, and the target voltage and the target current corresponding to the target power of the target 420 do not need to be acquired in advance, so that the fault detection difficulty of the second power supply 120 can be reduced.
In addition, in the present embodiment, the specific connection manner between the first power source 110, the second power source 120 and the third power source 130, and the connection manner between the three and the chamber 410 and the target 420 may also be correspondingly set with reference to the above embodiment not including the voltage measuring device 220.
Based on the power supply assembly including the current measuring part 210 and the voltage measuring part 220 disclosed in the above embodiments, the present application also discloses a power supply control method, which can be applied to the above power supply assembly.
As shown in fig. 3, the power control method includes:
s11, acquiring the actual current and the actual voltage of the target 420. Specifically, during the sputtering process, the actual current of the target 420 can be obtained by measuring with the current measuring element 210 in the power supply assembly; correspondingly, the actual voltage of the target 420 can be obtained by measurement by the voltage measuring part 220 in the power supply assembly.
The power supply control method further comprises the following steps:
and S12, when the second difference value between the target power and the actual power is larger than a second preset difference value, an alarm signal is sent out, the first switch 161 and the second switch 162 are controlled to be closed, and the third power supply 130 is controlled to output power with the second difference value.
That is, when it is determined that the second power supply 120 has a fault and cannot normally provide the output power according to the second difference between the target power and the actual power, the third power supply 130 is further controlled to participate in the sputtering process under the condition of sending an alarm signal, so that the actual power of the target 420 reaches the target power under the action of the complementary power of the third power supply 130. As shown in fig. 4 and fig. 5, the voltage of the third power supply 130 is equal to the voltage of the first power supply 110, and based on the second difference between the target power and the actual power and the voltage of the first power supply 110, the output current of the third power supply 130 can be obtained, so that the actual power of the target 420 reaches the target power.
Specifically, as shown in fig. 4, since the output impedance of the first power supply and the second power supply to the target is substantially uniform, the voltage U measured by the voltage measuring member L The chamber potential difference U, the current I detected by the current measuring member L1 ＝I L2 =1/2 of the actual current I of the chamber. The process is performed as follows:
step 1, a control host calls a process formula, power output power is set, sputtering deposition process time is set, and an error threshold value of the power output power and actual load parameters, namely a second preset difference value of the power parameters is set;
step 2, the control host transmits the set power value PS to the first power supply through bus communication, and confirms that a contactor of the third power supply (namely, the positive electrode and the negative electrode of the third power supply are electrically connected with the target material and grounded through the contactor) is closed; the first power supply and the second power supply respectively output half power to the chamber;
and step 3, measuring the feedback voltage and the feedback current of the power supply end in the first power supply and the second power supply, and calculating the power supply. The first power supply feeds back the power supply voltage, current and power value to the control host in real time through bus communication, and the control host converts the power supply voltage, current and power value into readable feedback values PO, UO and IO in real time and displays the feedback values PO, UO and IO on a host interface;
step 4, voltage value analog quantity U detected by voltage measuring piece L Analog quantity I of current value detected by current measuring element L1 、I L2 And the analog quantity input module is directly input to the control host in real time. The control host calculates the actual load power value PL=U in real time L *(I L1 +I L2 )；
Step 5, the control host compares and calculates an error value between the power feedback value PO of the power supply and the actual load power PL, namely a second difference value:
Ea＝(PL-PO)/PO*100％；
step 6, the control host judges whether the power error Ea is larger than a second preset difference value;
step 7, when the power error Ea is smaller than or equal to a second preset difference value, continuing to execute the rest process;
step 8, when the power error Ea is larger than a second preset difference value, the control host confirms that the second power supply output fault is judged by comparing PO=PS, and then the second power supply output fault alarm is thrown;
step 9, simultaneously controlling the host computer to calculate the difference value between the set power PS and the actual load power PL: Δp=ps-PL; the control host transmits the power difference delta P to a third power supply through bus communication;
step 10, controlling a host to turn on a contactor of a third power supply, and outputting power to a chamber by the third power supply; and then loops to step 5.
The control host calculates the difference value of the actual load power value and the set power in real time, and the difference value is automatically compensated and output to the cavity through the third power supply, so that the thickness of the deposited film layer of the wafer is automatically compensated, and the problem of insufficient film layer thickness is solved.
For example: the control host sets power error threshold values to be +/-5%, when the process is executed, the control host sets power PS=25kW, the second power supply does not have power output, and the control host measures an actual voltage value U through the voltage measuring piece and the current measuring piece L Current value i=500V L1 ＝I L2 Actual load power pl=u calculated by the host computer=12.5a L *(I L1 +I L2 ) =12.5 kW, half of the control master display value po=25 kW and the set value PS. The control host calculates an error value between a power feedback value PO of the power supply and an actual load power PL: ea= (12.5-25)/25 x 100% = -50%, exceeding the set error threshold. And the control host computer confirms that the second power supply output fails by comparing po=ps=25 kW, and throws out a second power supply output failure alarm.
The control host calculates a difference between the set power PS and the actual load power PL: Δp=ps-pl=25-12.5=12.5 kW; setting the power difference value of 12.5kW to a third power supply through bus communication; and simultaneously turning on a contactor of a third power supply, and outputting power to the chamber by the third power supply. The control host calculates the actual load power to be the sum of the output powers of the first power supply and the third power supply in real time, and PL=12.5+12.5=25 kW and the power error Ea=0%. The control host continues to execute the rest process, thereby realizing automatic compensation of the thickness of the deposited film layer of the wafer and solving the problem of insufficient film layer thickness caused by the output failure of the power supply.
Based on the power supply assembly disclosed in any of the foregoing embodiments, the present application may further disclose a sputtering apparatus, which includes a control host 300, a chamber 410, and any of the foregoing power supply assemblies, wherein a first power supply 110 in the power supply assembly is communicatively connected to the control host 300, anodes of the first power supply 110 and a second power supply 120 are all grounded to the chamber 410, a target 420 may be installed on the chamber 410, and cathodes of the first power supply 110 and the second power supply 120 are all electrically connected to the target 420.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in an opposite order depending on the functions involved, e.g., the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.
Claims (10)
1. The power supply assembly is applied to sputtering equipment and is characterized by comprising a first power supply, a second power supply, a dial switch and a current measuring piece, wherein the first power supply and the second power supply are arranged in parallel, the first power supply is configured to be in communication connection with a control host, and the second power supply is in master-slave connection with the first power supply through the dial switch; the anodes of the first power supply and the second power supply are grounded, and the cathodes of the first power supply and the second power supply are electrically connected with a target material of a chamber installed in sputtering equipment; the current measuring piece is configured to be electrically connected with the target, and is in communication connection with the control host so as to transmit the actual current of the target to the control host.
2. The power supply assembly of claim 1, further comprising a combiner box having two inputs and two outputs, wherein the negative pole of the first power supply is configured to be connected to one input of the combiner box via a first wire, the negative pole of the second power supply is configured to be connected to the other input of the combiner box via a second wire, and the two outputs of the combiner box are electrically connected to the target via a third wire and a fourth wire, respectively.
3. The power supply assembly of claim 2, wherein the third and fourth wires are each mounted with the current measurement.
4. The power supply assembly of claim 1, further comprising a third power supply communicatively coupled to the control host, an anode of the third power supply being grounded via a first switch, a cathode of the third power supply being configured to be electrically coupled to a target mounted to a chamber of the sputtering apparatus via a second switch, the first switch and the second switch being configured to be both closed to compensate for an actual current of the target to the target current if a first difference between the target current and the actual current is greater than a first predetermined difference.
5. The power supply assembly of claim 4, wherein the positive electrode of the second power supply is grounded via a fifth wire, the negative electrode of the second power supply is electrically connected to the target via a sixth wire, the positive electrode of the third power supply is connected to the fifth wire via the first switch, and the negative electrode of the third power supply is connected to the sixth wire via the second switch.
6. A power supply assembly is applied to sputtering equipment, and is characterized in that the power supply assembly comprises a first power supply, a second power supply, a third power supply, a dial switch, a current measuring piece and a voltage measuring piece,
the first power supply, the second power supply and the third power supply are all arranged in parallel, the first power supply and the third power supply are both configured to be in communication connection with a control host, and the second power supply is in master-slave connection with the first power supply through the dial switch;
the anodes of the first power supply and the second power supply are grounded, and the cathodes of the first power supply and the second power supply are electrically connected with a target material of a chamber installed in sputtering equipment; the positive electrode of the third power supply is grounded through the first switch, the negative electrode of the third power supply is configured to be electrically connected with a target material arranged in a chamber of the sputtering equipment through the second switch,
the current measuring piece and the voltage measuring piece are both configured to be electrically connected with the target, and the current measuring piece and the voltage measuring piece are both in communication connection with the control host so as to respectively transmit the actual current and the actual voltage of the target to the control host, and the first switch and the second switch are used for being closed under the condition that the second difference value between the target power and the actual power of the target is larger than a second preset difference value so as to compensate the actual power of the target to the target power.
7. A power supply control method applied to the power supply assembly according to any one of claims 1 to 5, characterized by comprising:
acquiring the actual current of the target;
and sending out an alarm signal under the condition that the first difference value between the target current and the actual current is larger than a first preset difference value.
8. The power supply control method according to claim 7, wherein the power supply assembly further comprises a third power supply communicatively connected to the control host, an anode of the third power supply being grounded through a first switch, a cathode of the third power supply being configured to be electrically connected to a target mounted to a chamber of the sputtering apparatus through a second switch, the first switch and the second switch being both closed to compensate for an actual current of the target to the target current if a first difference between the target current and the actual current is greater than a first preset difference; the power supply control method further includes:
and under the condition that the first difference value between the target current and the actual current is larger than a first preset difference value, controlling the first switch and the second switch to be closed, and controlling the third power supply to output current with the first difference value.
9. A power supply control method applied to the power supply assembly of claim 6, characterized by comprising:
acquiring actual current and actual voltage of the target;
and when the second difference value between the target power and the actual power is larger than a second preset difference value, sending an alarm signal, controlling the first switch and the second switch to be closed, and controlling the third power supply to output the power with the second difference value.
10. A sputtering apparatus comprising a control host, a chamber, and the power assembly of any of claims 1-6, a first power source of the power assembly being communicatively coupled to the control host, the chamber being grounded, and the power assembly being configured to provide a power signal to a target of the chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111601804.3A CN114277341B (en) | 2021-12-24 | 2021-12-24 | Power supply assembly, power supply control method and sputtering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111601804.3A CN114277341B (en) | 2021-12-24 | 2021-12-24 | Power supply assembly, power supply control method and sputtering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114277341A CN114277341A (en) | 2022-04-05 |
| CN114277341B true CN114277341B (en) | 2023-09-08 |
Family
ID=80875201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111601804.3A Active CN114277341B (en) | 2021-12-24 | 2021-12-24 | Power supply assembly, power supply control method and sputtering equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114277341B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1248298A (en) * | 1997-02-20 | 2000-03-22 | 芝浦机械电子装置股份有限公司 | Power supply device for sputtering and sputtering device using the same |
| CN1669369A (en) * | 2002-05-31 | 2005-09-14 | 芝浦机械电子装置股份有限公司 | Discharging power source, sputtering power source, and sputtering device |
| JP2009059715A (en) * | 2008-11-14 | 2009-03-19 | Shibaura Mechatronics Corp | Power source, sputtering power source, and sputtering device |
| CN207853556U (en) * | 2017-11-30 | 2018-09-11 | 德淮半导体有限公司 | Dual power supply system and semiconductor production equipment |
| CN109722638A (en) * | 2019-01-29 | 2019-05-07 | 北京铂阳顶荣光伏科技有限公司 | A kind of thin film sputtering control device and method |
| CN113584442A (en) * | 2021-08-16 | 2021-11-02 | 中科微机电技术（北京）有限公司 | Reactive sputtering apparatus including control system and reactive sputtering method |
-
2021
- 2021-12-24 CN CN202111601804.3A patent/CN114277341B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1248298A (en) * | 1997-02-20 | 2000-03-22 | 芝浦机械电子装置股份有限公司 | Power supply device for sputtering and sputtering device using the same |
| CN1669369A (en) * | 2002-05-31 | 2005-09-14 | 芝浦机械电子装置股份有限公司 | Discharging power source, sputtering power source, and sputtering device |
| JP2009059715A (en) * | 2008-11-14 | 2009-03-19 | Shibaura Mechatronics Corp | Power source, sputtering power source, and sputtering device |
| CN207853556U (en) * | 2017-11-30 | 2018-09-11 | 德淮半导体有限公司 | Dual power supply system and semiconductor production equipment |
| CN109722638A (en) * | 2019-01-29 | 2019-05-07 | 北京铂阳顶荣光伏科技有限公司 | A kind of thin film sputtering control device and method |
| CN113584442A (en) * | 2021-08-16 | 2021-11-02 | 中科微机电技术（北京）有限公司 | Reactive sputtering apparatus including control system and reactive sputtering method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114277341A (en) | 2022-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114300760B (en) | Safety battery energy management system, battery management system node and method | |
| EP2587565B1 (en) | Secondary battery unit | |
| EP2729821B1 (en) | Method and system for detecting an arc fault in a photovoltaic power system | |
| US8412966B2 (en) | Voltage sensing circuitry for solid state power controllers | |
| CN110018349A (en) | Ground fault detection device | |
| US7764067B2 (en) | High voltage cable testing method | |
| CN101750529B (en) | Capacitive divider device, voltage sensor, trip device module and electrical protection apparatus provided with such a device | |
| US7696760B2 (en) | High voltage harness testing system | |
| AU2014224084B2 (en) | Electrical control and protection device | |
| US11465525B2 (en) | Measuring apparatus and method for capturing electrical energy transferred from a charging station | |
| CN103389416A (en) | Measurement of a resistance of a switch contact of an electrical circuit breaker | |
| US20210165026A1 (en) | Circuit arrangement having an active measuring voltage for determining an insulation resistance against ground potential in an ungrounded power supply system | |
| CN114277341B (en) | Power supply assembly, power supply control method and sputtering equipment | |
| CN104136261A (en) | Method for determining the absence of voltage in an electrical high-voltage system, and electrical high-voltage system | |
| US20180231597A1 (en) | Arc occurrence position detection device and arc occurrence position detection method | |
| US20240014684A1 (en) | Power sourcing equipment and method for detecting insulation resistance at input end of power sourcing equipment | |
| CN111337850B (en) | Ground fault detection device | |
| KR20190071320A (en) | System and method for diagnosing relay fault | |
| CN112327210A (en) | Low-voltage wire harness fault detection circuit and method for energy storage battery system | |
| CN216956276U (en) | Device for judging state of multi-path high-voltage fuse and contactor | |
| KR20200052688A (en) | System and method for measuring insulation resistance | |
| CN115377966A (en) | Energy storage inverter load power supply regulation and control system and method | |
| KR101680297B1 (en) | Apparatus for measuring current of high voltage battery in vehicle | |
| US11913999B2 (en) | Detection of a ground fault in a direct-current network | |
| CN104685749B (en) | Circuit device with inverter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |