CN114277246A - Method for recovering valuable metal from oxidation roasting packaged chip - Google Patents
Method for recovering valuable metal from oxidation roasting packaged chip Download PDFInfo
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- CN114277246A CN114277246A CN202111588147.3A CN202111588147A CN114277246A CN 114277246 A CN114277246 A CN 114277246A CN 202111588147 A CN202111588147 A CN 202111588147A CN 114277246 A CN114277246 A CN 114277246A
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- Prior art keywords
- leaching
- roasting
- gold
- oxidation
- chip
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 31
- 239000002184 metal Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000007254 oxidation reaction Methods 0.000 title claims abstract description 23
- 230000003647 oxidation Effects 0.000 title claims abstract description 22
- 238000002386 leaching Methods 0.000 claims abstract description 36
- 229910052737 gold Inorganic materials 0.000 claims abstract description 24
- 239000010931 gold Substances 0.000 claims abstract description 24
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 11
- 230000001590 oxidative effect Effects 0.000 claims abstract description 10
- 239000002893 slag Substances 0.000 claims abstract description 6
- 238000005660 chlorination reaction Methods 0.000 claims abstract description 5
- 238000005245 sintering Methods 0.000 claims abstract description 3
- 150000002739 metals Chemical class 0.000 claims description 25
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 10
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 8
- 239000011780 sodium chloride Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000005708 Sodium hypochlorite Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 claims description 2
- 239000002699 waste material Substances 0.000 abstract description 10
- 238000011084 recovery Methods 0.000 abstract description 5
- 239000010793 electronic waste Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004090 dissolution Methods 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000000605 extraction Methods 0.000 abstract 1
- 239000002920 hazardous waste Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 9
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000010813 municipal solid waste Substances 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Images
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention relates to a method for extracting gold from an oxidation roasting packaged chip, belonging to the field of comprehensive utilization of resources. Firstly, crushing a circuit board chip to a certain size; placing the crushed powder in a muffle furnace for oxidizing roasting; leaching the obtained powder to remove copper after the oxidation roasting and sintering; and leaching gold from the copper-removed slag to obtain a gold-containing leaching solution. The method adopts a method of extracting gold from an oxidation roasting packaged chip and adopts the process thought of oxidation roasting chip-oxidation leaching copper removal-chlorination leaching gold dissolution, thereby filling the blank of valuable metal resource recovery of waste chips; the gold leaching by chlorination avoids the safety problem of the existing gold extraction process by cyanidation, simultaneously avoids the chip from being mixed with electronic waste for treatment, improves the metal recovery rate, and has obvious economic and environmental benefits. The method changes the harm into the treasure, realizes the resource utilization of the hazardous waste, is beneficial to relieving the pressure of resources and environment, and has excellent economic and ecological benefits.
Description
Technical Field
The invention relates to a method for recovering valuable metals from an oxidation roasting packaging chip, belongs to the technical field of comprehensive utilization of resources, and particularly relates to the field of comprehensive utilization of solid waste resources.
Background
The continuous generation and huge amount of electronic garbage become a problem which cannot be avoided globally, the circuit board is taken as the most active electronic element as the most basic component, the proportion of the circuit board in the electric appliance is very high, the circuit board contains a large amount of electronic chips, and the amount of the waste electronic chips is also increased sharply along with the increase of the waste circuit board. The electronic chip has a large amount and a wide range, contains toxic heavy metals (Pd, Cd, and the like), stable organic matters (polycyclic aromatic hydrocarbons, phenylethers), and precious valuable metals (Au, Ag, and the like), belongs to electronic garbage which is easy to pollute the environment, and has great threat to the environment and human health.
How to enhance the treatment of the wastes and recover valuable substances in the wastes becomes an important issue of concern at home and abroad. However, in China and abroad, the waste chips are recycled and classified into electronic wastes for centralized treatment, and a small part of enterprises and public institutions dedicated to chip recycling mostly concentrate on chip shaping and reusing, so that valuable metals in the chips which are completely scrapped and cannot be shaped and reused are further diluted, and the metal recovery rate is reduced.
The invention provides a method for recovering valuable metals from oxidation roasting packaged chips, which utilizes the process ideas of oxidation roasting of waste chips, oxidation leaching for copper removal, and chlorination leaching for gold dissolution to treat the chips, avoids the direct mixing of the waste chips into electronic waste for centralized treatment, dilutes the valuable metals in the chips, and improves the metal recovery rate. The invention adopts oxidizing roasting to recover valuable metals in the chips, and fills the blank in the aspect of recovering valuable resources in waste chips. Meanwhile, the invention can realize the independent comprehensive treatment of the chip with the existing shaping and chip recycling method, and has the advantages of small treatment capacity, environmental protection and resource saving.
Disclosure of Invention
Aiming at the problems and the defects in the prior art, the invention provides a method for recovering valuable metals from an oxidation roasting packaged chip. A method for recovering valuable metals from an oxidation roasting packaged chip is characterized by comprising the following specific steps:
1) crushing the circuit board chip to a certain size;
2) placing the crushed powder in a muffle furnace for oxidizing roasting;
3) after the baking and sintering, crushing and leaching the obtained powder to remove copper;
4) and leaching gold from the copper-removed slag to obtain a gold-containing leaching solution.
The method for recovering valuable metals from the oxidation roasting packaged chip is characterized by comprising the following steps: the packaged chip obtained by disassembling the circuit board in the step (1) contains 0.5-5g/kg of gold, 0.1-6kg of silver, 10-30% of copper and other metals.
The method for recovering valuable metals from the oxidation roasting packaged chip is characterized by comprising the following steps: crushing the chip in the step (1) to 60-200 meshes;
the method for recovering valuable metals from the oxidation roasting packaged chip is characterized by comprising the following steps: the oxidizing roasting condition in the step (2) is 400-650 ℃:
the method for recovering valuable metals from the oxidation roasting packaged chip is characterized by comprising the following steps: grinding the obtained powder to 100-200 meshes after the reaction in the step (3) is finished;
the method for recovering valuable metals from the oxidation roasting packaged chip is characterized by comprising the following steps: the condition of copper removal by leaching in the step (3) is sulfuric acid: 2-10mol/L, hydrogen peroxide addition: 15-40%, liquid-solid ratio: 2-5; leaching time: 2-5 h.
The method for recovering valuable metals from the oxidation roasting packaged chip is characterized by comprising the following steps: and (4) leaching gold by adopting a chlorination leaching system: hydrochloric acid: 4-8mol/L, sodium chloride: 100-200g/L, sodium hypochlorite: 100-200g/L, the liquid-solid ratio is: 2-7.
The invention has the beneficial effects that:
1) the existing method is avoided: waste chips are mixed into electronic waste for centralized treatment, so that the recovery rate of valuable metals is improved;
2) valuable metals in the chip are recovered by oxidizing roasting, so that the blank in the aspect of recovering valuable resources in the chip is filled;
3) can be used for processing chips independently with the existing method for shaping and recycling chips, and has small processing amount.
4) And cyaniding gold leaching is not adopted, so that the operation safety of personnel is guaranteed.
Drawings
As in fig. 1.
Detailed Description
The invention is further described with reference to the following drawings and detailed description.
Example 1
Placing 200g of 200-mesh chips in a muffle furnace for roasting, wherein the oxidizing roasting temperature is as follows: 400 ℃, time: grinding the oxidized mixture for 2.5h, adding 250mL of 4mol/L sulfuric acid solution into 100g of the roasted mixture powder, and adding 100mL of hydrogen peroxide, wherein the leaching conditions are as follows: normal temperature, time: 2 h; rotating speed: 200 r/min.
And after the copper removal is finished, filtering the copper removal mixture, and drying and grinding filter residues.
Adding 200g/L of sodium chloride and mixed solution containing 4mol/L of hydrochloric acid into the copper-removed slag, introducing chlorine gas for leaching gold, wherein the introduction amount of the chlorine gas is 0.2ml/min, and the leaching conditions are as follows: the temperature is 60 ℃, the time is 4h, and the rotating speed is 150r/min.
The oxidation roasting packaging chip has the following gold leaching rate: 98.6 percent;
example 2
Placing 200g of 200-mesh chips in a muffle furnace for roasting, wherein the oxidizing roasting temperature is as follows: 400 ℃, time: grinding the oxidized mixture for 2.5h, adding 250mL of 4mol/L sulfuric acid solution into 100g of the roasted mixture powder, and adding 100mL of hydrogen peroxide, wherein the leaching conditions are as follows: normal temperature, time: 2 h; rotating speed: 200 r/min.
And after the copper removal is finished, filtering the copper removal mixture, and drying and grinding filter residues.
Adding 150g/L of sodium chloride and a mixed solution containing 2mol/L of hydrochloric acid into the copper-removed slag, introducing chlorine gas for leaching gold, wherein the introduction amount of the chlorine gas is 0.2ml/min, and the leaching conditions are as follows: the temperature is 60 ℃, the time is 3.5h, and the rotating speed is 150r/min.
The oxidation roasting packaging chip has the following gold leaching rate: 95.3 percent
Example 3
Placing 200g of 200-mesh chips in a muffle furnace for roasting, wherein the oxidizing roasting temperature is as follows: 400 ℃, time: grinding the oxidized mixture for 2.5h, adding 250mL of 4mol/L sulfuric acid solution into 100g of the roasted mixture powder, and adding 100mL of hydrogen peroxide, wherein the leaching conditions are as follows: normal temperature, time: 2 h; rotating speed: 200 r/min.
And after the copper removal is finished, filtering the copper removal mixture, and drying and grinding filter residues.
Adding 200g/L of sodium chloride and mixed solution containing 4mol/L of hydrochloric acid into the copper-removed slag, introducing chlorine gas for leaching gold, wherein the introduction amount of the chlorine gas is 0.6ml/min, and the leaching conditions are as follows: the temperature is 90 ℃, the time is 4h, and the rotating speed is 150r/min.
The oxidation roasting packaging chip has the following gold leaching rate: 99.5 percent
While the present invention has been described in detail with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, and various changes can be made without departing from the spirit and scope of the present invention.
Claims (7)
1. A method for recovering valuable metals from an oxidation roasting packaged chip is characterized by comprising the following specific steps:
crushing the circuit board chip to a certain size;
placing the crushed powder in a muffle furnace for oxidizing roasting;
after the baking and sintering, crushing and leaching the obtained powder to remove copper;
and leaching gold from the copper-removed slag to obtain a gold-containing leaching solution.
2. The method for recovering valuable metals of the oxidation-roasting packaged chip as claimed in claim 1, wherein: the packaged chip obtained by disassembling the circuit board in the step (1) contains 0.5-5g/kg of gold, 0.1-6kg of silver, 10-30% of copper and other metals.
3. The method for recovering valuable metals of the oxidation-roasting packaged chip as claimed in claim 1, wherein: and (2) crushing the chip in the step (1) to 60-200 meshes.
4. The method for recovering valuable metals of the oxidation-roasting packaged chip as claimed in claim 1, wherein: the oxidizing roasting condition in the step (2) is 400-650 ℃.
5. The method for recovering valuable metals of the oxidation-roasting packaged chip as claimed in claim 1, wherein: and (4) grinding the obtained powder to 100-200 meshes after the reaction in the step (3) is finished.
6. The method for recovering valuable metals of the oxidation-roasting packaged chip as claimed in claim 1, wherein: the condition of copper removal by leaching in the step (3) is sulfuric acid: 2-10mol/L, hydrogen peroxide: 15-40%, leaching temperature: leaching at normal temperature of-60 deg.C for 2-5 h.
7. The method for recovering valuable metals of the oxidation-roasting packaged chip as claimed in claim 1, wherein: and (4) leaching gold by adopting a chlorination leaching system: hydrochloric acid: 4-8mol/L, sodium chloride: 100-200g/L, sodium hypochlorite: 100-200g/L, the liquid-solid ratio is: 2-7.
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CN202111588147.3A CN114277246A (en) | 2021-12-23 | 2021-12-23 | Method for recovering valuable metal from oxidation roasting packaged chip |
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CN202111588147.3A CN114277246A (en) | 2021-12-23 | 2021-12-23 | Method for recovering valuable metal from oxidation roasting packaged chip |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102181644A (en) * | 2011-04-13 | 2011-09-14 | 深圳市格林美高新技术股份有限公司 | Method for reclaiming rare noble metals from waste circuit board |
CN103898325A (en) * | 2012-12-27 | 2014-07-02 | 深圳市格林美高新技术股份有限公司 | Method for recovering valuable metals from scraped auto parts |
CN103966450A (en) * | 2014-05-23 | 2014-08-06 | 江西理工大学 | All-wet process pretreatment method for copper anode mud |
CN105132690A (en) * | 2015-09-20 | 2015-12-09 | 成都育芽科技有限公司 | Method for extracting gold, silver, platinum and palladium from electronic waste |
CN108796227A (en) * | 2018-07-05 | 2018-11-13 | 汉能新材料科技有限公司 | The efficient recycling method of the useless chip of copper indium gallium selenide |
CN113151667A (en) * | 2021-04-19 | 2021-07-23 | 上海第二工业大学 | Method for recycling rare and precious metal elements from waste LED packaging |
-
2021
- 2021-12-23 CN CN202111588147.3A patent/CN114277246A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102181644A (en) * | 2011-04-13 | 2011-09-14 | 深圳市格林美高新技术股份有限公司 | Method for reclaiming rare noble metals from waste circuit board |
CN103898325A (en) * | 2012-12-27 | 2014-07-02 | 深圳市格林美高新技术股份有限公司 | Method for recovering valuable metals from scraped auto parts |
CN103966450A (en) * | 2014-05-23 | 2014-08-06 | 江西理工大学 | All-wet process pretreatment method for copper anode mud |
CN105132690A (en) * | 2015-09-20 | 2015-12-09 | 成都育芽科技有限公司 | Method for extracting gold, silver, platinum and palladium from electronic waste |
CN108796227A (en) * | 2018-07-05 | 2018-11-13 | 汉能新材料科技有限公司 | The efficient recycling method of the useless chip of copper indium gallium selenide |
CN113151667A (en) * | 2021-04-19 | 2021-07-23 | 上海第二工业大学 | Method for recycling rare and precious metal elements from waste LED packaging |
Non-Patent Citations (1)
Title |
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崔毅琦: "《非氰提取金银技术》", 30 April 2019, 冶金工业出版社, pages: 17 * |
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