CN114276599A - Low-pressure molding material, data line comprising same and molding method of data line - Google Patents
Low-pressure molding material, data line comprising same and molding method of data line Download PDFInfo
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- CN114276599A CN114276599A CN202111483731.2A CN202111483731A CN114276599A CN 114276599 A CN114276599 A CN 114276599A CN 202111483731 A CN202111483731 A CN 202111483731A CN 114276599 A CN114276599 A CN 114276599A
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Abstract
The invention provides a low-pressure molding material, a data wire containing the same and a molding method of the data wire, wherein the low-pressure molding material comprises a combination of low-density polyethylene resin, ethylene-vinyl acetate copolymer and polybutylene succinate resin in specific parts, the three specific resins are selected for matching, so that the obtained low-pressure molding material can be molded by a common molding machine, the molding pressure can be controlled, the phenomenon of unsaturated mold or glue overflow can not occur in the molding process, the molded product can not easily generate burrs, the retraction amount of the molded product is small during welding, the problem of poor wire drawing caused by the retraction of soldering tin of the product can be improved, and the molded product can be used as an inner mold layer material to be applied to a data wire connector.
Description
Technical Field
The invention belongs to the technical field of high polymer materials, and particularly relates to a low-pressure molding material, a data line containing the same and a molding method of the data line.
Background
With the iterative development progress of information technology, people have higher requirements on data transmission speed, wherein a data connecting line is used as a carrier for data transmission, and the requirements on design and manufacture are also higher. According to the manufacturing process of the high-speed wire connecting wire, the high-speed wire is peeled firstly, then the high-speed wire is arranged in a jig according to a certain wire sequence, then the wire sequence is formed and fixed, the jig is removed, the core wire is peeled and welded on a terminal, and then an outer mold is formed; the core wire is made of materials such as foamed PE or Teflon and the like, and has the reason that the wire diameter is small, so that the sizing material for forming and fixing the wire sequence has the characteristics of good viscosity, high fluidity, low forming pressure and temperature resistance, and does not melt and retract when soldering is needed.
CN112489871A discloses explosion-proof data line of high safety, this explosion-proof data line of high safety, including first connecting block, the right flank fixedly connected with USB of first connecting block connects, the right flank fixedly connected with wire of first connecting block, the one end fixedly connected with second connecting block of first connecting block is kept away from to the wire, the lower surface swing joint of second connecting block has the apron, the upper surface of second connecting block is provided with the button, the inside of second connecting block is provided with the connecting wire, the one end fixedly connected with third connecting block of second connecting block is kept away from to the connecting wire, the one end fixedly connected with plug of connecting wire is kept away from to the third connecting block. Through explosion-proof layer and filling layer for the data line uses safelyr, has good heat conductivity and ductility with, has the characteristic of letting back, plays good cushioning effect with the filling layer together.
CN113214595A discloses a high-tension-bearing data line, which comprises a power supply end connector and a data end connector, wherein the power supply end connector and the data end connector both comprise a circuit assembly, an inner mold layer and an outer mold layer, and the inner mold layer is made of ABS/PC/TPV composite material; the ABS/PC/TPV composite material is prepared from the following raw materials: ABS, PC, TPV, lubricant, functional additive and compatilizer. The manufactured data line is not easy to break in bending and stretching, can bear large tensile force, and has good weather resistance, wear resistance, ageing resistance and long service life.
However, the material unit price of the inner mold layer for the data line connector in the prior art is high, burrs are easily generated during molding, and the molded product is resistant to temperature difference and easy to retract during soldering, so that the yield and efficiency of the product are affected, and the industrialization process of the data line connector is limited.
Therefore, the development of a low-pressure molding material with controllable pressure during molding, less possibility of generating burrs and less solder retraction after molding is an urgent technical problem to be solved in the field.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a low-pressure molding material, a data line comprising the same and a molding method of the data line, wherein the low-pressure molding material comprises a combination of low-density polyethylene resin, ethylene-vinyl acetate copolymer and polybutylene succinate resin in specific parts, and the three resins are adopted for matching, so that the low-pressure molding material which is controllable in pressure during molding, not easy to generate burrs and small in product retraction after molding is obtained and can be used as an inner mold material of a data line connector.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a low-pressure molding material, which comprises the following components in parts by weight:
50-80 parts by weight of low-density polyethylene resin
5-15 parts by weight of ethylene-vinyl acetate copolymer
10-40 parts of poly (butylene succinate) resin.
Wherein the low density polyethylene resin (LDPE) may be 53 parts by weight, 56 parts by weight, 59 parts by weight, 63 parts by weight, 66 parts by weight, 69 parts by weight, 73 parts by weight, 76 parts by weight, or 79 parts by weight, and specific points therebetween, the invention is not exhaustive and for brevity and clarity, the specific points included in the range are not intended to be exhaustive.
The ethylene vinyl acetate copolymer (EVA) may be 6 parts by weight, 7 parts by weight, 8 parts by weight, 9 parts by weight, 10 parts by weight, 11 parts by weight, 12 parts by weight, 13 parts by weight, or 14 parts by weight, and specific points therebetween, are not exhaustive for the invention and for brevity.
The polybutylene succinate (PBS) resin may be 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, or 40 parts by weight, and specific values therebetween are not exhaustive for the invention, which is limited to the space and for brevity.
The low-pressure molding material provided by the invention comprises the combination of LDPE resin, EVA resin and PBS resin in specific parts, and the three specific resins are selected to match with specific dosage, so that the obtained low-pressure molding material can be prevented from being liquefied by using a rubber cylinder, and can be molded only by using a common molding machine, the molding pressure in the molding process can be controlled, the phenomenon of unsaturated mold or glue overflow is not easy to occur, meanwhile, the molded product is not easy to generate burrs, the retraction amount is small during welding, the problem of poor solder retraction and wire drawing can be further improved, and the requirement of serving as a material of an inner mold layer of a data line connector is met.
The low pressure in the low-pressure molding material provided by the invention refers to the molding material with the pressure not higher than 80Bar in injection molding.
Preferably, the low density polyethylene resin has a melt index of 20 to 60g/10min, such as 25g/10min, 30g/10min, 35g/10min, 40g/10min, 45g/10min, 50g/10min or 55g/10min, and the specific values therebetween are not exhaustive, and for brevity and clarity, the invention is not intended to be exhaustive.
The melt index in the present invention was measured at a temperature of 190 ℃ and a pressure of 2.16 kg.
Preferably, the ethylene-vinyl acetate copolymer has a vinyl acetate content of 35-45% by mass, such as 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43% or 44%, and the specific values therebetween are not exhaustive for the sake of brevity and simplicity.
Preferably, the viscosity of the polybutylene succinate-co-butylene glycol resin is 20000-40000 pcs/230 ℃, such as 24000pcs/230 ℃, 26000pcs/230 ℃, 28000pcs/230 ℃, 30000pcs/230 ℃, 32000pcs/230 ℃, 34000pcs/230 ℃, 36000pcs/230 ℃ or 38000pcs/230 ℃, and specific values therebetween are limited to space and for the sake of brevity, and the invention is not exhaustive enumeration of the specific values included in the range.
Preferably, the low-pressure molding material also comprises an antioxidant.
Preferably, the antioxidant is contained in the low-pressure molding compound in an amount of 0.1 to 1 part by weight, for example, 0.2 part by weight, 0.3 part by weight, 0.4 part by weight, 0.5 part by weight, 0.6 part by weight, 0.7 part by weight, 0.8 part by weight or 0.9 part by weight, and specific values therebetween are not exhaustive, and the invention is not limited to the specific values included in the ranges for brevity and conciseness.
Preferably, the antioxidant comprises a combination of antioxidant 1010 and antioxidant 168.
Preferably, the mass ratio of the antioxidant 1010 to the antioxidant 168 is 1 (0.5-5), such as 1:1, 1:1.5, 1:2, 1:2.5, 1:3, 1:3.5, 1:4 or 1: 4.5.
As the preferred technical scheme of the invention, the antioxidant 1010 and the antioxidant 168 are selected to be matched for use, which is more favorable for improving the temperature resistance of the low-pressure molding material, and the temperature resistance of a single antioxidant is weak.
In a second aspect, the present invention provides a method for preparing a low-pressure molding compound according to the first aspect, the method comprising: mixing low-density polyethylene resin, ethylene-vinyl acetate copolymer, poly (butylene succinate) resin and optional antioxidant, extruding and plasticizing to obtain the low-pressure molding material.
Preferably, the mixing time is 10-15 min, such as 10.5min, 11min, 11.5min, 12min, 12.5min, 3min, 13.5min, 14min or 14.5min, and the specific values therebetween are limited by space and for the sake of brevity, the invention is not exhaustive of the specific values included in the range.
Preferably, the mixing is performed in a stirred tank.
Preferably, the temperature of the extrusion plasticizing is 150-180 ℃, such as 153 ℃, 156 ℃, 159 ℃, 163 ℃, 166 ℃, 169 ℃, 173 ℃, 176 ℃ or 179 ℃, and the specific values therebetween are limited by space and for the sake of brevity, and the invention is not exhaustive of the specific values included in the range.
Preferably, the extrusion is carried out in a twin screw machine.
Preferably, the preparation method further comprises the steps of bracing, water cooling, air cooling and granulating the plasticized material after extrusion and plasticization.
In a third aspect, the present invention provides a data line, where the data line includes a data line connector, a data line body, an inner mold layer and an outer mold layer; the data line connector comprises a circuit assembly, the data line body comprises wire cores connected with the circuit assembly, the inner mold layer coats and fixes the plurality of wire cores, and the outer mold layer coats the connection parts of the circuit assembly and the plurality of wire cores and the inner mold layer; the raw material for preparing the inner mold layer comprises the low-pressure molding material according to the first aspect. .
In the invention, the data line connector comprises a circuit assembly, the data line body comprises a plurality of wire cores connected with the circuit assembly, the circuit assembly is connected with the plurality of wire cores to form a joint, the inner mold layer is coated on the outer sides of the plurality of wire cores and used for fixing the plurality of wire cores, and the outer mold layer is coated on the inner mold layer and the joints of the plurality of wire cores and the circuit assembly.
In a fourth aspect, the present invention provides a method for forming a data line according to the third aspect, the method comprising the steps of:
(1) branching a plurality of wire cores exposed from a data wire body to form a wire sequence, performing injection molding on the surfaces of the plurality of wire cores by using a low-pressure molding material, fixing the plurality of wire cores to form an inner mold layer, and fixing the wire sequence; the plurality of wire cores exposed out of the inner mold layer are connected with the circuit assembly in the data wire connector to form a connecting part;
(2) and welding the circuit assembly and the plurality of wire cores, and coating the outer die layer to obtain the data wire.
Preferably, the temperature of the injection molding in the step (1) is 170-190 ℃, such as 172 ℃, 174 ℃, 176 ℃, 178 ℃, 180 ℃, 182 ℃, 184 ℃, 186 ℃ or 188 ℃.
Preferably, the pressure of the injection molding in the step (1) is 10-80 Bar, such as 20Bar, 30Bar, 40Bar, 50Bar, 60Bar or 70 Bar.
Compared with the prior art, the invention has the following beneficial effects:
(1) the low-pressure molding material provided by the invention comprises the combination of LDPE resin, EVA resin and PBS resin in specific parts, and the three specific resin materials are selected to match with specific dosage, so that the obtained low-pressure molding material can be prevented from being liquefied and molded by using a rubber cylinder, can be molded only by using a common injection molding machine, has controllable molding pressure in the molding process, is not easy to have the phenomenon of unsaturated mold or glue overflow, is not easy to generate burrs on the molded product, has small retraction amount of the molded product during welding, improves the problem of poor solder retraction and wire drawing, and can be used as an inner mold layer material to be applied to a data line.
(2) The low-pressure molding material provided by the invention is temperature-resistant and easy to mold, the hardness is 88-91A, the tensile strength is 7.2-8.6 MPa, the elongation at break is 306-386%, the melt index is 42-71 g/10min, the molding pressure is 20-68 Bar, and the retraction length is 0.68-0.89 mm; meanwhile, the environment-friendly and nontoxic raw materials are adopted, can be recycled by 100 percent, have no pollution to the environment and are beneficial to recycling.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
A low-pressure molding material comprises the following components in parts by weight:
the preparation method of the low-pressure molding material provided by the embodiment comprises the following steps: mixing LDPE resin (the melt index is 40g/10min), EVA resin (the mass percentage of VA is 40%), PBS resin (the viscosity is 30000pcs/230 ℃) and antioxidant (antioxidant 1010 and antioxidant 168 with the mass ratio of 1: 2) in a stirrer at 15rpm for 20min, discharging the mixture into a double screw extruder with the diameter of 65mm for extrusion plasticization, wherein the extrusion processing temperature is 160 ℃, and then carrying out bracing, water cooling, air cooling and grain cutting in sequence to obtain the low-pressure molding material.
Example 2
A low-pressure molding material comprises the following components in parts by weight:
the preparation method of the low-pressure molding material provided by the embodiment comprises the following steps: mixing LDPE resin (melt index of 60g/10min), EVA resin (the mass percentage of VA is 35%), PBS resin (the viscosity of 20000pcs/230 ℃) and antioxidant (antioxidant 1010 and antioxidant 168 with the mass ratio of 1: 2) in a stirrer at 15rpm for 20min, discharging into a double screw extruder with the diameter of 65mm for extrusion plasticization, wherein the extrusion processing temperature is 160 ℃, and then sequentially carrying out bracing, water cooling, air cooling and grain cutting to obtain the low-pressure molding material.
Example 3
A low-pressure molding material comprises the following components in parts by weight:
the preparation method of the low-pressure molding material provided by the embodiment comprises the following steps: mixing LDPE resin (with the melt index of 20g/10min), EVA resin (with the mass percentage of VA of 45%), PBS resin (with the viscosity of 40000pcs/230 ℃) and antioxidant (antioxidant 1010 and antioxidant 168 with the mass ratio of 1: 2) in a stirrer at the speed of 15rpm for 20min, discharging the mixture into a double screw extruder with the diameter of 65mm for extrusion plasticization, wherein the extrusion processing temperature is 160 ℃, and then sequentially carrying out bracing, water cooling, air cooling and grain cutting to obtain the low-pressure molding material.
Example 4
A low-pressure molding material comprises the following components in parts by weight:
the preparation method of the low-pressure molding material provided by the embodiment comprises the following steps: mixing LDPE resin (the melt index is 40g/10min), EVA resin (the mass percentage of VA is 40%), PBS resin (the viscosity is 30000pcs/230 ℃) and antioxidant (antioxidant 1010 and antioxidant 168 with the mass ratio of 1: 2) in a stirrer at 15rpm for 20min, discharging the mixture into a double screw extruder with the diameter of 65mm for extrusion plasticization, wherein the extrusion processing temperature is 160 ℃, and then carrying out bracing water cooling, air cooling and grain cutting in sequence to obtain the low-pressure molding material.
Example 5
A low-pressure molding compound which is different from the compound in example 1 only in that no antioxidant 1010 is added, the antioxidant 168 is added in an amount of 0.5 parts by weight, and other components, the amount and the preparation method are the same as those in example 1.
Example 6
A low-pressure molding compound which is different from the compound in example 1 only in that an antioxidant 168 is not added, an antioxidant 1010 is added in an amount of 0.5 part by weight, and other components, the amount and the preparation method are the same as those in example 1.
Comparative example 1
A low-pressure molding material which differs from example 1 only in that no PBS resin was added, 90 parts by weight of LDPE was added, and the other components, the amounts and the preparation method were the same as in example 1.
Comparative example 2
A low-pressure molding material is different from the molding material in example 1 only in that no EVA resin is added, the addition amount of LDPE resin is 88.4 parts by weight, the addition amount of PBS resin is 11.1 parts by weight, and other components, the use amounts and the preparation method are the same as those in example 1.
Application example 1
A molding method of a data line, the molding method comprising the steps of:
(1) branching a plurality of wire cores exposed from a data wire body to form a certain wire sequence, performing injection molding on the surfaces of the plurality of wire cores by using a low-pressure molding material (embodiment 1) at 180 ℃ and a specific molding pressure, fixing the plurality of wire cores to form an inner mold layer to fix the wire sequence; the plurality of wire cores exposed out of the inner mold layer are connected with the circuit assembly in the data wire connector to form a connecting part;
(2) and welding the circuit assembly and the plurality of wire cores, and coating the outer die layer to obtain the data wire. Application examples 2 to 6
The forming method of the data line is different from the application example 1 only in that the low-pressure forming materials obtained in the embodiments 2 to 6 are respectively adopted to replace the low-pressure forming material obtained in the embodiment 1, and other steps are the same as the application example 1.
Comparative application examples 1 to 2
The forming method of the data line is different from the application example 1 only in that the low-pressure forming material obtained in comparative examples 1-2 is adopted to replace the low-pressure forming material obtained in the application example 1, and other steps are the same as the application example 1.
And (3) performance testing:
(1) hardness: according to ISO 75-2: 2004 Standard for testing;
(2) tensile strength and elongation at break: testing was performed according to ASTM D1238 Standard;
(3) melt index: testing was performed according to the method provided in ASTM D1238 Standard;
(4) molding pressure: recording the molding pressure of the inner mold layer in the molding process of the data line;
(5) solder retraction: when welding many sinle silks to circuit assembly's the pad that corresponds, sinle silks soldering tin condition is: and (5) soldering tin at 280 ℃ for 5s, and recording the retraction length of the low-pressure molding material.
The low-pressure molding materials provided in examples 1 to 6 and comparative examples 1 to 2 were tested according to the test method, and the test data are shown in table 1;
TABLE 1
As can be seen from the data in table 1:
the hardness of the low-pressure molding material obtained in the embodiments 1 to 6 is 88 to 91A, the tensile strength is 7.2 to 8.6MPa, the elongation at break is 306 to 386%, the melt index is 42 to 71g/10min, the molding pressure is 20 to 68Bar, and the retraction length is 0.68 to 0.89 mm.
Comparing example 1 with comparative example 1, it can be seen that the molding pressure required for the low-pressure molding material obtained without adding the PBS resin was as high as 130Bar, and the shrinkage length of the low-pressure molding material upon soldering was as high as 2.12 mm.
Comparing example 1 with comparative example 2, it can be seen that the low-pressure molding compound obtained without adding EVA resin has a lower slush molding pressure, but also the low-pressure molding compound has a higher length of set-back at the time of soldering.
The applicant states that the present invention is illustrated by the above embodiments of a low-pressure molding material, a data line including the same, and a molding method thereof, but the present invention is not limited to the above embodiments, i.e., it does not mean that the present invention must be implemented by the above embodiments. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. The low-pressure molding material is characterized by comprising the following components in parts by weight:
50-80 parts by weight of low-density polyethylene resin
5-15 parts by weight of ethylene-vinyl acetate copolymer
10-40 parts of poly (butylene succinate) resin.
2. A low-pressure molding compound as claimed in claim 1, wherein the low-density polyethylene resin has a melt index of 20 to 60g/10 min.
3. The low-pressure molding material according to claim 1 or 2, wherein the mass percentage of vinyl acetate in the ethylene-vinyl acetate copolymer is 35-45%.
4. A low-pressure molding material according to any one of claims 1 to 3, wherein the polybutylene succinate resin has a viscosity of 20000 to 40000pcs/230 ℃.
5. A low-pressure molding compound as claimed in any one of claims 1 to 4, further comprising an antioxidant;
preferably, the content of the antioxidant in the low-pressure molding material is 0.1-1 part by weight;
preferably, the antioxidant comprises a combination of antioxidant 1010 and antioxidant 168;
preferably, the mass ratio of the antioxidant 1010 to the antioxidant 168 is 1 (0.5-5).
6. A method for preparing a low-pressure molding compound according to any one of claims 1 to 5, comprising: mixing low-density polyethylene resin, ethylene-vinyl acetate copolymer, poly (butylene succinate) resin and optional antioxidant, extruding and plasticizing to obtain the low-pressure molding material.
7. The method according to claim 6, wherein the mixing time is 10 to 15 min;
preferably, the mixing is carried out in a stirred tank;
preferably, the temperature of the extrusion plasticizing is 150-180 ℃;
preferably, said extrusion is carried out in a twin-screw machine;
preferably, the preparation method further comprises the steps of bracing, water cooling, air cooling and granulating the plasticized material after extrusion and plasticization.
8. The data line is characterized by comprising a data line connector, a data line body, an inner mold layer and an outer mold layer; the data line connector comprises a circuit assembly, the data line body comprises a plurality of wire cores connected with the circuit assembly, the inner mold layer coats and fixes the plurality of wire cores, and the outer mold layer coats the connection part of the circuit assembly and the plurality of wire cores and the inner mold layer; the raw material for preparing the inner mold layer comprises the low-pressure molding material as claimed in any one of claims 1 to 5.
9. A method for forming a data line according to claim 8, wherein the method comprises the steps of:
(1) branching a plurality of wire cores exposed from a data wire body to form a wire sequence, performing injection molding on the surfaces of the plurality of wire cores by using a low-pressure molding material, fixing the plurality of wire cores to form an inner mold layer, and fixing the wire sequence; the plurality of wire cores exposed out of the inner mold layer are connected with the circuit assembly in the data wire connector to form a connecting part;
(2) and welding the circuit assembly and the plurality of wire cores, and coating the outer die layer to obtain the data wire.
10. The molding method according to claim 9, wherein the temperature of the injection molding in the step (1) is 170-190 ℃;
preferably, the pressure of the injection molding in the step (1) is 10-80 Bar.
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| CN202111483731.2A CN114276599A (en) | 2021-12-07 | 2021-12-07 | Low-pressure molding material, data line comprising same and molding method of data line |
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| CN109401044A (en) * | 2018-12-17 | 2019-03-01 | 上海至正道化高分子材料股份有限公司 | A kind of low-smoke halogen-free polyolefin cable material and preparation method thereof |
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| CN101805523A (en) * | 2010-04-06 | 2010-08-18 | 王文广 | Superfine biological powder filling masterbatch and method for preparing same |
| CN106009459A (en) * | 2016-06-18 | 2016-10-12 | 合肥浦尔菲电线科技有限公司 | Novel soft cable for data cable |
| CN108022686A (en) * | 2017-12-29 | 2018-05-11 | 东莞金信诺电子有限公司 | A kind of flexible sides frontier defense conduction high speed data lines |
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