CN114274617A - High-performance aluminum-based flame-retardant copper-clad plate and forming process thereof - Google Patents
High-performance aluminum-based flame-retardant copper-clad plate and forming process thereof Download PDFInfo
- Publication number
- CN114274617A CN114274617A CN202111367521.7A CN202111367521A CN114274617A CN 114274617 A CN114274617 A CN 114274617A CN 202111367521 A CN202111367521 A CN 202111367521A CN 114274617 A CN114274617 A CN 114274617A
- Authority
- CN
- China
- Prior art keywords
- parts
- weight
- aluminum
- clad plate
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to the technical field of copper-clad plates, in particular to a high-performance aluminum-based flame-retardant copper-clad plate and a forming process thereof; the aluminum-based LED lamp comprises an aluminum substrate, an insulating medium layer and an outer layer, wherein the outer side of the aluminum substrate is bonded with the inner side of the insulating medium layer, and the outer side of the insulating medium layer is fixedly connected with the inner side of the outer layer; according to the invention, the low-modulus high-thermal-conductivity adhesive is coated on the inner surface of the copper foil of the aluminum-based copper-clad plate, so that the aluminum-based copper-clad plate has the properties of high thermal conductivity, high bending resistance and the like, and the high-thermal-conductivity inorganic filler is introduced into the low-modulus adhesive, so that the low-modulus high-thermal-conductivity aluminum-based copper-clad plate can be prepared, and the application of the low-modulus high-thermal-conductivity aluminum-based copper-clad plate in the field of new-generation lighting LED carrier plates is facilitated.
Description
Technical Field
The invention relates to the technical field of copper-clad plates, in particular to a high-performance aluminum-based flame-retardant copper-clad plate and a forming process thereof.
Background
With the development of a new generation of high-power LED lighting technology, a higher heat dissipation requirement is provided for the heat dissipation of an LED packaging carrier plate, and meanwhile, a bendable function is required, so that the diversified design of lighting products is met.
In the prior art, for example, Chinese patent numbers are: CN 106945360A 'a processing method of an aluminum-based copper-clad plate and the aluminum-based copper-clad plate', comprising the following steps: 1) forming a hole with a certain aperture on the aluminum substrate; 2) soaking the back of the aluminum substrate in alkaline cleaning to remove oil stains; 3) carrying out anodic oxidation treatment on the back surface of the aluminum substrate; 4) carrying out surface roughening treatment on the front surface of the aluminum substrate and drying the whole aluminum substrate at the temperature of 80-90 ℃; 5) sequentially stacking a glass felt impregnated with epoxy resin, a first prepreg, a second prepreg and copper foil on the front surface of the aluminum substrate; 6) and (3) carrying out vacuum lamination on the unshaped copper-clad plate in the step 5) to obtain the aluminum-based copper-clad plate. The invention also discloses an aluminum-based copper-clad plate processed by the processing method, which comprises an aluminum substrate, wherein a glass felt layer, a first prepreg layer, a second prepreg layer and a copper foil layer are sequentially arranged on the front surface of the aluminum substrate from inside to outside. The aluminum-based copper-clad plate obtained by the invention has good machinability and dimensional stability. However, in the prior art, in order to improve the performance of the aluminum substrate, only the surface of the aluminum substrate is roughened or the structure of the aluminum-based copper-clad plate is added, and when the aluminum-based copper-clad plate is applied to the design of an LED heat dissipation circuit, the aluminum-based copper-clad plate still needs to have excellent bending resistance and peeling resistance.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a high-performance aluminum-based flame-retardant copper-clad plate and a forming process thereof, the invention coats a low-modulus high-heat-conductivity adhesive on the inner surface of a copper foil of the aluminum-based copper-clad plate to ensure that the aluminum-based copper-clad plate has high heat conductivity, high bending resistance and other properties, and the low-modulus adhesive is introduced with a high-heat-conductivity inorganic filler to prepare the low-modulus high-heat-conductivity aluminum-based copper-clad plate, thereby being more beneficial to the application of the low-modulus high-heat-conductivity aluminum-based copper-clad plate in the field of new-generation lighting LED carrier plates.
In order to achieve the purpose, the invention provides the following technical scheme:
the high-performance aluminum-based flame-retardant copper-clad plate comprises an aluminum substrate, an insulating medium layer and an outer layer, wherein the outer side of the aluminum substrate is bonded with the inner side of the insulating medium layer, the outer side of the insulating medium layer is fixedly connected with the inner side of the outer layer, the outer layer comprises a copper foil and a low-modulus high-heat-conductivity adhesive layer, the outer side of the low-modulus high-heat-conductivity adhesive layer is bonded with the inner side of the copper foil, and the inner side of the low-modulus high-heat-conductivity adhesive layer is bonded with the outer side of the insulating medium layer.
The invention is further provided with: the inner side of the copper foil and the outer side of the aluminum substrate are both rough surfaces.
The invention also provides a forming process of the high-performance aluminum-based flame-retardant copper-clad plate, which comprises the following steps:
s1, roughening the surfaces of the aluminum substrate and the copper foil;
s2, preparing low-modulus high-thermal-conductivity glue;
s3, preparing an insulating resin adhesive;
s4, coating glue;
s5, combining;
and S6, hot-press forming.
The invention is further provided with: in step S1, roughening the outer surface of the aluminum substrate and roughening the inner surface of the copper foil;
the treatment mode of the aluminum substrate comprises mechanical treatment and chemical treatment, namely sand blasting treatment and alkaline etching treatment;
the roughening treatment of the copper foil is acid electrolysis in chemical treatment.
The invention is further provided with: in the step S2, the low modulus high thermal conductive adhesive includes 80 to 120 parts by weight of silane modified polyether, 15 to 25 parts by weight of epoxy acrylate, 10 to 14 parts by weight of urethane acrylate, 10 to 12 parts by weight of polyether acrylate, 8 to 12 parts by weight of polyester acrylate, 4 to 7 parts by weight of acrylic resin, 2 to 4 parts by weight of photoinitiator, 40 to 60 parts by weight of viscosity reducer, 50 to 65 parts by weight of nano calcium carbonate, 1 to 3 parts by weight of thixotropic agent, 6 to 8 parts by weight of anti-aging agent, 1 to 3 parts by weight of water removing agent, and 0.5 to 1 part by weight of catalyst.
The invention is further provided with: in step S2, the preparation method of the low-modulus high-thermal-conductivity adhesive includes:
s20, putting the nano calcium carbonate into a 75-95 ℃ oven to remove water for 6-14 h;
s21, adding the silane modified polyether resin, the viscosity reducer, the thixotropic agent and the anti-aging agent into a double-planetary power mixer, and stirring for 0.5-1 h;
s22, adding epoxy acrylate, polyurethane acrylate, polyether acrylate, polyester acrylate, acrylic resin and a photoinitiator in batches, starting to heat to 90-110 ℃ after all the materials are added, and vacuumizing to-0.082-0.098 MPa;
s23, dehydrating at high temperature under negative pressure for 1-2h, cooling, adding a water removing agent when the temperature is reduced to 40-60 ℃, and stirring for 10-30 min;
and S24, adding a catalyst, stirring for 10-15min, and defoaming in vacuum for 15-20min to obtain the low-modulus high-heat-conductivity adhesive.
The invention is further provided with: in the step S3, the insulating resin paste includes: 80-120 parts of epoxy resin, 20-30 parts of dicyandiamide, 40-60 parts of dimethylformamide, 1-2 parts of dimethylimidazole, 40-60 parts of acetone, 10-20 parts of triethylamine, 80-100 parts of toluene, 15-20 parts of release agent and 62-78 parts of talcum powder.
The invention is further provided with: in step S3, the method for preparing the insulating resin adhesive includes:
s30, mixing and stirring the epoxy resin, the toluene, the acetone and the triethylamine for 0.5-1.5h to obtain a first-stage mixed solution;
s31, adding dicyandiamide, dimethylformamide, dimethyl imidazole and a film coating agent into the mixed solution, heating to 40-65 ℃, and stirring for 20-40min to obtain a secondary mixed solution;
and S32, adding talcum powder into the secondary mixed solution, and mixing and stirring for 10-15min in vacuum to obtain the insulating resin adhesive.
The invention is further provided with: in step S3, the low modulus high thermal conductive adhesive is uniformly applied to the inner surface of the copper foil, and the insulating resin adhesive is uniformly applied to the outer surface of the aluminum substrate.
Advantageous effects
Compared with the known public technology, the technical scheme provided by the invention has the following beneficial effects:
according to the invention, the low-modulus high-thermal-conductivity adhesive is coated on the inner surface of the copper foil of the aluminum-based copper-clad plate, so that the aluminum-based copper-clad plate has the properties of high thermal conductivity, high bending resistance and the like, and the high-thermal-conductivity inorganic filler is introduced into the low-modulus adhesive, so that the low-modulus high-thermal-conductivity aluminum-based copper-clad plate can be prepared, and the application of the low-modulus high-thermal-conductivity aluminum-based copper-clad plate in the field of new-generation lighting LED carrier plates is facilitated.
Drawings
FIG. 1 is a schematic structural diagram of a high-performance aluminum-based flame-retardant copper-clad plate;
fig. 2 is an enlarged schematic view of a point a in fig. 1.
Illustration of the drawings: 1. an aluminum substrate; 2. an insulating dielectric layer; 3. an outer layer; 30. copper foil; 31. Low modulus high thermal conductivity adhesive layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present invention will be further described with reference to the following examples.
Example 1
Referring to fig. 1 and 2, the high-performance aluminum-based flame-retardant copper-clad plate comprises an aluminum substrate 1, an insulating medium layer 2 and an outer layer 3, wherein the outer side of the aluminum substrate 1 is bonded with the inner side of the insulating medium layer 2, the outer side of the insulating medium layer 2 is fixedly connected with the inner side of the outer layer 3, the outer layer 3 comprises a copper foil 30 and a low-modulus high-heat-conductivity adhesive layer 31, the outer side of the low-modulus high-heat-conductivity adhesive layer 31 is bonded with the inner side of the copper foil 30, the inner side of the low-modulus high-heat-conductivity adhesive layer 31 is bonded with the outer side of the insulating medium layer 2, and the inner side of the copper foil 30 and the outer side of the aluminum substrate 1 are both rough surfaces.
The invention also provides a forming process of the high-performance aluminum-based flame-retardant copper-clad plate, which comprises the following steps:
firstly, roughening the surfaces of the aluminum substrate 1 and the copper foil 30:
the outer surface of the aluminum substrate 1 is roughened, and the inner surface of the copper foil 30 is roughened.
The aluminum substrate 1 is processed by mechanical processing and chemical processing, including sand blasting and alkaline etching, respectively.
The roughening treatment of the copper foil 30 is acid electrolysis in chemical treatment.
And step two, preparing the low-modulus high-thermal-conductivity adhesive, wherein the low-modulus high-thermal-conductivity adhesive comprises 120 parts by weight of silane modified polyether, 25 parts by weight of epoxy acrylate, 14 parts by weight of polyurethane acrylate, 12 parts by weight of polyether acrylate, 12 parts by weight of polyester acrylate, 7 parts by weight of acrylic resin, 4 parts by weight of photoinitiator, 60 parts by weight of viscosity reducer, 65 parts by weight of nano calcium carbonate, 3 parts by weight of thixotropic agent, 8 parts by weight of anti-aging agent, 3 parts by weight of water removing agent and 1 part by weight of catalyst.
The preparation method of the low-modulus high-heat-conductivity adhesive comprises the following steps:
20) and (3) putting the nano calcium carbonate into a 95 ℃ oven to remove water for 14 h.
21) Adding the silane modified polyether resin, the viscosity reducer, the thixotropic agent and the anti-aging agent into a double-planet power mixer, and stirring for 1 h.
22) Adding epoxy acrylate, polyurethane acrylate, polyether acrylate, polyester acrylate, acrylic resin and photoinitiator in batches, starting to heat to 110 ℃ after all the materials are added, and vacuumizing to-0.098 MPa.
23) Dewatering at high temperature and negative pressure for 2 hr, cooling, adding water removing agent when the temperature is reduced to 60 deg.C, and stirring for 30 min.
24) Adding a catalyst, stirring for 115min, and defoaming in vacuum for 20min to obtain the low-modulus high-heat-conductivity adhesive.
Step three, preparing an insulating resin adhesive, wherein the insulating resin adhesive comprises: 120 parts by weight of an epoxy resin, 30 parts by weight of dicyandiamide, 60 parts by weight of dimethylformamide, 2 parts by weight of dimethylimidazole, 60 parts by weight of acetone, 20 parts by weight of triethylamine, 100 parts by weight of toluene, 20 parts by weight of a mold release agent and 78 parts by weight of talc;
the preparation method of the insulating resin adhesive comprises the following steps:
30) epoxy resin, toluene, acetone and triethylamine are mixed and stirred for 1.5h to obtain first-grade mixed liquid.
31) Adding dicyandiamide, dimethylformamide, dimethyl imidazole and a coating agent into the mixed solution, heating to 65 ℃, and stirring for 40min to obtain a secondary mixed solution.
32) And adding talcum powder into the secondary mixed liquid, and mixing and stirring for 15min in vacuum to obtain the insulating resin adhesive.
Step four, coating glue: the low-modulus high-thermal-conductivity glue is uniformly coated on the inner surface of the copper foil 30, and the insulating resin glue is uniformly coated on the outer surface of the aluminum substrate 1.
Step five, combination: a plurality of aluminum substrates 1 coated with insulating resin glue are stacked and combined, and the copper foil 30 coated with low-modulus high-thermal-conductivity glue is wrapped on the outer surface of the aluminum substrate 1 combination.
Step six, hot-press forming: using a vacuum press at a temperature of 160 ℃ and a pressure of 50kg/cm2And (5) carrying out hot pressing for 5min to prepare the copper-clad plate.
Example 2
The high-performance aluminum-based flame-retardant copper-clad plate and the forming process thereof provided by the embodiment are substantially the same as those of the embodiment 1, and the main differences are as follows: the low-modulus high-thermal-conductivity adhesive comprises 80 parts by weight of silane modified polyether, 15 parts by weight of epoxy acrylate, 10 parts by weight of polyurethane acrylate, 10 parts by weight of polyether acrylate, 8 parts by weight of polyester acrylate, 4 parts by weight of acrylic resin, 2 parts by weight of photoinitiator, 40 parts by weight of viscosity reducer, 50 parts by weight of nano calcium carbonate, 1 part by weight of thixotropic agent, 6 parts by weight of anti-aging agent, 1 part by weight of water remover and 0.5 part by weight of catalyst.
Example 3
The high-performance aluminum-based flame-retardant copper-clad plate and the forming process thereof provided by the embodiment are substantially the same as those of the embodiment 1, and the main differences are as follows: the low-modulus high-thermal-conductivity adhesive comprises 100 parts by weight of silane modified polyether, 20 parts by weight of epoxy acrylate, 12 parts by weight of polyurethane acrylate, 11 parts by weight of polyether acrylate, 10 parts by weight of polyester acrylate, 5 parts by weight of acrylic resin, 3 parts by weight of photoinitiator, 50 parts by weight of viscosity reducer, 60 parts by weight of nano calcium carbonate, 2 parts by weight of thixotropic agent, 7 parts by weight of anti-aging agent, 2 parts by weight of water remover and 0.8 part by weight of catalyst.
Comparative example 1
The high-performance aluminum-based flame-retardant copper-clad plate and the forming process thereof provided by the embodiment are substantially the same as those of the embodiment 1, and the main differences are as follows: the photoinitiator was not added to the low modulus, high thermal conductivity gel pack.
Comparative example 2
The high-performance aluminum-based flame-retardant copper-clad plate and the forming process thereof provided by the embodiment are substantially the same as those of the embodiment 1, and the main differences are as follows: nano calcium carbonate is not added into the low-modulus high-thermal-conductivity rubber bag.
Comparative example 3
The high-performance aluminum-based flame-retardant copper-clad plate and the forming process thereof provided by the embodiment are substantially the same as those of the embodiment 1, and the main differences are as follows: no thixotropic agent was added to the low modulus, high thermal conductivity gel pack.
Performance testing
Taking the copper-clad plates prepared in the embodiments 1-3 and the comparative examples 1-3, and detecting the related performance of the prepared copper-clad plates, wherein the detection method comprises the following steps:
1. respectively detecting the flame retardant performance of the copper-clad plates according to the detection standard GB 20286-;
table 1 results table of copper clad laminate
2. Respectively detecting the bending resistance of the copper-clad plates according to the detection standard GB T9341-2000, and recording the obtained test results in a table 2;
table 2 anti-bending property detecting meter for copper clad laminate
| Test items | Bending Strength (/ N) |
| Example 1 | 192 |
| Example 2 | 171 |
| Example 3 | 186 |
| Comparative example 1 | 176 |
| Comparative example 2 | 190 |
| |
179 |
3. Impact toughness: selecting a 1kg drop weight with the height of 20cm and the sample size of 50mm multiplied by 50mm, respectively detecting the impact toughness of each copper-clad plate, and recording the obtained test result in a table 3;
TABLE 3 impact toughness testing table for copper clad laminate
By analyzing the relevant data in the tables, the copper-clad plate prepared by the invention has high bending resistance, excellent flame retardance and good anti-stripping performance, can be applied to the heat dissipation of the LED carrier plate of the new generation of illumination, puts forward higher requirements, and effectively solves the problem of pad cracking by using low-modulus high-thermal-conductivity coating resin to be coated on the inner surface of the copper foil. Therefore, the forming process of the high-performance aluminum-based flame-retardant copper-clad plate provided by the invention has wider market prospect and is more suitable for popularization.
According to the invention, the low-modulus high-thermal-conductivity adhesive is coated on the inner surface of the copper foil of the aluminum-based copper-clad plate, so that the aluminum-based copper-clad plate has the properties of high thermal conductivity, high bending resistance and the like, and the high-thermal-conductivity inorganic filler is introduced into a low-modulus high-performance epoxy resin system, so that the low-modulus high-thermal-conductivity aluminum-based copper-clad plate can be prepared, and the application of the low-modulus high-thermal-conductivity aluminum-based copper-clad plate in the field of new-generation lighting LED carrier plates is facilitated.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (9)
1. A high-performance aluminum-based flame-retardant copper-clad plate is characterized in that: the aluminum-based high-modulus heat-conducting adhesive plate comprises an aluminum substrate (1), an insulating medium layer (2) and an outer layer (3), wherein the outer side of the aluminum substrate (1) is bonded with the inner side of the insulating medium layer (2), the outer side of the insulating medium layer (2) is fixedly connected with the inner side of the outer layer (3), the outer layer (3) comprises a copper foil (30) and a low-modulus high-heat-conducting adhesive layer (31), the outer side of the low-modulus high-heat-conducting adhesive layer (31) is bonded with the inner side of the copper foil (30), and the inner side of the low-modulus high-heat-conducting adhesive layer (31) is bonded with the outer side of the insulating medium layer (2).
2. The high-performance aluminum-based flame-retardant copper-clad plate according to claim 1, characterized in that: the inner side of the copper foil (30) and the outer side of the aluminum substrate (1) are rough surfaces.
3. A molding process of a high-performance aluminum-based flame-retardant copper-clad plate is characterized in that the high-performance aluminum-based flame-retardant copper-clad plate according to any one of claims 1-2 is used, and comprises the following steps:
s1, roughening the surfaces of the aluminum substrate (1) and the copper foil (30);
s2, preparing low-modulus high-thermal-conductivity glue;
s3, preparing an insulating resin adhesive;
s4, coating glue;
s5, combining;
and S6, hot-press forming.
4. The forming process of the high-performance aluminum-based flame-retardant copper-clad plate according to claim 3, wherein in the step S1, the outer surface of the aluminum substrate (1) is roughened, and the inner surface of the copper foil (30) is roughened;
the treatment mode of the aluminum substrate (1) comprises mechanical treatment and chemical treatment, namely sand blasting treatment and alkaline etching treatment;
the roughening treatment of the copper foil (30) is acid electrolysis in chemical treatment.
5. The forming process of the high-performance aluminum-based flame-retardant copper-clad plate according to claim 3, wherein in the step S2, the low-modulus high-thermal-conductivity adhesive comprises 80-120 parts by weight of silane-modified polyether, 15-25 parts by weight of epoxy acrylate, 10-14 parts by weight of urethane acrylate, 10-12 parts by weight of polyether acrylate, 8-12 parts by weight of polyester acrylate, 4-7 parts by weight of acrylic resin, 2-4 parts by weight of photoinitiator, 40-60 parts by weight of viscosity reducer, 50-65 parts by weight of nano calcium carbonate, 1-3 parts by weight of thixotropic agent, 6-8 parts by weight of anti-aging agent, 1-3 parts by weight of water scavenger and 0.5-1 part by weight of catalyst.
6. The molding process of the high-performance aluminum-based flame-retardant copper-clad plate according to claim 5, wherein in the step S2, the preparation method of the low-modulus high-thermal-conductivity adhesive comprises the following steps:
s20, putting the nano calcium carbonate into a 75-95 ℃ oven to remove water for 6-14 h;
s21, adding the silane modified polyether resin, the viscosity reducer, the thixotropic agent and the anti-aging agent into a double-planetary power mixer, and stirring for 0.5-1 h;
s22, adding epoxy acrylate, polyurethane acrylate, polyether acrylate, polyester acrylate, acrylic resin and a photoinitiator in batches, starting to heat to 90-110 ℃ after all the materials are added, and vacuumizing to-0.082-0.098 MPa;
s23, dehydrating at high temperature under negative pressure for 1-2h, cooling, adding a water removing agent when the temperature is reduced to 40-60 ℃, and stirring for 10-30 min;
and S24, adding a catalyst, stirring for 10-15min, and defoaming in vacuum for 15-20min to obtain the low-modulus high-heat-conductivity adhesive.
7. The molding process of the high performance aluminum-based flame retardant copper-clad plate according to claim 3, wherein in the step S3, the insulating resin adhesive comprises: 80-120 parts of epoxy resin, 20-30 parts of dicyandiamide, 40-60 parts of dimethylformamide, 1-2 parts of dimethylimidazole, 40-60 parts of acetone, 10-20 parts of triethylamine, 80-100 parts of toluene, 15-20 parts of release agent and 62-78 parts of talcum powder.
8. The molding process of the high-performance aluminum-based flame-retardant copper-clad plate according to claim 3, wherein in the step S3, the preparation method of the insulating resin adhesive comprises the following steps:
s30, mixing and stirring the epoxy resin, the toluene, the acetone and the triethylamine for 0.5-1.5h to obtain a first-stage mixed solution;
s31, adding dicyandiamide, dimethylformamide, dimethyl imidazole and a film coating agent into the mixed solution, heating to 40-65 ℃, and stirring for 20-40min to obtain a secondary mixed solution;
and S32, adding talcum powder into the secondary mixed solution, and mixing and stirring for 10-15min in vacuum to obtain the insulating resin adhesive.
9. The forming process of the high-performance aluminum-based flame-retardant copper-clad plate according to claim 3, wherein in the step S3, the low-modulus high-thermal-conductivity adhesive is uniformly coated on the inner surface of the copper foil (30), and the insulating resin adhesive is uniformly coated on the outer surface of the aluminum substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111367521.7A CN114274617A (en) | 2021-11-18 | 2021-11-18 | High-performance aluminum-based flame-retardant copper-clad plate and forming process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111367521.7A CN114274617A (en) | 2021-11-18 | 2021-11-18 | High-performance aluminum-based flame-retardant copper-clad plate and forming process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114274617A true CN114274617A (en) | 2022-04-05 |
Family
ID=80869402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111367521.7A Pending CN114274617A (en) | 2021-11-18 | 2021-11-18 | High-performance aluminum-based flame-retardant copper-clad plate and forming process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114274617A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114654829A (en) * | 2022-04-09 | 2022-06-24 | 江西鑫远基电子科技有限公司 | Aluminum-based copper-clad plate with high breakdown voltage and production process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1405260A (en) * | 2001-12-18 | 2003-03-26 | 黄堂杰 | Adhensive for producing cladding film of flexible printed circuit board and preparation method thereof |
| CN101654004A (en) * | 2008-08-22 | 2010-02-24 | 金安国纪科技股份有限公司 | Method for manufacturing CTI copper-clad laminate |
| CN101735558A (en) * | 2008-11-07 | 2010-06-16 | 福建新世纪电子材料有限公司 | Glue solution for copper-clad plate |
| CN103722807A (en) * | 2013-12-17 | 2014-04-16 | 浙江伟弘电子材料开发有限公司 | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof |
| CN103849186A (en) * | 2014-03-24 | 2014-06-11 | 宁波三泓新材料科技有限公司 | UV curing radiating composition, radiating film and preparation method of composition |
-
2021
- 2021-11-18 CN CN202111367521.7A patent/CN114274617A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1405260A (en) * | 2001-12-18 | 2003-03-26 | 黄堂杰 | Adhensive for producing cladding film of flexible printed circuit board and preparation method thereof |
| CN101654004A (en) * | 2008-08-22 | 2010-02-24 | 金安国纪科技股份有限公司 | Method for manufacturing CTI copper-clad laminate |
| CN101735558A (en) * | 2008-11-07 | 2010-06-16 | 福建新世纪电子材料有限公司 | Glue solution for copper-clad plate |
| CN103722807A (en) * | 2013-12-17 | 2014-04-16 | 浙江伟弘电子材料开发有限公司 | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof |
| CN103849186A (en) * | 2014-03-24 | 2014-06-11 | 宁波三泓新材料科技有限公司 | UV curing radiating composition, radiating film and preparation method of composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114654829A (en) * | 2022-04-09 | 2022-06-24 | 江西鑫远基电子科技有限公司 | Aluminum-based copper-clad plate with high breakdown voltage and production process thereof |
| CN114654829B (en) * | 2022-04-09 | 2023-11-17 | 江西鑫远基电子科技有限公司 | Aluminum-based copper-clad plate with high breakdown voltage and production process thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108219371B (en) | Epoxy resin composition, prepreg, laminate, and printed wiring board | |
| WO2011152412A1 (en) | Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition | |
| CN103342895A (en) | Thermosetting resin composition as well as prepreg and laminated board manufactured by using same | |
| CN113004856B (en) | high-Tg thermosetting resin composition and preparation method and application thereof | |
| CN114274617A (en) | High-performance aluminum-based flame-retardant copper-clad plate and forming process thereof | |
| CN113912981A (en) | High-heat-resistance medium-Tg copper-clad plate and preparation method thereof | |
| TWI788549B (en) | Resin composition, prepreg and laminate | |
| CN116239777A (en) | Modified bismaleimide prepolymer, resin composition and application of resin composition | |
| CN109971175B (en) | Modified maleimide resin composition, prepreg and laminated board prepared from same | |
| CN103665864A (en) | Glue solution for copper-clad laminate and preparation method thereof | |
| CN111662435A (en) | Insulating substrate and preparation method and application thereof | |
| CN114316264B (en) | Modified bismaleimide prepolymer, resin composition and application thereof | |
| CN108219134B (en) | Prepolymer and resin composition of modified composite bismaleimide resin, and prepreg and laminated board manufactured by using prepolymer and resin composition | |
| CN114149659B (en) | Resin composition and use thereof | |
| KR20210030900A (en) | Insulating dielectric film, manufacturing method thereof, and multilayer printed circuit board | |
| CN114230794B (en) | Modified bismaleimide prepolymer, resin composition and application | |
| JP5866806B2 (en) | Epoxy resin composition, prepreg using this epoxy resin composition, resin film with support, metal foil-clad laminate and multilayer printed wiring board | |
| CN113292824B (en) | Long-chain alkyl polyphenyl ether resin composition and application thereof | |
| JP6304294B2 (en) | Epoxy resin composition, prepreg using this epoxy resin composition, resin film with support, metal foil-clad laminate and multilayer printed wiring board | |
| CN111849122A (en) | Resin composition and application thereof | |
| EP3778685A1 (en) | Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package | |
| CN116120560A (en) | Preparation method of modified bismaleimide prepolymer, resin composition and application of resin composition | |
| CN110862653B (en) | Halogen-free resin composition, RCC, adhesive film and metal foil-clad laminate | |
| CN114262437A (en) | Modified bismaleimide prepolymer and resin composition thereof, prepreg, laminated board and metal foil laminated board | |
| JP5460322B2 (en) | Thermosetting resin composition and cured product thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |