CN114271582A - Insole for treating diabetic foot - Google Patents
Insole for treating diabetic foot Download PDFInfo
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- CN114271582A CN114271582A CN202111556054.2A CN202111556054A CN114271582A CN 114271582 A CN114271582 A CN 114271582A CN 202111556054 A CN202111556054 A CN 202111556054A CN 114271582 A CN114271582 A CN 114271582A
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- insole
- layer
- thickness
- diabetic foot
- treating diabetic
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Abstract
The invention discloses an insole for treating diabetic feet, which comprises an insole surface layer, an insole middle layer and an insole bottom layer which are arranged from top to bottom in sequence; the two ends of the bottom layer of the insole are thick, and the arch of the foot is thin; the surface of the middle layer of the insole is provided with a thickened part which is arranged at the phalanges and the heel. The invention can relieve foot discomfort and pain of diabetic foot patients.
Description
Technical Field
The invention relates to the technical field of insoles, in particular to an insole for treating diabetic foot.
Background
Diabetic foot is a foot infection, ulcer and deep tissue destruction caused by lower limb nerve and vascular disease in diabetic patients. Today the incidence of diabetic foot is rising gradually and it has a severe impact on the patient's daily life, even when the critically ill person is at risk of amputation. The existing insoles can not solve the problems.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide an insole for treating diabetic feet, which can relieve the foot discomfort and pain of patients with diabetic feet.
In order to achieve the purpose, the invention adopts the technical scheme that:
an insole for treating diabetic foot comprises an insole surface layer 1, an insole middle layer 2 and an insole bottom layer 3 which are arranged from top to bottom in sequence;
the two ends of the insole bottom layer 3 are thick, and the arch of the foot is thin;
the surface of the middle layer 2 of the insole is provided with a thickened part 2-1, and the thickened part 2-1 is arranged at the phalanges and the heel.
The insole bottom layer 3 is made of PU (polyurethane) materials, the insole middle layer 2 is made of EVA (ethylene-vinyl acetate) materials, and the insole surface layer 1 is made of bamboo fiber polyester silk fabrics.
The bamboo fiber polyester silk fabric of the insole surface layer 1 is provided with 5-8mm of extension to form an extension part 1-1, and the extension part 1-1 is attached to the edges of the insole bottom layer 3 and the insole middle layer 2 to wrap the edge parts.
The insole surface layer 1, the insole middle layer 2 and the insole bottom layer 3 are bonded through epoxy resin.
The thickness of the insole bottom layer 3 is 3-6mm, the arch part 3-2 of the insole bottom layer 3 has an upward bending radian which is 2mm higher than the lowest part of the insole, the hollow part 3-1 of the material center of the heel part is 2mm thick, and the upper and lower intervals are 2 mm.
The thickness of 2mm in the middle layer of the insole is 2-4mm, the thickness of 2mm in the common part is 2mm, the thickness of 2-1 in the thickened part is 2mm in the first two phalanges, the thickness of 1mm in the fifth phalange and the area nearby the fifth phalange, the thickness of 2mm in the heel area, and all hemispheres are thick in the middle and become thinner gradually to the periphery.
The invention has the beneficial effects that:
the invention changes the structure and the local thickness of the insole through the data of the pressure peak value, achieves the purposes of fitting with the foot, buffering the pressure and absorbing shock, has simple structure and convenient operation, and can effectively relieve the discomfort of a patient when wearing shoes.
The invention has soft and comfortable surface and avoids secondary damage to patients.
The invention adopts light materials, is light and flexible, is convenient for patients to use, and reduces the foot burden of the patients.
Drawings
FIG. 1 is a schematic layered view of the diabetic foot insole of the present invention.
FIG. 2 is a top view of the middle layer of the diabetic foot insole of the present invention.
FIG. 3 is an overall cross-sectional view of the diabetic foot insole of the present invention.
Illustration of the drawings:
1. the surface layer of the insole; 2. a middle layer of insole; 3. a shoe pad bottom layer; 1-1, an extension part; 2-1, thickening part; 3-1, hollow part; 3-2 and arch part.
Detailed Description
The present invention will be described in further detail with reference to examples.
As shown in fig. 1-3, the insole for treating diabetic foot according to the present invention is divided into a bottom layer, a middle layer and a surface layer, wherein the bottom layer 3 of the insole is made of PU polyurethane, the middle layer 2 of the insole is made of EVA, the surface layer 1 of the insole is made of bamboo fiber and polyester silk fabric, and the layers are bonded with each other by epoxy resin. The thickness of the bottom layer 3 of the diabetic foot insole is 3-6mm, the two ends are thick, the arch of the foot is thin, the arch part 3-2 has an upward bending radian which is 2mm higher than the lowest part of the insole, the hollow part 3-1 in the center of the heel material is 2mm thick, and the distance between the upper part and the lower part is 2 mm. Is beneficial to ulcer isolation and relieves the oscillation pressure during walking.
The thickness of 2 in the middle layer of the diabetic foot insole is 2-4mm, the thickness of 2mm in common parts is 2-1 phalanges and the heel parts are thickened, the hemispherical appearance is adopted, the honeycomb structure local enlarged view shown in the attached drawing 2-1 is arranged inside the diabetic foot insole, the first phalanx shown in 2-1 is thickened by 2mm, the fifth phalanx and the area nearby the fifth phalanx are thickened by 1mm, the heel area is thickened by 2mm, and all hemispheres are thick in the middle and gradually thinned towards the periphery. The effect of dispersion is facilitated, the pressure is relieved, and the buffering effect is achieved.
The bamboo fiber polyester silk fabric on the surface layer of the diabetic foot insole is provided with 5-8mm of extension, and the extension part 1-1 is attached to the edges of the bottom layer and the middle layer to wrap the edge parts of the bottom layer and the middle layer. The epoxy resin used by the diabetic foot insole is heat-resistant and moisture-resistant polyphenol glycidyl ether epoxy resin. The bamboo fiber polyester silk fabric is formed by warp and weft interweaving of bamboo carbon fiber yarns and polyester yarns, and has the characteristics of softness, comfort, air permeability and antibiosis.
The working principle of the invention is as follows:
when in use, a patient holds the insole by hands, the insole is slightly inwards concaved to form an arc and is lightly fed into a shoe, and the fabric at the front sole of the insole is fed in by being attached to the lining of the shoe until the insole is completely attached to the sole.
Claims (6)
1. An insole for treating diabetic foot is characterized by comprising an insole surface layer (1), an insole middle layer (2) and an insole bottom layer (3) which are arranged from top to bottom in sequence;
the two ends of the insole bottom layer (3) are thick, and the arch of the foot is thin;
the surface of the middle layer (2) of the insole is provided with a thickened part (2-1), and the thickened part (2-1) is arranged at the phalange part and the heel part.
2. The insole for treating diabetic foot according to claim 1, wherein the bottom insole layer (3) is made of PU polyurethane material, the middle insole layer (2) is made of EVA material, and the surface insole layer (1) is made of bamboo fiber and polyester silk fabric.
3. The insole for treating diabetic foot according to claim 2, wherein the bamboo fiber polyester silk fabric of the insole surface layer (1) is provided with 5-8mm extensions to form extension parts (1-1), and the extension parts (1-1) are attached to the edges of the insole bottom layer (3) and the insole middle layer (2) to wrap the edge parts.
4. The insole for treating diabetic foot according to claim 1, wherein the surface layer (1), the middle layer (2) and the bottom layer (3) are bonded by epoxy resin.
5. The insole for treating diabetic foot according to claim 1, wherein the thickness of the insole base layer (3) is 3-6mm, the arch part (3-2) of the insole base layer (3) has an upward curvature 2mm higher than the lowest part of the insole, and the heel part has a hollow part (3-1) in the center of the material, the thickness of which is 2mm and the interval is 2 mm.
6. The insole for treating diabetic foot according to claim 1, wherein the thickness of the middle layer (2) of the insole is 2-4mm, the thickness of the common part is 2mm, the thickness of the thickened part (2-1) is hemispherical, the thickness of the thickened part (2-1) is 2mm in the first two phalanges, the thickness of the fifth phalanges is 1mm in the area near the fifth phalanges, the thickness of the heel area is 2mm, and all hemispheres are thick in the middle and gradually thinner towards the periphery.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111556054.2A CN114271582A (en) | 2021-12-17 | 2021-12-17 | Insole for treating diabetic foot |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111556054.2A CN114271582A (en) | 2021-12-17 | 2021-12-17 | Insole for treating diabetic foot |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114271582A true CN114271582A (en) | 2022-04-05 |
Family
ID=80873544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111556054.2A Withdrawn CN114271582A (en) | 2021-12-17 | 2021-12-17 | Insole for treating diabetic foot |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114271582A (en) |
-
2021
- 2021-12-17 CN CN202111556054.2A patent/CN114271582A/en not_active Withdrawn
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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WW01 | Invention patent application withdrawn after publication |
Application publication date: 20220405 |
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WW01 | Invention patent application withdrawn after publication |