CN1142694A

CN1142694A - Methanically trimmable conductor structure

Info

Publication number: CN1142694A
Application number: CN 96107408
Authority: CN
Inventors: W·齐尔瓦斯; D·贝托尔德
Original assignee: Siemens AG
Current assignee: Siemens AG
Priority date: 1995-05-16
Filing date: 1996-05-16
Publication date: 1997-02-12
Also published as: AU5230996A; BR9602274A; DE19517967A1; EP0743695A1

Abstract

In a receiver used to transfer signals with a speed of tens of gigabits per second, it is necessary to adjust the delay time between the time path and the data path so as to minimize bit error rate. In view of current technology, the adjustment to the delay time is done through the thermocompression of a microstrip conductor deposited on a ceramic substrate, while in the invention, it is done through forming a first conductor structure with an interrupted segment on a first ceramic substrate and a second conductor structure made of a 180-degree arc and two extended line segments at the two ends on a second substrate; the second substrate is made of glass so that the conductor structures are clearly visible when the two substrates are moved respectively, thus the conductors can be positioned at the optimum positions.

Description

Conductor structure that can mechanical adjustment

The present invention relates to a kind of conductor structure that can change time of delay, more particularly, relate to a kind of being used for to conductor structure tens GHz frequencies, that have the variable delay time.

When transmission of digital signals, because the different deformation that will cause each signal pulse of decay with each segment pulse phase delay time.Therefore be necessary that after transmission these signal pulses that will be received are reducing aspect amplitude, pulsewidth and the phase place.Wherein, adopting the phase adjusted loop wire to produce clock pulse at receiving terminal usually aspect pulsewidth and the phase place reduction by received signal.Here, up to being necessary during tens of kilomegabit each second best compensation is carried out in each pulse the time of delay in signal and data path and beat path mutually in frequency.Thereby normally in signal path or beat path, insert the different length lead of different time of delays for this reason, for example such lead is done by welding be fixed up desired time of delay on the ceramic substrate and when adjusting.The shortcoming of this scheme is, can only be divided into that thick or thin some levels are adjusted time of delay and each change of time of delay all needs again welding, can only finish with suitable and more valuable equipment and weld.Adopt this class scheme can not carry out adjusting rapidly and flexibly.

Therefore, task of the present invention is, further develops the conductor structure that a kind of this paper begins described type, thereby even can realize active wires structure length and poor, the time of delay of xor signal and the continuous as far as possible change of signal phase.

This task is to solve by the conductor structure that a kind of this paper begins described type according to the present invention, and is described as total design of claim 1.

The advantage of solution of the present invention do not need to be supplementary equipment therefore can realize for example carrying out with simple method the adjustment again of necessity of causing because of connect component aging, and is not only that the expert just can carry out.Be described in claim 2 to 6 based on the preferential embodiment that adopts of the conductor structure of the present invention of microwave circuit common technology.

By means of the embodiment shown in the accompanying drawings the present invention is further set forth below.

Accompanying drawing 1 illustrates first substrate with deposit microstrip conductor; And

Accompanying drawing 2 illustrates second substrate with other microstrip conductor.

In Fig. 1, two pairs of deposits respectively have two microstrip conductor L1 that are parallel to each other, L3 and L2, L4 on a substrate K who is made of pottery.The two pairs of microstrip conductors respectively from substrate K opposed side edges A, B is initial and extend to the centre of substrate surface, from here they all to the approximate rectangular turning of the 3rd side C or D and extend in parallel one section predetermined length.Like this, just obtained first line construction of forming by four parallel microstrip conductors in this scope.

These microstrip conductors are made of gold, gold directly evaporates by a mask and is evaporating on substrate K on the substrate K or behind adhesion layer of deposit, also can at first evaporate or electroplate deposit last layer planar structure, go out the microstrip conductor figure by corresponding mask etch in the above then.

Second substrate G shown in Fig. 2 is made of glass, adopts the technology identical with first substrate second line construction that deposit is made of the parallel microstrip conductor LG1 of two other, LG2 on this substrate.This microstrip conductor LG1, LG2 shape have the line segment that extends in parallel as two sections 180 ° circular arc, and wherein, the spacing of two microstrip conductors and width thereof are identical with the parameter of first line construction.

One cover conductor structure is made of substrate K, places second substrate G on it, and wherein, the prolongation line segment of 180 ° of circular arcs of second line construction is with the microstrip conductor of first line construction electrically contacts and they are replenished is complete lead.The position of second line construction is illustrated on Fig. 1 among the area B E.By the side A of the second substrate G and the first substrate K, B parallel moved " U " shape waveguide cell as adjustable in length that works the effective length that changes this lead, and wherein the length of two microstrip conductors changes simultaneously.Wherein, for adjustment, a common mechanical clamping device is enough, and this hold down gag is fixed second substrate G to prevent its slip.After adjustment, after successfully being adjusted to optimal site, two substrates are mutually permanently connected in other words, this finishes with solder with simple method.

Wherein, the second substrate G adopts the advantage of glass material to be both can see that first also can see second on-chip conductor structure, thereby can easily realize best location.In addition, because the dielectric constant of the permittivity ratio microwave ceramics of glass is little a lot, it is very little therefore to be subjected to the interference of microstrip conductor field distribution on second substrate in the field distribution of microstrip conductor on first substrate.Adopt conductor structure of the present invention as phase shifter when about 10GHz frequency, its phase adjustment range is about 300 °, and path attenuation is about 2dB.

Except glass, also can adopt other transparent material, for example quartz or sapphire.

Claims

1. be used for to tens GHz frequencies, have the conductor structure of variable delay time,

It is characterized in that,

Go up two pairs of deposits at first substrate (K) and respectively have two microstrip conductor (L1 that are parallel to each other ... L4), these two pairs of microstrip conductors are respectively by substrate (K) dual-side (A, B) extension in the middle of substrate surface relatively, and be the turning of approximate right angle to the 3rd side (C) at this, thereby obtain first line construction of constituting by four microstrip conductors that on predetermined length, are parallel to each other in this zone

Go up configuration by two other parallel microstrip conductor (LG1 at second transparent substrate (G), LG2) second line construction of Gou Chenging, it is shaped as the parallel segment of 180 ° of circular arcs and two ends prolongation, wherein, these spacings that prolong line segments and width are identical with relevant parameter on first line construction, and

Second substrate (G) is placed on first substrate (K), makes the microstrip conductor of the prolongation line segment at 180 ° of circular arc two ends and first line construction electrically contact and they are replenished to be continuous lead.

2. according to the described conductor structure of claim 1, it is characterized in that first substrate (K) is a ceramic substrate, preferentially select for use the aluminium dioxide material to constitute.

3. according to the described conductor structure of claim 1, it is characterized in that second substrate is made of glass material.

4. according to the described conductor structure of claim 1, it is characterized in that these microstrip conductors mainly are made of gold, gold directly or through an adhesion layer is deposited on the substrate.

5. according to the described conductor structure of claim 1, it is characterized in that in order to adjust conductor structure, first and second substrates (K, G) can move with respect to first or second side of first substrate (K) are parallel mutually at least.

6. according to the described conductor structure of claim 1, it is characterized in that, after adjusting, first and second substrates (K, G) are mutually permanently connected, particularly welding.