CN114266335A - Solid-state memory card - Google Patents
Solid-state memory card Download PDFInfo
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- CN114266335A CN114266335A CN202111613634.0A CN202111613634A CN114266335A CN 114266335 A CN114266335 A CN 114266335A CN 202111613634 A CN202111613634 A CN 202111613634A CN 114266335 A CN114266335 A CN 114266335A
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- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000007787 solid Substances 0.000 claims abstract description 6
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- 229940044442 onfi Drugs 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
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- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
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- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
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Abstract
The present invention provides a solid state memory card comprising: the device comprises a substrate, a CFexpress Type A interface module, a controller module and a storage module, wherein the CFexpress Type A interface module, the controller module and the storage module are fixed on the substrate; the two ends of the controller module are respectively connected to the CFexpress Type A interface module and the storage module, and the controller module is configured to perform read-write operation on data in the storage module; the specification of the solid-state memory card is the same as that of the CFExpress Type a memory card. According to the invention, the CFexpress Type A interface module, the controller module and the storage module are fixed on the substrate, so that the difficulty of production and processing is reduced, and the solid-state memory card is convenient to debug and maintain. And, through setting up the specification of solid-state storage card and the same with the specification of CFExpress Type A memory card, satisfied the miniaturized demand of solid-state storage card.
Description
Technical Field
The invention relates to the technical field of data solid-state storage, in particular to a solid-state storage card.
Background
At present, the development of the film and television industry is very rapid, the shooting pixels of a high-end camera generally rise to 4K and 8K, the performance requirements of shooting and recording video are high, a new generation of CFexpress series memory card is produced, and the shooting and recording requirements of the high-end camera are met. Among them, CFExpress series memory cards are mainly classified into three types: type A supports PCIE3.0x1 transmission interface; type B supports PCIE3.0x2 transmission interface; type C supports PCIE3.0x4 transport interfaces. Since the size of Type a memory cards is very small, CFExpress Type a memory cards are currently very few on the market, with the major vendor on the market being sony.
However, the Package of the CFExpress Type a memory card sold by sony is a System In Package (SIP), and the SIP Package is an integrated Package, and only the interface is visible from the outside and the components inside are not visible. The debugging is very limited, no interface and method capable of debugging exist, no positioning and maintenance method exists when problems occur, and only the processing can be abandoned when faults occur.
Disclosure of Invention
In view of the above, a solid-state memory card is needed to solve the technical problem that the CFExpress Type a memory card in the prior art cannot be debugged and maintained due to the integration of the package.
In order to solve the above technical problem, the present invention provides a solid-state memory card, including: the device comprises a substrate, a CFexpress Type A interface module, a controller module and a storage module, wherein the CFexpress Type A interface module, the controller module and the storage module are fixed on the substrate;
the two ends of the controller module are respectively connected to the CFexpress Type A interface module and the storage module, and the controller module is configured to perform read-write operation on data in the storage module;
the specification of the solid-state memory card is the same as that of the CFExpress Type a memory card.
In some possible implementation manners, the storage module includes a plurality of flash memory chips and a package shell, the package shell and the substrate enclose to form an accommodating space, the plurality of flash memory chips are disposed in the accommodating space, and the plurality of flash memory chips are packaged on the substrate through a package structure.
In some possible implementations, the package size of the memory module is 8mm by 13 mm.
In some possible implementations, the package structure is a ball grid array package structure.
In some possible implementations, the storage module further includes a transmission interface, and the controller module is connected to the transmission interface; the maximum transmission rate of the transmission interface is 1.2 Gbps.
In some possible implementations, the interface transmission protocol between the controller module and the storage module is ONFI and Toggle.
In some possible implementations, the substrate is a printed circuit board.
In some possible implementations, the controller module is a non-cache controller module.
In some possible implementations, the controller module supports nand boot startup, and the controller module supports PCIE3.0 × 1.
In some possible implementations, the CFExpress Type a interface module is an interface module that does not require installation of a driver and supports hot plugging.
The beneficial effects of adopting the above embodiment are: compared with the integrated package in the prior art, the solid-state memory card provided by the invention has the advantages that the CFexpress Type A interface module, the controller module and the memory module are fixed on the substrate, namely: the solid-state storage card adopts the scheme that the three separation components and parts of the base plate and the CFexpress Type A interface module, the controller module and the storage module are added, and can be directly fixed on the base plate through welding or other modes with the three separation components and parts of the CFexpress Type A interface module, the controller module and the storage module, so that the difficulty of production and processing is reduced. And, when the solid-state storage card broke down, can directly see CFExpress Type A interface module, controller module and storage module to can debug and maintain CFExpress Type A interface module, controller module and storage module, make the solid-state storage card be convenient for debug and maintain. In addition, the solid-state memory card can meet the performance of the CFExpress Type A memory card by arranging the CFExpress Type A interface module. Further, the requirement for miniaturization of the solid-state memory card is met by setting the specification of the solid-state memory card to be the same as that of the CFExpress Type A memory card.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a solid-state memory card provided in the present invention;
fig. 2 is a schematic structural diagram of a memory module according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the embodiments of the present invention, "a plurality" means two or more unless otherwise specified.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The present invention provides a solid state memory card, which is described separately below.
Fig. 1 is a schematic structural diagram of an embodiment of a solid-state memory card according to an embodiment of the present invention, and as shown in fig. 1, a solid-state memory card 10 includes: a substrate 100, and a CFExpress Type a interface module 200, a controller module 300, and a memory module 400 fixed to the substrate 100;
two ends of the controller module 300 are respectively connected to the CFExpress Type a interface module 200 and the storage module 400, and the controller module 300 is configured to perform read-write operation on data in the storage module 400;
the specification of the solid-state memory card 10 is the same as that of the CFExpress Type a memory card.
In the solid-state memory card 10 in the embodiment of the present invention, a scheme of adding three separate components, namely, the CFExpress Type a interface module 200, the controller module 300, and the memory module 400, to the substrate 100 is adopted, and the three separate components, namely, the CFExpress Type a interface module 200, the controller module 300, and the memory module 400, can be directly fixed on the substrate 100 by welding or other methods, so that difficulty in production and processing is reduced. Moreover, when the solid-state memory card 10 fails, the CFExpress Type a interface module 200, the controller module 300, and the memory module 400 can be directly seen, and the CFExpress Type a interface module 200, the controller module 300, and the memory module 400 can be debugged and maintained, so that the solid-state memory card is convenient to debug and maintain.
Compared with the integrated package in the prior art, the solid-state memory card 10 provided in the embodiment of the present invention reduces the difficulty of production and processing by fixing the CFExpress Type a interface module 200, the controller module 300, and the memory module 400 on the substrate 100, and facilitates debugging and maintenance of the solid-state memory card 10. In addition, the present invention enables the solid-state memory card 10 to satisfy the performance of the CFExpress Type a memory card by providing the CFExpress Type a interface module 200. Further, by setting the specification of the solid-state memory card 10 to be the same as that of the CFExpress Type a memory card, the demand for miniaturization of the solid-state memory card 10 is satisfied.
Herein, the CFExpress Type a interface module 200 refers to an interface module supporting the CFExpress Type a interface standard.
In order to further reduce the size of the memory module 400, so as to achieve the specification of the solid-state memory card 10 being the same as the specification of the CFExpress Type a memory card, in some embodiments of the invention, as shown in fig. 2, the memory module 400 includes a plurality of flash memory chips 410 and a package 420, the package 420 and the substrate 100 enclose to form an accommodating space 421, the plurality of flash memory chips 410 are disposed in the accommodating space 421, and the plurality of flash memory chips 410 are packaged on the substrate 100 through a packaging structure.
Since flash memory die 410 is an unpackaged electronic device chip, embodiments of the present invention provide a memory module 400 comprising a plurality of flash memory dies 410 and a package 420, namely: the unpackaged flash memory wafer 410 is disposed in the accommodating space 421, and the unpackaged flash memory wafer 410 is packed by the packing case 420, so that the size of the memory module 400 can be reduced, and the specification of the solid-state memory card 10 is the same as that of the CFExpress Type a memory card.
Further, by providing the flash memory chip 410, the technical effect of increasing the storage capacity of the memory module 400 can be achieved even when the memory module 400 has the same volume.
Furthermore, when different storage capacities are required, only the number of the flash memory chips 410 needs to be increased, decreased or deleted, and other parts of the solid-state memory card 10 do not need to be modified, so that the cost of realizing different storage capacities of the solid-state memory card 10 is reduced, and the applicability of the solid-state memory card 10 is improved.
The number of the flash memory chips 410 can be adjusted according to actual requirements, when the required storage capacity of the memory module 400 is larger, more flash memory chips 410 are required, and when the required storage capacity of the memory module 400 is smaller, fewer flash memory chips 410 are required.
In a specific embodiment of the present invention, the storage capacity of the storage module 400 is 64GB to 512GB, the read-write performance of the storage module 400 reaches PCIE3.1 × 1, and the continuous read-write performance reaches above 700 MB/s.
In one embodiment of the present invention, the package size of the memory module 400 is 8mm by 13 mm.
Namely: by the memory module 400 structure in the embodiment of the invention, the packaging size of the memory module 400 can be reduced, and the miniaturization requirement of the solid-state memory card 10 can be further met.
In some embodiments of the present invention, the package housing 420 may be made of at least one of ceramic, epoxy, thermoplastic, metal, and the like.
To further reduce the volume of the memory module 400, in some embodiments of the invention, the Package structure is a Ball Grid Array Package (BGA).
The BGA packaging structure has high integration level, and compared with other packaging structures, the BGA packaging structure can improve the memory capacity by two to three times under the condition that the memory volume is not changed. Therefore, the embodiment of the invention can further reduce the volume of the memory module 400 by setting the package structure to be the ball grid array package structure, thereby ensuring that the solid-state memory card 10 meets the miniaturization requirement.
In some embodiments of the present invention, as shown in fig. 1, the memory module 400 further includes a transmission interface 430, and the controller module 300 is connected to the transmission interface 430; the maximum transmission rate of the transmission interface 430 is 1.2 Gbps.
In some embodiments of the present invention, the interface transmission protocol between the controller module 300 and the memory module 400 is ONFI and Toggle.
Specifically, the interface transmission protocols between the controller module 300 and the storage module 400 are ONFI4.0 and toggle4.0.
To reduce the cost of manufacturing solid-state memory card 10, in some embodiments of the present invention, the substrate is a Printed Circuit Board (PCB).
It should be understood that: in some embodiments of the present invention, the solid-state memory card 10 further includes a housing (not shown in the figures), and by providing the housing, the CFExpress Type a interface module 200, the controller module 300, and the memory module 400 can be prevented from being exposed to the air, thereby improving the security of the solid-state memory card 10 and improving the aesthetic property thereof.
It should be noted that: the shell is detachably connected with the substrate 100, and the shell is detachably connected with the substrate 100 by arranging the shell, so that the shell can be detached from the substrate 100 when the solid-state storage card 10 fails, the fault can be positioned and maintained, and the convenience of fault positioning and maintenance of the solid-state storage card 10 is improved.
In some embodiments of the present invention, the controller module 300 is a cache-less controller module.
By setting the controller module 300 as a non-cache controller module, it is possible to avoid a decrease in data transmission rate due to a data caching process, that is: the data read/write speed of the controller module 300 can be further increased, and thus the data read/write speed of the controller module 300 can be increased.
In one embodiment of the present invention, the controller module 300 employs the marvell 88SS1322 controller scheme. The controller module 300 supports nand boot startup, and the controller module 300 supports PCIE3.0 × 1.
By setting the controller module 300 to support nand boot startup, initialization of the controller module 300 can be realized, and sequential reliability in a subsequent data transmission process is ensured.
It should be noted that: in order to minimize the size of the controller module 300 while implementing the controller module 300 to control data read and write operations in the memory module 400, in a preferred embodiment of the present invention, the controller module 300 is of a simplest design, and peripheral circuits thereof are simplified as much as possible, thereby reducing the size of the controller module 300.
In some embodiments of the present invention, the CFExpress Type A interface module 200 is an interface module that does not require installation of a driver and supports hot plugging.
By setting the CFExpress Type a interface module 200 as an interface module that does not require a driver to be installed and supports hot plugging, the portability of the CFExpress Type a interface module 200 can be improved.
In one embodiment of the present invention, the CFExpress Type a interface module 200 may be a USB interface module supporting CFExpress Type a.
The solid-state memory card provided by the present invention is described in detail above, and the principle and the implementation of the present invention are explained in the present document by applying specific examples, and the description of the above examples is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A solid state memory card, comprising: the device comprises a substrate, a CFexpress Type A interface module, a controller module and a storage module, wherein the CFexpress Type A interface module, the controller module and the storage module are fixed on the substrate;
the two ends of the controller module are respectively connected to the CFexpress Type A interface module and the storage module, and the controller module is configured to perform read-write operation on data in the storage module;
the specification of the solid-state memory card is the same as that of the CFExpress Type a memory card.
2. The solid-state memory card of claim 1, wherein the memory module comprises a plurality of flash memory chips and a package casing, the package casing and the substrate enclose a receiving space, the plurality of flash memory chips are disposed in the receiving space, and the plurality of flash memory chips are packaged on the substrate through a package structure.
3. The solid state memory card of claim 2, wherein the package size of the memory module is 8mm x 13 mm.
4. The solid state memory card of claim 2, wherein the package structure is a ball grid array package structure.
5. The solid-state memory card of claim 2, wherein the memory module further comprises a transport interface, the controller module being connected to the transport interface; the maximum transmission rate of the transmission interface is 1.2 Gbps.
6. The solid-state memory card of claim 1, wherein interface transmission protocols between the controller module and the memory module are ONFI and Toggle.
7. The solid state memory card of claim 1 or 2, wherein the substrate is a printed circuit board.
8. The solid-state memory card of claim 1, wherein the controller module is a cache-less controller module.
9. The solid-state memory card of claim 1, wherein the controller module supports nand boot startup and the controller module supports PCIE3.0x 1.
10. The solid-state memory card of claim 1, wherein the CFExpress Type a interface module is an interface module that does not require a driver to be installed and supports hot plug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111613634.0A CN114266335A (en) | 2021-12-27 | 2021-12-27 | Solid-state memory card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111613634.0A CN114266335A (en) | 2021-12-27 | 2021-12-27 | Solid-state memory card |
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| CN114266335A true CN114266335A (en) | 2022-04-01 |
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| CN202111613634.0A Pending CN114266335A (en) | 2021-12-27 | 2021-12-27 | Solid-state memory card |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2781459Y (en) * | 2004-12-02 | 2006-05-17 | 华腾微电子（上海）有限公司 | Flash card with special capacity |
| CN103959386A (en) * | 2011-11-02 | 2014-07-30 | 莫塞德技术公司 | Flash memory module and memory subsystem |
| TW201433924A (en) * | 2013-02-21 | 2014-09-01 | Hon Hai Prec Ind Co Ltd | Storage expansion system |
| JP3212373U (en) * | 2017-06-26 | 2017-09-07 | 群翊科技股▲ふん▼有限公司 | CF express card structure |
| CN210723023U (en) * | 2019-11-29 | 2020-06-09 | 力成科技（苏州）有限公司 | BGA packaging structure |
| CN213458109U (en) * | 2020-10-16 | 2021-06-15 | 群翊科技股份有限公司 | Assembling structure of memory card |
-
2021
- 2021-12-27 CN CN202111613634.0A patent/CN114266335A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2781459Y (en) * | 2004-12-02 | 2006-05-17 | 华腾微电子（上海）有限公司 | Flash card with special capacity |
| CN103959386A (en) * | 2011-11-02 | 2014-07-30 | 莫塞德技术公司 | Flash memory module and memory subsystem |
| TW201433924A (en) * | 2013-02-21 | 2014-09-01 | Hon Hai Prec Ind Co Ltd | Storage expansion system |
| JP3212373U (en) * | 2017-06-26 | 2017-09-07 | 群翊科技股▲ふん▼有限公司 | CF express card structure |
| CN210723023U (en) * | 2019-11-29 | 2020-06-09 | 力成科技（苏州）有限公司 | BGA packaging structure |
| CN213458109U (en) * | 2020-10-16 | 2021-06-15 | 群翊科技股份有限公司 | Assembling structure of memory card |
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