CN114264928A

CN114264928A - Inspection apparatus, inspection system, and inspection method

Info

Publication number: CN114264928A
Application number: CN202111125718.XA
Authority: CN
Inventors: 今堀翔也
Original assignee: Espec Corp
Current assignee: Espec Corp
Priority date: 2020-10-01
Filing date: 2021-09-24
Publication date: 2022-04-01

Abstract

The invention provides an inspection apparatus, an inspection system and an inspection method. The inspection device (2A) is provided with a test controller (13) and a system controller (11) which control boundary scan testing of the circuit board (100), and the system controller (11) causes the test controller (13) to execute the boundary scan testing of the circuit board (100) in a state where the environment forming device (3) applies three degrees of freedom or more of oscillating pressure to the circuit board (100). Therefore, the time required by the test can be shortened, and the reliability of the actual product can be improved.

Description

Inspection apparatus, inspection system, and inspection method

Technical Field

The present invention relates to an inspection apparatus, an inspection system, and an inspection method, and more particularly, to an inspection apparatus, an inspection system, and an inspection method for performing a boundary scan test on an inspection object.

Background

As one type of inspection for a circuit board, a boundary scan Test (boundary scan Test) is known, in which a semiconductor device according to JTAG (Joint Test Action Group) is mounted on the circuit board. In the boundary scan test, a semiconductor device mounted on a circuit board is mainly inspected for a defective soldering and a defective opening or short-circuiting of a plurality of wirings between the semiconductor devices. Japanese patent laid-open publication No. 2000-148528 discloses a test system for performing a boundary scan test with an integrated circuit based on JTAG as an object.

Actual products shipped through a mass production process may be used in a severe environment subject to various environmental factors such as vibration and temperature. However, according to the test system disclosed in patent document 1, since the use state of the actual product is not estimated when the boundary scan test is performed, there is a problem that the reliability of the actual product is low. Further, there is a problem that shortening of the time required for the test is required to reduce the test cost.

Disclosure of Invention

The invention aims to obtain an inspection device, an inspection system and an inspection method which can shorten the time required for testing and improve the reliability of actual products.

An inspection apparatus according to an aspect of the present invention is communicably connected to an environment forming apparatus capable of housing at least one circuit board as an inspection target, the inspection apparatus including: a test control unit for controlling a boundary scan test of the circuit board; and a main control part, wherein the main control part enables the test control part to execute the boundary scan test on the circuit board under the condition that the environment forming device applies more than three degrees of freedom of vibration pressure on the circuit board.

Another aspect of the present invention relates to an inspection system including: an environment forming device capable of accommodating at least one circuit board as an inspection object; and an inspection apparatus communicably connected to the environment forming apparatus, wherein the inspection apparatus has: a test control unit for controlling a boundary scan test of the circuit board; and a main control part, wherein the main control part enables the test control part to execute the boundary scan test on the circuit board under the condition that the environment forming device applies more than three degrees of freedom of vibration pressure on the circuit board.

An inspection method according to still another aspect of the present invention includes the steps of: applying, by an environment forming device, a three-degree-of-freedom or more oscillating pressure to at least one circuit board housed in the environment forming device; and a step of performing a boundary scan test on the circuit board in a state where the vibration pressure is applied to the circuit board by the environment forming device.

According to the invention, the time required by the test can be shortened, and the reliability of the actual product can be improved.

Drawings

Fig. 1 is a simplified diagram showing the configuration of an inspection system according to an embodiment of the present invention.

Fig. 2 is a block diagram showing a simplified configuration of the inspection apparatus.

Fig. 3 is a block diagram showing a simplified configuration of the environment forming apparatus.

Fig. 4 is a diagram showing a first example of the mode of applying the vibration pressure to the circuit board.

Fig. 5 is a diagram showing a second example of the mode of applying the vibration pressure to the circuit board.

Fig. 6 is a diagram showing a third example of the mode of applying the vibration pressure to the circuit board.

Fig. 7 is a diagram showing a fourth example of the mode of applying the vibration pressure to the circuit board.

Fig. 8 is a diagram showing a fifth example of the application pattern of the vibration pressure to the circuit board.

Fig. 9 is a diagram showing a first example of the timing of execution of the boundary scan test on the circuit board.

Fig. 10 is a diagram showing a second example of the timing of execution of the boundary scan test on the circuit board.

Fig. 11 is a diagram showing a third example of the timing of execution of the boundary scan test on the circuit board.

Fig. 12 is a diagram showing a fourth example of the timing of execution of the boundary scan test on the circuit board.

Fig. 13 is a block diagram showing a simplified configuration of an inspection apparatus according to a modification.

Fig. 14 is a simplified diagram showing the configuration of the scanner unit.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same reference numerals denote the same or corresponding elements.

Fig. 1 is a simplified diagram showing the configuration of an inspection system 1 according to an embodiment of the present invention. As shown in fig. 1, the inspection system 1 includes an inspection apparatus 2 and an environment forming apparatus 3 which are communicably connected to each other. The environment forming apparatus 3 is an environment testing apparatus for performing an environment test on a test product in a design and development stage of a product. However, the environment formation device 3 may be a screening device for performing a screening test on an actual product in a pre-shipment test of the product. The inspection apparatus 2 is an apparatus including a control unit for executing a boundary scan test on an inspection target housed in the environment forming apparatus 3. The inspection object is a circuit board on which a semiconductor device according to jtag (joint Test Action group) is mounted. In the boundary scan test, a semiconductor device mounted on a circuit board is mainly inspected for a defective soldering and a defective opening or short-circuiting of a plurality of wirings between the semiconductor devices.

Fig. 2 is a block diagram showing a simplified configuration of the inspection apparatus 2 (2A). As shown in the connection relationship of fig. 2, the inspection apparatus 2A includes a system controller 11 (main control unit), a chamber monitor 12, a test controller 13 (test control unit), a storage unit 14, a display unit 15, and a communication unit 16.

The test controller 13 is a controller for controlling a boundary scan test performed on a circuit board 100 (details will be described later) as an inspection target in accordance with control from the system controller 11. The test controller 13 performs processing such as generation of test data (test pattern) and generation of test clock in the boundary scan test. The test controller 13 is connected to the relay unit 17.

The system controller 11 includes a processor such as a CPU and memories such as a ROM and a RAM, and controls the overall operation of the system. The system controller 11 causes the test controller 13 to perform the boundary scan test on the circuit board 100 in a state where the environment forming device 3 applies a prescribed environmental pressure to the circuit board 100.

The storage unit 14 is any storage device such as a semiconductor memory or a hard disk. The display unit 15 is an arbitrary display device such as a liquid crystal display or an organic EL display. The system controller 11 and the chamber monitor 12 are connected to each other by, for example, an RS-232C cable. The system controller 11 and the test controller 13 are connected to each other by, for example, a USB cable. The communication unit 16 and a communication unit 21 (details will be described later) of the environment forming apparatus 3 are connected to each other by an RS-485 cable, for example.

Fig. 3 is a simplified diagram showing the configuration of the environment forming apparatus 3. In the example of the present embodiment, as the environment forming apparatus 3, a halt (high Accelerated Limit test) apparatus, a hass (high Accelerated Stress screen) apparatus, or a hasa (high Accelerated Stress audit) apparatus is used. The HALT test apparatus is mainly used for testing a test product, and continues to apply environmental pressure until the test product fails (until a defective portion is detected) in order to identify a defective portion of the test product in the environment. The HASS test apparatus and the HASA test apparatus are mainly objects to be inspected. The HASS test is a total inspection in which all actual products are subjected to the inspection, and the HASA test is a sampling inspection in which a part of actual products are subjected to the inspection. The HALT test apparatus, the HASS test apparatus, or the HASA test apparatus can realize a highly accelerated test by applying a vibration pressure (vibration stress) and/or a temperature pressure (temperature stress) to an inspection target exceeding an assumed range (specification range) of a usage state of an actual product. As the vibration pressure, a vibration pressure of six degrees of freedom can be applied by vibrations in the extending direction and the rotating direction of each of the orthogonal 3 axes (the X axis and the Y axis in the horizontal plane and the Z axis in the plumb direction). However, the vibration pressure may be applied in three degrees of freedom or more which may occur in the use condition of the actual product or exceed the assumed range of the use condition of the actual product. The vibration pressure in six degrees of freedom (three or more degrees of freedom) is different from the vibration in both the uniaxial and biaxial directions, and is a compound vibration that may occur in the use condition of the actual product or exceed the assumed range of the use condition of the actual product. By using the vibration pressure of six degrees of freedom (three or more degrees of freedom), the reliability of the inspection object can be evaluated in a shorter time. The vibration acceleration can be arbitrarily set in a range of, for example, 5 to 75 (Grms). As the temperature pressure, a temperature pressure in a wide temperature range (for example, -100 to +200 ℃) and rapidly changing (for example, 70 ℃ C./min on average) may be applied.

As shown in fig. 3, the environment forming apparatus 3 includes an air conditioning room 23 and a chamber 24 surrounded by a heat insulating casing 25. A blower 26 for air circulation, a heater 27 for heating, and a nozzle 28 for spraying liquid nitrogen for cooling are disposed in the air conditioning room 23. The nozzle 28 is connected to a liquid nitrogen tank 31 disposed outside the environment forming apparatus 3 via a pipe 29. A valve 30 for controlling whether or not liquid nitrogen can be supplied from a tank 31 to the nozzle 28 is provided in the pipe 29. The conditioned air generated in the conditioned room 23 is supplied from the conditioned room 23 into the chamber 24 through the supply port 42 as indicated by arrow a, circulates in the chamber 24, and is discharged from the chamber 24 into the conditioned room 23 through the exhaust port 41.

A flat plate-like vibration table 32 is disposed in the chamber 24. The vibration table 32 is swingably supported by a support member 34 via a spring 33, and the support member 34 is fixed to the side of the housing 25. The vibration table 32 is driven by an actuator 35, thereby realizing the six-degree-of-freedom vibration. The actuator 35 is configured by using a plurality of (for example, 5) cylinders or the like having different movement directions. The supply and exhaust of compressed air are repeated in a short cycle for each cylinder, thereby realizing a vibration motion in each cylinder.

A circuit board 100 to be inspected is fixed to the upper surface of the vibration table 32 in the chamber 24 by a fixing member 38. Although not shown, a semiconductor device such as a Field Programmable Gate Array (FPGA) based on a jtag (joint Test Action group) is mounted on the printed wiring board 100 by soldering or the like using a connection method such as a Ball Grid Array (BGA) or the like. A cable 40 for communicating data (test data, test result data, and the like) of the boundary scan test is connected to the circuit board 100. The cable 40 is led out to the outside of the housing 25 via a cable hole 39 formed in a side wall of the housing 25, and is connected to the relay unit 17 shown in fig. 2. The circuit board 100 housed in the environment forming apparatus 3 and the test controller 13 of the inspection apparatus 2A are connected to each other through the cable 40 and the relay unit 17.

The environment forming apparatus 3 includes an environment controller 22, a communication unit 21, a temperature sensor 37, and a vibration sensor 36. The temperature sensor 37 is disposed within the chamber 24. The vibration sensor 36 is configured using an acceleration sensor or the like, and is disposed on the vibration table 32.

The environment controller 22 includes a processor such as a CPU and a memory such as a ROM and a RAM. The environment controller 22 controls the driving of the heater 27, the valve 30, and the actuator 35 by the respective control signals. The application of temperature pressure and the application of vibration pressure to the circuit board 100 are controlled by the environmental controller 22.

Temperature data indicating the temperature in the chamber 24 detected by the temperature sensor 37 is input to the environment controller 22. The environment controller 22 feedback-controls the heater 27 and the valve 30 based on the temperature data input from the temperature sensor 37, and thereby can control the temperature in the chamber 24 to a target value. Vibration data indicating the vibration acceleration of the vibration table 32 detected by the vibration sensor 36 is input to the environment controller 22. The environment controller 22 feedback-controls the actuator 35 based on the vibration data input from the vibration sensor 36, so that the vibration acceleration of the vibration table 32 can be controlled to a target value.

These temperature data and vibration data are input from the environment controller 22 to the chamber monitor 12 (see fig. 2) via the

communication units

21 and 16. Accordingly, the state (temperature and vibration) of the chamber 24 of the environment forming apparatus 3 can be monitored by the chamber monitor 12 of the inspection apparatus 2A.

Fig. 4 is a diagram showing a first example of the application pattern (pattern) of the vibration pressure to the circuit board 100. The abscissa axis of the graph represents elapsed time, and the ordinate axis represents the magnitude of vibration acceleration. In the first example, the environmental controller 22 maintains the vibration acceleration of the vibration table 32 at a constant value throughout the period from the start of the test to the end of the test. Accordingly, a constant vibration pressure is applied to the circuit board 100 throughout the period from the start of the test to the end of the test.

Fig. 5 is a diagram showing a second example of the mode of applying the vibration pressure to the circuit board 100. In the second example, the environment controller 22 alternately repeats a period in which the vibration table 32 is vibrated (a period in which the vibration becomes "ON" by setting the vibration acceleration to a predetermined value) and a period in which the vibration table 32 is not vibrated (a period in which the vibration becomes "OFF" by setting the vibration acceleration to zero). Accordingly, a period in which the vibration pressure is applied to the circuit board 100 (ON period) and a period in which the vibration pressure is not applied (OFF period) are alternately repeated. The length of the ON period and the length of the OFF period may be the same or different. Further, the vibration acceleration may be a constant value or a variable value during the ON period.

Fig. 6 is a diagram showing a third example of the mode of applying the vibration pressure to the circuit board 100. In the third example, the environment controller 22 alternately repeats a period in which the vibration table 32 is vibrated largely (a period in which the vibration is "large" by setting the vibration acceleration to a value larger than a certain reference value) and a period in which the vibration table 32 is vibrated to a small extent (a period in which the vibration is "small" by setting the vibration acceleration to a value smaller than the reference value). Accordingly, a period (large period) in which a large vibration pressure is applied to the circuit board 100 and a period (small period) in which a small vibration pressure is applied are alternately repeated. The length of the large period and the length of the small period may be the same or different. In addition, the vibration acceleration may be a constant value or a variable value in each of the large period and the small period.

Fig. 7 is a diagram showing a fourth example of the mode of applying the vibration pressure to the circuit board 100. In the fourth example, the environment controller 22 gradually changes the vibration acceleration to a large value in a stepwise manner as time passes. Accordingly, the vibration pressure gradually increasing in a stepwise shape as time passes is applied to the circuit board 100. In addition, contrary to the example shown in fig. 7, a vibration pressure that gradually decreases in a stepwise manner with the passage of time may be applied to the circuit board 100. The increase width or the decrease width of the vibration acceleration changed in a stepwise manner may be a constant value or a variable value. Further, the vibration pressure may be increased in a stepwise manner and decreased in a stepwise manner.

Fig. 8 is a diagram showing a fifth example of the application pattern of the vibration pressure to the circuit board 100. In the fifth example, the environmental controller 22 gradually changes the vibration acceleration to a large value in a straight line shape with the passage of time. Accordingly, a vibration pressure that gradually increases linearly is applied to the circuit board 100 with the passage of time. In contrast to the example shown in fig. 8, a vibration pressure that gradually decreases linearly with the passage of time may be applied to the circuit board 100. Further, the vibration pressure may be linearly increased and linearly decreased in combination.

The environment controller 22 may perform all the application modes of the vibration pressure shown in fig. 4 to 8 to the circuit board 100, or may perform only 1 application mode. Further, the environment controller 22 may be executed on the circuit board 100 in any combination of the application modes of the vibration pressure shown in fig. 4 to 8. For example, the following manners and the like may be performed in combination.

The second example (fig. 5) is executed after the first example (fig. 4).

The ON period and the OFF period in the second example (fig. 5) and the large period and the small period in the third example (fig. 6) are mixed.

The OFF period of the second example (fig. 5) or the small period of the third example (fig. 6) is inserted in the middle of the fourth example (fig. 7) or the fifth example (fig. 8).

In addition, the environmental controller 22 may apply not only the vibration pressure but also the temperature pressure to the circuit board 100. Information indicating which application mode should be executed is set in advance in the environment controller 22 according to the type of the circuit board 100 and the like.

In the inspection apparatus 2A according to the present embodiment shown in fig. 2, the system controller 11 causes the test controller 13 to execute the boundary scan test on the circuit board 100 in a state where the environment forming apparatus 3 applies the vibration pressure (and the temperature pressure) to the circuit board 100. In the following description, an example in which the system controller 11 determines the timing to execute the boundary scan test will be described, but the present invention is not limited to this example. The test controller 13 may be provided with the same functions as those of the system controller 11, so that the test controller 13 determines the timing of executing the boundary scan test. In this case, the test controller 13 has a function as a test control unit for controlling the boundary scan test and a function as a main control unit for causing the test control unit to execute the boundary scan test and determining the execution timing of the boundary scan test. In the following description, an example in which the inspection apparatus 2A is provided with the system controller 11 and the test controller 13 individually is described, but the present invention is not limited to this example. The inspection apparatus 2A may include 1 controller having the functions of the system controller 11 and the test controller 13. In this case, the 1 controller has a function as the test control unit and a function as the main control unit.

Fig. 9 is a diagram showing a first example of the timing of executing the boundary scan test on the circuit board 100. The abscissa axis of the graph represents elapsed time, and the ordinate axis represents the magnitude of vibration acceleration. Further, an arrow P indicates a timing of performing the boundary scan test. As the mode of applying the vibration pressure, the example shown in fig. 5 is employed. The test controller 13 performs a plurality of boundary scan tests on the circuit board 100. In the first example shown in fig. 9, the execution interval of the boundary scan test is constant at an interval W0 (referred to as "constant mode") regardless of whether the vibration pressure is in the ON period or the OFF period.

Fig. 10 is a diagram showing a second example of the timing of execution of the boundary scan test on the circuit board 100. As the mode of applying the vibration pressure, the example shown in fig. 5 is employed. The test controller 13 performs a plurality of boundary scan tests on the circuit board 100. In the second example shown in fig. 10, the system controller 11 makes the execution intervals of the boundary scan test different according to the application condition of the vibration pressure. Specifically, the system controller 11 sets the execution interval of the boundary scan test to a relatively wide interval W11 during the OFF period (for example, time T0 to T1) in which the magnitude of the vibration pressure is smaller than the first predetermined value. In addition, the system controller 11 sets the interval at which the boundary scan test is executed to an interval W12 narrower than the interval W11 (referred to as "a fluctuation mode corresponding to the magnitude of the oscillation pressure") during the ON period (for example, time T3 to T4) in which the magnitude of the oscillation pressure is equal to or greater than the first predetermined value.

According to this example, since a failure is likely to occur when the magnitude of the vibration pressure is equal to or greater than the first predetermined value, the system controller 11 can early detect the occurrence of a failure by setting the execution interval of the boundary scan test to be short. On the other hand, since the failure is less likely to occur when the magnitude of the vibration pressure is smaller than the first predetermined value, the system controller 11 can avoid an increase in the data amount of the test result by setting the execution interval of the boundary scan test to be longer.

As another example, the system controller 11 may vary the execution interval of the boundary scan test according to the application time of the vibration pressure. Specifically, the system controller 11 measures the application time of the vibration pressure to the circuit board 100 from the start of the test, and sets the execution interval of the boundary scan test to a relatively wide interval W11 in the case where the application time of the vibration pressure is less than the second predetermined value. When the application time of the vibration pressure is equal to or longer than the second predetermined value, the system controller 11 sets the execution interval of the boundary scan test to an interval W12 narrower than the interval W11 (referred to as "a variation pattern corresponding to the application time of the vibration pressure").

According to this example, since a failure is likely to occur when the application time of the vibration pressure is equal to or longer than the second predetermined value, the system controller 11 can early detect the occurrence of a failure by setting the execution interval of the boundary scan test to be short. On the other hand, since the failure is less likely to occur when the application time of the vibration pressure is less than the second predetermined value, the system controller 11 can avoid an increase in the data amount of the test result by setting the execution interval of the boundary scan test to be longer.

In contrast to the above, by setting the interval of execution of the boundary scan test to be long in a situation where a failure is likely to occur and setting the interval of execution of the boundary scan test to be short in a situation where a failure is unlikely to occur, a failure occurring in the circuit board 100 can be reliably detected, and the occurrence of a failure can be detected early.

Fig. 11 is a diagram showing a third example of the timing of execution of the boundary scan test on the circuit board 100. As the mode of applying the vibration pressure, the example shown in fig. 7 is employed. The system controller 11 makes the execution interval of the boundary scan test different according to the application condition of the vibration pressure. Specifically, the system controller 11 sets the execution interval of the boundary scan test to a relatively wide interval W21 during the OFF period (time T0 to T1) in which no vibration pressure is applied. In addition, the system controller 11 sets the execution interval of the boundary scan test to the interval W22 narrower than the interval W21 during the next period (time T1 to T2) in which the magnitude of the vibration pressure increases by 1 step. In addition, the system controller 11 sets the execution interval of the boundary scan test to the interval W23 narrower than the interval W22 during the next period (time T2 to T3) in which the magnitude of the vibration pressure rises by 1 step again. In this way, the system controller 11 sets the execution interval of the boundary scan test to be gradually narrowed every time the magnitude of the vibration pressure rises by 1 step.

According to this example, since the occurrence of a failure is more likely as the vibration pressure is larger, the system controller 11 can early detect the occurrence of a failure by setting the execution interval of the boundary scan test to be shorter. On the other hand, since the smaller the vibration pressure, the more difficult the failure occurs, the system controller 11 can avoid an increase in the data amount of the test result by setting the execution interval of the boundary scan test to be longer.

In addition, contrary to the above, the boundary scan test execution interval may be set to be long in a situation where a failure is likely to occur, and the boundary scan test execution interval may be set to be short in a situation where a failure is unlikely to occur. In this case, the occurrence of a defect in the circuit board 100 can be reliably detected, and the occurrence of a defect can be detected at an early stage.

Fig. 12 is a diagram showing a fourth example of the timing of execution of the boundary scan test on the circuit board 100. As the mode of applying the vibration pressure, the example shown in fig. 7 is employed. Furthermore, not only the vibration pressure but also the temperature pressure is applied. In conjunction with 1 cycle of the temperature cycle (for example, time T3 to T5), the magnitude of the vibration pressure increases by 1 step. The system controller 11 makes the execution interval of the boundary scan test different according to the application condition of the temperature pressure. Specifically, the system controller 11 sets the interval at which the boundary scan test is executed to a relatively wide interval W31 during a period (temperature maintaining period) in which the temperature and pressure do not change, that is, during a period which is substantially constant (including both a case where the temperature and pressure are completely constant and a case where the temperature and pressure slightly change with a change width smaller than a predetermined value). In addition, the system controller 11 sets the interval at which the boundary scan test is executed to an interval W32 narrower than the interval W31 (referred to as "a variation pattern corresponding to the temperature-pressure application condition") during the period in which the magnitude of the temperature pressure changes (temperature change period).

According to this example, since a failure is likely to occur during a period in which the magnitude of the temperature pressure changes, the system controller 11 can early detect the occurrence of a failure by setting the execution interval of the boundary scan test to be short. On the other hand, since a failure is unlikely to occur while the temperature and pressure are constant, the system controller 11 can avoid an increase in the data amount of the test result by setting the execution interval of the boundary scan test to be long.

In addition, in contrast to the above, the interval of execution of the boundary scan test in the temperature maintaining period may be set to be shorter than the interval of execution of the boundary scan test in the temperature changing period. In this case, even during the temperature maintenance period in which the occurrence of the failure is difficult, the occurrence of the failure in the circuit board 100 can be reliably detected, and the occurrence of the failure can be detected early.

The system controller 11 may set the execution interval of the boundary scan test to the relatively wide interval W31 while the magnitude of the vibration pressure is constant, and set the execution interval of the boundary scan test to the interval W32 narrower than the interval W31 while the magnitude of the vibration pressure is changing. In this case, since a failure is likely to occur during the period in which the magnitude of the vibration pressure changes, the system controller 11 can detect a failure occurring in the circuit board 100 at an early stage by setting the execution interval of the boundary scan test to be short.

As another example, the system controller 11 may vary the execution interval of the boundary scan test according to the detection status of the defective portion by the boundary scan test. Specifically, the system controller 11 may count the number of defective portions detected by the boundary scan test based on the test result data received from the environment forming apparatus 3. When the count value of the defective portion number (the cumulative value from the start of the test) is smaller than the third predetermined value, the system controller 11 sets the execution interval of the boundary scan test to a relatively wide interval W31. When the count value of the number of defective portions is equal to or greater than the third predetermined value, the system controller 11 sets the execution interval of the boundary scan test to an interval W32 narrower than the interval W31 (referred to as "a variation pattern corresponding to the detection condition of defective portions").

According to this example, when the number of defective portions detected by the boundary scan test is equal to or greater than the third predetermined value, since other defects are likely to occur, the system controller 11 can early detect the occurrence of other defects by setting the execution interval of the boundary scan test to be short. On the other hand, when the number of defective portions detected by the boundary scan test is smaller than the third predetermined value, since a defect is unlikely to occur, the system controller 11 can avoid an increase in the data amount of the test result by setting the execution interval of the boundary scan test to be long.

In contrast to the above, the execution interval of the boundary scan test in the case where the number of detected defective portions is smaller than the third predetermined value may be set to be shorter than the execution interval of the boundary scan test in the case where the number of detected defective portions is equal to or larger than the third predetermined value. In this case, even in a situation where a defect is unlikely to occur, the occurrence of the defect in the circuit board 100 can be reliably detected, and the occurrence of the defect can be detected early.

In addition, when the example shown in fig. 4 is adopted as the mode of applying the vibration pressure, the system controller 11 may adopt any one of a constant method, a method of varying the application time corresponding to the vibration pressure, a method of varying the detection condition corresponding to the defective portion, and a method of varying the application condition corresponding to the temperature pressure as the execution interval of the boundary scan test.

In addition, when the examples shown in fig. 5 to 8 are employed as the mode of applying the vibration pressure, the system controller 11 may employ any one of a constant method, a method of varying according to the magnitude of the vibration pressure, a method of varying according to the application time of the vibration pressure, a method of varying according to the detection state of the defective portion, and a method of varying according to the application condition of the temperature pressure as the execution interval of the boundary scan test.

The system controller 11 determines that the circuit board 100 has failed when the number of defective detections (or the defective detection ratio) in a predetermined unit period of the boundary scan test exceeds a predetermined threshold. Even if a soldering failure such as a crack occurs in the circuit board 100, if the degree of the failure is small, the crack may accidentally come into contact at the time of detection, and the failure may not be detected. When the degree of defect progresses due to the application of the vibration pressure, even if the detection timing overlaps the OFF period, the crack is not in contact and is highly likely to be detected as a defect. Therefore, by performing the failure determination based on the number of times of failure detection (or the failure detection ratio) in a predetermined unit period, it is possible to detect that the failure degree has progressed.

< generalization >

According to the inspection apparatus 2 of the present embodiment, the circuit board 100 to be inspected is housed in the environment forming apparatus 3, and the system controller 11 (main control unit) causes the test controller 13 (test control unit) to execute the boundary scan test on the circuit board 100 in a state where the environment forming apparatus 3 applies the oscillating pressure of three degrees of freedom or more to the circuit board 100. As described above, by performing the boundary scan test on the circuit board 100 in a state where the oscillating pressure of three degrees of freedom or more exceeding the assumed range of the usage state of the actual product is applied to the circuit board 100, it is possible to promote the occurrence of the defect in the circuit board 100 and to accurately evaluate the occurred defective portion. As a result, the time required for the test can be shortened, and the reliability of the actual product can be improved.

Further, by using a HALT test apparatus, a HASS test apparatus, or a HASA test apparatus as the environment forming apparatus 3, it is possible to apply a vibration pressure of six degrees of freedom or more and a temperature pressure which is wide in temperature range and rapidly changes to the circuit board 100. As a result, the occurrence of defects in the circuit board 100 can be effectively promoted.

< modification example >

Fig. 13 is a block diagram showing a simplified configuration of the inspection apparatus 2(2B) according to the modification. The scanner unit 18 is added to the configuration shown in fig. 2. In the present modification, the environment forming apparatus 3 accommodates a plurality of circuit boards 100(100_1 to 100_ N) of the same type. A plurality of circuit boards 100_1 to 100_ N are connected in parallel to the relay unit 17. The respective circuit boards 100 and the relay unit 17 are connected to each other by 5 wirings of 1 group for connecting ports such as TDI (test data input), TCK (test clock), TMS (test mode select), TRST (test reset), and TDO (test data output). The "(N)" mark in fig. 13 is a group of N sets of parallel wirings between the circuit boards 100_1 to 100_ N and the relay unit 17. The scanner unit 18 switches the connection between the test controller 13 and the circuit boards 100_1 to 100_ N in such a manner that one circuit board 100 of the circuit boards 100_1 to 100_ N is connected to the test controller 13.

The system controller 11 causes the scanner unit 18 to repeatedly execute a connection process of sequentially connecting one circuit board 100 to the test controller 13 in a state where the environment forming apparatus 3 applies an environmental pressure to the plurality of circuit boards 100_1 to 100_ N. The system controller 11 causes the test controller 13 to execute the boundary scan test on one circuit board 100 in conjunction with the connection process, thereby executing the boundary scan test on each of the plurality of circuit boards 100_1 to 100_ N a plurality of times. Here, "interlocked" means that the connection switching by the scanner unit 18 and the boundary scan test by the test controller 13 are synchronized with each other.

Fig. 14 is a simplified diagram showing the structure of the scanner unit 18. The scanner unit 18 has a plurality of channels C (C1-CN) having the same number (or more) as the plurality of circuit boards 100_ 1-100 _ N to be inspected. Each channel C includes a switch S of a normally open contact system (S1 to SN). One terminal of each switch S is connected to the test controller 13, and the other terminal is connected to the circuit boards 100_1 to 100_ N via the relay unit 17.

One circuit board 100 connected to one of the switches S1 to SN is connected to the test controller 13 by closing the switch S by the switch control of the system controller 11. That is, the switching control of the switches S1 to SN and the selection control of the channels C1 to CN are equivalent, and by closing one switch S, the corresponding one channel C is selected. A condition in which the switch S1 is closed and the channel C1 is selected so that the circuit board 100_1 is connected to the test controller 13 is shown in fig. 14. In addition, instead of the configuration in which all of the 5 ports are switchable by the switch S1, a configuration may be adopted in which only a required port of the 5 ports is switchable by the switch S1. For example, a configuration may be adopted in which only two ports of TDI (test data input) and TDO (test data output) are switchable by the switch S1.

In the present modification, the test controller 13 performs a plurality of boundary scan tests on each of the plurality of circuit boards 100_1 to 100_ N. The system controller 11 may vary the execution interval of the boundary scan test on the remaining circuit boards 100 according to the detection status of the defective portion of the boundary scan test on 1 circuit board 100. Specifically, the system controller 11 may set the execution interval of the boundary scan test for all the circuit boards 100 to a relatively wide first interval in a case where the number of defective parts detected by performing the boundary scan test on each circuit board 100 is smaller than the fourth predetermined value. In addition, the system controller 11 may set the execution interval of the boundary scan test for all the circuit boards 100 to a second interval narrower than the first interval in accordance with a case where the number of defective parts detected by performing the boundary scan test on at least one of the circuit boards 100 is equal to or greater than a fourth predetermined value.

According to the present modification, the scanner unit 18 (connection switching section) repeatedly executes a connection process of sequentially connecting one circuit board 100 to the test controller 13, and the test controller 13 executes a boundary scan test on one circuit board 100 in conjunction with the connection process. Accordingly, since the boundary scan test for each of the plurality of circuit boards 100_1 to 100_ N is continuously performed by one test controller 13, the boundary scan test for the plurality of circuit boards 100_1 to 100_ N can be efficiently performed. As a result, the test cost can be reduced.

Further, according to the present modification, when the number of defective portions detected by performing the boundary scan test on at least one circuit board is equal to or greater than the fourth predetermined value, since a defect is likely to occur in other circuit boards 100, the system controller 11 can early detect the occurrence of a defect by setting the execution interval of the boundary scan test on all the circuit boards 100 to be short. On the other hand, when the number of defective portions detected by performing the boundary scan test on each circuit board 100 is smaller than the fourth predetermined value, since the defective portions are unlikely to occur in all the circuit boards 100, the system controller 11 can avoid an increase in the data amount of the test result by setting the execution interval of the boundary scan test with respect to all the circuit boards 100 to be long.

In the present modification, a circuit configuration in which 1 semiconductor device is mounted on 1 circuit board 100 is assumed, but the present modification is not limited to this example. A plurality of semiconductor devices may be mounted on 1 circuit board 100. At this time, 1 channel C is allocated to 1 semiconductor device, so that the selection of the channel C and the switching of the semiconductor device are equivalent.

According to this aspect, the circuit board to be inspected is housed in the environment forming apparatus, and the main control unit causes the test control unit to execute the boundary scan test on the circuit board in a state where the environment forming apparatus applies the oscillating pressure of three degrees of freedom or more to the circuit board. As described above, in a state where the oscillating pressure of three degrees of freedom or more, which may occur or exceed the assumed range of the usage condition of the actual product in the usage condition of the actual product, is applied to the circuit board, the boundary scan test is performed on the circuit board, and thereby the occurrence of the defect in the circuit board can be promoted and the occurrence of the defective portion can be accurately evaluated. As a result, the time required for the test can be shortened, and the reliability of the actual product can be improved.

In the above aspect, the test control unit may execute the boundary scan test on the circuit board a plurality of times, and the main control unit may vary an execution interval of the boundary scan test according to an application condition of the vibration pressure.

According to this aspect, the main control unit varies the execution interval of the boundary scan test according to the application condition of the vibration pressure. Therefore, when the condition for applying the vibration pressure is a condition in which a failure is likely to occur, the main control unit can early detect the occurrence of the failure by setting the execution interval to be short. On the other hand, when the condition for applying the vibration pressure is a condition that is difficult to cause a failure, the main control unit sets the execution interval to be long, thereby making it possible to avoid an increase in the data amount of the test result.

In the above aspect, the main control unit may narrow the execution interval of the boundary scan test when the magnitude of the vibration pressure is equal to or larger than a first predetermined value, as compared to when the magnitude of the vibration pressure is smaller than the first predetermined value.

According to this aspect, since a failure is likely to occur when the magnitude of the vibration pressure is equal to or greater than the first predetermined value, the main control unit can early detect the occurrence of the failure by setting the execution interval to be short. On the other hand, since the failure is less likely to occur when the magnitude of the vibration pressure is smaller than the first predetermined value, the main control unit can avoid an increase in the data amount of the test result by setting the execution interval to be long.

In the above aspect, the main control unit may narrow the execution interval of the boundary scan test when the application time of the vibration pressure is equal to or longer than a second predetermined value, as compared with when the application time of the vibration pressure is shorter than the second predetermined value.

According to this aspect, since the failure is likely to occur when the application time of the vibration pressure is equal to or longer than the second predetermined value, the main control unit can early detect the occurrence of the failure by setting the execution interval to be short. On the other hand, since the failure is less likely to occur when the application time of the vibration pressure is less than the second predetermined value, the main control unit can avoid an increase in the data amount of the test result by setting the execution interval to be long.

In the above aspect, the test control unit executes the boundary scan test on the circuit board a plurality of times, and the main control unit varies the execution interval of the boundary scan test according to a detection condition of a defective portion of the boundary scan test.

According to this aspect, the main control unit varies the execution interval of the boundary scan test according to the detection status of the defective portion of the boundary scan test. Therefore, when a predetermined number or more of defective portions are detected and another defect is likely to occur, the main control unit sets the execution interval to be short, thereby making it possible to early detect that another defect has occurred. On the other hand, when a predetermined number or more of defective portions are not detected and a defect is unlikely to occur, the main control unit sets the execution interval to be long, thereby avoiding an increase in the data amount of the test result.

In the above aspect, the main control unit may narrow the execution interval of the boundary scan test in a case where the number of defective portions detected by the boundary scan test is equal to or greater than a third predetermined value, as compared to a case where the number of defective portions detected by the boundary scan test is smaller than the third predetermined value.

According to this aspect, when the number of defective portions detected by the boundary scan test is equal to or greater than the third predetermined value, since other defects are likely to occur, the main control unit can early detect the occurrence of other defects by setting the execution interval to be short. On the other hand, when the number of defective portions detected by the boundary scan test is smaller than the third predetermined value, since a defect is unlikely to occur, the main control unit can avoid an increase in the data amount of the test result by setting the execution interval to be long.

In the above aspect, the at least one circuit board includes a first circuit board and a second circuit board, the test control unit performs the boundary scan test on each of the first circuit board and the second circuit board a plurality of times, and the main control unit varies an execution interval of the boundary scan test on the second circuit board according to a detection condition of a defective portion of the boundary scan test on the first circuit board.

According to this aspect, the main control unit varies the execution interval of the boundary scan test on the second circuit board according to the detection status of the defective portion of the boundary scan test on the first circuit board. Therefore, when a predetermined number or more of defective portions are detected in the first circuit board and a defect is likely to occur in the second circuit board, the main control unit sets the execution interval with respect to the second circuit board to be short, thereby making it possible to find the occurrence of the defect at an early stage. On the other hand, when the first circuit board does not detect a predetermined number or more of defective portions and thus a defect is unlikely to occur in the second circuit board, the main control unit sets the execution interval with respect to the second circuit board to be long, thereby making it possible to avoid an increase in the data amount of the test result.

In the above aspect, the main control unit may narrow an execution interval of the boundary scan test on the second circuit board in a case where the number of defective portions detected by the boundary scan test on the first circuit board is equal to or greater than a fourth predetermined value, as compared to a case where the number of defective portions detected by the boundary scan test on the first circuit board is smaller than the fourth predetermined value.

According to this aspect, when the number of defective portions detected by performing the boundary scan test on the first circuit board is equal to or greater than the fourth predetermined value, since a defect is likely to occur also in the second circuit board, the main control unit can early detect the occurrence of another defect by setting the execution interval with respect to the second circuit board to be short. On the other hand, when the number of defective portions detected by performing the boundary scan test on the first circuit board is smaller than the fourth predetermined value, since the defective portions are unlikely to occur in the second circuit board, the main control unit can avoid an increase in the data amount of the test result by setting the execution interval relating to the second circuit board to be long.

In the above aspect, the environment forming device may further apply temperature pressure to the circuit board, the test control unit may perform the boundary scan test on the circuit board a plurality of times, and the main control unit may vary an execution interval of the boundary scan test according to an application condition of the temperature pressure.

According to this aspect, the main control unit varies the execution interval of the boundary scan test according to the temperature and pressure application condition. Therefore, when the condition for applying the temperature and pressure is a condition in which a failure is likely to occur, the main control unit can early detect the occurrence of the failure by setting the execution interval to be short. On the other hand, when the condition of applying the temperature and pressure is a condition that is difficult to cause a failure, the main control unit sets the execution interval to be long, thereby making it possible to avoid an increase in the data amount of the test result.

In the above aspect, the main control unit may narrow the interval between the boundary scan tests in a period in which the magnitude of the temperature pressure changes, as compared with a period in which the magnitude of the temperature pressure does not change.

According to this aspect, since the failure is likely to occur while the magnitude of the temperature and pressure is changing, the main control unit can early detect the occurrence of the failure by setting the execution interval to be short. On the other hand, since a failure is unlikely to occur while the temperature and pressure are not changed, the main control unit can avoid an increase in the data amount of the test result by setting the execution interval to be long.

In the above aspect, the at least one circuit board includes a plurality of circuit boards, the test control section performs the boundary scan test on each of the plurality of circuit boards, the inspection apparatus further includes a connection switching section, the connection switching unit connects 1 of the plurality of circuit boards to the test control unit, the connections between the test control section and the plurality of circuit boards housed in the environment forming apparatus may be switched, the main control portion, in a state where the environment forming device applies the vibration pressure to the plurality of circuit boards, the connection switching section repeatedly executes connection processing for sequentially connecting the one circuit board to the test control section, the main control unit causes the test control unit to perform the boundary scan test on the one circuit board in association with the connection processing.

According to this aspect, the connection switching unit repeatedly executes a connection process of sequentially connecting one circuit board to the test control unit, and the test control unit executes the boundary scan test on one circuit board in conjunction with the connection process. Accordingly, since the boundary scan test for each of the plurality of circuit boards is continuously performed by one test control section, the boundary scan test for the plurality of circuit boards can be efficiently performed. As a result, the test cost can be reduced.

In the aspect, the environment forming device is a high-acceleration limit test device, a high-acceleration stress screening test device, or a high-acceleration stress audit test device.

According to this aspect, by using the high-acceleration limit test device, the high-acceleration stress screening test device, or the high-acceleration stress auditing test device as the environment forming device, it is possible to apply the oscillating pressure of six degrees of freedom or more and the temperature pressure of a wide temperature range and rapid change to the circuit board. As a result, the occurrence of defects in the circuit board can be effectively promoted.

According to this aspect, the circuit board to be inspected is housed in the environment forming apparatus, and the boundary scan test is performed on the circuit board in a state where the environment forming apparatus applies the oscillating pressure of three degrees of freedom or more to the circuit board. As described above, in a state where the oscillating pressure of three degrees of freedom or more, which may occur or exceed the assumed range of the usage condition of the actual product in the usage condition of the actual product, is applied to the circuit board, the boundary scan test is performed on the circuit board, and thereby the occurrence of the defect in the circuit board can be promoted and the occurrence of the defective portion can be accurately evaluated. As a result, the time required for the test can be shortened, and the reliability of the actual product can be improved.

Claims

1. An inspection apparatus communicably connected with an environment forming apparatus that can house at least one circuit board as an inspection object, characterized by comprising:

a test control unit for controlling a boundary scan test of the circuit board; and the number of the first and second groups,

a main control part, wherein,

the main control unit allows the test control unit to perform the boundary scan test on the circuit board in a state where the environment forming device applies three or more degrees of freedom of vibratory pressure to the circuit board.

2. The inspection device of claim 1,

the test control section performs the boundary scan test on the circuit board a plurality of times,

the main control section varies an execution interval of the boundary scan test according to an application condition of the vibration pressure.

3. The inspection apparatus of claim 2,

the main control unit narrows an execution interval of the boundary scan test in comparison with a case where a magnitude of the vibration pressure is smaller than a first predetermined value when the magnitude of the vibration pressure is equal to or larger than the first predetermined value.

4. The inspection apparatus of claim 2,

the main control unit narrows an execution interval of the boundary scan test in comparison with a case where an application time of the vibration pressure is less than a second predetermined value when the application time of the vibration pressure is greater than or equal to the second predetermined value.

5. The inspection device of claim 1,

the main control unit varies the execution interval of the boundary scan test according to the detection state of the defective portion of the boundary scan test.

6. The inspection device of claim 5,

the main control unit narrows an execution interval of the boundary scan test in comparison with a case where the number of defective portions detected by the boundary scan test is smaller than a third predetermined value when the number of defective portions detected by the boundary scan test is equal to or larger than the third predetermined value.

7. The inspection device of claim 1,

the at least one circuit board includes a first circuit board and a second circuit board,

the test control section performs the boundary scan test a plurality of times for each of the first circuit board and the second circuit board,

the main control unit varies the execution interval of the boundary scan test on the second circuit board according to a detection condition of a defective portion of the boundary scan test on the first circuit board.

8. The inspection device of claim 7,

the main control unit narrows an execution interval of the boundary scan test on the second circuit board, in a case where the number of defective portions detected by the boundary scan test on the first circuit board is equal to or greater than a fourth predetermined value, as compared to a case where the number of defective portions detected by the boundary scan test on the first circuit board is smaller than the fourth predetermined value.

9. The inspection device of claim 1,

the environment forming means may also apply temperature pressure to the circuit board,

the main control unit varies the execution interval of the boundary scan test according to the condition of applying the temperature and pressure.

10. The inspection device of claim 9,

the main control unit narrows an execution interval of the boundary scan test during a period in which the magnitude of the temperature pressure changes, as compared with a period in which the magnitude of the temperature pressure does not change.

11. The inspection device of claim 1,

the at least one circuit board comprises a plurality of circuit boards,

the test control section performs the boundary scan test on each of the plurality of circuit boards,

the inspection apparatus further includes a connection switching unit that switches connection between the test control unit and the plurality of circuit boards housed in the environment forming apparatus so that 1 of the plurality of circuit boards is connected to the test control unit,

the main control unit causes the connection switching unit to repeatedly perform connection processing for sequentially connecting the one circuit board to the test control unit in a state where the environment forming device applies the vibration pressure to the plurality of circuit boards,

the main control unit causes the test control unit to perform the boundary scan test on the one circuit board in association with the connection processing.

12. The inspection device of any one of claims 1 to 11,

the environment forming device is a high-acceleration limit test device, a high-acceleration stress screening test device or a high-acceleration stress auditing test device.

13. An inspection system, comprising:

an environment forming device capable of accommodating at least one circuit board as an inspection object; and the number of the first and second groups,

an inspection device communicably connected with the environment forming device, wherein,

the inspection apparatus includes:

a main control part, wherein,

14. An inspection method characterized by comprising the steps of:

applying, by an environment forming device, a three-degree-of-freedom or more oscillating pressure to at least one circuit board housed in the environment forming device; and the number of the first and second groups,

and a step of performing a boundary scan test on the circuit board in a state where the vibration pressure is applied to the circuit board by the environment forming device.