CN114262897A - Workpiece machining method - Google Patents
Workpiece machining method Download PDFInfo
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- CN114262897A CN114262897A CN202111555946.0A CN202111555946A CN114262897A CN 114262897 A CN114262897 A CN 114262897A CN 202111555946 A CN202111555946 A CN 202111555946A CN 114262897 A CN114262897 A CN 114262897A
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- workpiece
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- transition layer
- shielding layer
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000003754 machining Methods 0.000 title claims description 6
- 230000007704 transition Effects 0.000 claims abstract description 91
- 239000007788 liquid Substances 0.000 claims abstract description 71
- 239000007822 coupling agent Substances 0.000 claims abstract description 14
- 230000007797 corrosion Effects 0.000 claims description 26
- 238000005260 corrosion Methods 0.000 claims description 26
- 239000004115 Sodium Silicate Substances 0.000 claims description 19
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 19
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 19
- 230000000873 masking effect Effects 0.000 claims description 18
- 239000001509 sodium citrate Substances 0.000 claims description 15
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 15
- 238000003672 processing method Methods 0.000 claims description 13
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 12
- 238000002791 soaking Methods 0.000 claims description 12
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 11
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 11
- 239000012964 benzotriazole Substances 0.000 claims description 11
- 159000000011 group IA salts Chemical class 0.000 claims description 8
- 239000003112 inhibitor Substances 0.000 claims description 7
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 6
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 6
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 5
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000011736 potassium bicarbonate Substances 0.000 claims description 3
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims description 3
- 235000015497 potassium bicarbonate Nutrition 0.000 claims description 3
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 3
- 235000011181 potassium carbonates Nutrition 0.000 claims description 3
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims description 3
- 235000017550 sodium carbonate Nutrition 0.000 claims description 3
- 235000011083 sodium citrates Nutrition 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 5
- 238000007639 printing Methods 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 description 43
- 239000002184 metal Substances 0.000 description 43
- 230000000694 effects Effects 0.000 description 27
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 239000008367 deionised water Substances 0.000 description 8
- 229910021641 deionized water Inorganic materials 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 150000007529 inorganic bases Chemical class 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 5
- 238000005562 fading Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910001867 inorganic solvent Inorganic materials 0.000 description 2
- 239000003049 inorganic solvent Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
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Abstract
The present application provides a method of processing a workpiece, the workpiece including a plastic portion, the method comprising: and treating the surface of the workpiece by adopting a pretreatment liquid to form a transition layer, wherein the pretreatment liquid comprises a coupling agent, and the transition layer is combined with the surface of the plastic part. And forming a shielding layer on the surface of the workpiece, wherein the transition layer is positioned between the plastic part and the shielding layer. And removing the shielding layer and the transition layer on the surface of the workpiece. This application has realized carrying out printing ink to the work piece that contains multiple material and has shielded and remove printing ink, and the damage that causes the work piece simultaneously is little, with low costs, is fit for industrialization batch processing.
Description
Technical Field
The application relates to the field of ink shielding treatment, in particular to a workpiece processing method.
Background
The ink shielding technology is a technology for covering the surface of a material with ink to protect the covered surface. After the workpiece to be processed is shielded by ink, the part which is not shielded is normally processed by etching, sand blasting, wire drawing, CNC processing and the like, and the part which is shielded by the ink is protected by the ink without the processing, so that the covering surface is protected.
The ink needs to be removed after being shielded, and in the prior art, the ink on the plastic material is usually removed by adopting a strong-alkaline inorganic solvent, and the ink on the surface of the metal material is removed by adopting an organic solvent. When the metal material and plastic material are combined together, the solvent has defects, the strong alkaline inorganic solvent can corrode the metal material, and the organic solvent can dissolve the plastic material. Therefore, there is a need to find an ink removing technique capable of treating the combination of metal material and plastic.
Disclosure of Invention
In view of the above, the present application provides a method for processing a workpiece, which can remove an ink layer of a metal and plastic joint with high quality.
An embodiment of the present application provides a method of processing a workpiece, the workpiece including a plastic part, the method including:
treating the surface of a workpiece by adopting pretreatment liquid to form a transition layer, wherein the pretreatment liquid comprises a coupling agent, and the transition layer is combined with the surface of the plastic part;
forming a shielding layer on the surface of the workpiece, wherein the transition layer is positioned between the plastic part and the shielding layer;
and removing the shielding layer and the transition layer on the surface of the workpiece.
Therefore, the purpose that the plastic part and the shielding layer on the metal part except the plastic part are removed is achieved by the mode that the transition layer prevents the plastic part from contacting the shielding layer.
In some embodiments, the step of treating the surface of the workpiece with the pretreatment liquid to form the transition layer includes:
and (3) soaking the surface of the workpiece in a pretreatment solution at the temperature of 20-35 ℃ for 5-10 min.
Thus, a transition layer with uniform thickness is formed.
In some embodiments, the transition layer has a thickness in a range from 0.5 μm to 2 μm.
Therefore, the combination of the shielding layer and the plastic is prevented, and the phenomenon that the shielding layer is too thick and is not easy to remove is avoided.
In some embodiments, the step of treating the surface of the workpiece with the pretreatment liquid to form the transition layer comprises:
and drying the workpiece at the temperature of 50-70 ℃ for 60-120 min.
Therefore, the formation of the transition layer is accelerated, and the time of the process flow is shortened.
In some embodiments, the pretreatment liquid comprises 5% to 15% by weight of a coupling agent.
Therefore, the transition layer can be formed quickly.
In some embodiments, the coupling agent comprises at least one of gamma-aminopropyltriethoxysilane or gamma-methacryloxypropyltrimethoxysilane.
Therefore, the transition layer can be formed quickly.
In some embodiments, the step of forming a masking layer on the surface of the workpiece comprises:
forming an ink layer on the surface of the workpiece;
and baking the ink layer to form the shielding layer.
Thus, the formation of the shielding layer is accelerated.
In some embodiments, the step of removing the masking layer and the transition layer from the surface of the workpiece comprises:
and removing the shielding layer and the transition layer by using an ink removing liquid, wherein the ink removing liquid comprises 2-6% by mass of alkaline salt, and the alkaline salt comprises at least one of sodium carbonate, sodium bicarbonate, potassium carbonate, potassium bicarbonate and sodium citrate.
Thus, the masking layer is sufficiently removed while avoiding corrosion of the metal by adding an appropriate amount of an inorganic base.
In some embodiments, the ink-stripping liquid further comprises 2 to 6 mass percent sodium silicate.
Therefore, the proper amount of sodium silicate is added to control the pH value of the solvent, so that the shielding layer is removed while the corrosion inhibition effect is achieved.
In some embodiments, the ink removing liquid further comprises 1-3% by weight of a corrosion inhibitor, and the corrosion inhibitor comprises one of thiourea, triethanolamine or benzotriazole.
Thus, the corrosion of the metal material is slowed down by adding a proper amount of the corrosion inhibitor.
In some embodiments, the step of removing the masking layer and the transition layer from the surface of the workpiece comprises:
and (3) soaking the workpiece in the ink removing liquid at the temperature of 60-80 ℃ for 20-40 min.
Therefore, the shielding layer is fully removed, and meanwhile, the workpiece is prevented from being corroded.
In some embodiments, the step of removing the masking layer and the transition layer from the surface of the workpiece further comprises:
and machining the workpiece with the shielding layer.
Therefore, the part of the workpiece which is not shielded by the shielding layer is processed, and the part protected by the shielding layer is not influenced, so that partial treatment is realized.
The workpiece processing method can remove the ink shielding layer on the metal and plastic combining piece, can avoid corrosion to the workpiece, and has the advantages of high removal efficiency, environmental protection and low cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a flow chart illustrating steps of a method for processing a workpiece according to an embodiment of the present application.
Detailed Description
In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
FIG. 1 is a flowchart illustrating steps of one embodiment of a method of processing a workpiece according to the present application. The order of the steps in the flow chart may be changed and some steps may be omitted according to different needs.
Referring to fig. 1, in one embodiment, a method of processing a workpiece includes:
s10: and treating the surface of the workpiece by adopting a pretreatment liquid to form a transition layer, wherein the pretreatment liquid comprises a coupling agent, and the transition layer is combined with the surface of the plastic part.
S20: and forming a shielding layer on the surface of the workpiece, wherein the transition layer is positioned between the plastic part and the shielding layer.
S30: and removing the shielding layer and the transition layer on the surface of the workpiece.
It should be noted that, in the embodiment of the present application, the workpiece is a combination of plastic and metal, that is, the workpiece includes a plastic portion and a metal portion. By using the pretreatment liquid, the organosilane coupling agent can act on the plastic part to form a transition layer on the surface of the plastic part, so that the contact between the plastic part and the shielding layer is blocked. Meanwhile, the organosilane coupling agent is easy to dissolve in the inorganic weak alkaline solvent, so that when the shielding layer is removed, the shielding layer on the outer side of the transition layer is removed in a mode of removing the transition layer between the workpiece and the shielding layer by adopting the inorganic weak alkaline solvent, and the purpose of removing the shielding layer is achieved.
Since the workpiece in this embodiment is a metal and plastic combination, before step S20, the workpiece is further subjected to mechanical polishing and cleaning to remove the residual pretreatment liquid on the surface of the metal portion, so as to avoid the unreacted pretreatment liquid from affecting the formation of the shielding layer on the surface of the metal portion.
In some embodiments, the step of treating the surface of the workpiece with the pretreatment liquid to form the transition layer comprises:
the surface of the workpiece is soaked in the pretreatment liquid at the temperature of 20-35 ℃ for 5-10 min.
Too short soaking time is not favorable for the coupling agent in the pretreatment liquid to form a transition layer with uniform thickness on the surface of the workpiece, and too long soaking time can cause the transition layer formed on the surface of the workpiece to need longer time to complete curing, thereby affecting the treatment efficiency.
In some embodiments, the transition layer formed on the surface of the workpiece has a thickness in a range from 0.5 μm to 2 μm. In step S10, the thickness of the transition layer needs to be controlled, and too thick transition layer causes the coating to be viscous and not easy to be removed, and causes the masking layer to be incompletely removed and have residue; and the transition layer is too thin and can not play due effect, the shielding layer is easy to directly contact with the plastic part of the workpiece, the transition layer can not play a role in preventing the shielding layer from being combined with the plastic part, so that when the shielding layer is removed, the solvent can not be removed from the shielding layer combined with the plastic part, and the transition layer can not generate a due role in preventing the printing ink from being combined with the plastic.
In some embodiments, the step of treating the surface of the workpiece with the pretreatment liquid to form the transition layer comprises:
and drying the workpiece at the temperature of 50-70 ℃ for 60-120 min.
In some embodiments, the pretreatment liquid comprises 5% to 15% by weight of a coupling agent.
In some embodiments, the coupling agent comprises at least one of gamma-aminopropyltriethoxysilane or gamma-methacryloxypropyltrimethoxysilane. This example employs a silane coupling agent.
In some embodiments, the step of forming a masking layer on the surface of the workpiece comprises:
forming an ink layer on the surface of a workpiece;
and baking the ink layer to form a shielding layer.
In some embodiments, the step of removing the masking layer and the transition layer on the surface of the workpiece in step S30 includes:
and removing the shielding layer and the transition layer by using an ink removing liquid, wherein the ink removing liquid comprises 2-6% of alkaline salt by mass, and the alkaline salt comprises at least one of sodium carbonate, sodium bicarbonate, potassium carbonate, potassium bicarbonate and sodium citrate.
It should be noted that the ink removing liquid is weakly alkaline, and if the alkalinity is too strong, although the ink removing liquid is beneficial to rapidly removing the shielding layer, the ink removing liquid can also severely corrode metal parts. If the basicity is too weak, although the degree of corrosion is reduced, the efficiency of removing the masking layer is also reduced.
In some embodiments, the ink-stripping solution further comprises 2 to 6 mass% sodium silicate.
In some embodiments, the ink stripping liquid further comprises 1-3 wt% of a corrosion inhibitor, and the corrosion inhibitor comprises one of thiourea, triethanolamine or benzotriazole.
In some embodiments, the step of removing the masking layer and the transition layer from the surface of the workpiece comprises:
and soaking the workpiece in the ink removing liquid at 60-80 ℃ for 20-40 min.
The hot alkali can be in saponification reaction with partial groups in the shielding layer, so that the shielding layer is dissolved in the ink removing liquid, and the volatile steam can fumigate the groups in the shielding layer, so that the crosslinking strength among the groups is destroyed by the steam, and the shielding layer is more favorable for removing. In addition, the hot alkali can break the silica bond in the transition layer, so that the adhesive force between the transition layer and the plastic part of the workpiece is reduced, and the transition layer is removed.
In some embodiments, after the ink is removed from the workpiece, the workpiece may be dried at a temperature of 80 ℃ to 100 ℃ for 30min to 60 min.
In some embodiments, the step of removing the masking layer and the transition layer on the surface of the workpiece further comprises:
and machining the workpiece with the shielding layer.
When the workpiece is machined, the shielding layer is arranged on part of the surface of the workpiece and is not influenced, so that the shielding layer can play a role in protection.
The following will specifically describe the method of processing a workpiece in the specific examples and comparative examples.
Example 1
The first embodiment of the application provides a workpiece processing method, which comprises the steps of processing the surface of a workpiece by adopting a pretreatment liquid and curing to form a transition layer, wherein the pretreatment liquid comprises 10% of gamma-aminopropyltriethoxysilane, 15% of ethyl acetate, 5% of ethanol, 5% of water and 65% of diethylene glycol methyl ether, the workpiece is soaked in the pretreatment liquid for 10 minutes at room temperature (20-35 ℃), then the transition layer is formed on the surface of the workpiece through curing, the curing time is 1.5 hours, the curing temperature is 60 ℃, and the transition layer with the thickness of 1 mu m is formed on the surface of the workpiece. And after the transition layer is formed, mechanically polishing and cleaning the workpiece, and then shielding the surface of the workpiece by ink to form a shielding layer. And then, the workpiece covered with the shielding layer is mechanically processed, and the scratch on the surface of the workpiece can be prevented during workpiece processing due to the protection effect of the shielding layer. And after mechanical processing, treating the surface of the workpiece by using an ink removing liquid to remove the shielding layer and the transition layer. The ink fading liquid comprises 4% of sodium silicate, 4% of sodium citrate and 1% of benzotriazole, and the rest is deionized water. The parameters of ink fade were: the surface of the workpiece is placed in ink removing liquid at 70 ℃ for 40 minutes, and then the workpiece is placed at 100 ℃ for drying for 30 minutes. The final removing effect is that the metal part is not corroded, and the transition layer and the shielding layer are not left.
Example 2
The curing parameters were the same as those of example 1, except that the coupling agent was different in the type of the pretreatment liquid, which included 10% of γ -methacryloxypropyltrimethoxysilane, 15% of ethyl acetate, 5% of ethanol, 5% of water, and 65% of diethylene glycol monomethyl ether, and the formed transition layer was 1 μm.
Example 3
The parameters were substantially the same as those of example 1, except that the silane coupling agent content in the pretreatment liquid was different, the pretreatment liquid contained 5% of γ -aminopropyltriethoxysilane, 15% of ethyl acetate, 5% of ethanol, 5% of water and 70% of diethylene glycol monomethyl ether, the curing time required was 2.5 hours, and the thickness of the formed transition layer was 1 μm.
Example 4
The curing time was 0.5 hours, and the thickness of the formed transition layer was 1 μm, which was substantially the same as the parameters of example 1, except that the content of the silane coupling agent in the pretreatment liquid was different, and the pretreatment liquid included 15% of γ -aminopropyltriethoxysilane, 15% of ethyl acetate, 5% of ethanol, 5% of water, and 60% of diethylene glycol monomethyl ether.
Example 5
The parameters were substantially the same as those of example 1, except that the immersion time of the pretreatment liquid was different from the curing time of the transition layer, the immersion time of the pretreatment liquid was 1 minute, the required curing time was 0.5 hour, the thickness of the formed transition layer was 0.5 μm, and the final removal effect was no corrosion of the metal portion and slight residue of the masking layer.
Example 6
The parameters were substantially the same as those of example 1, except that the immersion time of the pretreatment liquid was different from the curing time of the transition layer, the immersion time of the pretreatment liquid was 20 minutes, the required curing time was 3.5 hours, the thickness of the formed transition layer was 2 μm, and the final removal effect was that the metal portion was not corroded and the shielding layer was slightly remained.
Example 7
The parameters were substantially the same as those of example 1, except that the curing temperature and curing time of the transition layer were different, the curing temperature of the pretreatment liquid was 30 ℃, the curing time required was 6 hours, the thickness of the formed transition layer was 1 μm, and the final removal effect was that the metal portion was not corroded and the shielding layer was not left.
Example 8
The parameters were approximately the same as those of example 1, except that the curing temperature and curing time of the transition layer were different, the curing temperature of the pretreatment liquid was 100 ℃, the curing time required was 1 hour, the thickness of the formed transition layer was 0.5 μm, and the final removal effect was no corrosion of the metal portion and moderate residue of the shielding layer.
Example 9
The parameters were approximately the same as those of example 1, except that the type and content of the alkaline salt in the ink remover, which included 4% sodium silicate, 4% sodium carbonate, 1% benzotriazole, and the balance deionized water, were different. And the final removing effect is that the metal part is slightly corroded, and the shielding layer has no residue.
Example 10
The parameters were approximately the same as those of example 1, except that the type and content of the alkaline salt in the ink remover, which included 4% sodium silicate, 4% sodium bicarbonate, 1% benzotriazole, and the balance deionized water, were different. And the final removing effect is that the metal part is slightly corroded, and the shielding layer has no residue.
Example 11
The parameters were approximately the same as those of example 1, except that the content of sodium citrate in the ink remover, which comprised 4% sodium silicate, 1% sodium citrate, 1% benzotriazole, and the balance deionized water, was different. And the final removal effect is that the metal part is not corroded and the shielding layer has slight residue.
Example 12
The parameters were approximately the same as those of example 1, except that the content of sodium citrate in the ink remover, which comprised 4% sodium silicate, 6% sodium citrate, 1% benzotriazole, and the balance deionized water, was different. And the final removing effect is that the metal part is slightly corroded, and the shielding layer has no residue.
Example 13
The parameters were approximately the same as those of example 1, except that the ink stripping solution contained sodium silicate in an amount different from that of the ink stripping solution, which contained 1% sodium silicate, 4% sodium citrate, 1% benzotriazole, and the balance deionized water. And the final removing effect is that the metal part is slightly corroded, and the printing ink and the shielding layer have no residue.
Example 14
The parameters were approximately the same as those of example 1, except that the ink stripping solution contained sodium silicate in an amount different from that of the ink stripping solution, which contained 6% sodium silicate, 4% sodium citrate, 1% benzotriazole, and the balance deionized water. And the final removing effect is that the metal part is slightly corroded, and the shielding layer has no residue.
Example 15
The parameters were substantially the same as those of example 1, except that the ink removal time was different, and the ink removal parameters were: the reaction mixture was then removed at 70 ℃ for 10 minutes. And the final removal effect is that the metal part is not corroded and the shielding layer has slight residue.
Example 16
The parameters were substantially the same as those of example 1, except that the ink removal time was different, and the ink removal parameters were: the reaction mixture was then removed at 70 ℃ for 60 minutes. And the final removing effect is that the metal part is slightly corroded, and the shielding layer has no residue.
Example 17
The parameters were substantially the same as those of example 1, except that the ink fade temperature was different, and the ink fade parameters were: the reaction mixture was removed at 60 ℃ for 40 minutes. And the final removal effect is that the metal part is not corroded and the shielding layer has slight residue.
Example 18
The parameters were substantially the same as those of example 1, except that the ink removal time was different, and the ink removal parameters were: the reaction mixture was removed at 80 ℃ for 40 minutes. And the final removing effect is that the metal part is slightly corroded, and the printing ink and the shielding layer have no residue.
Comparative example 1
The same parameters as in example 1, except that the pretreatment liquid included no silane coupling agent, only 15% ethyl acetate, 5% ethanol, 5% water, and 75% diethylene glycol methyl ether, and the required curing time was 5 hours.
Comparative example 2
The parameters were about the same as the examples except that the ink remover did not include sodium carbonate, sodium bicarbonate and sodium citrate, only 4% sodium silicate, 4% sodium hydroxide, 1% benzotriazole and the balance deionized water. And the final removing effect is that the metal part is seriously corroded and the shielding layer has no residue.
TABLE 1 correlation of pretreatment liquid composition with curing time
It can be seen from the data in table 1 and comparative examples 1, 2 and 1 that the curing time required for the transition layer can be greatly reduced by adding gamma-aminopropyltriethoxysilane or gamma-methacryloxypropyltrimethoxysilane to the pretreatment liquid, and the curing time can be shortened from 5 hours to 1.5 hours, so that the time is saved, and the effect of improving the efficiency of the whole process is achieved.
TABLE 2 relationship of gamma-aminopropyltriethoxysilane content to cure time
As can be seen from the data in table 2 and comparative examples 1, 3 and 4, the curing time required for removing the transition layer was changed by adjusting the content ratio of γ -aminopropyltriethoxysilane in the pretreatment liquid. The curing time is longer when the content ratio of the gamma-aminopropyltriethoxysilane is low, and the curing time is shorter when the content ratio of the gamma-aminopropyltriethoxysilane is high.
TABLE 3 relationship between immersion time of pretreatment solution and curing time and fading effect
| Soaking time | Curing time | Thickness of transition layer | Degree of ink residue | |
| Example 1 | 10min | 1.5h | 1μm | Is free of |
| Example 5 | 1min | 0.5h | 0.5μm | Light and slight |
| Example 6 | 20min | 3.5h | 2μm | Light and slight |
It can be seen from table 3 and comparative examples 1, 5 and 6 that changing the time for soaking the workpiece in the pretreatment solution affects the thickness of the transition layer and the required curing time, and further affects the residue of the masking layer. The soaking time of the pretreatment liquid is short, the curing time of the transition layer is short, the thickness of the formed transition layer is thinner, and the shading layer is not thoroughly faded and has residues; the soaking time of the pretreatment liquid is long, the curing time of the transition layer is longer, the thickness of the formed transition layer is thicker, and the final shading layer is not thoroughly removed and has residues.
TABLE 4 relationship between the curing temperature of the transition layer and the curing time and the fading effect
| Curing temperature | Curing time | Thickness of transition layer | Degree of ink residue | |
| Example 1 | 60℃ | 1.5h | 1μm | Is free of |
| Example 7 | 30℃ | 6.0h | 1μm | Is free of |
| Example 8 | 100℃ | 1.0h | 0.5μm | Medium and high grade |
As can be seen by combining table 4 and comparative examples 1, 7 and 8, changing the curing temperature of the pretreatment solution after soaking the workpiece affects the time required for curing, and the lower the curing temperature, the longer the time required for curing the transition layer; the higher the curing temperature, the shorter the time required for curing the transition layer, but the too high curing temperature may cause the powdering and cracking of part of the transition layer, and the failure to protect the workpiece, and further cause the moderate residue of the shielding layer after ink is removed.
As can be seen from the comparison between the two groups in table 3 and table 4, the thickness of the transition layer has an influence on the final fading effect, and when the thickness of the formed transition layer is too thick, the transition layer is sticky and difficult to fade, so that the shielding layer has residue; when the transition layer is too thin, the ink cannot be prevented from being combined with the plastic part, so that the ink is overflowed to the plastic part, and the shielding layer is not removed completely and remains. The thickness of the transition layer is directly influenced by the residual ink, and the thickness of the transition layer depends on the time of the pretreatment liquid treatment and the temperature during curing.
TABLE 5 relationship between inorganic base and degree of corrosion of metallic part in ink stripping liquid
It can be seen from table 5 and comparative examples 1, 9, 10 and 2 that changing the type of inorganic base in the ink-removing liquid affects the degree of corrosion of the metal part, and when 4% sodium citrate is used, the metal part is not corroded; when 4% sodium carbonate or sodium bicarbonate is used, slight corrosion of the metal parts occurs; and when 4% sodium hydroxide is used, severe corrosion of the metal part occurs. Strong bases are beneficial for rapid ink removal, but can also cause severe corrosion of metal parts.
TABLE 6 relationship between inorganic base content in ink stripping liquid and stripping effect
In table 6, and comparative example 1, example 11 and example 12, it can be seen that changing the content of sodium citrate in the ink-removing liquid affects the degree of corrosion of the metal portion and the degree of residue of the ink and the shielding layer. When the content of sodium citrate is low, ink and a masking layer may be slightly left, and when the content of sodium citrate is high, metal parts may be slightly corroded. The low content of the inorganic base is beneficial to avoiding corroding metal parts, but can cause incomplete ink fading; while a high content of the inorganic base tends to corrode metal parts.
TABLE 7 relationship between sodium silicate content in ink stripping solution and stripping effect
In table 7, and comparative example 1, example 13 and example 14, it can be seen that the degree of corrosion of the metal part is affected by changing the content of sodium silicate in the ink removing liquid. The sodium silicate can play a good corrosion inhibition role on metal materials in an alkaline environment, so that the corrosion inhibition role cannot be played when the content of the sodium silicate is too low, the metal part is corroded, and the solution alkalinity is too strong when the content of the sodium silicate is high, so that the metal part is corroded.
TABLE 8 relationship between ink fade time and fade effect in ink fade process
In table 8 and comparative example 1, example 15 and example 16, it can be seen that changing the time for removing the ink removing liquid affects the degree of corrosion of the metal portion and the degree of remaining of the ink and the shielding layer. If the removal time is too short, the ink cannot be removed sufficiently, and if the removal time is too long, the metal part is corroded.
TABLE 9 relationship between ink fade temperature and fade effect in ink fade process
| Temperature of removal | Degree of corrosion of metal part | Degree of ink residue | |
| Example 1 | 70℃ | Is free of | Is free of |
| Example 17 | 60℃ | Is free of | Light and slight |
| Examples18 | 80℃ | Light and slight | Is free of |
Comparing example 1, example 17 and example 18, it can be seen that changing the removal temperature of the ink removing liquid affects the degree of corrosion of the metal portion and the degree of residue of the ink and the shielding layer. If the removal temperature is low, the ink and the shielding layer cannot be removed completely, and if the removal temperature is high, the metal part is corroded.
It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive. Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. The terms first, second, etc. are used to denote names, but not any particular order.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.
Claims (12)
1. A method of machining a workpiece, the workpiece comprising a plastic part, the method comprising:
treating the surface of a workpiece by adopting pretreatment liquid to form a transition layer, wherein the pretreatment liquid comprises a coupling agent, and the transition layer is combined with the surface of the plastic part;
forming a shielding layer on the surface of the workpiece, wherein the transition layer is positioned between the plastic part and the shielding layer;
and removing the shielding layer and the transition layer on the surface of the workpiece.
2. The workpiece processing method of claim 1, wherein the step of treating the surface of the workpiece with the pretreatment liquid to form the transition layer comprises:
and (3) soaking the surface of the workpiece in a pretreatment solution at the temperature of 20-35 ℃ for 5-10 min.
3. The workpiece processing method of claim 1, wherein the transition layer has a thickness in a range of 0.5 μm to 2 μm.
4. The workpiece processing method of claim 1, wherein the step of treating the surface of the workpiece with the pretreatment liquid to form the transition layer comprises:
and drying the workpiece at the temperature of 50-70 ℃ for 60-120 min.
5. The workpiece processing method of claim 1, wherein the pretreatment liquid comprises a coupling agent in a mass fraction of 5% to 15%.
6. The method of claim 5, wherein the coupling agent comprises at least one of gamma-aminopropyltriethoxysilane or gamma-methacryloxypropyltrimethoxysilane.
7. The workpiece processing method of claim 1, wherein the step of forming a masking layer on the workpiece surface comprises:
forming an ink layer on the surface of the workpiece;
and baking the ink layer to form the shielding layer.
8. The workpiece processing method of claim 1, wherein the step of removing the masking layer and the transition layer of the workpiece surface comprises:
and removing the shielding layer and the transition layer by using an ink removing liquid, wherein the ink removing liquid comprises 2-6% of alkaline salt by mass, and the alkaline salt comprises at least one of sodium carbonate, sodium bicarbonate, potassium carbonate, potassium bicarbonate or sodium citrate.
9. The workpiece processing method of claim 8, wherein the ink-removing liquid further comprises 2-6% by mass of sodium silicate.
10. The workpiece processing method of claim 8, wherein the ink removing liquid further comprises 1-3% by mass of a corrosion inhibitor, and the corrosion inhibitor comprises one of thiourea, triethanolamine or benzotriazole.
11. The workpiece processing method of claim 8, wherein the step of removing the masking layer and the transition layer of the workpiece surface comprises:
and (3) soaking the workpiece in the ink removing liquid at the temperature of 60-80 ℃ for 20-40 min.
12. The workpiece processing method of claim 1, wherein the step of removing the masking layer and the transition layer of the workpiece surface is preceded by:
and machining the workpiece with the shielding layer.
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| JP2008218777A (en) * | 2007-03-06 | 2008-09-18 | Bridgestone Corp | Production process of light-permeable electromagnetic wave shielding material |
| CN104817878A (en) * | 2015-04-09 | 2015-08-05 | 深圳万佳原精化科技股份有限公司 | Ultraviolet curing anti-sandblasting shielding protection printing ink |
| CN105398183A (en) * | 2015-11-11 | 2016-03-16 | 广东长盈精密技术有限公司 | Composite base material surface treatment process |
| CN106398374A (en) * | 2016-08-30 | 2017-02-15 | 广东山之风环保科技有限公司 | Deinking method for glass workpiece and water-based deinking agent used by deinking method as well as preparation method of water-based deinking agent |
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|---|---|---|---|---|
| JP2008218777A (en) * | 2007-03-06 | 2008-09-18 | Bridgestone Corp | Production process of light-permeable electromagnetic wave shielding material |
| CN104817878A (en) * | 2015-04-09 | 2015-08-05 | 深圳万佳原精化科技股份有限公司 | Ultraviolet curing anti-sandblasting shielding protection printing ink |
| CN105398183A (en) * | 2015-11-11 | 2016-03-16 | 广东长盈精密技术有限公司 | Composite base material surface treatment process |
| CN106398374A (en) * | 2016-08-30 | 2017-02-15 | 广东山之风环保科技有限公司 | Deinking method for glass workpiece and water-based deinking agent used by deinking method as well as preparation method of water-based deinking agent |
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