CN114259254A - Ultrasonic imaging device and ultrasonic equipment - Google Patents
Ultrasonic imaging device and ultrasonic equipment Download PDFInfo
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- CN114259254A CN114259254A CN202111554345.8A CN202111554345A CN114259254A CN 114259254 A CN114259254 A CN 114259254A CN 202111554345 A CN202111554345 A CN 202111554345A CN 114259254 A CN114259254 A CN 114259254A
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- 238000003384 imaging method Methods 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 claims abstract description 9
- 239000011241 protective layer Substances 0.000 claims abstract description 4
- 238000012285 ultrasound imaging Methods 0.000 claims description 12
- 238000002604 ultrasonography Methods 0.000 claims description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- -1 polydimethylsiloxane Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000523 sample Substances 0.000 abstract description 17
- 239000007822 coupling agent Substances 0.000 abstract description 3
- 238000005530 etching Methods 0.000 description 11
- 239000010949 copper Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 229910004205 SiNX Inorganic materials 0.000 description 3
- 230000004075 alteration Effects 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
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Abstract
The embodiment of the present disclosure provides an ultrasonic imaging device and an ultrasonic apparatus, the ultrasonic imaging device including: the device comprises a PI substrate layer, a plurality of array element units arranged on the PI substrate and a packaging protection layer arranged on the array element units; wherein, each array element unit is isolated by soft filling material; the array element unit comprises from bottom to top in sequence: the cross section of the upper electrode is smaller than that of the lower electrode, the lower electrode is arranged on one side close to a PI substrate layer, the upper electrode is arranged on one side close to a packaging protective layer, the section structure of the concave cavity structure is concave, and the inside of the concave cavity structure is a hollow cavity. The array element units of the ultrasonic imaging device disclosed by the embodiment of the disclosure are not affected with each other, the size and the form of the probe can be designed at will, imaging can be clearly realized without a coupling agent, and the performance is better.
Description
Technical Field
The present disclosure relates to the field of medical devices, and in particular, to an ultrasound imaging device and an ultrasound apparatus.
Background
The traditional medical imaging probe is a PZT piezoelectric ceramic wire array focusing probe, the probe can transmit and receive, one focusing sound beam is transmitted each time and reflected by human tissues, and the probe acquires echo signals to identify tissue interfaces. The focused acoustic beam scans human tissues in sequence to complete the imaging of the length of the probe and the width area of the focused acoustic beam. The probe is moved by the doctor to realize the detection of the whole tissue.
However, the PZT probe manufacturing process limits the area, the conventional probe has a small size, a small imaging area (20-50 mm × 2mm), a low frame rate (30 Hz probe), a fixed probe size and shape, and an array element pitch of 0.2-0.3mm, and further, during ultrasonic detection, a clear image can be formed by applying pressure to a detected part and using a coupling agent, and the detection area is small, so that the size and shape of a detected target can be judged by depending on doctor experience, and the PZT probe cannot be used due to insufficient doctor experience.
Disclosure of Invention
In view of this, the disclosed embodiments provide an ultrasound imaging device and an ultrasound apparatus, so as to solve the following problems in the prior art: when the PZT probe is used for ultrasonic detection, a clearer image can be formed by applying pressure to a detected part and using a coupling agent, the detection area is small, the size and the shape of a detected target need to be judged by the experience of a doctor, and the PZT probe cannot be used when the experience of the doctor is insufficient.
In one aspect, an embodiment of the present disclosure provides an ultrasound imaging device, including: the device comprises a PI substrate layer, a plurality of array element units arranged on the PI substrate and a packaging protection layer arranged on the array element units; wherein, each array element unit is isolated by soft filling material; the array element unit sequentially comprises from bottom to top: the cross section of the lower electrode, the cross section of the concave cavity structure, the cross section of the vibrating diaphragm and the cross section of the upper electrode are the same in shape, the cross section of the concave cavity structure and the cross section of the vibrating diaphragm are the same in size, the cross section of the upper electrode is smaller than that of the lower electrode, the lower electrode is arranged on one side close to the PI substrate layer, the upper electrode is arranged on one side close to the packaging protective layer, the section structure of the concave cavity structure is concave, and a hollow cavity is formed inside the concave cavity structure.
In some embodiments, the soft fill material comprises one of: resin, epoxy resin, polydimethylsiloxane.
In some embodiments, the cross-sectional length of the lower electrode is the same as the cross-sectional length of the bottom edge of the concave cavity structure.
In some embodiments, the material of the lower electrode comprises one of: mo, TiAlTi and MoAlMo.
In some embodiments, the cross-sectional length of the upper electrode is 0.7 times the cross-sectional length of the lower electrode.
In some embodiments, the frequency of the diaphragm is 3-10M, the cross-sectional length of the diaphragm is 10-30um, and the thickness of the diaphragm is 0.1-0.6 um.
In some embodiments, the concave cavity structure has a height of 0.2-0.8 um.
In some embodiments, the material of the concave cavity structure is an insulating material.
In some embodiments, the lower electrode is circular in cross-section.
In another aspect, an embodiment of the present disclosure provides an ultrasound apparatus, including: an ultrasound imaging device as in any embodiment of the present disclosure.
Every array element unit of this disclosed embodiment's ultrasonic imaging device has concave cavity structure, realizes surveying through vibrating diaphragm and concave cavity structure when the circular telegram, and keeps apart through soft filler material between each array element unit, each other does not influence between each array element unit, and probe size and form can design at will, and does not need the couplant just can clearly present the image, and product property can be better.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present disclosure, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an ultrasonic imaging device provided in an embodiment of the present disclosure;
fig. 2 is a structural form of a corresponding device in a process of manufacturing an ultrasonic imaging device according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be described below clearly and completely with reference to the accompanying drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
To maintain the following description of the embodiments of the present disclosure clear and concise, a detailed description of known functions and known components have been omitted from the present disclosure.
The embodiment of the present disclosure provides an ultrasonic imaging device, a structural schematic of which is shown in fig. 1, including:
the device comprises a PI substrate layer, a plurality of array element units arranged on the PI substrate and a packaging protection layer arranged on the array element units; wherein, each array element unit is isolated by soft filling material; the array element unit comprises from bottom to top in sequence: the cross section of the upper electrode is smaller than that of the lower electrode, the lower electrode is arranged on one side close to a PI substrate layer, the upper electrode is arranged on one side close to a packaging protective layer, the section structure of the concave cavity structure is concave, and the inside of the concave cavity structure is a hollow cavity.
Every array element unit of this disclosed embodiment's ultrasonic imaging device has concave cavity structure, realizes surveying through vibrating diaphragm and concave cavity structure when the circular telegram, and keeps apart through soft filler material between each array element unit, each other does not influence between each array element unit, and probe size and form can design at will, and does not need the couplant just can clearly present the image, and product property can be better.
In specific implementations, the soft filling material includes various materials, such as resin, epoxy resin, polydimethylsiloxane, etc.
For the design of the upper electrode and the lower electrode, the cross-sectional length of the lower electrode is the same as the cross-sectional length of the bottom edge of the concave cavity structure, the cross-sectional length of the upper electrode is smaller than the cross-sectional length of the lower electrode, and the cross-sectional length of the upper electrode is preferably designed to be 0.7 times the cross-sectional length of the lower electrode. For the shape of the upper and lower electrodes, the cross section of the lower electrode is preferably circular, and correspondingly, the cross section of the concave cavity structure and the cross section of the upper electrode are also preferably circular.
In a specific implementation, the material of the lower electrode may include Mo, TiAlTi, MoAlMo, and the like, and those skilled in the art may set the material according to actual requirements.
For the diaphragm, the preferred design frequency is 3-10M, the cross-sectional length is 10-30um, and the thickness is 0.1-0.6 um.
During specific design, the height of the concave cavity structure can be adjusted according to actual requirements, and is preferably 0.2-0.8 um; the material of the concave cavity structure is an insulating material.
Fig. 2 is a structural form of the device corresponding to the process of the ultrasonic imaging device, where the process includes the following steps S101 to S109:
s101, spin coating a PI flexible substrate on the glass substrate.
And S102, spin coating the lower electrode with PR (photo resist) glue, exposing, developing and etching to ensure that the lower electrode is patterned to obtain the lower electrode. The lower electrode can be made of metal materials such as Mo, TiAlTi, MoAlMo and the like.
And S103, PECVD deposits SiNx to be used as insulation (the bottom edge of the concave cavity structure) so as to prevent the short circuit of the electrodes.
And S104, the Sputter copper electrode is used as a sacrificial layer, and patterning only leaves the copper electrode at the concave cavity structure of the array element unit.
And S105, depositing SiNx as the outer wall of the concave cavity structure in the vertical direction and a vibrating diaphragm, etching to the required thickness according to the required vibrating diaphragm thickness, and reserving etching holes so that etching liquid can flow in.
S106, Sputter electrodes and patterning.
S107, holes are punched at the positions corresponding to the reserved etching holes, the holes expose the Cu corresponding to the reserved etching holes, and Cu etching liquid is used for etching the Cu sacrificial layer at the concave cavity structure through the reserved etching holes to form a hollow cavity.
And S108, carrying out ICP etching on SiNx at the interval of the array element units to release stress.
S109, spin coating a soft resin or PDMS layer with a thickness slightly higher than that of the upper electrode. Among them, 3 functions: the array element unit interval is filled to realize flexibility, the etching hole is sealed, and a protective packaging layer is formed on the surface of the device.
And finally, peeling the glass substrate to finish the manufacture of the flexible device.
The embodiment of the disclosure provides a flexible ultrasonic imaging device, which is an ultrasonic imaging device for refining a large array. Traditional ultrasonic imaging probe is PZT piezoceramics cutting preparation, and array element size is big (0.2-0.3mm), when ultrasonic testing, need to be to surveyed the position and just can be more clear image with the help of the couplant, however this disclosed embodiment can be simple realization become more meticulous and big array (array element size is little (10-100+ um), array area is big (the FPD technology can make tens of cm size), fine parcel is surveyed the region to detect more target information, become more clear image of large tracts of land.
The embodiment of the present disclosure further provides an ultrasound apparatus, which at least includes the ultrasound imaging device in the above embodiments, and details of the ultrasound imaging device are not repeated here.
Moreover, although exemplary embodiments have been described herein, the scope thereof includes any and all embodiments based on the disclosure with equivalent elements, modifications, omissions, combinations (e.g., of various embodiments across), adaptations or alterations. The elements of the claims are to be interpreted broadly based on the language employed in the claims and not limited to examples described in the present specification or during the prosecution of the application, which examples are to be construed as non-exclusive. It is intended, therefore, that the specification and examples be considered as exemplary only, with a true scope and spirit being indicated by the following claims and their full scope of equivalents.
The above description is intended to be illustrative and not restrictive. For example, the above-described examples (or one or more versions thereof) may be used in combination with each other. For example, other embodiments may be used by those of ordinary skill in the art upon reading the above description. In addition, in the foregoing detailed description, various features may be grouped together to streamline the disclosure. This should not be interpreted as an intention that a disclosed feature not claimed is essential to any claim. Rather, the subject matter of the present disclosure may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that these embodiments may be combined with each other in various combinations or permutations. The scope of the disclosure should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
While the present disclosure has been described in detail with reference to the embodiments, the present disclosure is not limited to the specific embodiments, and those skilled in the art can make various modifications and alterations based on the concept of the present disclosure, and the modifications and alterations should fall within the scope of the present disclosure as claimed.
Claims (10)
1. An ultrasound imaging device, comprising:
the device comprises a PI substrate layer, a plurality of array element units arranged on the PI substrate and a packaging protection layer arranged on the array element units;
wherein, each array element unit is isolated by soft filling material;
the array element unit sequentially comprises from bottom to top: the cross section of the lower electrode, the cross section of the concave cavity structure, the cross section of the vibrating diaphragm and the cross section of the upper electrode are the same in shape, the cross section of the concave cavity structure and the cross section of the vibrating diaphragm are the same in size, the cross section of the upper electrode is smaller than that of the lower electrode, the lower electrode is arranged on one side close to the PI substrate layer, the upper electrode is arranged on one side close to the packaging protective layer, the section structure of the concave cavity structure is concave, and a hollow cavity is formed inside the concave cavity structure.
2. The ultrasound imaging device of claim 1, wherein the soft filler material comprises one of: resin, epoxy resin, polydimethylsiloxane.
3. The ultrasonic imaging device of claim 1, wherein the cross-sectional length of said lower electrode is the same as the cross-sectional length of the bottom edge of said concave cavity structure.
4. The ultrasound imaging device of claim 1, wherein the material of the lower electrode comprises one of: mo, TiAlTi and MoAlMo.
5. The ultrasonic imaging device of claim 1, wherein the cross-sectional length of the upper electrode is 0.7 times the cross-sectional length of the lower electrode.
6. The ultrasonic imaging device of any one of claims 1 to 5, wherein the frequency of the diaphragm is 3-10M, the cross-sectional length of the diaphragm is 10-30um, and the thickness of the diaphragm is 0.1-0.6 um.
7. An ultrasound imaging device according to any of claims 1 to 5, wherein the height of the concave cavity structure is 0.2-0.8 um.
8. An ultrasound imaging device according to any of claims 1 to 5, wherein the material of the concave cavity structure is an insulating material.
9. The ultrasonic imaging device according to any one of claims 1 to 5, wherein the cross section of the lower electrode is circular.
10. An ultrasound device, comprising: the ultrasound imaging device of any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111554345.8A CN114259254B (en) | 2021-12-17 | 2021-12-17 | Ultrasonic imaging device and ultrasonic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111554345.8A CN114259254B (en) | 2021-12-17 | 2021-12-17 | Ultrasonic imaging device and ultrasonic equipment |
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| CN114259254A true CN114259254A (en) | 2022-04-01 |
| CN114259254B CN114259254B (en) | 2024-04-23 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104622512A (en) * | 2015-02-04 | 2015-05-20 | 天津大学 | Capacitance type micro-ultrasonic sensor ring array with oval diaphragm unit structure and circuit system thereof |
| CN105411623A (en) * | 2015-12-25 | 2016-03-23 | 中国科学院深圳先进技术研究院 | Two-dimensional area array ultrasonic transducer and manufacturing method thereof |
| JP2018114042A (en) * | 2017-01-17 | 2018-07-26 | 株式会社日立製作所 | Ultrasound probe, ultrasound diagnostic apparatus, and semiconductor sensor |
| CN108704827A (en) * | 2018-04-16 | 2018-10-26 | 天津大学 | Capacitance type micromachined ultrasonic energy converter, the Preparation method and use of Air Coupling formula |
| CN112791926A (en) * | 2021-01-27 | 2021-05-14 | 上海悉像科技有限公司 | Ultrasonic imaging apparatus and ultrasonic imaging system |
-
2021
- 2021-12-17 CN CN202111554345.8A patent/CN114259254B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104622512A (en) * | 2015-02-04 | 2015-05-20 | 天津大学 | Capacitance type micro-ultrasonic sensor ring array with oval diaphragm unit structure and circuit system thereof |
| CN105411623A (en) * | 2015-12-25 | 2016-03-23 | 中国科学院深圳先进技术研究院 | Two-dimensional area array ultrasonic transducer and manufacturing method thereof |
| JP2018114042A (en) * | 2017-01-17 | 2018-07-26 | 株式会社日立製作所 | Ultrasound probe, ultrasound diagnostic apparatus, and semiconductor sensor |
| CN108704827A (en) * | 2018-04-16 | 2018-10-26 | 天津大学 | Capacitance type micromachined ultrasonic energy converter, the Preparation method and use of Air Coupling formula |
| CN112791926A (en) * | 2021-01-27 | 2021-05-14 | 上海悉像科技有限公司 | Ultrasonic imaging apparatus and ultrasonic imaging system |
Non-Patent Citations (1)
| Title |
|---|
| 伍于添: "医学超声设备原理", vol. 1, 北京：科学技术文献出版社, pages: 257 - 261 * |
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