CN114251922A - Temperature adjusting method of pressure oven and pressure oven - Google Patents

Abstract

The invention discloses a temperature adjusting method of a pressure oven, which comprises the following steps: providing a pressure oven, wherein the pressure oven comprises a cavity, a heater arranged in the cavity, an air inlet unit communicated with the cavity, a pressure release valve arranged in the cavity and a cooling return pipeline which is positioned outside the cavity and is communicated with the cavity in an openable and closable manner; operating the air inlet unit, filling air into the cavity, and enabling the air pressure in the cavity to be a first pressure, wherein the first pressure is greater than the standard atmospheric pressure; when the air pressure in the cavity is higher than the standard atmospheric pressure, operating the heater to raise the temperature of the cavity, so that the temperature in the cavity is raised from the first temperature to the second temperature; after the temperature is raised, opening the pressure release valve, and releasing the pressure of the cavity to reduce the pressure to a second pressure; and closing the pressure release valve, cooling, enabling at least one part of gas in the cavity to flow into the cooling return pipeline for cooling, and returning the gas to the cavity through the cooling return pipeline, so that the temperature in the cavity is reduced to a third temperature. The invention also discloses a pressure oven.

Description

Temperature adjusting method of pressure oven and pressure oven

Technical Field

The present invention relates to an oven and a temperature adjusting method, and more particularly, to a pressure oven and a temperature adjusting method for the pressure oven.

Background

In industrial processes, it is often necessary to operate in different temperature environments. Therefore, the rate of the heating process and the cooling process will affect the efficiency of the process, and the faster the heating and/or cooling rate, the higher the process efficiency.

Conventional cooling processes include non-reflow and reflow cooling processes. In a conventional non-reflow cooling process, for example, a high temperature gas is evacuated and then a low temperature gas is introduced to cool the chamber. However, this method consumes a large amount of gas and leads to an increase in cooling cost. In the conventional reflow cooling process, for example, the original high temperature gas is cooled outside the chamber through an additional pipeline and then reflows into the chamber to cool the chamber. Although the reflow cooling process can recycle the gas to reduce the gas cost, the cooling speed still has room for improvement. Therefore, how to combine the advantages of the non-reflow cooling process and the reflow cooling process, the development of a cooling process with fast cooling and reduced gas cost is an urgent problem to be solved in the art.

Disclosure of Invention

The technical problem to be solved by the embodiments of the present invention is to provide a temperature adjustment method for a pressure oven and a pressure oven, which can reduce the temperature of the pressure oven under a high-pressure environment and shorten the time required for cooling the cavity.

In order to solve the above technical problem, the present invention provides a temperature adjustment method for a pressure oven, comprising:

providing a pressure oven, wherein the pressure oven comprises a cavity, a heater arranged in the cavity, an air inlet unit communicated with the cavity, a pressure release valve arranged in the cavity, and a cooling return pipeline which is positioned outside the cavity and is communicated with the cavity in a switchable manner;

and operating the air inlet unit to fill the cavity with gas, so that the air pressure in the cavity is a first pressure, and the first pressure is greater than the standard atmospheric pressure.

When the air pressure in the cavity is greater than the standard atmospheric pressure, operating the heater to perform a temperature rise program on the cavity so as to raise the temperature in the cavity from a first temperature to a second temperature;

after the temperature rise program, opening the pressure release valve to perform a pressure release program on the cavity, so that a part of the gas in the cavity is released, and the gas pressure in the cavity is reduced to a second pressure;

and closing the pressure release valve, performing a temperature reduction procedure to enable at least one part of the gas in the cavity to flow into the cooling return pipeline for temperature reduction, and returning the gas back into the cavity through the cooling return pipeline again to enable the temperature in the cavity to be reduced to a third temperature.

In one possible implementation, at least a portion of the gas within the chamber is a remainder of the gas within the chamber after being vented by the pressure relief valve.

In one possible implementation, the second pressure is greater than standard atmospheric pressure.

In one possible implementation, the ratio of the second pressure to the first pressure is between 10% and 90%.

In one possible implementation, the ratio of the second pressure to the first pressure is between 30% and 70%.

In one possible implementation method, before the gas in the cavity flows into the cooling return line, the method further includes:

and filling external gas into the cavity, so that the gas pressure in the cavity is increased from the second pressure to a third pressure, wherein the temperature of the external gas is lower than the second temperature.

In one possible implementation, the external gas flows into the cooling return line together with the rest of the gas in the chamber after being discharged by the pressure relief valve to be cooled, and then returns to the chamber through the cooling return line.

In one possible implementation, the second pressure is greater than or equal to standard atmospheric pressure.

In one possible implementation, the third pressure is equal to or less than the first pressure.

Accordingly, the present invention also provides a pressure oven comprising:

a cavity;

the heater is arranged in the cavity so as to heat the cavity;

the fan is arranged in the cavity;

the air inlet unit is communicated with the cavity so as to inflate the cavity and pressurize the cavity;

the pressure relief valve is arranged in the cavity and used for discharging gas in the cavity to reduce pressure;

and the cooling return pipeline is positioned outside the cavity and can be communicated with the cavity in a switching way.

The implementation of the invention has the following beneficial effects:

based on the above, in the temperature adjustment method of the pressure oven of the present invention, the pressure relief procedure is performed before the temperature reduction procedure to release part of the heat energy in the cavity, and the air pressure in the cavity is kept to be greater than or equal to the standard atmospheric pressure. And then, flowing at least one part of the gas in the cavity into a cooling return pipeline outside the cavity to execute a cooling program, so that the temperature in the cavity is quickly reduced from the second temperature to a third temperature, and the aim of quickly reducing the temperature of the cavity is fulfilled. In addition, in the pressure oven of the invention, the cavity is pressurized through the air inlet unit, when the air pressure in the cavity is greater than the standard atmospheric pressure, the heater in the cavity is used for executing a temperature rise program to the cavity, and the pressure relief valve is used for executing a pressure relief program to the cavity after the temperature rise program, so that the air pressure in the cavity is greater than or equal to the standard atmospheric pressure. Then, a cooling procedure is executed by a cooling return pipeline outside the cavity body, so that the temperature in the cavity body is reduced to a third temperature. Therefore, the pressure oven of the present invention has the function of heating and cooling under high pressure environment, and the time required for the manufacturing process can be shortened by the temperature adjusting method of the pressure oven of the present invention.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application and are not to be construed as limiting the application.

Fig. 1 is a schematic view of a pressure oven of an embodiment of the present invention.

Fig. 2 is a flowchart of a temperature adjustment method of a pressure oven according to an embodiment of the present invention.

Fig. 3 is a schematic illustration of gas flow within the cavity of the pressure oven of fig. 1 during a temperature ramp sequence.

Fig. 4 is a schematic illustration of the gas flow within the lines of a pressure relief valve during a pressure relief procedure of the pressure oven of fig. 1.

Fig. 5 is a schematic illustration of the gas flow within the cooling return line during a pull down sequence for the pressure oven of fig. 4.

Fig. 6A is a schematic illustration of gas flow within the piping of the gas inlet unit during a pressurization sequence for the pressure oven of fig. 4.

Fig. 6B is a schematic illustration of the gas flow within the cooling return line of the pressure oven of fig. 6A during a cool down sequence.

Reference numerals in the drawings:

200-pressure oven; 210-a cavity; 220-a heater; 230-a fan; 232-central portion;

234-fan blades; 236-a rotating shaft; 238-a drive motor; 240-an air intake unit; 242. 262-a pipeline;

250-a cooling return line; 254-a cooling device; 256-a cooler; 258-fan; 260-pressure relief valve;

270-a pressure controller; 280-a pressure sensing device; 290-temperature controller;

310. 320, 340-gas; 330-external gas;

n1 — number of first gas molecules; n2 — number of second gas molecules; n3 — number of third gas molecules;

p1 — first pressure; p2-second pressure; p3-third pressure;

s110, S120, S130, S140, S150, S160 and S162-steps;

t1 — first temperature; t2 — second temperature; t3-third temperature.

Detailed description of the invention

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Fig. 1 is a schematic view of a pressure oven according to an embodiment of the present invention. In order to clearly show the arrangement of the components of the pressure oven 200, the components of the pressure oven 200 of fig. 1 are not drawn to scale and some components are omitted.

Referring to fig. 1, the pressure oven 200 of the present embodiment includes a cavity 210, a heater 220, a fan 230, an air intake unit 240, a cooling return line 250, and a pressure relief valve 260. The heater 220 and the fan 230 are disposed in the cavity 210, the heater 220 is adapted to heat the cavity 210, and the fan 230 is adapted to uniformly distribute the temperature in the cavity 210.

The gas inlet unit 240 is communicated with the cavity 210 and is adapted to fill the cavity 210 with gas 310 to pressurize the cavity 210. The pressure relief valve 260 is disposed in the chamber 210 and adapted to release a portion of the gas 310 in the chamber 210. The cooling return line 250 is located outside the cavity 210 and is in open-close communication with the cavity 210.

The pressure oven 200 also includes a cooling device 254 disposed in the cooling return line 250. The cooling device 254 of the present embodiment includes a cooler 256 and a fan 258, but the present invention is not limited thereto. The cooler 256 cools the gas 320 (fig. 4), and the fan 258 is adapted to create a pressure differential between the cooling device 254 and the chamber 210, such that the cooled gas 320 returns to the chamber 210 along the cooling return line 250 to lower the temperature in the chamber 210.

The fan 230 of the present embodiment includes a central portion 232, a plurality of blades 234, a rotating shaft 236 and a driving motor 238. The fan 234 extends from the central portion 232 and the range of rotation of the fan 234 is a windy area. The fan 234 is adapted to blow the gas 310 in the chamber 210, thereby causing the gas 310 to flow in the chamber 210. The shaft 236 connects the central portion 232 and the driving motor 238, so that the blades 234 can be rotated by the driving motor 238.

As shown in fig. 1, the heater 220 of the present embodiment is disposed at the front side of the fan 230 and the size of the fan 230 is smaller than that of the heater 220. The projection of the heater 220 onto the plane of the fan 230 at least partially overlaps the fan 230, and particularly partially overlaps the fan blade 234 (wind zone) of the fan 230. Of course, in other embodiments, the size of the fan 230 may be equal to or greater than the size of the heater 220.

The pressure oven 200 may optionally include a pressure sensing device 280, a temperature controller 290, and a pressure controller 270, but the present invention is not limited thereto. The pressure relief valve 260 is disposed in the chamber 210 to exhaust the gas 310 in the chamber 210 for pressure reduction. The pressure sensing device 280 is adapted to sense the air pressure within the cavity 210. The temperature controller 290 is adapted to identify the temperature within the chamber 210 to monitor the cool down rate of the chamber 210. The pressure controller 270 is adapted to control the gas 310 filled in the chamber 210.

The pressure oven 200 of the present embodiment can be applied to processes requiring rapid temperature rise and temperature fall, such as a defoaming process. Bubbles (void) generated in the die attach (die attach), potting (potting), underfill (underfill), printing (printing) or optical film attach (OCA) processes of the components (not shown) in the cavity 210 are removed by the pressure oven 200, and the cavity 210 of the pressure oven 200 is rapidly cooled by a temperature adjustment method to improve the process efficiency.

Fig. 2 is a flowchart of a temperature adjustment method of a pressure oven according to an embodiment of the present invention. Referring to fig. 1 and fig. 2, fig. 1 corresponds to step S110 of fig. 2. The intake unit 240 is operated to perform a supercharging process (step S110). As shown in fig. 1, the gas inlet unit 240 fills the chamber 210 with gas 310 through a pipe 242.

Referring to fig. 1, at this time, the number of gas molecules in the chamber 210 is the first number of gas molecules N1, so that the pressure in the chamber 210 is the first pressure P1, and the first pressure P1 is greater than the standard atmospheric pressure. The first pressure P1 of the present embodiment is, for example, 9 standard atmospheres, but the present embodiment is not limited thereto. Here, the temperature inside the chamber 210 is a first temperature T1.

Fig. 3 is a schematic illustration of gas flow within the cavity of the pressure oven of fig. 1 during a temperature ramp sequence. Referring to fig. 2 and fig. 3, fig. 3 corresponds to step S120 of fig. 2. When the air pressure in the chamber 210 is greater than the standard atmospheric pressure, the heater 220 and the fan 230 are operated to perform a temperature raising process on the chamber (step S120). The heater 220 heats the gas 310, and the fan 230 makes the gas 310 flow in the chamber 210 in the arrow direction, so that the temperature in the chamber 210 is uniformly increased from the first temperature T1 (fig. 1) to the second temperature T2 (step S120). At this time, the number of gas molecules in the chamber 210 maintains the first number of gas molecules N1, and the pressure in the chamber 210 is greater than the standard atmospheric pressure. At this stage, the component to be heated located in the cavity 210 may be rapidly heated.

Fig. 4 is a schematic illustration of the gas flow within the lines of a pressure relief valve during a pressure relief procedure of the pressure oven of fig. 1. Referring to fig. 4 and fig. 2, fig. 4 corresponds to step S130 of fig. 2. When the temperature increasing process (step S120) is finished and the cavity 210 needs to be cooled down, the heater 220 is turned off and the pressure relief valve 260 is opened to perform the pressure relief process (step S130). A portion of the gas 310 with high thermal energy in the chamber 210 is discharged from the chamber 210 through the pipe 262 by the pressure relief valve 260.

As shown in fig. 4, a part of the gas 310 flows in the line 262 to the relief valve 260 in the direction of the arrow, and leaves the chamber 210 through the relief valve 260, so that the number of gas molecules in the chamber 210 decreases, and the relief valve 260 is closed until the number of gas molecules in the chamber 210 decreases to the second number of gas molecules N2, and the gas pressure in the chamber 210 decreases to the second pressure P2 (step S130). Here, the second pressure P2 is equal to or greater than the standard atmospheric pressure. In the present embodiment, the second pressure P2 is, for example, 6 atm, but the invention is not limited thereto. In other embodiments, the second pressure P2 is, for example, standard atmospheric pressure.

Since a portion of the gas 310 having high thermal energy is discharged by the pressure relief valve 260, the thermal energy in the chamber 210 (fig. 4) of step S130 is less than or equal to the thermal energy in the chamber 210 (fig. 3) of step S120. In the present embodiment, the ratio of the second pressure P2 to the first pressure P1 is between 10% and 90%, but the invention is not limited thereto. For example, in other embodiments, the ratio of the second pressure P2 to the first pressure P1 is between 30% and 70%.

Fig. 5 is a schematic illustration of the gas flow within the cooling return line during a pull down sequence for the pressure oven of fig. 4. Referring to fig. 2 and fig. 5, fig. 5 corresponds to steps S140 and S150 of fig. 2. Here gas 320 is the remainder of gas 310 after being vented by pressure relief valve 260. The cooling return line 250 and the chamber 210 are communicated to perform a cooling process (step S140), so that the gas 320 with high thermal energy flows into the cooling return line 250 from the chamber 210.

As shown in fig. 5, gas 320 flows in the direction of the arrows in the cooling return line 250 and enters the cooling device 254. The gas molecules of the gas 320 are in heat exchange with the cooler 256 of the cooling device 254 to cool the gas 320. Next, the cooled gas 320 is returned to the chamber 210 through the cooling return line 250 (step S150).

The gas 320 is continuously circulated in the chamber 210 and the cooling return line 250 until the temperature in the chamber 210 drops to the third temperature T3 (step S160). At this time, the number of gas molecules in the chamber 210 maintains the second number of gas molecules N2, and the pressure in the chamber 210 is greater than or equal to the standard atmospheric pressure.

It can be seen that the pressure oven 200 of the present embodiment is an open loop, and a part of the gas 310 (fig. 1) filled in the cavity 210 can be discharged through the pressure relief valve 260. During the temperature raising process (step S120), the pressure releasing process (step S130) and the temperature lowering process (step S140) of the pressure oven 200 of the present embodiment, the air pressure in the cavity 210 is always greater than the standard atmospheric pressure. In other words, the pressure oven 200 is heated and cooled under positive pressure, so as to increase the heating and cooling rate and efficiency.

In addition, in the temperature reduction procedure of the embodiment, the temperature of the cavity 210 is reduced by returning the gas 320 to the cavity 210 after the gas exchanges heat with the cooling device 254 in the cooling return line 250. Therefore, the number of gas molecules in the gas 320 is greater than the number of molecules at the standard atmospheric pressure, thereby enhancing the cooling performance of the chamber 210.

In addition, since only a part of the gas 310 is discharged in the pressure releasing procedure of the present embodiment, the preparation time of the next temperature raising procedure can be shortened, for example, only a small amount of gas is required to be filled to make the gas pressure in the cavity 210 reach the first pressure P1, and then the temperature raising procedure can be performed to improve the process efficiency of the pressure oven 200.

Fig. 6A is a schematic illustration of gas flow within the piping of the gas inlet unit during a pressurization sequence for the pressure oven of fig. 4. Referring to fig. 2 and fig. 6A together, fig. 6A corresponds to step S160 of fig. 2. The temperature adjustment method of the pressure oven 200 may optionally include a pressurization process (step S160).

After the pressure relief valve 260 is closed (step S130) and before the temperature reduction process (step S162), the chamber 210 is filled with an external gas 330 by the gas inlet unit 240, until the number of gas molecules in the chamber 210 increases from the second number of gas molecules N2 to the third number of gas molecules N3, so that the gas pressure increases from the second pressure P2 to the third pressure P3 (step S160), and then the gas inlet unit 240 is closed.

The third pressure P3 of the present embodiment is greater than the standard atmospheric pressure, and the third pressure P3 is equal to or less than the first pressure P1. The third pressure P3 is, for example, 9 atm, but the invention is not limited thereto. For example, in other embodiments, the third pressure P3 is greater than the first pressure P1.

Fig. 6B is a schematic illustration of the gas flow within the cooling return line of the pressure oven of fig. 6A during a cool down sequence. Referring to fig. 2 and fig. 6B, fig. 6B corresponds to steps S162 and S150 of fig. 2. The temperature lowering process (step S162) is executed after the pressurization process (step S160). Here, gas 340 includes external gas 330 and the remainder of gas 310 (fig. 1) after being vented by pressure relief valve 260. The cooling return line 250 is communicated with the chamber 210 to perform a temperature reduction process (step S162).

The gas 340 flows from the chamber 210 into the cooling return line 250 and is cooled by the cooling device 254. Finally, the cooled gas 340 returns to the chamber 210 through the cooling return line 250 again (step S162) until the temperature in the chamber 210 drops to the third temperature T3 (step S150). At this time, the number of gas molecules in the chamber 210 maintains the third number of gas molecules N3, so that the pressure in the chamber 210 is greater than the standard atmospheric pressure.

In the present embodiment, the temperature of the outside air 330 is lower than the second temperature T2. In other words, before the cooling is performed through the cooling return line 250, the external gas 330 with low heat energy and the gas 320 with high heat energy are mixed to form the gas 340, so that the heat energy in the cavity 210 is reduced, and then the cooling process is performed to improve the cooling efficiency of the cavity 210.

It should be noted that, referring back to fig. 2, the present embodiment further includes a pressurization process (step S160) before the temperature reduction process (step S162). Since the external gas 330 is filled into the cavity 210 (fig. 6A) in the step S160, the number of gas molecules (the third gas molecule number N3) in the cavity 210 in the step S162 is greater than the number of gas molecules (the second gas molecule number N2) in the cavity 210 mentioned in the step S130, compared to the temperature reduction method from the steps S130, S140 to S150 described in the previous embodiment.

Since the temperature reduction performance of the temperature reduction process is related to the number of gas molecules of the gases 320 and 340, and the third number of gas molecules N3 is greater than the second number of gas molecules N2, the chamber 210 of step S162 has more gas molecules capable of exchanging heat with the cooler 230, thereby achieving a better temperature reduction performance. Whether directly proceeding from steps S130, S140 to step S150 or proceeding from steps S130, S160, S162 to step S150, has the advantage of facilitating cooling.

It should be noted that, since the additional external gas 330 needs to be additionally charged in the step S160, the step S160 further includes an additional waiting time to increase the number of the gas molecules in the chamber 210 to the third number of gas molecules N3 before the temperature decreasing procedure is performed, and the operator can select the required operation steps according to the requirement.

In summary, in the temperature adjustment method for a pressure oven of the present invention, the pressure relief process is performed before the temperature reduction process to release part of the heat energy of the cavity, so as to shorten the time required by the temperature reduction process and improve the process efficiency. The air pressure (e.g., the second pressure and the third pressure) of the cavity during the temperature reduction procedure is greater than or equal to the standard atmospheric pressure, so that the temperature reduction procedure of the cavity can be quickly executed again after the temperature reduction procedure is finished, thereby improving the process efficiency of the pressure oven.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A method of adjusting temperature of a pressure oven, comprising:

providing a pressure oven, wherein the pressure oven comprises a cavity, a heater arranged in the cavity, an air inlet unit communicated with the cavity, a pressure release valve arranged in the cavity, and a cooling return pipeline which is positioned outside the cavity and is communicated with the cavity in a switchable manner;

operating the air inlet unit to fill the cavity with air so that the air pressure in the cavity is a first pressure, wherein the first pressure is greater than a standard atmospheric pressure;

when the air pressure in the cavity is greater than the standard atmospheric pressure, operating the heater to perform a temperature rise program on the cavity so as to raise the temperature in the cavity from a first temperature to a second temperature;

after the temperature rise program, opening the pressure release valve to perform a pressure release program on the cavity, so that a part of the gas in the cavity is released, and the gas pressure in the cavity is reduced to a second pressure;

and closing the pressure release valve, performing a temperature reduction procedure to enable at least one part of the gas in the cavity to flow into the cooling return pipeline for temperature reduction, and returning the gas back into the cavity through the cooling return pipeline again to enable the temperature in the cavity to be reduced to a third temperature.

2. The method of temperature adjustment of a pressure oven of claim 1, wherein at least a portion of the gas within the cavity is a remaining portion of the gas within the cavity after being vented out by the pressure relief valve.

3. The method of temperature adjustment for a pressure oven of claim 2, wherein said second pressure is greater than standard atmospheric pressure.

4. The method of claim 1, wherein a ratio of the second pressure to the first pressure is between 10% and 90%.

5. The method of claim 1, wherein a ratio of the second pressure to the first pressure is between 30% and 70%.

6. The method of adjusting temperature of a pressure oven of claim 1, further comprising, prior to flowing gas within the cavity into the cooling return line:

and filling external gas into the cavity, so that the gas pressure in the cavity is increased from the second pressure to a third pressure, wherein the temperature of the external gas is lower than the second temperature.

7. The method of adjusting temperature of a pressure oven of claim 6, wherein external air flows into the cooling return line to be cooled along with the remaining portion of the air in the cavity after being vented by the pressure relief valve, and is returned to the cavity again through the cooling return line.

8. The method of claim 6, wherein the second pressure is equal to or greater than a standard atmospheric pressure.

9. The method of claim 6, wherein the third pressure is less than or equal to the first pressure.

10. A pressure oven, comprising:

a cavity;

the heater is arranged in the cavity so as to heat the cavity;

the fan is arranged in the cavity;

the air inlet unit is communicated with the cavity so as to inflate the cavity and pressurize the cavity;

the pressure relief valve is arranged in the cavity and used for discharging gas in the cavity to reduce pressure;

and the cooling return pipeline is positioned outside the cavity and can be communicated with the cavity in a switching way.

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