TWI778897B - Temperature adjustment method for pressure oven and pressure oven - Google Patents

Abstract

A temperature adjustment method for a pressure oven includes the steps below. The pressure oven is provided. The pressure oven includes a chamber, a heater, an air inlet unit, a pressure relief valve, and a cooling return pipe located outside the chamber and switchably connected to the chamber. The air inlet unit is operated to fill the chamber with gas so that a pressure in the chamber is a first pressure, and the first pressure is greater than one atmospheric. The heater is operated to increase a temperature in the chamber from a first temperature to a second temperature. The pressure relief valve is opened to perform a pressure relief procedure, so that a part of the gas in the chamber is discharged, and the pressure is decreased to a second pressure. The pressure relief valve is closed and a cooling procedure is performed, so that at least a part of the gas in the chamber flows into the cooling return pipe to cool down, and returns to the chamber through the cooling return pipe, so that the temperature in the chamber is decreased to a third temperature.

Description

How to adjust the temperature of the pressure oven and the pressure oven

The present invention relates to an oven and a temperature adjustment method, and in particular to a pressure oven and a temperature adjustment method for the pressure oven.

In industrial processes, it is often necessary to operate in different temperature environments. Therefore, the rate of the heating process and the cooling process will affect the efficiency of the process, and the faster the heating and/or cooling rate, the higher the process efficiency.

Conventional cooling processes include non-regenerating and regenerative cooling processes. In the conventional non-feedback cooling process, for example, the original high temperature gas is evacuated and then the low temperature gas is introduced to cool the cavity. However, this method will consume a large amount of gas and lead to increased cooling costs. In the conventional feedback cooling process, for example, the original high-temperature gas is cooled outside the cavity through an additional pipeline, and then fed back into the cavity to cool the cavity. Although the feedback cooling process can reuse the gas and reduce the gas cost, there is still room for improvement in the cooling rate. Therefore, how to take into account the advantages of the non-feedback cooling process and the feedback cooling process, and develop a cooling process with rapid cooling and reduced gas cost is an urgent problem to be solved in the art.

The present invention provides a temperature adjustment method for a pressure oven. Before the cooling procedure of the pressure oven, the pressure relief valve is opened to perform the pressure relief procedure, and part of the gas is released, and the air pressure in the cavity is still greater than or equal to one atmosphere. Next, the remaining gas in the cavity flows into the cooling return line outside the cavity to cool down, and the remaining gas is returned to the cavity through the cooling return line to cool the cavity, so as to quickly cool the cavity and reduce the gas cost target.

The invention provides a pressure oven. The cavity is provided with a pressure relief valve and a cooling return line is arranged outside the cavity. When a part of the gas is released from the cavity through the pressure relief valve and the air pressure in the cavity is greater than atmospheric pressure, the cooling return pipe is passed through the cavity. The cooling gas is used to cool the cavity, so that the pressure oven can be cooled in a high-pressure environment, and the time required for the cooling of the cavity is shortened.

The present invention relates to a temperature adjustment method of a pressure oven, which includes: providing a pressure oven, the pressure oven includes a cavity, a heater arranged in the cavity, an air intake unit communicated with the cavity, and a heater arranged in the cavity. A pressure relief valve and a cooling return line located outside the cavity and switchably connected to the cavity. The air inlet unit is operated to fill the cavity with a gas, so that an air pressure in the cavity is a first pressure, and the first pressure is greater than one atmosphere. When the air pressure in the cavity is greater than one atmosphere, the heater is operated to perform a heating program for the cavity to increase the temperature in the cavity from a first temperature to a second temperature. After the heating procedure, the pressure relief valve is opened to perform a pressure relief procedure for the cavity, so that a part of the gas in the cavity is released, and the air pressure is lowered to the second pressure. Close the pressure relief valve to perform a cooling procedure, so that at least a part of the gas in the cavity flows into the cooling return line to cool down, and returns to the cavity through the cooling return line again, so that the temperature in the cavity drops to the third temperature .

In an embodiment of the present invention, at least a part of the gas is the remaining part of the gas in the cavity after being released by the pressure relief valve.

In an embodiment of the present invention, the second pressure is greater than one atmosphere.

In an embodiment of the present invention, the ratio of the second pressure to the first pressure is between 10% and 90%.

In an embodiment of the present invention, the ratio of the second pressure to the first pressure is between 30% and 70%.

In an embodiment of the present invention, before the gas flows into the cooling return line, the method further includes filling the cavity with external gas, and increasing the gas pressure from the second pressure to the third pressure. The temperature of the outside air is lower than the second temperature.

In an embodiment of the present invention, the external gas and the remaining part of the gas after being discharged by the pressure relief valve flow into the cooling return line to cool down, and then return to the cavity through the cooling return line.

In an embodiment of the present invention, the second pressure is greater than or equal to one atmosphere.

In an embodiment of the present invention, the third pressure is less than or equal to the first pressure.

A pressure oven of the present invention includes: a cavity, a heater, a fan, an air intake unit, a pressure relief valve and a cooling return line. The heater is arranged in the cavity to heat up the cavity. The fan is arranged in the cavity. The air intake unit is communicated with the cavity to inflate and pressurize the cavity. The pressure relief valve is arranged in the cavity to discharge the gas in the cavity to reduce the pressure. The cooling return line is located outside the cavity and is switchably connected to the cavity.

Based on the above, in the temperature adjustment method of the pressure oven of the present invention, the pressure relief procedure is performed before the cooling procedure to release part of the thermal energy in the cavity and keep the air pressure in the cavity greater than or equal to one atmosphere. Next, at least a part of the gas in the cavity flows into the cooling return line outside the cavity to perform a cooling procedure, so that the temperature in the cavity is rapidly lowered from the second temperature to the third temperature, so as to achieve the goal of rapidly cooling the cavity. In addition, in the pressure oven of the present invention, the cavity is pressurized through the air intake unit, and when the air pressure in the cavity is greater than one atmosphere, the heating process is performed on the cavity by the heater in the cavity, and after the heating process, the cavity is heated by The pressure relief valve performs a pressure relief procedure on the cavity, so that the air pressure in the cavity is greater than or equal to one atmosphere. Next, a cooling procedure is performed through the cooling return line outside the cavity, so that the temperature in the cavity is lowered to a third temperature. It can be seen that the pressure oven of the present invention has the functions of heating and cooling in a high-pressure environment, and the time required for the manufacturing process can be shortened through the temperature adjustment method of the pressure oven of the present invention.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

The present invention is more fully described with reference to the drawings of this embodiment. However, the present invention may be embodied in various forms and should not be limited to the embodiments described herein. The same or similar reference numerals denote the same or similar elements, and will not be repeated in the following paragraphs.

FIG. 1 is a schematic diagram of a pressure oven according to an embodiment of the present invention. In order to clearly show the arrangement relationship of the elements of the pressure oven 200 , each element of the pressure oven 200 in FIG. 1 is not drawn to scale, and some elements are omitted.

Referring to FIG. 1 , the pressure oven 200 of this embodiment includes a cavity 210 , a heater 220 , a fan 230 , an air intake unit 240 , a cooling return line 250 and a pressure relief valve 260 . The heater 220 and the fan 230 are disposed in the cavity 210 . The heater 220 is suitable for heating the cavity 210 and the fan 230 is suitable for uniformly distributing the temperature in the cavity 210 .

The air intake unit 240 communicates with the cavity 210 and is suitable for filling the cavity 210 with a gas 310 to pressurize the cavity 210 . The pressure relief valve 260 is disposed in the cavity 210 and is suitable for releasing a part of the gas 310 in the cavity 210 . The cooling return line 250 is located outside the cavity 210 and is switchably connected to the cavity 210 .

The pressure oven 200 further includes a cooling device 254 disposed in the cooling return line 250 . The cooling device 254 in this embodiment includes a cooler 256 and a fan 258, but the invention is not limited thereto. The cooler 256 is adapted to cool the gas 320 ( FIG. 5 ), and the fan 258 is adapted to form a pressure difference between the cooling device 254 and the cavity 210 , so that the cooled gas 320 returns to the cavity along the cooling return line 250 210 to reduce the temperature in the cavity 210 .

The fan 230 of this embodiment includes a central portion 232 , a plurality of fan blades 234 , a rotating shaft 236 and a driving motor 238 . The fan blade 234 extends from the central portion 232 and the rotation range of the fan blade 234 is a windy area. The fan blades 234 are suitable for blowing the gas 310 in the cavity 210 to make the gas 310 flow in the cavity 210 . The rotating shaft 236 is connected to the central portion 232 and the driving motor 238 to rotate the fan blades 234 through the driving motor 238 .

As shown in FIG. 1 , the heater 220 of the present embodiment is disposed on the front side of the fan 230 and the size of the fan 230 is smaller than that of the heater 220 . The projection of the heater 220 on the plane where the fan 230 is located at least partially overlaps the fan 230 , and particularly partially overlaps the fan blade 234 (wind zone) of the fan 230 . Of course, in other embodiments, the size of the fan 230 may also be equal to or larger than the size of the heater 220 .

The pressure oven 200 can optionally include a pressure sensing device 280, a temperature controller 290 and a pressure controller 270, but the invention is not limited thereto. The pressure relief valve 260 is disposed in the cavity 210 to discharge the gas 310 in the cavity 210 to reduce pressure. The pressure sensing device 280 is adapted to sense the air pressure in the cavity 210 . The temperature controller 290 is adapted to confirm the temperature in the cavity 210 to monitor the cooling rate of the cavity 210 . The pressure controller 270 is adapted to control the gas 310 charged into the cavity 210 .

The pressure oven 200 of this embodiment can be applied to a process requiring rapid heating and cooling, such as a defoaming process. The components (not shown) in the cavity 210 are removed through the pressure oven 200 for die attach, potting, underfill, printing or optical film attachment (OCA lamination) and other processes, the cavity 210 of the pressure oven 200 is rapidly cooled by a temperature adjustment method, so as to improve the process efficiency.

FIG. 2 is a flowchart of a temperature adjustment method of a pressure oven according to an embodiment of the present invention. Please refer to FIG. 1 and FIG. 2 at the same time. FIG. 1 corresponds to step S110 of FIG. 2 . The intake unit 240 is operated to perform a supercharging process (step S110). As shown in FIG. 1 , the air intake unit 240 fills the gas 310 into the cavity 210 through a pipeline 242 .

Referring to FIG. 1 , the number of gas molecules in the cavity 210 is a first number N1 of gas molecules, and a pressure in the cavity 210 is a first pressure P1 , which is greater than one atmosphere. The first pressure P1 in this embodiment is, for example, 9 atmospheres, but this embodiment is not limited to this. Here, the temperature in the cavity 210 is a first temperature T1.

FIG. 3 is a schematic diagram of the gas flow in the cavity of the pressure oven of FIG. 1 during a temperature rise program. Please refer to FIG. 2 and FIG. 3 at the same time. FIG. 3 corresponds to step S120 of FIG. 2 . When the air pressure in the cavity 210 is greater than one atmosphere, the heater 220 and the fan 230 are operated to perform a heating procedure for the cavity (step S120 ). The heater 220 heats the gas 310, and the fan 230 makes the gas 310 flow in the cavity 210 in the direction of the arrow, so that the temperature in the cavity 210 uniformly rises from the first temperature T1 (FIG. 1) to a second temperature T2 ( Step S120). At this time, the number of gas molecules in the cavity 210 remains the first number N1 of gas molecules, so that the air pressure in the cavity 210 is greater than one atmosphere. At this stage, the element to be heated (not shown) located in the cavity 210 can be rapidly heated.

FIG. 4 is a schematic diagram of gas flow in the piping of the pressure relief valve of the pressure oven of FIG. 1 during a pressure relief procedure. Please refer to FIG. 4 and FIG. 2 at the same time. FIG. 4 corresponds to step S130 of FIG. 2 . When the heating procedure (step S120 ) ends and the cavity 210 needs to be cooled, the heater 220 is turned off and the pressure relief valve 260 is opened to perform a pressure relief procedure (step S130 ). A part of the gas 310 with high thermal energy in the cavity 210 is discharged from the cavity 210 through a pipeline 262 by means of the pressure relief valve 260 .

As shown in FIG. 4 , a part of the gas 310 flows in the pipeline 262 to the pressure relief valve 260 in the direction of the arrow, and leaves the cavity 210 through the pressure relief valve 260, so that the number of gas molecules in the cavity 210 decreases until the cavity When the number of gas molecules in the body 210 drops to a second number N2 of gas molecules, and when the air pressure in the cavity 210 drops to a second pressure P2, the pressure relief valve 260 is closed (step S130). The second pressure P2 here is equal to or greater than one atmosphere. In this embodiment, the second pressure P2 is, for example, 6 atmospheres, but the present invention is not limited to this. In other embodiments, the second pressure P2 is, for example, one atmosphere.

Since a part of the gas 310 with high thermal energy is released by the pressure relief valve 260, the thermal energy in the cavity 210 (FIG. 4) in step S130 is less than or equal to the thermal energy in the cavity 210 (FIG. 3) in step S120. In this embodiment, the ratio of the second pressure P2 to the first pressure P1 is between 10% and 90%, but the present invention is not limited thereto. For example, in other embodiments, the ratio of the second pressure P2 to the first pressure P1 is between 30% and 70%.

FIG. 5 is a schematic diagram of the gas flow in the cooling return line of the pressure oven of FIG. 4 during a cooling procedure. Please refer to FIG. 2 and FIG. 5 at the same time. FIG. 5 corresponds to steps S140 and S150 of FIG. 2 . The gas 320 here is the remaining part of the gas 310 after being released by the pressure relief valve 260 . The cooling return line 250 and the cavity 210 are connected to perform a cooling process (step S140 ), so that the gas 320 with high thermal energy flows from the cavity 210 into the cooling return line 250 .

As shown in FIG. 5 , the gas 320 flows in the cooling return line 250 and enters the cooling device 254 in the direction of the arrow. The gas molecules of the gas 320 exchange heat with the cooler 256 of the cooling device 254 to cool the gas 320 . Next, the cooled gas 320 is sent back to the cavity 210 through the cooling return line 250 (step S150 ).

The gas 320 circulates continuously in the cavity 210 and the cooling return line 250 until the temperature in the cavity 210 drops to the third temperature T3 (step S160 ). At this time, the number of gas molecules in the cavity 210 maintains the second number N2 of gas molecules, and the air pressure in the cavity 210 is greater than or equal to one atmospheric pressure.

It can be seen from this that the pressure oven 200 of this embodiment is an open circuit, and a part of the gas 310 ( FIG. 1 ) charged into the cavity 210 can be released through the pressure relief valve 260 . During the heating procedure (step S120 ), the pressure relief procedure (step S130 ), and the cooling procedure (step S140 ) of the pressure oven 200 of this embodiment, the air pressure in the cavity 210 is always greater than one atmosphere. In other words, the pressure oven 200 is heated and cooled in a positive pressure state, so that the rate and efficiency of the heating and cooling can be increased.

In addition, in the cooling process of the present embodiment, the temperature of the cavity 210 depends on the gas 320 performing heat exchange with the cooling device 254 in the cooling return line 250 and then returning to the cavity 210 to cool the cavity 210 . Therefore, the number of gas molecules of the gas 320 is greater than the number of molecules at atmospheric pressure, so that the cooling performance of the cavity 210 can be improved.

In addition, since only a part of the gas 310 is released in the pressure relief procedure of this embodiment, the preparation time for the next heating procedure can be shortened. After the pressure P1 ( FIG. 1 ), a temperature rise program can be performed to improve the process efficiency of the pressure oven 200 .

FIG. 6A is a schematic diagram of the gas flow in the piping of the air intake unit during the pressurization procedure of the pressure oven of FIG. 4 . Please refer to FIG. 2 and FIG. 6A at the same time. FIG. 6A corresponds to step S160 of FIG. 2 . The temperature adjustment method of the pressure oven 200 may optionally include a pressurization procedure (step S160).

After closing the pressure relief valve 260 (step S130 ) and before the cooling process ( S162 ), an external gas 330 is filled into the cavity 210 by the air intake unit 240 until the number of gas molecules in the cavity 210 increases from the second After the number N2 of gas molecules increases to a third number N3 of gas molecules, and the air pressure is increased from the second pressure P2 to a third pressure P3 (step S160 ), the air intake unit 240 is closed.

The third pressure P3 in this embodiment is greater than one atmosphere, and the third pressure P3 is less than or equal to the first pressure P1. The third pressure P3 is, for example, 9 atmospheres, but the present invention is not limited to this. For example, in other embodiments, the third pressure P3 is greater than the first pressure P1.

FIG. 6B is a schematic diagram of the gas flow in the cooling return line of the pressure oven of FIG. 6A during a cooling procedure. Please refer to FIG. 2 and FIG. 6B . FIG. 6B corresponds to steps S162 and S150 of FIG. 2 . The cooling process (step S162 ) is performed after the pressurization process (step S160 ). Here, a gas 340 includes the remaining part of the external gas 330 and the gas 310 ( FIG. 1 ) after being released by the pressure relief valve 260 . The cooling return line 250 is communicated with the cavity 210 to perform a cooling process (step S162).

The gas 340 flows into the cooling return line 250 from the cavity 210 and is cooled by the cooling device 254 . Finally, the cooled gas 340 is returned to the cavity 210 through the cooling return line 250 (step S162 ) until the temperature in the cavity 210 drops to the third temperature T3 (step S150 ). At this time, the number of gas molecules in the cavity 210 maintains the third number N3 of gas molecules, so that the air pressure in the cavity 210 is greater than one atmosphere.

In this embodiment, the temperature of the outside air 330 is lower than the second temperature T2. In other words, before cooling through the cooling return line 250, the external gas 330 with low thermal energy is mixed with the gas 320 with high thermal energy to form the gas 340, so that the thermal energy in the cavity 210 is reduced, and then the cooling process is performed, so as to The cooling efficiency of the cavity 210 is improved.

It is worth mentioning that, please go back to FIG. 2 , this embodiment also includes a pressurizing process (step S160 ) before the cooling process (step S162 ). Since the external gas 330 is filled into the cavity 210 ( FIG. 6A ) in step S160 , compared with the cooling method from steps S130 , S140 to S150 described in the previous embodiment, the gas in the cavity 210 in step S162 The number of molecules (the third number of gas molecules N3 ) is greater than the number of gas molecules (the second number of gas molecules N2 ) in the cavity 210 mentioned in step S130 .

Since the cooling efficiency of the cooling process is related to the number of gas molecules in the gases 320 and 340 , and the number N3 of the third gas molecules is greater than the number N2 of the second gas molecules, the cavity 210 in step S162 has more gas molecules that can interact with the cooler 256 For heat exchange, it can have better cooling performance. Whether it is directly from step S130, S140 to step S150 or from step S130, S160, S162 to step S150, it has the advantage of helping to reduce temperature.

It should be noted that since additional external gas 330 needs to be charged in step S160, an additional waiting time is also included in step S160 to increase the number of gas molecules in the cavity 210 to the third number of gas molecules N3 , the cooling procedure can be carried out, and the operator can choose the required operation steps according to the needs.

To sum up, in the temperature adjustment method of the pressure oven of the present invention, the pressure relief procedure is performed before the cooling procedure to release part of the thermal energy of the cavity, thereby shortening the time required for the cooling procedure and improving the process efficiency. During the cooling process, the air pressure of the cavity (eg, the second pressure, the third pressure) is greater than or equal to one atmosphere, so that the cavity can quickly perform the heating process again after the cooling process, so as to improve the process efficiency of the pressure oven .

Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.

N1: Number of first gas molecules

N2: Number of second gas molecules

N3: Number of third gas molecules

P1: First pressure

P2: Second pressure

P3: Third pressure

S110, S120, S130, S140, S150, S160, S162: Steps

T1: first temperature

T2: Second temperature

T3: The third temperature

200: Pressure Oven

210: Cavity

220: Heater

230: Fan

232: Central Department

234: Fan Leaf

236: Spindle

238: Drive Motor

240: Intake unit

242, 262: pipeline

250: Cooling return line

254: Cooling device

256: Cooler

258: Fan

260: Pressure relief valve

270: Pressure Controller

280: Pressure Sensing Device

290: Temperature Controller

310, 320, 340: Gas

330: External gas

FIG. 1 is a schematic diagram of a pressure oven according to an embodiment of the present invention. FIG. 2 is a flowchart of a temperature adjustment method of a pressure oven according to an embodiment of the present invention. FIG. 3 is a schematic diagram of the gas flow in the cavity of the pressure oven of FIG. 1 during a temperature rise program. FIG. 4 is a schematic diagram of gas flow in the piping of the pressure relief valve of the pressure oven of FIG. 1 during a pressure relief procedure. FIG. 5 is a schematic diagram of the gas flow in the cooling return line of the pressure oven of FIG. 4 during a cooling procedure. FIG. 6A is a schematic diagram of the gas flow in the piping of the air intake unit during the pressurization procedure of the pressure oven of FIG. 4 . FIG. 6B is a schematic diagram of the gas flow in the cooling return line of the pressure oven of FIG. 6A during a cooling procedure.

N1: Number of first gas molecules

P1: First pressure

T1: first temperature

200: Pressure Oven

210: Cavity

220: Heater

230: Fan

232: Central Department

234: Fan Leaf

236: Spindle

238: Drive Motor

240: Intake unit

242, 262: pipeline

250: Cooling return line

254: Cooling device

256: Cooler

258: Fan

260: Pressure relief valve

270: Pressure Controller

280: Pressure Sensing Device

290: Temperature Controller

310: Gas

Claims (8)

A temperature adjustment method for a pressure oven, comprising: providing a pressure oven, wherein the pressure oven includes a cavity, a heater arranged in the cavity, an air intake unit communicated with the cavity, and an air intake unit arranged in the cavity. a pressure relief valve and a cooling return line located outside the cavity and openably connected to the cavity; operate the air intake unit to fill the cavity with a gas, so that an air pressure in the cavity is a first pressure, the first pressure is greater than one atmospheric pressure; when the air pressure in the cavity is greater than one atmospheric pressure, the heater is operated to perform a heating program for the cavity, so that the temperature in the cavity is changed from a first A temperature is increased to a second temperature; after the heating procedure, the pressure relief valve is opened to perform a pressure relief procedure for the cavity, so that a part of the gas in the cavity is released, and the air pressure is reduced to a second pressure, the second pressure is greater than atmospheric pressure; and the pressure relief valve is closed to perform a cooling process, so that at least a part of the gas in the cavity flows into the cooling return line to cool down, and passes through the cooling return line The circuit returns to the cavity again, so that the temperature in the cavity drops to a third temperature. The temperature adjustment method of the pressure oven according to claim 1, wherein the at least part of the gas is the remaining part of the gas in the cavity after being released by the pressure relief valve. The temperature adjustment method of the pressure oven according to claim 1, wherein the ratio of the second pressure to the first pressure is between 10% and 90%. The temperature adjustment method of the pressure oven according to claim 1, wherein the ratio of the second pressure to the first pressure is between 30% and 70%. The temperature adjustment method for a pressure oven as claimed in claim 1, wherein before the gas flows into the cooling return line, the method further comprises: filling the cavity with an external gas, and increasing the air pressure from the second pressure to A third pressure, wherein the temperature of the outside gas is lower than the second temperature. The temperature adjustment method of the pressure oven according to claim 5, wherein the external air and the remaining part of the air after being discharged by the pressure relief valve flow into the cooling return line to reduce temperature, and pass through the cooling return line back into the cavity again. The temperature adjustment method of a pressure oven according to claim 5, wherein the third pressure is less than or equal to the first pressure. A pressure oven, comprising: a cavity; a heater arranged in the cavity to heat the cavity; a fan arranged in the cavity, wherein the projection of the heater on the plane where the fan is located is at least Partly overlaps the fan; an air intake unit communicates with the cavity to inflate and pressurize the cavity; a pressure relief valve is arranged in the cavity to discharge the gas in the cavity to reduce pressure; and a cooling return line, which is located outside the cavity and is switchably connected to the cavity.

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