CN114244380B - Modularized microwave signal source system - Google Patents
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- CN114244380B CN114244380B CN202111665698.5A CN202111665698A CN114244380B CN 114244380 B CN114244380 B CN 114244380B CN 202111665698 A CN202111665698 A CN 202111665698A CN 114244380 B CN114244380 B CN 114244380B
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- 238000010586 diagram Methods 0.000 description 6
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- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 3
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L27/00—Modulated-carrier systems
- H04L27/10—Frequency-modulated carrier systems, i.e. using frequency-shift keying
- H04L27/12—Modulator circuits; Transmitter circuits
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L27/00—Modulated-carrier systems
- H04L27/10—Frequency-modulated carrier systems, i.e. using frequency-shift keying
- H04L27/16—Frequency regulation arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H04B2001/0491—Circuits with frequency synthesizers, frequency converters or modulators
Abstract
The embodiment of the application relates to a modularized microwave signal source system, which comprises a baseband source module, an up-conversion module, a local oscillator source module, a spread spectrum module and a switch attenuation module; the baseband source module receives an external trigger signal and converts the external trigger signal into an intermediate frequency signal internally carrying modulation information; the up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information, up-converting the intermediate frequency signal carrying the modulation information to generate a modulation signal with the maximum carrier frequency being a preset frequency; the local oscillation source module generates a multichannel continuous wave signal to be input into the up-conversion module to drive the up-conversion module; and the switch attenuation module is used for carrying out signal combination on signals with different frequency bands and different functions generated by the system and carrying out power adjustment on the signals. The application realizes the function of external modulation of the broadband modularized microwave signal source.
Description
Technical Field
The embodiment of the application relates to the technical field of radio frequency circuits, in particular to a modularized microwave signal source system.
Background
Compared with the PXIe bus modularized microwave signal source product In the market, in the system design of the vector signal generation function, an In-phase (IQ) modulator generation mode is generally adopted In an internal and external modulation mode, and the circuit architecture is simple, but the defects are quite obvious: firstly, the IQ modulator with the working frequency reaching 44GHz is lack of products, secondly, the IQ modulation mode needs to calibrate the baseband amplitude imbalance, the baseband phase imbalance and the carrier leakage under different center frequencies, and the wider the working bandwidth of the modularized microwave signal source is, the higher the calibration complexity is, and the higher the uncertainty is caused by environmental factors.
Disclosure of Invention
In view of the above, in order to solve the above technical problems, an embodiment of the present application provides a modularized microwave signal source system, which implements a modularized microwave signal source function.
The modularized microwave signal source system comprises a baseband source module, an up-conversion module, a local oscillation source module, a spread spectrum module and a switch attenuation module;
the baseband source module receives an external trigger signal and converts the external trigger signal into an intermediate frequency signal internally carrying modulation information;
the up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information, up-converting the intermediate frequency signal carrying the modulation information to generate a modulation signal with the maximum carrier frequency being a preset frequency;
the local oscillation source module generates a multichannel continuous wave signal to be input into the up-conversion module to drive the up-conversion module;
and the switch attenuation module is used for carrying out signal combination on signals with different frequency bands and different functions generated by the system and carrying out power adjustment on the signals.
Further, the modular microwave signal source system further comprises:
and the IQ modulation module is used for receiving external IQ modulation input parameters and intermediate frequency signals carrying modulation information in the baseband source module and carrying out IQ modulation so as to generate baseband signals which are available to the microwave signal source.
Further, the modular microwave signal source system further comprises:
and the spread spectrum module is used for receiving the multichannel continuous wave signals generated by the local oscillator source module, performing spread spectrum processing on the multichannel continuous wave signals to generate continuous wave signals with preset frequency, inputting the continuous wave signals into the up-conversion module and driving the up-conversion module.
Further, the up-conversion module includes:
the 6GHz up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information in the interior and up-converting the intermediate frequency signal carrying the modulation information in the interior so as to generate a modulation signal with the maximum carrier frequency of 6 GHz;
the 20GHz up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information in the interior and up-converting the intermediate frequency signal carrying the modulation information in the interior so as to generate a modulation signal with the maximum carrier frequency of 20 GHz;
and the 44GHz up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information, and up-converting the intermediate frequency signal carrying the modulation information to generate a modulation signal with the maximum carrier frequency of 44 GHz.
Further, the local oscillation source module is a 20GHz local oscillation module and generates multichannel 100 MHz-20 GHz continuous wave signals.
Further, the spread spectrum module is a 40GHz spread spectrum module.
Further, the system comprises a first modulated signal and a second modulated signal,
the first modulation signal is an intermediate frequency signal which is generated by the high-speed DAC of the baseband source module and internally carries modulation information;
the second modulation signal is an intermediate frequency signal which is generated by the IQ modulation module based on an external input baseband signal and internally carries modulation information.
Further, when the IQ modulation module generates the second modulation signal, an internal FPGA of the IQ modulation module generates an IP core using the same vector modulation signal as the baseband source module.
Further, the center frequency in the second modulated signal generated by the IQ modulation module calibrates the system.
Further, the system utilizes the high-speed DAC chip in the baseband source module and the IQ modulator chip in the IQ modulation module to cooperatively complete the external modulation function of the modularized microwave signal source.
According to the technical scheme provided by the embodiment of the application, on one hand, the function of external modulation of the broadband modularized microwave signal source is realized, on the other hand, the calibration complexity of the broadband modularized microwave signal source is reduced, and in addition, the quality and stability of the output baseband and the radio frequency signal in the external modulation mode are improved. In the whole, due to the limitations of devices, software complexity and the like, the external modulation function of the modularized microwave signal source is realized by using a mode of combining the height DAC and the IQ modulator, the system design of the ultra-wideband modularized microwave signal source can be realized, the complexity of system calibration software is reduced, and the quality of output baseband and radio frequency modulation signals is improved.
Drawings
FIG. 1 is a schematic diagram of the overall principle of a modular microwave signal source system of the present application;
FIG. 2 is a schematic diagram of the general principle of the IQ modulation module according to the present application;
fig. 3 is a schematic diagram of an IQ modulation module according to the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The modularized microwave signal source system of the embodiment of the application can comprise a baseband source module, an up-conversion module, a local oscillator source module, a spread spectrum module and a switch attenuation module; the baseband source module receives an external trigger signal and converts the external trigger signal into an intermediate frequency signal carrying modulation information internally; the up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information, up-converting the intermediate frequency signal carrying the modulation information to generate a modulation signal with the maximum carrier frequency being a preset frequency; the local oscillation source module generates a multichannel continuous wave signal to be input into the up-conversion module and drive the up-conversion module; and the switch attenuation module is used for carrying out signal combination on signals with different frequency bands and different functions generated by the system and carrying out power adjustment on the signals.
Further, the modular microwave signal source system further comprises: and the IQ modulation module is used for receiving external IQ modulation input parameters and intermediate frequency signals carrying modulation information in the baseband source module and carrying out IQ modulation so as to generate baseband signals which are available to the microwave signal source.
Further, the modular microwave signal source system further comprises: and the spread spectrum module is used for receiving the multichannel continuous wave signals generated by the local oscillator source module, performing spread spectrum processing on the multichannel continuous wave signals to generate continuous wave signals with preset frequency, inputting the continuous wave signals into the up-conversion module and driving the up-conversion module.
Further, the up-conversion module includes: the 6GHz up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information in the interior and up-converting the intermediate frequency signal carrying the modulation information in the interior so as to generate a modulation signal with the maximum carrier frequency of 6 GHz; the 20GHz up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information in the interior and up-converting the intermediate frequency signal carrying the modulation information in the interior so as to generate a modulation signal with the maximum carrier frequency of 20 GHz; and the 44GHz up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information, and up-converting the intermediate frequency signal carrying the modulation information to generate a modulation signal with the maximum carrier frequency of 44 GHz.
Further, the local oscillation source module is a 20GHz local oscillation module and generates multichannel 100 MHz-20 GHz continuous wave signals.
Further, the spread spectrum module is a 40GHz spread spectrum module.
Further characterized in that the system comprises a first modulated signal and a second modulated signal,
the first modulation signal is an intermediate frequency signal which is generated by the high-speed DAC of the baseband source module and internally carries modulation information; the second modulation signal is an intermediate frequency signal which is generated by the IQ modulation module based on an external input baseband signal and internally carries modulation information.
Further, when the IQ modulation module generates the second modulation signal, an internal FPGA of the IQ modulation module generates an IP core using the same vector modulation signal as the baseband source module.
Further, the center frequency in the second modulated signal generated by the IQ modulation module calibrates the system.
Further, the system utilizes the high-speed DAC chip in the baseband source module and the IQ modulator chip in the IQ modulation module to cooperatively complete the external modulation function of the modularized microwave signal source.
The modular microwave signal source system provided by the present application is further illustrated by the following specific embodiments in conjunction with the accompanying drawings, which are not meant to limit the embodiments of the present application.
Fig. 1 is a schematic diagram of the overall principle of a modular microwave signal source system according to the present application. As shown in fig. 1, the workflow of the modular microwave signal source system of the present application may be, for example:
the clock source module provides an external clock input and output function of the system and provides 100MHz reference clock signals for the local oscillation module, the baseband source module, the IQ modulation module, the frequency conversion module and the local oscillation module;
the baseband source module generates intermediate frequency signals up to 3.5GHz, and the intermediate frequency signals are respectively sent to the 6GHz up-conversion module, the 20GHz up-conversion module and the 44GHz up-conversion module to be up-converted to realize the modulation signal output function up to 44 GHz;
the local oscillation module generates 4-channel local oscillation signals, three paths of the 4-channel local oscillation signals are respectively sent to the three frequency conversion modules to provide local oscillation signals for the frequency conversion modules, one path of the local oscillation signals is sent to the 40GHz frequency doubling module to finish continuous wave signal output up to 40GHz, and finally the 4-channel local oscillation signals uniformly enter the switch attenuation module to realize channel combination and output after large dynamic range power adjustment.
Fig. 2 is a schematic diagram of the general principle of the IQ modulation module according to the present application. As shown in fig. 2, the IQ modulation module is divided into a baseband carrier board and a radio frequency sub-board, the baseband carrier board completes functions of PXIe bus control, high-speed DAC differential signal generation, external modulation signal conditioning and the like, the radio frequency sub-board completes functions of IQ modulation, intermediate frequency power adjustment, intermediate frequency signal filtering and the like, an FPGA unit in the baseband carrier board completes functions of PXIe bus interface data interaction, high-speed DAC chip control, conditioning circuit bias voltage adjustment control and the like, the high-speed DAC unit completes functions of external output baseband signal generation and high-precision bias voltage generation, and the conditioning unit completes addition of external level matching and bias voltage; the IQ modulator in the radio frequency daughter board is used for completing the generation from a baseband signal to intermediate frequency signals of 3.5GHz and 2.5GHz, the amplifier attenuator is combined to realize the power adjustment of the intermediate frequency signals, and the LTCC filter bank is used for completing the suppression of intermediate frequency signal straying and harmonic signals.
Fig. 3 is a schematic diagram of an IQ modulation module according to the present application. As shown in FIG. 3, the IQ modulation module is in accordance with the PXI 3U module design standard, and occupies 1 slot. The front panel has more signal interfaces, and is designed by adopting a mode of combining various connectors in order to ensure firmness and rationality of layout. The base band carrier plate is provided with a radio frequency sub-plate, the radio frequency sub-plate adopts an integrated structural design, the panel end intermediate frequency signal output adopts an SMA-K connector, and the external intermediate frequency signal output adopts an SMP-J threaded mounting connector; the 5 ports of the module end clock input, the baseband signal input and the like adopt SMP-J PCB horizontal installation connectors, so that the module end clock input, the baseband signal input and the like are conveniently connected with corresponding interfaces in a baseband carrier plate, and the 9 interfaces of the baseband carrier plate panel end clock input, the baseband signal input and the like adopt a design of a small-volume stackable MMCX connector; the 5 ports of clock output, baseband signal output and the like, which are connected with the radio frequency daughter board at the module end, adopt SMP-J PCB vertical surface mount type connectors.
In this embodiment, the main key indexes of the system include: frequency range, error vector magnitude, external modulation level, etc. The frequency range is mutually spliced and ensured by the working frequency of the frequency conversion module; the error vector amplitude is ensured by means of a baseband source module high-speed DAC and an IQ modulator of an IQ modulation module; the external modulation level is ensured by means of an IQ modulation module front-end conditioning circuit. Therefore, the application realizes the system design of the ultra-wideband modularized microwave signal source.
In summary, the technical scheme provided by the embodiment of the application realizes the function of external modulation of the wideband modularized microwave signal source on one hand, reduces the complexity of the wideband modularized microwave signal source calibration on the other hand, and improves the quality and stability of the output baseband and radio frequency signals in the external modulation mode. In the whole, due to the limitations of devices, software complexity and the like, the external modulation function of the modularized microwave signal source is realized by using a mode of combining the height DAC and the IQ modulator, the system design of the ultra-wideband modularized microwave signal source can be realized, the complexity of system calibration software is reduced, and the quality of output baseband and radio frequency modulation signals is improved.
It is to be understood that the embodiments described herein may be implemented in hardware, software, firmware, middleware, microcode, or a combination thereof. For a hardware implementation, the processing units may be implemented within one or more application specific integrated circuits (ApplicationSpecificIntegratedCircuits, ASIC), digital signal processors (DigitalSignalProcessing, DSP), digital signal processing devices (dspev), programmable logic devices (ProgrammableLogicDevice, PLD), field programmable gate arrays (Field-ProgrammableGateArray, FPGA), general purpose processors, controllers, microcontrollers, microprocessors, other electronic units configured to perform the functions described herein, or a combination thereof.
For a software implementation, the techniques described herein may be implemented by means of units that perform the functions described herein. The software codes may be stored in a memory and executed by a processor. The memory may be implemented within the processor or external to the processor.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of function in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied in hardware, in a software module executed by a processor, or in a combination of the two. The software modules may be disposed in Random Access Memory (RAM), memory, read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the application, and is not meant to limit the scope of the application, but to limit the application to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the application are intended to be included within the scope of the application.
Claims (6)
1. The modularized microwave signal source system is characterized by comprising a baseband source module, an up-conversion module, a local oscillator source module, a spread spectrum module and a switch attenuation module;
the baseband source module receives an external trigger signal and converts the external trigger signal into an intermediate frequency signal internally carrying modulation information;
the up-conversion module receives the intermediate frequency signal carrying modulation information therein, up-converts the intermediate frequency signal carrying modulation information therein to generate a modulation signal with a maximum carrier frequency of a preset frequency, and includes: inputting the intermediate frequency signals carrying modulation information into a 6GHz up-conversion module, a 20GHz up-conversion module and a 44GHz up-conversion module respectively for up-conversion so as to generate modulation signals with the maximum carrier rate of 44 GHz;
the local oscillation source module generates a multichannel continuous wave signal to be input into the up-conversion module to drive the up-conversion module;
the switch attenuation module is used for carrying out signal combination on signals with different frequency bands and different functions generated by the system and carrying out power adjustment on the signals;
further comprises: the IQ modulation module, the first modulation signal and the second modulation signal;
the IQ modulation module is used for receiving external IQ modulation input parameters and intermediate frequency signals carrying modulation information in the baseband source module to carry out IQ modulation so as to generate baseband signals which are available for a microwave signal source; the IQ modulation module comprises a baseband carrier plate and a radio frequency sub-plate;
the first modulation signal is an intermediate frequency signal which is generated by the high-speed DAC of the baseband source module and internally carries modulation information;
the second modulation signal is an intermediate frequency signal which is generated by the IQ modulation module based on an external input baseband signal and internally carries modulation information;
when the IQ modulation module generates the second modulation signal, an internal FPGA of the IQ modulation module generates an IP core by adopting the vector modulation signal which is the same as the baseband source module; the center frequency of the second modulation signal generated by the IQ modulation module is used for calibrating the system.
2. The modular microwave signal source system of claim 1, further comprising:
and the spread spectrum module is used for receiving the multichannel continuous wave signals generated by the local oscillator source module, performing spread spectrum processing on the multichannel continuous wave signals to generate continuous wave signals with preset frequency, inputting the continuous wave signals into the up-conversion module and driving the up-conversion module.
3. The modular microwave signal source system of claim 2, wherein the up-conversion module comprises:
the 6GHz up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information in the interior and up-converting the intermediate frequency signal carrying the modulation information in the interior so as to generate a modulation signal with the maximum carrier frequency of 6 GHz;
the 20GHz up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information in the interior and up-converting the intermediate frequency signal carrying the modulation information in the interior so as to generate a modulation signal with the maximum carrier frequency of 20 GHz;
and the 44GHz up-conversion module is used for receiving the intermediate frequency signal carrying the modulation information, and up-converting the intermediate frequency signal carrying the modulation information to generate a modulation signal with the maximum carrier frequency of 44 GHz.
4. The modular microwave signal source system of claim 3, wherein the local oscillator source module is a 20GHz local oscillator module that generates a multichannel 100mhz to 20GHz continuous wave signal.
5. The modular microwave signal source system of claim 2, wherein the spread spectrum module is a 40GHz spread spectrum module.
6. The modular microwave signal source system of claim 1, wherein the system utilizes a high speed DAC chip in the baseband source module and an IQ modulator chip in the IQ modulation module to cooperatively perform a modular microwave signal source external modulation function.
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