CN1142428A - Series of bamboo floor - Google Patents
Series of bamboo floor Download PDFInfo
- Publication number
- CN1142428A CN1142428A CN 95109413 CN95109413A CN1142428A CN 1142428 A CN1142428 A CN 1142428A CN 95109413 CN95109413 CN 95109413 CN 95109413 A CN95109413 A CN 95109413A CN 1142428 A CN1142428 A CN 1142428A
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- CN
- China
- Prior art keywords
- bamboo
- series
- wood
- plate
- bond paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Chemical And Physical Treatments For Wood And The Like (AREA)
Abstract
A bamboo floor series is made of bamboo as basic raw materials. Luminous paint is coated over bamboo strips and bamboo shell. Theleaves and green covering of bamboo are processed and stuck in glue coated paper, which is then compounded along with basic material to form a whole body. Its advantages are high utilization rate of bamboo and good decorative effect.
Description
The invention belongs to a kind of structural panel, belong to ornament materials.
At present, the bamboo flooring product consumes the high-quality bamboo wood that needs certain thickness and width, processed complex, and large-scale production is few, and product such as bamboo bamboo or wicker fence are pieced together the utmost point, decorative brick board, bamboo slices jigsaw plate.
Purpose of the present invention is base material with the bamboo wood, and through handling, sticking in the bond paper is decorative layer, has realized that ornament materials is whole change with thin bamboo plate, bamboo gram, the leaf of bamboo, surf green etc.
The scheme of finishing is to realize like this
One, base material
Selecting bamboo wood is the bamboo of 3-5 growth, and through the saw section, wall is opened, to cuing open into thickness 0.5-1.5MM, and the bamboo chip of width 10-15MM, length is fixed and leave allowance by processing, then bamboo chip is dried to the moisture content of 8-10%.
Two, ornament materials
1, the thickness that is obtained by rotary-cut, slicing or other machining process is the thin bamboo plate about 0.5MM, handles and sticks in the bond paper through mildew-resistant, fire prevention, bleaching, again by the product specification shearing width.
2, the bamboo shell process of bamboo shoots is pruned, acid or alkali treatment stick in the bond paper, again by the product specification shearing width.
3, the thin bamboo plate about thickness 0.5MM is covered with paint, lacquer, colour wash, etc. luminous paint, stick in the bond paper, again by the product specification shearing width.
4, leaf of bamboo process is pruned, 20% NaOH softened 20-30 minute in the 60-80 ℃ of water, bleached at 3% hydrogen peroxide again, pressed the Nature colors staining, sticked in the bond paper, again by the product specification shearing width.
5, surf green is handled in a vacuum, stood upright in the oily solution of cyan, through the adjustment pH value of decompression 1.5-2.0MMHg post.
Three, synthetic resin gum
1, base material is a phenolic resin glue;
2, ornament materials is a melamine glue.
Four, bond paper
With 80 gram/M
2Brown paper soaks melamine glue at vertical dipping dryer.Baking temperature is 50 ℃, and the resin content of bond paper is 80%, and volatile content is 15%.
Five, gluing and assembly
The bamboo chip of brushing phenolic resin glue is combined into the bamboo clappers base of certain thickness (thickness is determined according to product specification), then that the surface of slab is multiple to be woven into the ornament materials of various patterns.
Six, hot pressing
The bamboo clappers base is put into multi-daylight press adopt once to mould again and be hot pressed into plate, hot pressing temperature 130-150 ℃, temperature retention time is 1.5 minutes/MM, hot pressing unit pressure 2MPa.
Seven, saw cuts and japanning
The pattern that woven saw is cut, sand milling, is coated with polyamine fat varnish.
Series of bamboo floor provided by the present invention has at the bottom of the cost honest and cleanly, and breadth is big, utilization rate of bamboo is high, advantages such as good decorating effect.
Claims (7)
1, a kind of bamboo floor board series is base material by bamboo wood;
2, the thin bamboo plate that obtains by rotary-cut slicing or other machining process;
3, handle by bamboo shell process;
4, cover with paint, lacquer, colour wash, etc. luminous paint by thin bamboo plate;
5, painted by bamboo (wood) leaf through bleaching;
6, handle by the surf green process;
7, be characterized in sticking in the bond paper 2,3,4,5,6 and shear braiding, sticker is at the bamboo substrate surface
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 95109413 CN1142428A (en) | 1995-08-04 | 1995-08-04 | Series of bamboo floor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 95109413 CN1142428A (en) | 1995-08-04 | 1995-08-04 | Series of bamboo floor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1142428A true CN1142428A (en) | 1997-02-12 |
Family
ID=5077193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 95109413 Pending CN1142428A (en) | 1995-08-04 | 1995-08-04 | Series of bamboo floor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1142428A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109227826A (en) * | 2018-10-19 | 2019-01-18 | 南京林业大学 | A kind of manufacturing method and its application of bamboo spring(-supported) mount |
-
1995
- 1995-08-04 CN CN 95109413 patent/CN1142428A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109227826A (en) * | 2018-10-19 | 2019-01-18 | 南京林业大学 | A kind of manufacturing method and its application of bamboo spring(-supported) mount |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C01 | Deemed withdrawal of patent application (patent law 1993) | ||
WD01 | Invention patent application deemed withdrawn after publication |