CN114239786A

CN114239786A - Manufacturing method and application of cable temperature measurement electronic tag and package electronic tag

Info

Publication number: CN114239786A
Application number: CN202111248450.9A
Authority: CN
Inventors: 黄建华; 赵鹏; 李坚
Original assignee: Beijing Rxg Technology Co ltd
Current assignee: Beijing Rxg Technology Co ltd
Priority date: 2021-10-26
Filing date: 2021-10-26
Publication date: 2022-03-25

Abstract

The invention discloses a method for manufacturing a cable temperature measurement electronic tag and a coiled electronic tag and application thereof, wherein the method comprises the following steps: bonding the RFID chip on the flexible circuit board to form an FPC antenna, carrying out dry-to-wet processing on the FPC antenna, and carrying out die cutting on the FPC antenna subjected to the dry-to-wet processing; punching the polyimide high polymer material layer to obtain a containing hole for containing the RFID chip; laminating the punched polyimide material layer on the aluminum foil coated with the glue, and bending one end of the aluminum foil to ensure that a gap with a preset width is reserved between the end part of the aluminum foil and the end part of the FPC antenna when the FPC antenna is laminated with the polyimide material layer; and covering the FPC antenna on the glued polyimide high polymer material layer. The process flow can be applied to large-scale production and manufacturing, and the prepared electronic tag is suitable for complex environments, especially plays a role in the overall life management of power equipment, and can be used for equipment asset inventory, quality control, source tracing and other better services.

Description

Manufacturing method and application of cable temperature measurement electronic tag and package electronic tag

Technical Field

The invention relates to the technical field of RFID (radio frequency identification devices), in particular to a manufacturing method and application of a cable temperature measurement electronic tag and a coiled electronic tag.

Background

With the development of national economy, higher and higher requirements are also put on the reliability of equipment of the power system. In order to implement the guidance suggestions of relevant departments on actively promoting the innovation and application of the supply chain, the construction of a modern (intelligent) supply chain system with intelligent purchasing, digital logistics, panoramic quality control and intelligent operation is developed, a professional brand image is created, and a series of remarkable achievements are obtained in the aspects of promoting resource sharing, data fusion, supply and demand docking, value creation and the like. Meanwhile, in the construction process of a modern (intelligent) supply chain system, it is also found that how to play the role of the material part in the overall life management of the power equipment in each link and management departments of manufacturing, storage, distribution, engineering, retirement and the like related to the power materials is an important problem in the ubiquitous power internet of things construction of the material part at present.

Disclosure of Invention

The inventor is aware that the cables in the prior art are usually identified by using a code-spraying method based on the knowledge of the material management technology. Therefore, the inventor develops a life-cycle management innovation based on the radio frequency RFID technology by selecting the cable device which is one of the core devices for power grid construction. In view of the above, the present invention has been made to provide a method for manufacturing a cable thermometric electronic tag and a wound electronic tag and applications thereof, which overcome or at least partially solve the above problems.

In a first aspect, an embodiment of the present invention provides a method for manufacturing a cable temperature measurement electronic tag, which may include:

bonding an RFID chip on a flexible circuit board to form an FPC antenna, carrying out dry-to-wet processing on the FPC antenna, and carrying out die cutting on the FPC antenna subjected to the dry-to-wet processing;

punching the polyimide high polymer material layer to obtain a containing hole for containing the RFID chip;

laminating the punched polyimide material layer on an aluminum foil coated with glue, and bending one end of the aluminum foil to ensure that a gap with a preset width is reserved between the end part of the aluminum foil and the end part of the FPC antenna when the FPC antenna is attached to the polyimide material layer;

and covering the FPC antenna on the glued polyimide high polymer material layer.

Optionally, after one end of the aluminum foil is bent, the method may further include:

and coating glue on one side of the aluminum foil, which is far away from the bending direction, and coating a release film.

Optionally, after the FPC antenna is covered on the glued polyimide layer, the method may further include:

and die cutting is carried out on the cable temperature measuring electronic tag finished product after the FPC antenna is covered on the polyimide high polymer material layer after being coated with the glue.

Optionally, after the die cutting is performed on the FPC antenna subjected to the dry-to-wet processing, the method may further include:

detecting the FPC antenna, and removing unqualified die-cut products;

and rewriting and initializing the storage area of the RFID chip.

Optionally, after the rewriting and initializing the storage area of the RFID chip, the method may further include:

and covering identification information of the cable temperature measurement electronic tag on the surface of the FPC antenna.

Optionally, before the identification information of the cable temperature measurement electronic tag is covered on the surface of the FPC antenna, the method may further include:

and detecting the FPC antenna again, and rejecting unqualified products.

Optionally, after the step of laminating the polyimide polymer material layer on the glued aluminum foil, the method may further include: and a thermoplastic polyester layer is coated on the FPC antenna on the side opposite to the RFID chip.

Optionally, the polyimide polymer material layer is formed by laminating two layers of polyimide polymer materials.

In a second aspect, an embodiment of the present invention provides a method for manufacturing a packaged electronic tag, which may include:

covering the FPC antenna on the glued polyimide high polymer material layer;

and coating glue on one side of the aluminum foils of the electronic tags, which is deviated from the bending direction, and winding the electronic tags into a roll after coating a release film.

Optionally, after the FPC antenna is laminated on the glued polyimide layer, the method further includes: and a thermoplastic polyester layer is coated on the FPC antenna on the side opposite to the RFID chip.

In a third aspect, an embodiment of the present invention provides an application of the cable temperature measuring electronic tag prepared by the method for manufacturing a cable temperature measuring electronic tag according to the first aspect and/or the wound electronic tag prepared by the method for manufacturing a wound electronic tag according to the second aspect in a cable identification.

The technical scheme provided by the embodiment of the invention has the beneficial effects that at least:

the embodiment of the invention provides a manufacturing method and application of a cable temperature measurement electronic tag and a coiled electronic tag, wherein the manufacturing method of the cable temperature measurement electronic tag can comprise the following steps: bonding the RFID chip on the flexible circuit board to form an FPC antenna, carrying out dry-to-wet processing on the FPC antenna, and carrying out die cutting on the FPC antenna subjected to the dry-to-wet processing; punching the polyimide high polymer material layer to obtain a containing hole for containing the RFID chip; laminating the punched polyimide material layer on the aluminum foil coated with the glue, and bending one end of the aluminum foil to ensure that a gap with a preset width is reserved between the end part of the aluminum foil and the end part of the FPC antenna when the FPC antenna is laminated with the polyimide material layer; and covering the FPC antenna on the glued polyimide high polymer material layer. According to the manufacturing method of the cable temperature measurement electronic tag provided by the embodiment of the invention, the process flow can be applied to large-scale production and manufacturing, and the electronic tag suitable for complex environments is prepared. The prepared electronic tag plays a role in the overall life management of the power equipment, and particularly serves equipment assets better in inventory, quality control, source tracing and the like.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.

The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic flow chart of a method for manufacturing a cable temperature measurement electronic tag according to embodiment 1 of the present invention;

fig. 2 is a schematic structural diagram of a cable temperature measurement electronic tag provided in embodiment 1 of the present invention;

fig. 3 is a schematic flow chart illustrating a detailed manufacturing process of a cable temperature measurement electronic tag according to embodiment 1 of the present invention;

fig. 4 is a second flowchart illustrating a detailed manufacturing process of the cable temperature measuring electronic tag according to embodiment 1 of the present invention;

fig. 5 is a schematic flow chart of a method for manufacturing a roll-to-roll electronic tag according to embodiment 2 of the present invention;

wherein 21 is an FPC antenna; 211 is an RFID chip; 212 is a flexible circuit board; 22 is a layer of polyimide polymer material; 221 is a receiving hole; 23 is glue; 24 is an aluminum foil; 25 is a release film; 26 is a thermoplastic polyester layer.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "far", "near", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

The embodiment 1 of the invention provides a manufacturing method of a cable temperature measurement electronic tag, the cable temperature measurement electronic tag provided by the embodiment 1 of the invention belongs to a single/single electronic tag, and the shape of the tag can be similar to that of a woundplast and can be used as an RFID passive electronic tag for independent use. The cable temperature measurement electronic tag in the embodiment of the invention has the function of resisting metal interference, is attached to a cable when in use, and can monitor the change of the temperature of the cable in time.

Referring to fig. 1 to 3, the method may include the steps of:

step S111, bonding the RFID chip 211 to the flexible circuit board 212 to form the FPC antenna 21, performing dry-to-wet processing on the FPC antenna 21, and performing die cutting on the FPC antenna 21 after the dry-to-wet processing.

The flexible printed circuit board in this embodiment serves as a flat cable, and after the RFID chip is attached, power can be supplied to the RFID chip and data can be transmitted. The dry-to-wet treatment is to avoid the problem that the manufactured electronic label is not foamed or adhered uniformly when in use, for example, when the electronic label is adhered to a cable or an electromechanical device, the label is not foamed or adhered uniformly due to moisture adsorbed on the surface. The die cutting means that the required size is die-cut according to the specification specified by the electronic label, and redundant waste materials are removed.

In step S112, the polyimide layer 22 is punched to obtain an accommodating hole 221 for accommodating the RFID chip 211.

Because the RFID chip has certain thickness, when pasting together, in order to avoid electronic tags overall outward appearance more level and more smooth, and in order effectively to better protection to the RFID chip. Therefore, the polyimide layer in this step needs to be punched with a hole of a chip size to obtain a receiving hole for receiving the RFID chip. The punching technology can be the prior art in die cutting punching, and the embodiment is not described herein again.

In this embodiment, the polyimide material layer is formed by laminating two layers of polyimide materials, so that a single layer of the polyimide material needs to be laminated into two layers before punching.

Step S113, the punched polyimide layer 22 is laminated on the aluminum foil 24 coated with the adhesive 23, and one end of the aluminum foil 24 is bent so that a gap with a preset width is reserved between the end of the aluminum foil 24 and the end of the FPC antenna 21 when the FPC antenna 21 is attached to the polyimide layer 22.

The application environment of the cable temperature measuring electronic tag is complex, so that the tag needs to be designed to be metal-resistant. As is well known, metal has a great influence on radio frequency signals (because of electromagnetic signals in radio frequency signals, metal has an adsorption effect on the electromagnetic signals), and anti-metal tags are produced in the environment. The anti-metal label is an electronic label packaged by a special anti-magnetic wave-absorbing material, and technically solves the problem that the electronic label cannot be attached to the surface of metal for use. Therefore, in the embodiment of the invention, the aluminum foil is used as the antimagnetic wave-absorbing material.

It should be noted that the aluminum foil needs to be bent at the end, and the electronic tag and the reader realize spatial (contactless) coupling of radio frequency signals through a coupling element, and realize energy transfer and data exchange in a coupling channel according to a time sequence relationship; there are two types of coupling between them.

1) Electromagnetic backscatter coupling: the radar principle model reflects the emitted electromagnetic waves after the electromagnetic waves touch a target and carries back target information, and the space propagation rule of the electromagnetic waves is based on.

2) Inductive coupling: the transformer model realizes coupling through a space high-frequency alternating magnetic field according to an electromagnetic induction law; the application range is as follows: the inductive coupling approach is generally suitable for near-field rfid systems operating at medium and low frequencies. Typical operating frequencies are: 125kHz, 225kHz and 13.56 MHz. The identification action distance is less than 1m, and the typical action distance is 10-20 cra.

3) Electromagnetic backscattering coupling mode: generally suitable for long-distance radio frequency identification systems working in high frequency and microwave. Typical operating frequencies are: 433MHz, 915MHz, 2.45GHz and 5.8 GHz. The range is identified as greater than 1m, with a typical range of 3-l 0 m.

The anti-metal cable sizing and temperature measuring label is characterized in that an electromagnetic backscattering coupling mode is utilized, an aluminum foil is bent to the plane where the PFC antenna is located, a certain distance is kept between the aluminum foil and the FPC antenna, and a gap coupling structure is formed, so that the anti-metal cable sizing and temperature measuring label can cope with a complex environment.

Step S114, the FPC antenna 21 is laminated on the glued polyimide layer 22.

According to the manufacturing method of the cable temperature measurement electronic tag provided by the embodiment of the invention, the process flow can be applied to large-scale production and manufacturing, and the electronic tag suitable for complex environments is prepared. The prepared electronic tag plays a role in the overall life management of the power equipment, and particularly serves equipment assets better in inventory, quality control, source tracing and the like.

For example, during cable monitoring, a special thermometry tool is required to perform temperature readings in alignment with the outer sheath of the cable. In the embodiment of the invention, the temperature measurement sensor module is integrated in the RFID chip, so that the automatic temperature measurement of the cable can be realized, and the use temperature of the cable can be conveniently acquired through the reader, so that the electronic tag is more suitable for the application scene of the cable identification.

In a more specific embodiment, as shown in fig. 4 and fig. 2, the method may specifically include the following steps:

step S411, adhering the RFID chip 211 on the flexible circuit board 212 to form the FPC antenna 21, performing dry-to-wet processing on the FPC antenna 21, and performing die cutting on the FPC antenna 21 after the dry-to-wet processing.

This step can refer to the step S111, and is not described herein again. Of course, the FPC supply needs to be inspected before this, i.e. the number of FPC antennas and the lot number is determined.

And step S412, detecting the FPC antenna 21 and removing unqualified die-cut products.

Referring to fig. 3, the detection method may include a spot check, a visual check, and the like, and the detection method is not particularly limited in the embodiment of the present invention.

Step S413 rewrites and initializes the storage area of the RFID chip 211.

Since the RFID chip contains a plurality of storable areas, the EPC area needs to be enlarged, that is, the parameters of the PC bit need to be modified, for example, the PC bit 3000 in the RFID chip is rewritten to 4000 and TID is recorded.

And step S414, detecting the FPC antenna 21 again and rejecting unqualified products.

Step S415, the identification information of the cable temperature measurement electronic tag is coated on the surface of the FPC antenna 21.

And after the initialization is finished, a layer of plane material is covered on the surface of the FPC antenna, and the plane material can contain company information, product information and the like, so that the subsequent product manufacturing is facilitated.

In step S416, the polyimide layer 22 is punched to obtain an accommodating hole 221 for accommodating the RFID chip 211.

This step can refer to the step S112, which is not described herein again.

The polyimide layer is formed by laminating two layers of polyimide materials, and the polyimide materials are soft and thin, and are laminated into a desired shape and size as required.

Step S417, the punched polyimide layer 22 is laminated on the aluminum foil 24 coated with the glue 23.

Step S418, a thermoplastic polyester layer 26 is laminated on the FPC antenna 21 on the side facing away from the RFID chip 211.

The thermoplastic polyester layer may be provided with an identification of the electronic label. For example, a manufacturer identifier of the electronic tag, Identity (ID) information of the electronic tag, and the like may be printed on a side of the thermoplastic polyester layer away from the RFID chip, which is not particularly limited in the embodiment of the present invention. Of course, the thermoplastic polyester layer can also play a role in buffering the electronic tag, so that the FPC antenna in the tag is further protected.

Step S419, coating glue 23 on the side of the aluminum foil 24 away from the bending direction, and coating a release film 25.

The semi-finished product covered by the aluminum foil is covered with glue at the bottom of the aluminum foil, the product can be adhered to the surface of an object after being formed, and the glue is adhered to the surface of the release film and is easy to tear off through a special process.

Step S420, the FPC antenna 21 is laminated on the glued polyimide layer 22.

In the step, the FPC antenna 21 is covered on the glued polyimide layer 22, and in the covering process, the position of an accommodating hole of a punched hole of the polyimide layer is covered corresponding to an RFID chip without deviation, otherwise, the performance of the product which is not protected by the RFID chip is prone to deviation.

Step S421, die cutting is performed on the finished product of the cable temperature measuring electronic tag after the FPC antenna 21 is covered on the polyimide high polymer material layer 22 covered with the glue 23.

The step is to die cut the laminated semi-finished product to meet the requirement of the finished product.

Of course, the embodiment of the invention can also comprise consistency check, appearance check and the like, and the consistency check of the product performance is needed before the product is delivered out of the warehouse, so that the product performance is guaranteed without irregularity. And then, after the cable temperature measuring electronic tag is manufactured, putting the cable temperature measuring electronic tag into a packing box according to the packing requirement.

Based on the same inventive concept, the embodiment of the invention also provides application of the cable temperature measurement electronic tag prepared by the manufacturing method of the cable temperature measurement electronic tag in cable identification.

Example 2

Embodiment 2 of the present invention provides a method for manufacturing a roll-to-roll electronic tag, which, as shown in fig. 5, may include the following steps:

and S511, adhering the RFID chip on the flexible circuit board to form the FPC antenna, carrying out dry-to-wet processing on the FPC antenna, and carrying out die cutting on the FPC antenna subjected to the dry-to-wet processing.

Step S512, punching the polyimide high polymer material layer to obtain a containing hole for containing the RFID chip.

Step S513, laminating the punched polyimide material layer on the aluminum foil coated with the adhesive, and bending one end of the aluminum foil to leave a gap with a preset width between the end of the aluminum foil and the end of the FPC antenna when the FPC antenna is attached to the polyimide material layer.

And step S514, covering the FPC antenna on the glued polyimide high polymer material layer.

And step S515, coating glue on one side of the aluminum foils of the electronic tags, which is opposite to the bending direction, and winding the electronic tags into a roll after coating a release film.

In the step, the release film is required to be covered above the release film in the product manufacturing process for coiling so as to facilitate the subsequent process manufacturing, and the prepared coiled electronic tag is convenient for industrialized labeling, for example, labeling machine equipment is used for rapidly attaching the coiled electronic tag on a cable.

In an optional embodiment, after the FPC antenna is laminated on the glued polyimide layer, the method may further include: a thermoplastic polyester layer is laminated on the FPC antenna on the side facing away from the RFID chip.

Based on the same inventive concept, the embodiment of the invention also provides an application of the coiled electronic tag prepared by the method for manufacturing the coiled electronic tag in cable identification.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. The present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A manufacturing method of a cable temperature measurement electronic tag is characterized by comprising the following steps:

2. The method of claim 1, further comprising, after bending one end of the aluminum foil:

3. The method of claim 2, wherein after the laminating the FPC antenna on the glued polyimide layer, further comprising:

4. The method for manufacturing the FPC antenna according to claim 1, wherein after the step of die cutting the FPC antenna after the step of dry-to-wet processing, the method further comprises the steps of:

detecting the FPC antenna, and removing unqualified die-cut products;

and rewriting and initializing the storage area of the RFID chip.

5. The method of claim 4, wherein after the overwriting and initializing the storage area of the RFID chip, further comprising:

6. The manufacturing method of claim 5, wherein before the step of covering the surface of the FPC antenna with the identification information of the cable temperature measurement electronic tag, the method further comprises the following steps:

and detecting the FPC antenna again, and rejecting unqualified products.

7. The method according to any one of claims 1 to 6, wherein after laminating the polyimide polymer material layer on the glued aluminum foil, the method further comprises: and a thermoplastic polyester layer is coated on the FPC antenna on the side opposite to the RFID chip.

8. The method according to any one of claims 1 to 6, wherein the layer of the polyimide polymer material is formed by laminating two layers of the polyimide polymer material.

9. A method for manufacturing a packaged electronic tag is characterized by comprising the following steps:

covering the FPC antenna on the glued polyimide high polymer material layer;

10. The method of manufacturing a packaged electronic tag according to claim 9, wherein after the FPC antenna is coated on the coated polyimide polymer material layer, the method further comprises: and a thermoplastic polyester layer is coated on the FPC antenna on the side opposite to the RFID chip.

11. Use of the cable temperature measurement electronic tag prepared by the method for manufacturing the cable temperature measurement electronic tag according to any one of claims 1 to 8 and/or the wound electronic tag prepared by the method for manufacturing the wound electronic tag according to claim 9 or 10 in cable identification.