CN114234270A - Heating device and manufacturing method thereof - Google Patents
Heating device and manufacturing method thereof Download PDFInfo
- Publication number
- CN114234270A CN114234270A CN202111670521.4A CN202111670521A CN114234270A CN 114234270 A CN114234270 A CN 114234270A CN 202111670521 A CN202111670521 A CN 202111670521A CN 114234270 A CN114234270 A CN 114234270A
- Authority
- CN
- China
- Prior art keywords
- heating
- heat transfer
- heating device
- supporting
- body part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 122
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000005266 casting Methods 0.000 claims abstract description 15
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims description 16
- 238000005219 brazing Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 238000005242 forging Methods 0.000 claims description 8
- 238000005098 hot rolling Methods 0.000 claims description 8
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
- F24D19/10—Arrangement or mounting of control or safety devices
- F24D19/1096—Arrangement or mounting of control or safety devices for electric heating systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Surface Heating Bodies (AREA)
Abstract
The invention provides a heating device, which comprises a body part, a heating element and a heating element, wherein the body part is provided with a heating element; a supporting part, comprising a supporting plate arranged on the bottom surface of the body part and a supporting column extending from the bottom surface of the supporting plate, wherein the supporting column is provided with an internal channel accommodating lead; a heat transfer part configured on a top surface of the body part; wherein the body part is formed by casting the heating element and the aluminum alloy material. The invention also provides a manufacturing method of the heating device.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a heating device and a manufacturing method thereof.
Background
Wafer heating is one of the common processes in semiconductor manufacturing, and is mostly performed by a heating device in a dedicated reaction chamber. A conventional wafer heating apparatus has a disk shape and a support is provided below the disk shape. When heating, the wafer is placed on the disk and is heated by the heating component embedded in the groove in the disk. However, the main body of the conventional wafer heating apparatus is made by forging or hot rolling, and aluminum alloy is used as a main material, and the manufacturing method of forging or hot rolling aluminum alloy easily causes burrs on the surface of the groove accommodating the heating element, so that the heating element cannot be absolutely attached to the inner wall of the groove, and a gap is generated between the groove and the heating element, which finally affects the heat transfer or radio frequency performance of the heating apparatus. On the other hand, if the heating device is made by casting, the surface of the final product has many defects due to the formation of the aluminum alloy material. In summary, the above-mentioned manufacturing method of the wafer heating device has the disadvantage that the wafer is not heated uniformly, and the final product of the wafer is affected. Therefore, it is worth the thinking of those skilled in the art to solve the above-mentioned drawbacks.
Disclosure of Invention
In view of the foregoing, the present invention provides a heating device and a method for manufacturing the same, which can make a heating element tightly fit in the heating device, overcome the problem of surface defects of the heating device, and reduce the corrosion degree of welding materials at a welding seam, and the above advantages can reduce the generation of gaps between internal parts of the heating device as a whole, and further overcome the adverse effect of the gaps on the heat transfer or radio frequency efficiency of the heating device.
To achieve the above object, the present invention provides a heating device, comprising: a body portion in which a plurality of spaced heating elements are disposed, each of the heating elements having a heating element extension exposed from a center of a bottom surface of the body portion to connect a heating source; a support portion including a support plate disposed on the bottom surface of the body portion and a support post extending from a center of a bottom surface of the support plate, the support post having an interior channel in which the heating element extensions are disposed; a heat transfer part configured on a top surface of the body part; wherein the body part is formed by casting the heating element and the aluminum alloy material.
The heating device has the beneficial effects that: the body part is formed by the heating components and the aluminum alloy material in a casting mode, so that the heating device does not need to additionally process a groove for accommodating the heating components and remove burrs generated in the groove, and most importantly, the heating components can be completely tightly adhered in the body part without generating more gaps, and the heating device improves the heat transfer and radio frequency efficiency.
Optionally, the body portion is connected to the heat transfer portion and the support plate by brazing.
Optionally, the heat transfer portion further includes a side portion extending downward from an outer periphery of a bottom surface of the heat transfer portion, the side portion correspondingly houses the main body portion and the support plate, and an inner side surface of the side portion is connected to the side surface of the main body portion and the side surface of the support plate by friction welding or electron beam welding.
Optionally, the inner side surface of the side part and the side surface of the body part and the side surface of the support plate are a common surface.
Alternatively, the heat transfer portion and the support portion may be manufactured by forging or hot rolling. The beneficial effects are that: the heat transfer part and the support part manufactured by forging or hot rolling do not generate air holes, and the surfaces of the heat transfer part and the support part are smooth and have no concave-convex formation, so that the support part and the heat transfer part can be tightly adhered to the body part of the heating device.
To achieve the above object, the present invention provides a method for manufacturing a heating device, comprising: providing a body part, wherein the body part is formed by a heating component and an aluminum alloy material in a casting mode, and the heating component is electrically connected with a heating source through a lead; providing a supporting part, wherein the supporting part comprises a supporting plate and a supporting column extending from the bottom surface of the supporting plate, and the supporting column provides an internal channel for accommodating a lead; providing a heat transfer part; the top and bottom surfaces of the body portion are brazed to the bottom surface of the heat transfer portion and the top surface of the support plate, respectively.
Optionally, the manufacturing method further comprises: providing a side part extending on a bottom surface of the heat transfer part, enabling the side part to accommodate the main body part and the support part, and connecting an inner side surface of one side part of the side part to the side surface of the main body part and the side surface of the support plate by friction welding or electron beam welding.
The manufacturing method of the heating device has the advantages that: the body part is formed by a heating component and aluminum alloy materials in a casting mode, and the top surface and the bottom surface of the body part are respectively connected to the bottom surface of the heat transfer part and the top surface of the supporting plate in a brazing mode, so that the heating device does not need to additionally process a groove for accommodating the heating component and remove burrs generated in the groove, most importantly, the heating component can be completely tightly adhered in the body part, no more gap is generated, and the heating device improves the heat transfer and radio frequency efficiency.
Drawings
FIG. 1 is a cross-sectional view of a first embodiment of a heating device of the present invention;
FIG. 2 is a flow chart of a first embodiment of a heating device of the present invention;
FIG. 3 is a cross-sectional view of a second embodiment of the heating device of the present invention;
FIG. 4 is a flow chart of a second embodiment of the heating device of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.
In some embodiments, the heating device comprises: a body portion having a heating element electrically connected to a heating source via a wire; a supporting part, comprising a supporting plate arranged on the bottom surface of the body part and a supporting column extending from the bottom surface of the supporting plate, wherein the supporting column is provided with an internal channel accommodating lead; a heat transfer part configured on a top surface of the body part; wherein the body part is formed by casting the heating element and the aluminum alloy material.
In some embodiments, the heating device is a heating device for a semiconductor reaction chamber.
In some embodiments, the heating device is preferably a circular heating plate for carrying and heating a wafer.
In some embodiments, the body portion is connected to the heat transfer portion and the support plate by brazing.
In some embodiments, the heat transfer portion further includes a side portion extending downward from an outer periphery of a bottom surface of the heat transfer portion, the side portion receives the main body portion and the support plate, and an inner side surface of the side portion is connected to the side surface of the main body portion and the side surface of the support plate by friction welding or electron beam welding.
In some embodiments, the inner side surface of the side portion and the side surface of the body portion and the side surface of the support plate are coplanar.
In some embodiments, the heat transfer portion and the support portion are manufactured by forging or hot rolling.
FIG. 1 is a cross-sectional view of a first embodiment of the heating apparatus of the present invention.
Referring to the cross-sectional view shown in fig. 1, a first embodiment of a heating apparatus 100 for a semiconductor reaction chamber according to the present invention is described below, wherein the heating apparatus 100 includes a main body 110, the main body 110 has a central axis a, and a plurality of circular heating elements 112 spaced apart from each other are disposed inside the main body 110, or the heating elements 112 are configured in different arrangements according to the requirement of a heating region.
In some embodiments, referring to FIG. 1, the heating assemblies 112 may be the same heating coil or different heating coils.
In some embodiments, referring to fig. 1, the heating elements 112 are the same heating coil, the innermost circle of the heating elements 112 is electrically connected to a conducting wire 114 exposed from the middle of a bottom surface 110B of the body 110, and the heating elements 112 are connected to a heating source 200 through the conducting wires 114.
In some embodiments, referring to fig. 1, the heating elements 112 are different heating coils, and the wires 114 connected to the different coils may be respectively connected to different heating sources according to the requirement of the heating device 100 for temperature distribution, such as: the heating element 112 near the outer periphery of the body is connected to a heating source by one set of wires, and the heating element 112 near the central axis a is connected to another heating source by another set of wires 114.
In some embodiments, referring to fig. 1, the heating apparatus 100 further includes a supporting portion 120 including a supporting plate 122 contacting the bottom surface 110B of the body portion 110, the supporting plate 122 having a size corresponding to the body portion 110, the supporting portion 120 also includes a supporting pillar 124 extending from a middle of the bottom surface 122B of the supporting plate 122 along the central axis a, the supporting pillar 124 has an inner channel 126, the inner channel 126 is used for disposing and fixing the conducting wire 114 therein, and the supporting plate 122 and the supporting pillar 124 of the supporting portion 120 may be integrally formed or separately formed.
In some embodiments, referring to fig. 1, the heating apparatus 100 further includes a heat transfer portion 130 contacting a top surface 110A of the body portion 110, wherein the heat transfer portion 130 is used for transferring heat of the heating elements 112 in the body portion 110 to the wafer.
In some embodiments, the heating device 100 comprises components not shown in the drawings but common, such as: air holes, support pins that can be raised and lowered, and the like.
In some embodiments, the method of manufacturing the heating device comprises: providing a body part, wherein the body part is formed by a heating component and an aluminum alloy material in a casting mode, and the heating component is electrically connected with a heating source through a lead; providing a supporting part, wherein the supporting part comprises a supporting plate and a supporting column extending from the bottom surface of the supporting plate, and the supporting column provides an internal channel for accommodating a lead; providing a heat transfer part; the top and bottom surfaces of the body portion are brazed to the bottom surface of the heat transfer portion and the top surface of the support plate, respectively.
In some embodiments, the method of manufacturing the heating device further comprises: providing a side part extending on a bottom surface of the heat transfer part, enabling the side part to accommodate the main body part and the support part, and connecting an inner side surface of one side part of the side part to the side surface of the main body part and the side surface of the support plate by friction welding or electron beam welding.
FIG. 2 is a flow chart of a first embodiment of the heating device of the present invention.
Referring to fig. 1 and 2, first, referring to step S11, the heating element 112 is fixed in a casting mold. Referring to step S12, the heating elements 112 and the aluminum alloy material are cast to form the body 110, so that the heating apparatus 100 can be manufactured without additional processing of grooves for accommodating the heating elements 112 and removing burrs generated in the grooves, and most importantly, the heating elements 112 can be completely adhered to the body 110 without generating more gaps, thereby improving the heat transfer and rf performance of the heating apparatus 100. Referring to step S13 in fig. 1 and 2, it should be additionally described that the support portion 120 and the heat transfer portion 130 of the heating apparatus 100 are manufactured by forging or hot rolling, respectively, in comparison with the manufacturing method of the support portion 120 and the heat transfer portion 130 by casting, the manufacturing method has no voids and is flat and has no unevenness, so that the support portion 120 and the heat transfer portion 130 can be adhered to the body portion 110 of the heating apparatus 100, and also because of the advantages, the bottom surface 110B of the body portion 110 and the top surface 122A of the support plate 122 are connected to each other by brazing, the top surface 110A of the body portion 110 and the bottom surface 130B of the heat transfer portion 130 are connected to each other by brazing, and the support plate 122 can be adhered to the body portion 110 and the heat transfer portion 130 can be adhered to the body portion 110 by brazing, so that no gap is generated between the three, thereby improving the heat transfer and radio frequency efficiency of the heating device 100.
Fig. 3 is a sectional view of a second embodiment of the heating device of the present invention, and fig. 4 is a flowchart of manufacturing the second embodiment of the heating device of the present invention.
Referring to fig. 3 and 4, the heat transfer portion 130 of the heating apparatus 100 of the second embodiment further includes a side portion 132 extending downward from an outer periphery of a bottom surface 130B of the heat transfer portion 130, an inner space formed by the side portion 132 and the bottom surface 130B of the heat transfer portion 130 can correspondingly accommodate the main body portion 110 and the support plate 122, and a side portion inner surface 134 of the side portion 132 is connected to the side surface 110C of the main body portion 110 and the side surface 122C of the support plate 122 by friction Welding or Electron Beam Welding (EBW), wherein the side portion inner surface 134 is coplanar with the side surface 110C of the main body portion 110 and the side surface 122C of the support plate 122, such that the connection manner of friction Welding or Electron Beam Welding is utilized, the contact between the solder material welded between the main body 110, the support 120 and the heat transfer unit 130 and the corrosive gas can be reduced, so as to reduce the corrosion phenomenon and the gap caused by corrosion.
The casting process steps as described above mainly include: calculating ingredients, preparing gold furnace materials, selecting and preparing for smelting, holding furnaces and tools, charging and melting, analyzing before furnace, adjusting components, refining alloy liquid, deoxidizing/slagging off, modifying and the like, but the invention is not limited by the steps. The brazing process steps as described above mainly comprise: cutting the brazing filler metal, removing the oxide film on the surfaces of the base material of the brazing piece and the brazing filler metal, fixing the brazing filler metal, assembling, carrying out vacuum brazing, inspecting and the like, but the invention is not limited by the steps. Compared with the prior art, the invention can reduce the structural defects of the parts by the mutual matching of the casting process and the brazing process on the whole.
In summary, the heating device of the present invention is manufactured by a casting method in combination with a forging/hot rolling method, so that compared with the conventional heating device, there is no gap caused by burrs, surface irregularities and corrosion phenomena, and the effect of the gap on heat transfer and radio frequency is avoided.
Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (7)
1. A heating device, comprising: a body portion having a heating element electrically connected to a heating source via a wire; a supporting part, comprising a supporting plate arranged on the bottom surface of the body part and a supporting column extending from the bottom surface of the supporting plate, wherein the supporting column is provided with an internal channel accommodating lead; a heat transfer part configured on a top surface of the body part; wherein the body part is formed by casting the heating element and the aluminum alloy material.
2. The heating device as claimed in claim 1, wherein the body part is connected to the heat transfer part and the support plate by brazing.
3. The heating device as claimed in claim 2, wherein the heat transfer portion further includes a side portion extending downward from an outer periphery of a bottom surface of the heat transfer portion, the side portion accommodates the body portion and the support plate, respectively, and an inner side surface of the side portion is connected to the side surface of the body portion and the side surface of the support plate by friction welding or electron beam welding.
4. The heating device of claim 3, wherein the inner side surface of the side portion is a common surface with the side surface of the body portion and the side surface of the support plate.
5. The heating apparatus according to claim 1, wherein the heat transfer portion and the support portion are manufactured by forging or hot rolling.
6. A method of manufacturing a heating device, comprising: providing a body part, wherein the body part is formed by a heating component and an aluminum alloy material in a casting mode, and the heating component is electrically connected with a heating source through a lead; providing a supporting part, wherein the supporting part comprises a supporting plate and a supporting column extending from the bottom surface of the supporting plate, and the supporting column provides an internal channel for accommodating a lead; providing a heat transfer part; the top and bottom surfaces of the body portion are brazed to the bottom surface of the heat transfer portion and the top surface of the support plate, respectively.
7. The method of claim 6, further comprising: providing a side part extending on a bottom surface of the heat transfer part, enabling the side part to accommodate the main body part and the support part, and connecting an inner side surface of one side part of the side part to the side surface of the main body part and the side surface of the support plate by friction welding or electron beam welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111670521.4A CN114234270A (en) | 2021-12-31 | 2021-12-31 | Heating device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111670521.4A CN114234270A (en) | 2021-12-31 | 2021-12-31 | Heating device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114234270A true CN114234270A (en) | 2022-03-25 |
Family
ID=80745305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111670521.4A Pending CN114234270A (en) | 2021-12-31 | 2021-12-31 | Heating device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114234270A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180931B1 (en) * | 1999-02-24 | 2001-01-30 | Nhk Spring Co., Ltd. | Heater unit for semiconductor processing |
| JP2004165085A (en) * | 2002-11-15 | 2004-06-10 | Nhk Spring Co Ltd | Heating device and manufacturing method of the same |
| US20090184093A1 (en) * | 2008-01-21 | 2009-07-23 | Abhi Desai | High temperature fine grain aluminum heater |
| JP2012004252A (en) * | 2010-06-15 | 2012-01-05 | Nhk Spring Co Ltd | Heater unit with shaft, and method of manufacturing heater unit with shaft |
| TW201430913A (en) * | 2012-12-13 | 2014-08-01 | Dainippon Screen Mfg | Heat treatment apparatus |
| CN104285500A (en) * | 2012-05-08 | 2015-01-14 | 剑桥Cmos传感器有限公司 | Infrared emitter and NDIR sensor |
| CN111001503A (en) * | 2019-12-04 | 2020-04-14 | 沈阳拓荆科技有限公司 | Heating device and temperature control spray assembly |
-
2021
- 2021-12-31 CN CN202111670521.4A patent/CN114234270A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180931B1 (en) * | 1999-02-24 | 2001-01-30 | Nhk Spring Co., Ltd. | Heater unit for semiconductor processing |
| JP2004165085A (en) * | 2002-11-15 | 2004-06-10 | Nhk Spring Co Ltd | Heating device and manufacturing method of the same |
| US20090184093A1 (en) * | 2008-01-21 | 2009-07-23 | Abhi Desai | High temperature fine grain aluminum heater |
| JP2012004252A (en) * | 2010-06-15 | 2012-01-05 | Nhk Spring Co Ltd | Heater unit with shaft, and method of manufacturing heater unit with shaft |
| CN104285500A (en) * | 2012-05-08 | 2015-01-14 | 剑桥Cmos传感器有限公司 | Infrared emitter and NDIR sensor |
| TW201430913A (en) * | 2012-12-13 | 2014-08-01 | Dainippon Screen Mfg | Heat treatment apparatus |
| CN111001503A (en) * | 2019-12-04 | 2020-04-14 | 沈阳拓荆科技有限公司 | Heating device and temperature control spray assembly |
Non-Patent Citations (1)
| Title |
|---|
| 王永福主编: "《汽车车身修复》", 重庆大学出版社, pages: 146 - 147 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI605539B (en) | Electrostatic chuck | |
| KR100974130B1 (en) | Substrate support having brazed plates and heater | |
| JP6968120B2 (en) | Electrostatic carrier for handling thin substrates | |
| US20200312692A1 (en) | Electrostatic chuck and semiconductor equipment | |
| US20060081601A1 (en) | Device for heating or cooling workpieces and manufacturing method therefor | |
| CN114234270A (en) | Heating device and manufacturing method thereof | |
| US3005867A (en) | Hermetically sealed semiconductor devices | |
| TWI830398B (en) | Base, base manufacturing method and plasma processing equipment | |
| US3348297A (en) | Method of manufacturing a mount for a semi-conductor device | |
| JP2006313919A (en) | Processed object retainer, susceptor for semiconductor manufacturing apparatus, and processor | |
| JP2006179897A (en) | Workpiece holder, susceptor for semiconductor manufacturing apparatus, and processing apparatus | |
| KR101904490B1 (en) | Joint structure of ceramic heater | |
| CN219873419U (en) | Heating plate and thin film deposition equipment | |
| JP7338675B2 (en) | Electrostatic chuck member, electrostatic chuck device, and method for manufacturing electrostatic chuck member | |
| CN216902837U (en) | Annealing device for annealing chips | |
| JP3325179B2 (en) | Manufacturing method of circuit breaker electrode | |
| JP2023146282A (en) | electrostatic chuck device | |
| JP2001345402A (en) | Module-type semiconductor device and its method | |
| WO2022264729A1 (en) | Ceramic heater and holding member | |
| JP2000049198A (en) | Pressure welding type semiconductor device and producing method therefor | |
| JP3814020B2 (en) | High frequency induction heating method and high frequency induction heating apparatus for brazing material | |
| JPS5941860A (en) | Manufacture of case for semiconductor device | |
| US2992480A (en) | Method for bonding laminations | |
| US7101736B2 (en) | Method of assembling a semiconductor component and apparatus therefor | |
| KR20100027563A (en) | A ring type collimater |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220325 |
|
| RJ01 | Rejection of invention patent application after publication |