CN114231227A - Epoxy resin composition and production method thereof - Google Patents
Epoxy resin composition and production method thereof Download PDFInfo
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- CN114231227A CN114231227A CN202010941792.8A CN202010941792A CN114231227A CN 114231227 A CN114231227 A CN 114231227A CN 202010941792 A CN202010941792 A CN 202010941792A CN 114231227 A CN114231227 A CN 114231227A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 68
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 68
- 239000000203 mixture Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000945 filler Substances 0.000 claims abstract description 27
- 229920001971 elastomer Polymers 0.000 claims abstract description 24
- 239000005011 phenolic resin Substances 0.000 claims abstract description 24
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 24
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 24
- 239000004645 polyester resin Substances 0.000 claims abstract description 24
- 229920001225 polyester resin Polymers 0.000 claims abstract description 24
- 239000005077 polysulfide Substances 0.000 claims abstract description 24
- 229920001021 polysulfide Polymers 0.000 claims abstract description 24
- 150000008117 polysulfides Polymers 0.000 claims abstract description 24
- 239000002994 raw material Substances 0.000 claims abstract description 24
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 8
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 8
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 8
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 239000011574 phosphorus Substances 0.000 claims abstract description 8
- 229910052718 tin Inorganic materials 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims description 58
- 239000003795 chemical substances by application Substances 0.000 claims description 26
- 239000012745 toughening agent Substances 0.000 claims description 23
- 239000003960 organic solvent Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 20
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 17
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 5
- -1 alicyclic amine Chemical class 0.000 claims description 5
- 150000004982 aromatic amines Chemical class 0.000 claims description 5
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 5
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 5
- 239000012467 final product Substances 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims description 5
- 150000003512 tertiary amines Chemical class 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 239000007767 bonding agent Substances 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- ZMEAEUNNMHQAJK-UHFFFAOYSA-N 2-[3-[3-[2,2-diphenylethyl-[(4-methoxyphenyl)methyl]amino]propoxy]phenyl]acetamide Chemical group C1=CC(OC)=CC=C1CN(CC(C=1C=CC=CC=1)C=1C=CC=CC=1)CCCOC1=CC=CC(CC(N)=O)=C1 ZMEAEUNNMHQAJK-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- UFEIGDKXCLHAPU-UHFFFAOYSA-N 3-[3-[(3,4-dimethoxyphenyl)methyl-(2,2-diphenylethyl)amino]propoxy]benzamide Chemical group C1=C(OC)C(OC)=CC=C1CN(CC(C=1C=CC=CC=1)C=1C=CC=CC=1)CCCOC1=CC=CC(C(N)=O)=C1 UFEIGDKXCLHAPU-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2231—Oxides; Hydroxides of metals of tin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2234—Oxides; Hydroxides of metals of lead
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an epoxy resin composition and a production method thereof, wherein the epoxy resin composition comprises the following raw materials in parts by weight: 99-101 parts of epoxy resin, and relates to the technical field of epoxy resin. The epoxy resin composition and the production method thereof can improve the impact strength and the anti-stripping performance by adding the polysulfide rubber, the polyamide resin improves the brittleness and the bonding capacity, the phenolic resins improves the temperature resistance and the corrosion resistance, the polyester resin improves the anti-impact tanning performance, and the filler is one or more of oxides of phosphorus, arsenic, antimony, bismuth, germanium, tin and lead, so that the epoxy resin composition can keep the bonding capacity under high temperature and high pressure, the bonding capacity is stronger when the epoxy resin composition is used as a bonding agent, the bonding performance can be kept under high temperature and high pressure, the epoxy resin composition is high temperature resistant and corrosion resistant, the high impact resistance, the high impact tanning resistance and the anti-stripping performance are high, the bonding is firmer, the epoxy resin composition is suitable for complex environment, the anti-stripping performance is not easy, and the bonding requirement of the complex environment is met.
Description
Technical Field
The invention relates to the technical field of epoxy resin, in particular to an epoxy resin composition and a production method thereof.
Background
The epoxy resin is a generic name of a polymer having two or more epoxy groups in a molecule. It is a polycondensation product of epichlorohydrin and bisphenol A or a polyol. Because of the chemical activity of the epoxy group, the epoxy group can be opened by a plurality of compounds containing active hydrogen, and the epoxy group is cured and crosslinked to form a network structure, so that the epoxy group is a thermosetting resin. The bisphenol A epoxy resin has the largest yield and the most complete variety, and the new modified variety is continuously increased and the quality is continuously improved, so the invention provides the epoxy resin composition and the production method thereof.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an epoxy resin composition and a production method thereof.
In order to achieve the purpose, the invention is realized by the following technical scheme: an epoxy resin composition and a production method thereof, wherein the raw materials comprise the following components in parts by weight: 99-101 parts of epoxy resin, 160 parts of organic solvent 140-one, 3-5 parts of curing agent, 2-4 parts of polysulfide rubber, 0.5-1.5 parts of polyamide resin, 0.5-1.5 parts of phenolic resin, 0.2-0.4 part of polyester resin, 0.1-0.3 part of toughening agent and 0.27-0.36 part of filler.
Preferably, the raw materials comprise the following components in parts by weight: 99 parts of epoxy resin, 140 parts of organic solvent, 3 parts of curing agent, 4 parts of polysulfide rubber, 0.5 part of polyamide resin, 0.5 part of phenolic resin, 0.2 part of polyester resin, 0.1 part of toughening agent and 0.27 part of filler.
Preferably, the raw materials comprise the following components in parts by weight: 101 parts of epoxy resin, 160 parts of organic solvent, 5 parts of curing agent, 4 parts of polysulfide rubber, 1.5 parts of polyamide resin, 1.5 parts of phenolic resin, 0.4 part of polyester resin, 0.3 part of toughening agent and 0.36 part of filler.
Preferably, the raw materials comprise the following components in parts by weight: 100 parts of epoxy resin, 150 parts of organic solvent, 4 parts of curing agent, 3 parts of polysulfide rubber, 1 part of polyamide resin, 1 part of phenolic resin, 0.3 part of polyester resin, 0.2 part of toughening agent and 0.32 part of filler.
Preferably, the epoxy value of the epoxy resin is 0.25 to 0.45.
Preferably, the curing agent is one of aliphatic amine, alicyclic amine, aromatic amine, polyamide and tertiary amine.
Preferably, the toughening agent is one of dibutyl phthalate and dioctyl phthalate.
Preferably, the filler is composed of one or more oxides of phosphorus, arsenic, antimony, bismuth, germanium, tin and lead.
The invention also discloses a production method of the epoxy resin composition, which comprises the following steps: s1, accurately weighing a certain amount of epoxy resin, organic solvent, curing agent, polysulfide rubber, polyamide resin, phenolic resins, polyester resin, toughening agent and filler by using a balance, and fully mixing the epoxy resin, the organic solvent and the curing agent by using a stirring tank at normal temperature to prepare a raw material mixture;
s2, heating the raw material mixture in the S1 to 60-65 ℃ by using heating equipment, adding polysulfide rubber, polyamide resin, phenolic resin and polyester resin into a stirring tank, continuously stirring for 1-2 hours under the condition that the temperature is kept unchanged to fully mix the materials,
s3, reducing the temperature to 50-55 ℃, pouring the weighed toughening agent under the condition that the stirring tank continuously stirs, continuing to stir for 1-1.5 h under the condition that the temperature is kept unchanged,
and S4, heating to 80-90 ℃ by using heating equipment, pouring the weighed filler under the condition that the stirring tank continuously stirs, and continuing to stir for 10-30min to obtain the final product.
Preferably, the normal temperature in S1 is 15-25 ℃, the rotation speed of the stirring tank in S2 is 800r/min, and the rotation speed of the stirring tank in S3 and S4 is 600 r/min.
The invention provides an epoxy resin composition and a production method thereof. Compared with the prior art, the method has the following beneficial effects:
(1) when the epoxy resin composition is used as an adhesive, the impact strength and the stripping resistance can be improved by adding polysulfide rubber, the brittleness and the bonding capacity of polyamide resin are improved, the temperature resistance and the corrosion resistance of phenolic resins are improved, the impact tanning resistance of polyester resin is improved, and the filler is one or more of oxides of phosphorus, arsenic, antimony, bismuth, germanium, tin and lead, so that the epoxy resin composition can keep the bonding performance under high temperature and high pressure, the bonding capacity of the epoxy resin composition is stronger when the epoxy resin composition is used as the adhesive, the bonding performance can be kept under high temperature and high pressure, the epoxy resin composition is high in temperature resistance and corrosion resistance, and the epoxy resin composition has high impact resistance, high impact tanning resistance and stripping resistance, so that the bonding is firmer, adapts to complex environments, is not easy to fall off, and meets the bonding requirement of the complex environments.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides three technical schemes: an epoxy resin composition and a production method thereof specifically comprise the following embodiments:
example 1
The raw materials comprise the following components in parts by weight: 99 parts of epoxy resin, wherein the epoxy value of the epoxy resin is 0.25-0.45, 140 parts of organic solvent and 3 parts of curing agent, the curing agent is one of aliphatic amine, alicyclic amine, aromatic amine, polyamide and tertiary amine, 4 parts of polysulfide rubber, 0.5 part of polyamide resin, 0.5 part of phenolic resin, 0.2 part of polyester resin and 0.1 part of toughening agent, the toughening agent is one of dibutyl phthalate and dioctyl phthalate, and the filler is 0.27 part, and the filler is one or more of oxides of phosphorus, arsenic, antimony, bismuth, germanium, tin and lead.
S1, accurately weighing 99 parts of epoxy resin, 140 parts of organic solvent, 3 parts of curing agent, 4 parts of polysulfide rubber, 0.5 part of polyamide resin, 0.5 part of phenolic resin, 0.2 part of polyester resin, 0.1 part of flexibilizer and 0.27 part of filler by using a balance, and fully mixing the epoxy resin, the organic solvent and the curing agent by using a stirring tank at normal temperature to prepare a raw material mixture, wherein the normal temperature refers to 15-25 ℃;
s2, heating the raw material mixture in the S1 to 60-65 ℃ by using heating equipment, adding polysulfide rubber, polyamide resin, phenolic resin and polyester resin into a stirring tank, and continuously stirring for 1-2 hours under the condition that the temperature is kept unchanged, wherein the rotating speed of the stirring tank is 500-800r/min, so that the raw material mixture is fully mixed;
s3, then reducing the temperature to 50-55 ℃, pouring the weighed toughening agent under the condition that the stirring tank continuously stirs, and then continuing to stir for 1-1.5 h under the condition that the temperature is kept unchanged, wherein the rotating speed of the stirring tank is 300-600 r/min;
s4, heating to 80-90 ℃ by utilizing heating equipment, pouring the weighed filler under the condition that the stirring tank continuously stirs, and continuing to stir for 10-30min to obtain the final product, wherein the rotating speed of the stirring tank is 600 r/min.
Example 2
101 parts of epoxy resin, 160 parts of organic solvent and 5 parts of curing agent, wherein the epoxy value of the epoxy resin is 0.25-0.45, the curing agent is one of aliphatic amine, alicyclic amine, aromatic amine, polyamide and tertiary amine, 4 parts of polysulfide rubber, 1.5 parts of polyamide resin, 1.5 parts of phenolic resins, 0.4 part of polyester resin and 0.3 part of toughening agent, the toughening agent is one of dibutyl phthalate and dioctyl phthalate, and 0.36 part of filler is one or more of oxides of phosphorus, arsenic, antimony, bismuth, germanium, tin and lead.
S1, accurately weighing 101 parts of epoxy resin, 160 parts of organic solvent, 5 parts of curing agent, 4 parts of polysulfide rubber, 1.5 parts of polyamide resin, 1.5 parts of phenolic resin, 0.4 part of polyester resin, 0.3 part of flexibilizer and 0.36 part of filler by using a balance, and fully mixing the epoxy resin, the organic solvent and the curing agent by using a stirring tank at normal temperature to prepare a raw material mixture, wherein the normal temperature refers to 15-25 ℃;
s2, heating the raw material mixture in the S1 to 60-65 ℃ by using heating equipment, adding polysulfide rubber, polyamide resin, phenolic resin and polyester resin into a stirring tank, and continuously stirring for 1-2 hours under the condition that the temperature is kept unchanged, wherein the rotating speed of the stirring tank is 500-800r/min, so that the raw material mixture is fully mixed;
s3, then reducing the temperature to 50-55 ℃, pouring the weighed toughening agent under the condition that the stirring tank continuously stirs, and then continuing to stir for 1-1.5 h under the condition that the temperature is kept unchanged, wherein the rotating speed of the stirring tank is 300-600 r/min;
s4, heating to 80-90 ℃ by utilizing heating equipment, pouring the weighed filler under the condition that the stirring tank continuously stirs, and continuing to stir for 10-30min to obtain the final product, wherein the rotating speed of the stirring tank is 600 r/min.
Example 3
100 parts of epoxy resin, 150 parts of organic solvent and 4 parts of curing agent, wherein the epoxy value of the epoxy resin is 0.25-0.45, the curing agent is one of aliphatic amine, alicyclic amine, aromatic amine, polyamide and tertiary amine, 3 parts of polysulfide rubber, 1 part of polyamide resin, 1 part of phenolic resin, 0.3 part of polyester resin and 0.2 part of toughening agent, the toughening agent is one of dibutyl phthalate and dioctyl phthalate, and the filler is 0.32 part and is one or more of oxides of phosphorus, arsenic, antimony, bismuth, germanium, tin and lead.
S1, accurately weighing 100 parts of epoxy resin, 150 parts of organic solvent, 4 parts of curing agent, 3 parts of polysulfide rubber, 1 part of polyamide resin, 1 part of phenolic resins, 0.3 part of polyester resin, 0.2 part of flexibilizer and 0.32 part of filler by using a balance, and fully mixing the epoxy resin, the organic solvent and the curing agent by using a stirring tank at normal temperature to prepare a raw material mixture, wherein the normal temperature refers to 15-25 ℃;
s2, heating the raw material mixture in the S1 to 60-65 ℃ by using heating equipment, adding polysulfide rubber, polyamide resin, phenolic resin and polyester resin into a stirring tank, and continuously stirring for 1-2 hours under the condition that the temperature is kept unchanged, wherein the rotating speed of the stirring tank is 500-800r/min, so that the raw material mixture is fully mixed;
s3, then reducing the temperature to 50-55 ℃, pouring the weighed toughening agent under the condition that the stirring tank continuously stirs, and then continuing to stir for 1-1.5 h under the condition that the temperature is kept unchanged, wherein the rotating speed of the stirring tank is 300-600 r/min;
s4, heating to 80-90 ℃ by utilizing heating equipment, pouring the weighed filler under the condition that the stirring tank continuously stirs, and continuing to stir for 10-30min to obtain the final product, wherein the rotating speed of the stirring tank is 600 r/min.
When the epoxy resin composition is used as an adhesive, the impact strength and the stripping resistance can be improved by adding polysulfide rubber, the brittleness and the bonding capacity of polyamide resin are improved, the temperature resistance and the corrosion resistance of phenolic resins are improved, the impact tanning resistance of polyester resin is improved, and the filler is one or more of oxides of phosphorus, arsenic, antimony, bismuth, germanium, tin and lead, so that the epoxy resin composition can keep the bonding performance under high temperature and high pressure, the bonding capacity of the epoxy resin composition is stronger when the epoxy resin composition is used as an adhesive, the bonding performance can be kept under high temperature and high pressure, the epoxy resin composition is high-temperature-resistant and corrosion-resistant, and has high impact resistance, high impact tanning resistance and stripping resistance, the bonding is firmer, the epoxy resin composition is suitable for complex environments, is not easy to fall off, and meets the bonding requirements of complex environments.
And those not described in detail in this specification are well within the skill of those in the art.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. An epoxy resin composition characterized by: the raw materials comprise the following components in parts by weight: 99-101 parts of epoxy resin, 160 parts of organic solvent 140-one, 3-5 parts of curing agent, 2-4 parts of polysulfide rubber, 0.5-1.5 parts of polyamide resin, 0.5-1.5 parts of phenolic resin, 0.2-0.4 part of polyester resin, 0.1-0.3 part of toughening agent and 0.27-0.36 part of filler.
2. The epoxy resin composition according to claim 1, wherein: the raw materials comprise the following components in parts by weight: 99 parts of epoxy resin, 140 parts of organic solvent, 3 parts of curing agent, 4 parts of polysulfide rubber, 0.5 part of polyamide resin, 0.5 part of phenolic resin, 0.2 part of polyester resin, 0.1 part of toughening agent and 0.27 part of filler.
3. The epoxy resin composition according to claim 1, wherein: the raw materials comprise the following components in parts by weight: 101 parts of epoxy resin, 160 parts of organic solvent, 5 parts of curing agent, 4 parts of polysulfide rubber, 1.5 parts of polyamide resin, 1.5 parts of phenolic resin, 0.4 part of polyester resin, 0.3 part of toughening agent and 0.36 part of filler.
4. The epoxy resin composition according to claim 1, wherein: the raw materials comprise the following components in parts by weight: 100 parts of epoxy resin, 150 parts of organic solvent, 4 parts of curing agent, 3 parts of polysulfide rubber, 1 part of polyamide resin, 1 part of phenolic resin, 0.3 part of polyester resin, 0.2 part of toughening agent and 0.32 part of filler.
5. The epoxy resin composition according to claim 1, wherein: the epoxy value of the epoxy resin is 0.25-0.45.
6. The epoxy resin composition according to claim 1, wherein: the curing agent is composed of aliphatic amine, alicyclic amine, aromatic amine, polyamide and tertiary amine.
7. The epoxy resin composition according to claim 1, wherein: the toughening agent is composed of dibutyl phthalate and dioctyl phthalate.
8. The epoxy resin composition and the process for producing the same according to claim 1, wherein: the filler is one or more of oxides of phosphorus, arsenic, antimony, bismuth, germanium, tin and lead.
9. An epoxy resin composition according to claims 1-8, characterized in that: the production method specifically comprises the following steps:
s1, accurately weighing a certain amount of epoxy resin, organic solvent, curing agent, polysulfide rubber, polyamide resin, phenolic resins, polyester resin, toughening agent and filler by using a balance, and fully mixing the epoxy resin, the organic solvent and the curing agent by using a stirring tank at normal temperature to prepare a raw material mixture;
s2, heating the raw material mixture in the S1 to 60-65 ℃ by using heating equipment, adding polysulfide rubber, polyamide resin, phenolic resin and polyester resin into a stirring tank, and continuously stirring for 1-2 hours under the condition that the temperature is kept unchanged to fully mix the raw material mixture;
s3, next, reducing the temperature to 50-55 ℃, pouring the weighed toughening agent under the condition that the stirring tank continuously stirs, and then continuing to stir for 1-1.5 h under the condition that the temperature is kept unchanged;
and S4, heating to 80-90 ℃ by using heating equipment, pouring the weighed filler under the condition that the stirring tank continuously stirs, and continuing to stir for 10-30min to obtain the final product.
10. The process for producing an epoxy resin composition according to claim 9, wherein: the rotation speed of the stirring tank in S2 is 500-800r/min, and the rotation speed of the stirring tank in S3 and S4 is 300-600 r/min.
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| US20040169162A1 (en) * | 2003-02-28 | 2004-09-02 | Yue Xiao | Conductive materials with electrical stability and good impact resistance for use in electronics devices |
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