CN112574706B - Epoxy resin adhesive for solvent-resistant permeable membrane and preparation and application methods thereof - Google Patents
Epoxy resin adhesive for solvent-resistant permeable membrane and preparation and application methods thereof Download PDFInfo
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- CN112574706B CN112574706B CN202011451736.2A CN202011451736A CN112574706B CN 112574706 B CN112574706 B CN 112574706B CN 202011451736 A CN202011451736 A CN 202011451736A CN 112574706 B CN112574706 B CN 112574706B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
An epoxy resin adhesive for a solvent-resistant permeable membrane and a preparation and application method thereof, wherein the adhesive consists of a component A and a component B; the component A comprises the following raw material components in percentage by mass: 41.2-68.8% of bisphenol A type epoxy resin, 10-20% of bisphenol F type epoxy resin, 10-15% of organic silicon modified epoxy resin, 10-20% of epoxy resin diluent, 0.1-0.5% of coupling agent, 0.1-0.3% of defoaming agent and 1-3% of thixotropic agent; the component B comprises the following raw material components in percentage by mass: 81-88% of amine curing agent, 10-15% of curing agent accelerator and 2-4% of thixotropic agent. The epoxy resin adhesive has certain rigidity after being cured, keeps good flexibility, has the characteristics of good adhesion, high strength, solvent resistance, suitability for assembly line operation and the like, and has strong market application prospect in the field of solvent-resistant permeable membranes.
Description
Technical Field
The invention relates to the technical field of epoxy resin adhesives, in particular to an epoxy resin adhesive for a solvent-resistant permeable membrane and preparation and application methods thereof.
Background
The epoxy resin is a functional material with wide application, has the characteristics of good cohesiveness, high mechanical strength, solvent resistance, corrosion resistance, processing diversity and the like, and plays an important role in the fields of chemical corrosion prevention, electronic equipment, ship transportation, industrial bonding and the like.
One important use of epoxy resins is as one of the raw materials for water treatment permeable membranes. The epoxy resin material has great advantages in this respect, on one hand, the epoxy resin has good adhesion with the base material and long service life, and on the other hand, the epoxy resin can permeate water to separate other substances and has good permeation effect. The base material is usually selected from nonwoven fabric, fiber film and other materials.
The method for preparing the permeable membrane by using the epoxy resin as one of raw materials is to coat the epoxy resin on the base material and obtain the permeable membrane after curing. Due to the holes in the base material, the epoxy resin is also provided with holes after being cured, so that water molecules can penetrate through the epoxy resin. In this process, the epoxy resin is also referred to as an adhesive of the permeable membrane, more generally referred to as an epoxy resin adhesive of the permeable membrane.
In the field of water treatment permeable membranes, in addition to epoxy resin adhesives, many other polymeric materials are used in the same large amount, such as cellulose acetate membranes, aromatic polyhydrazide membranes, aromatic polyamide membranes, reverse osmosis membranes, PVDF membranes, etc., and these membrane materials have specific properties and play unique roles in different water treatment aspects. These high molecular materials have a color equal to that of autumn in the field of water treatment and epoxy resin adhesives.
With the development of industry, the demand of permeable membranes is larger and wider, the application field is wider and higher, the application of the permeable membranes is not limited to water treatment, and the adoption of the permeable membranes to treat solvents is urgent and desired by many solvent recovery enterprises.
At present, no adhesive for solvent-resistant permeable membranes exists in the market at home and abroad, and solvent recovery enterprises can only continue to recover solvents by using traditional treatment modes such as distillation, filtration and the like. The method not only wastes time and labor and consumes energy, but also has considerable potential safety hazard, and can cause serious safety accidents by carelessness.
The permeable membrane is also suitable for the field of solvent recovery, the method for treating the solvent has the characteristics of high efficiency and low energy consumption, but the method has the characteristics of realizing assembly line operation, is safe and reliable, does not have the dangers of combustion, explosion and the like, is undoubtedly a brand-new solvent treatment mode, and has huge market potential.
However, the existing cellulose acetate membranes, aromatic polyhydrazide membranes, aromatic polyamide membranes, reverse osmosis membranes, PVDF membranes and the like have poor effects when used for solvent-resistant permeable membranes, for example, the cellulose acetate membranes, the aromatic polyamide membranes and the like are dissolved in a solvent and cannot achieve a permeation effect, the PVDF membranes and the like have poor processability, and the membranes are difficult to be made into membrane materials with a predetermined structure, so that the membrane materials for water permeable membranes cannot be directly applied to the solvent-resistant permeable membranes.
Therefore, careful selection of appropriate membrane materials and formulation and process modifications are required in order to obtain good solvent permeation.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides an epoxy resin adhesive for a solvent-resistant permeable membrane and preparation and application methods thereof. The epoxy resin adhesive has certain rigidity after being cured, keeps good flexibility, has the characteristics of good adhesion, high strength, solvent resistance, suitability for assembly line operation and the like, and has strong market application prospect in the field of solvent-resistant permeable membranes.
The technical scheme of the invention is as follows:
an epoxy resin adhesive for a solvent-resistant permeable membrane is composed of a component A and a component B;
the component A comprises the following raw material components in percentage by mass:
41.2-68.8% of bisphenol A type epoxy resin, 10-20% of bisphenol F type epoxy resin, 10-15% of organic silicon modified epoxy resin, 10-20% of epoxy resin diluent, 0.1-0.5% of coupling agent, 0.1-0.3% of defoaming agent and 1-3% of thixotropic agent; the sum of the usage of the raw materials of the component A is 100 percent;
the component B comprises the following raw material components in percentage by mass:
81-88% of amine curing agent, 10-15% of curing agent accelerator and 2-4% of thixotropic agent; the sum of the consumption of the raw materials of the component B is 100 percent.
Preferably, in the component A, the equivalent weight of the bisphenol A type epoxy resin is between 180-230 g/eq; the equivalent weight of the bisphenol F type epoxy resin is between 160 and 180 g/eq.
Preferably, in the component A, the equivalent of the organosilicon modified epoxy resin is between 500-1200 g/eq.
More preferably, in the component A, the bisphenol A epoxy resin is selected from raw materials with the trade marks of NPEL-128, YD-127, YN1826, 850S, GY6010 or R-139S; the bisphenol F type epoxy resin is selected from raw materials with the trade marks of EPIKOTE 862, 830S or NPEF-165.
More preferably, in the component A, the organosilicon modified epoxy resin is selected from raw materials with the trade name of ALBIFLEX 296 or ALBIFLEX 348.
Preferably, in the component A, the epoxy resin diluent is one or two of trimethylolpropane triglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether and 1, 6-hexanediol diglycidyl ether; the thixotropic agent is CAB-O-SIL TS 720 or N202.
Preferably, the component B comprises the following raw material components in percentage by mass:
31-60% of D230, 15-25% of D400, 10-20% of D2000, 3-5% of T403, 10-15% of curing agent accelerator and 2-4% of thixotropic agent; the sum of the using amounts of the raw materials of the component B is 100%;
wherein D-230, D-400, D2000 and T403 are the amine curing agent.
Preferably, in the component B, the curing agent accelerator is AEP; the thixotropic agent is Wacker N20 or A200.
Further, the preparation method of the epoxy resin adhesive comprises the following steps:
(1) preparation of component A:
adding bisphenol A type epoxy resin, bisphenol F type epoxy resin, organosilicon modified epoxy resin and epoxy resin diluent into a reaction kettle, stirring for 1-2 hours at the temperature of 60-80 ℃, cooling to the temperature below 40 ℃, adding a coupling agent, a defoaming agent and a thixotropic agent, continuously stirring for 0.5-1 hour, then defoaming in vacuum for 15-30 minutes, and subpackaging to obtain a finished product;
(2) preparation of the component B:
adding the amine curing agent and the curing agent accelerator into a reaction kettle at the temperature of 30-40 ℃, stirring for 0.5-1 hour, then adding the thixotropic agent, continuously stirring for 0.5-1 hour, and subpackaging to obtain a finished product;
(3) mixing the component A and the component B:
when the epoxy resin adhesive is used, the component A and the component B are uniformly mixed according to the weight ratio of 100/(25-40), and the mixture is cured for 16-24 hours at normal temperature.
Furthermore, the method for preparing the solvent-resistant permeable membrane by using the epoxy resin adhesive comprises the following steps:
the specific method comprises the following steps: uniformly mixing the component A and the component B prepared in the steps (1) and (2) according to the weight ratio of 100/(25-40), coating the mixture on a permeable membrane substrate, and curing the mixture for 16-24 hours at normal temperature to obtain the solvent-resistant permeable membrane;
the permeable membrane substrate refers to a permeable membrane material with holes.
The beneficial technical effects of the invention are as follows:
aiming at the fact that the market of adhesives for solvent-resistant permeable membranes is blank, the applicant carries out a series of work and adopts various high polymer materials to carry out tests, and the result shows that the epoxy resin has outstanding performance in solvent resistance.
The applicant screens out the most appropriate epoxy resin raw materials, scientifically combines the raw materials and finally develops the epoxy resin adhesive for the solvent-resistant permeable membrane. A, B components of the epoxy resin adhesive are cured on a substrate at normal temperature according to a certain proportion, and the obtained permeable membrane finished product has a quite good solvent-resistant effect, and the solvent treatment effect is very good.
The adhesive for the solvent-resistant permeable membrane is prepared by taking epoxy resin as a main body, adding a flexible diluent, matching with organic silicon modified epoxy resin and selecting a proper curing system for compatibility. The adhesive has the characteristics of good fluidity, suitability for assembly line operation, excellent flexibility, outstanding solvent resistance effect and the like.
When an enterprise selects an osmotic membrane product, the solvent resistance, the service life, the solvent recovery efficiency, the strength of the osmotic membrane and other indexes of the osmotic membrane are most looked at, and the epoxy resin adhesive provided by the invention can well meet the requirements.
Compared with the traditional solvent recovery process, the solvent for treating the epoxy resin adhesive for the solvent-resistant permeable membrane has the greatest advantages of high efficiency, low energy consumption, long service life, simplified production process, safety and no pollution, is a brand new method for treating the solvent, is particularly suitable for recovering and treating solvents such as acetone, methylbenzene, alcohol and the like, and has wide market prospect.
The epoxy resin adhesive for the solvent-resistant permeable membrane does not exist in the market at present, the invention can fill the blank of the field, and provides a new choice for solvent recovery processing enterprises.
Detailed Description
The present invention will be described in detail with reference to examples. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The raw materials used in the following examples and test examples are commercially available products. In addition, the parts of the respective raw materials described below are all parts by weight.
Example 1:
the epoxy resin adhesive for the solvent-resistant permeable membrane is a double-component adhesive, wherein the component A comprises bisphenol A epoxy resin NPEL-128, bisphenol F epoxy resin EPIKOTE 862, organosilicon modified epoxy resin ALBIFLEX 296, diluent trimethylolpropane triglycidyl ether, coupling agent KH560, defoaming agent BYK-A530 and thixotropic agent CAB-O-SIL TS 720; the component B comprises polyether amine curing agents D230, D400, D2000 and T403, curing agent accelerator AEP and thixotropic agent Wacker N20.
The preparation method comprises the following steps:
preparation of glue A:
adding 56.8 parts of NPEL-128, 15 parts of EPIKOTE 862, 15 parts of ALBIFLEX 296 and 10 parts of trimethylolpropane glycidyl ether into a reaction kettle, stirring at 80 ℃ for 1.5 hours, cooling to 40 ℃, adding 0.1 part of KH560, 0.1 part of BYK-A530 and 3 parts of TS 720, continuing stirring for 0.5 hour, then carrying out vacuum defoaming for 20 minutes, cooling, discharging and subpackaging.
Preparing the glue B:
49 parts of D230, 15 parts of D400, 20 parts of D2000, 3 parts of T403 and 10 parts of AEP are added into a reaction kettle, stirred for 0.5 hour at the temperature of 40 ℃, then 3 parts of Wacker N20 are added, stirring is continued for 1 hour, and cooling, discharging and subpackaging are carried out.
When the glue is used, the component A and the component B are uniformly mixed according to the weight ratio of 100/25, curing is carried out at normal temperature, and the solvent-resistant permeable membrane with excellent performance can be obtained after 18 hours.
Example 2:
the epoxy resin adhesive for the solvent-resistant permeable membrane is double-component, and the component A comprises bisphenol A epoxy resin GY6010, bisphenol F epoxy resin 830S, organic silicon modified epoxy resin ALBIFLEX 348, diluent polypropylene glycol diglycidyl ether, coupling agent KH560, defoaming agent BYK-065 and thixotropic agent N202; the component B comprises polyether amine curing agents D230, D400, D2000 and T403, curing agent accelerator AEP and thixotropic agent A200.
The preparation method comprises the following steps:
preparation of glue A:
62.3 parts of GY6010, 10 parts of 830S, 10 parts of ALBIFLEX 348 and 15 parts of polypropylene glycol diglycidyl ether are added into a reaction kettle, stirred for 1.0 hour at the temperature of 60 ℃, cooled to the temperature of below 40 ℃, added with 0.5 part of KH560, 0.2 part of BYK-065 and 2 parts of N202, continuously stirred for 0.5 hour, subjected to vacuum defoaming for 15 minutes, cooled, discharged and subpackaged.
Preparing the glue B:
42 parts of D230, 25 parts of D400, 10 parts of D2000, 4 parts of T403 and 15 parts of AEP are added into a reaction kettle, stirred for 1.0 hour at the temperature of 30 ℃, then 4 parts of A200 are added, stirring is continued for 0.5 hour, cooling and discharging are carried out, and split charging is carried out.
When the glue is used, the component A and the component B are uniformly mixed according to the weight ratio of 100/40, curing is carried out at normal temperature, and the solvent-resistant permeable membrane with excellent performance can be obtained after 24 hours.
Example 3:
the epoxy resin adhesive for the solvent-resistant permeable membrane is a double-component adhesive, wherein the component A comprises bisphenol A type epoxy resin R-139S, bisphenol F type epoxy resin NPEF-165, organic silicon modified epoxy resin ALBIFLEX 296, a diluent 1, 6-hexanediol diglycidyl ether, a coupling agent KH560, a defoaming agent DEfom 5300 and a thixotropic agent CAB-O-SIL TS 720; the component B comprises polyether amine curing agents D230, D400, D2000 and T403, curing agent accelerator AEP and thixotropic agent A200.
The preparation method comprises the following steps:
preparation of glue A:
adding 46.4 parts of R-139S, 20 parts of NPEF-165, 12 parts of ALBIFLEX 296, 20 parts of 1, 6-hexanediol diglycidyl ether into a reaction kettle, stirring for 2.0 hours at the temperature of 60 ℃, cooling to the temperature of below 40 ℃, adding 0.3 part of KH560, 0.3 part of Defom 5300 and 1 part of TS 720, continuing stirring for 1.0 hour, then carrying out vacuum defoaming for 30 minutes, cooling and discharging, and subpackaging.
Preparing the glue B:
adding 46 parts of D230, 20 parts of D400, 15 parts of D2000, 5 parts of T403 and 12 parts of AEP into a reaction kettle, stirring for 0.5 hour at the temperature of 30 ℃, then adding 2 parts of A200, continuing stirring for 1 hour, cooling, discharging and subpackaging.
When the glue is used, the component A and the component B are uniformly mixed according to the weight ratio of 100/30, curing is carried out at normal temperature, and the solvent-resistant permeable membrane with excellent performance can be obtained after 16 hours.
Test example 1:
the cured products prepared in examples 1 to 3 were subjected to property testing. The results are shown in Table 1.
TABLE 1
Remarking: the comparative examples are epoxy adhesives commonly used in the market for the preparation of water treatment permeable membranes, consisting essentially of: the main resin of the A glue is bisphenol A type epoxy resin, and is matched with diluent C12-C14 glycidyl ether, a defoaming agent, a thixotropic agent and the like; the curing agent in the B glue is polyamide matched with a small amount of thixotropic agent.
The technical parameters of 3 embodiments provided by the invention are listed in the table, main characteristics of the adhesive, such as elongation at break, tensile strength, paint film hardness, paint film adhesion, paint film flexibility, permeable film solvent resistance and the like, are tested respectively, and the 3 embodiments have obvious differences in the parameters.
Example 1 is an adhesive with good flexibility, the elongation at break is 63% at the maximum, the hardness of the paint film is 2H at the minimum, the flexibility of the paint film is the best, the solvent resistance of the permeable membrane is good, the adhesive can resist acetone for 185 hours, toluene for 139 hours and alcohol for 262 hours, and all indexes meet the test requirements.
The adhesive in example 2 has good solvent resistance, the hardness of a paint film is 4H, the flexibility of the paint film is 3mm, and most importantly, the permeable membrane prepared by using the adhesive has the best solvent resistance, can resist acetone for 203 hours, toluene for 157 hours and alcohol for 295 hours, and has outstanding solvent resistance.
Indexes such as elongation at break, paint film hardness, paint film adhesion and paint film flexibility of the adhesive in embodiment 3 can meet actual requirements, and it is worth mentioning that the adhesive has unique advantages in acetone and toluene resistance, the acetone resistance can reach 222 hours, and the toluene resistance can reach 180 hours, so that the adhesive is particularly suitable for preparing permeable membranes for recycling acetone and toluene.
The comparative example is a common epoxy resin adhesive used for preparing water treatment permeable membranes on the market, and the adhesive has poor toughness and elongation at break of only 39%. The paint film has poor performance, the hardness of the paint film is higher and is 5H, the adhesive force of the paint film is higher and is 2 grade, and the flexibility at the end of the period is insufficient and is 4 mm. The adhesive is poorer in solvent resistance, the acetone resistance is only 105 hours, the toluene resistance is 63 hours, the alcohol resistance is 137 hours, and the adhesive is far different from the 3-style adhesive provided by the invention.
It should be noted that the adhesive is mainly applied to water treatment permeable membranes, and is widely applied in the field of water treatment permeable membranes, and the performance of the adhesive is acknowledged in the industry. The adhesive provided by the invention is applied to the solvent-resistant permeable membrane, the application fields of the two products are different, the performance emphasis of the products is naturally different, and the comparative example is selected as a reference because the same type of epoxy resin adhesive for the solvent-resistant permeable membrane does not exist in the market. The comparison result shows that the epoxy resin adhesive provided by the invention is indeed outstanding in solvent resistance, and the result also shows that the epoxy resin adhesive provided by the invention can solve the problem of poor solvent resistance of a permeable membrane.
The epoxy resin adhesive provided by the invention is applied to the field of solvent recovery, so that the solvent resistance of the epoxy resin adhesive is particularly emphasized, and the indexes of paint film flexibility, paint film adhesion, paint film hardness and the like are considered at the same time.
As can be seen from the 3 examples, the solvent resistance of the 3 types of adhesives provided by the invention can meet the preset requirements, the adhesives have quite good solvent resistance effect, meanwhile, the flexibility of the paint film is less than 3mm, the hardness of the paint film is moderate, and the paint film can not break due to external force in the preparation process. In addition, the adhesive force of the paint film is less than grade 1, which shows that the adhesive has quite good adhesive force to the base material, and the bad phenomena of the adhesive falling off from the base material and the like can not be generated. During the use of the product, different embodiments can be selected according to different technical parameters.
Test example 2:
the adhesives of examples 1-3 and comparative examples were applied to the surface of a substrate, cured at room temperature to obtain a solvent-resistant permeable membrane, and then subjected to a solvent permeation test. The base material is nylon, and the coating thickness is 0.2-0.3 mm.
Wherein, in the embodiment 1, the component A and the component B are evenly mixed according to the weight ratio of 100/25, and are cured for 18 hours at normal temperature after being coated on a base material; example 2 is that the component A and the component B are evenly mixed according to the weight ratio of 100/40, and are cured for 24 hours at normal temperature after being coated on a substrate; example 3 is that the component A and the component B are evenly mixed according to the weight ratio of 100/30, and are cured for 16 hours at normal temperature after being coated on a substrate; the comparative example is that the component A and the component B are uniformly mixed according to the proportion of 100/30, coated on a substrate and cured for 24 hours at normal temperature for molding.
And (3) preparing the prepared permeable membrane into a regular circular membrane, dripping 10 g of 50% acetone aqueous solution by mass on the membrane, standing for 24 hours in a closed environment, and analyzing the passing rate of the permeable membrane to acetone and water after the experiment is finished. The test results are shown in table 2.
TABLE 2
| Example 1 | Example 2 | Example 3 | Comparative example | |
| Acetone passage rate% | 65.1 | 70.3 | 68.9 | 13.6 |
| Water passage rate% | 10.6 | 7.3 | 8.2 | 52.7 |
As can be seen from the data in table 2, the permeable membrane prepared by using the epoxy resin adhesive provided by the present invention has a good permeation effect on acetone, the acetone passing rate of the permeable membrane can reach more than 60% under the same experimental conditions, the permeable membrane shows a certain selectivity on a solvent, and the water passing rate is substantially maintained below 10%.
In comparison, the comparative example is more different. The acetone passage of the comparative example is only 13.6%, and the water passage is relatively large, 52.7%.
The data in table 2 can show that the epoxy resin adhesive provided by the invention has a good solvent permeation effect, and a general permeation effect on water, and the adhesive is expected to be widely used in the field of solvent-resistant permeable membranes by virtue of the characteristic.
In conclusion, the epoxy resin adhesive for the solvent-resistant permeable membrane is developed by optimizing raw materials and scientifically combining the formula. The solvent resistance of the permeable membrane prepared by the adhesive can meet the preset requirement, and the solvent resistance of the optimal formula is better. In addition, indexes such as paint film flexibility, paint film adhesive force, paint film hardness and the like are not wrong, and all requirements of industrial production on the adhesive can be met.
Compared with the common epoxy resin adhesive used for preparing the water treatment permeable membrane on the market, the epoxy resin adhesive provided by the invention has obvious advantages in the aspect of solvent resistance. The permeable membrane recycling and treating solvent prepared by using the epoxy resin adhesive has the characteristics of high recycling efficiency, long service life, low energy consumption, safety and no pollution, is suitable for assembly line operation, is particularly suitable for recycling and treating solvents such as acetone, toluene, alcohol and the like, and has wide market prospect and development space in the field of solvent recycling.
While the embodiments of the present invention have been disclosed above, it is not limited to the applications listed in the description and embodiments, but is fully applicable to various fields suitable for the present invention, and it will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principle and spirit of the present invention, and therefore the present invention is not limited to the specific details without departing from the general concept defined in the claims and the scope of equivalents thereof.
Claims (7)
1. The epoxy resin adhesive for the solvent-resistant permeable membrane is characterized by consisting of a component A and a component B;
the component A comprises the following raw material components in percentage by mass:
41.2-68.8% of bisphenol A type epoxy resin, 10-20% of bisphenol F type epoxy resin, 10-15% of organic silicon modified epoxy resin, 10-20% of epoxy resin diluent, 0.1-0.5% of coupling agent, 0.1-0.3% of defoaming agent and 1-3% of thixotropic agent; the sum of the usage of the raw materials of the component A is 100 percent;
in the component A, the bisphenol A epoxy resin is selected from raw materials with the trade marks of NPEL-128, YD-127, YN1826, 850S, GY6010 or R-139S; the bisphenol F type epoxy resin is selected from raw materials with the trade marks of EPIKOTE 862, 830S or NPEF-165;
in the component A, the organosilicon modified epoxy resin is selected from raw materials with the trade name of ALBIFLEX 296 or ALBIFLEX 348;
in the component A, the epoxy resin diluent is one or two of trimethylolpropane triglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether and 1, 6-hexanediol diglycidyl ether;
the component B comprises the following raw material components in percentage by mass:
81-88% of amine curing agent, 10-15% of curing agent accelerator and 2-4% of thixotropic agent; the sum of the usage of the raw materials of the component B is 100 percent;
wherein the amine curing agent is D-230, D-400, D2000 or T403; the component B comprises the following components in percentage by mass: 31-60% of D230, 15-25% of D400, 10-20% of D2000 and 3-5% of T403.
2. The epoxy resin adhesive as claimed in claim 1, wherein in the component A, the equivalent weight of the bisphenol A epoxy resin is between 180-230 g/eq; the equivalent weight of the bisphenol F type epoxy resin is between 160 and 180 g/eq.
3. The epoxy resin adhesive as claimed in claim 1, wherein in the component A, the equivalent weight of the organosilicon modified epoxy resin is between 500-1200 g/eq.
4. The epoxy adhesive of claim 1, wherein in the a component, the thixotropic agent is CAB-O-SIL TS 720 or N202.
5. The epoxy adhesive of claim 1, wherein in the B component, the curing agent accelerator is AEP; the thixotropic agent is Wacker N20 or A200.
6. The method for preparing the epoxy resin adhesive according to any one of claims 1 to 5, which is characterized by comprising the following steps:
(1) preparation of component A:
adding bisphenol A epoxy resin, bisphenol F epoxy resin, organosilicon modified epoxy resin and epoxy resin diluent into a reaction kettle, stirring for 1-2 hours at the temperature of 60-80 ℃, cooling to the temperature below 40 ℃, adding a coupling agent, a defoaming agent and a thixotropic agent, continuously stirring for 0.5-1 hour, then defoaming for 15-30 minutes in vacuum, and subpackaging to obtain a finished product;
(2) preparation of the component B:
adding the amine curing agent and the curing agent accelerator into a reaction kettle at the temperature of 30-40 ℃, stirring for 0.5-1 hour, then adding the thixotropic agent, continuously stirring for 0.5-1 hour, and subpackaging to obtain a finished product;
(3) mixing the component A and the component B:
when the epoxy resin adhesive is used, the component A and the component B are uniformly mixed according to the weight ratio of 100/(25-40), and the mixture is cured for 16-24 hours at normal temperature.
7. The method of using the epoxy adhesive of claim 6, for preparing solvent-resistant permeable films;
the specific method comprises the following steps: uniformly mixing the component A and the component B prepared in the steps (1) and (2) according to the weight ratio of 100/(25-40), coating the mixture on a permeable membrane substrate, and curing the mixture for 16-24 hours at normal temperature to obtain the solvent-resistant permeable membrane;
the permeable membrane substrate refers to a permeable membrane material with holes.
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