CN114231201A - High-energy-absorption modified acrylic buffer material and preparation method thereof - Google Patents
High-energy-absorption modified acrylic buffer material and preparation method thereof Download PDFInfo
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- CN114231201A CN114231201A CN202111289067.8A CN202111289067A CN114231201A CN 114231201 A CN114231201 A CN 114231201A CN 202111289067 A CN202111289067 A CN 202111289067A CN 114231201 A CN114231201 A CN 114231201A
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- modified acrylic
- resin
- acrylic resin
- buffer material
- curing agent
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 title claims abstract description 134
- 239000000463 material Substances 0.000 title claims abstract description 88
- 238000002360 preparation method Methods 0.000 title claims abstract description 44
- 238000010521 absorption reaction Methods 0.000 title claims abstract description 36
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 88
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 88
- 239000010410 layer Substances 0.000 claims abstract description 76
- 239000011347 resin Substances 0.000 claims abstract description 52
- 229920005989 resin Polymers 0.000 claims abstract description 52
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 46
- 239000002994 raw material Substances 0.000 claims abstract description 44
- 239000000178 monomer Substances 0.000 claims abstract description 27
- 229920001971 elastomer Polymers 0.000 claims abstract description 23
- 239000002245 particle Substances 0.000 claims abstract description 20
- 239000003522 acrylic cement Substances 0.000 claims abstract description 19
- 238000005187 foaming Methods 0.000 claims abstract description 16
- 239000012790 adhesive layer Substances 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 14
- 239000003999 initiator Substances 0.000 claims abstract description 12
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 238000001723 curing Methods 0.000 claims description 51
- 239000003292 glue Substances 0.000 claims description 18
- 239000012948 isocyanate Substances 0.000 claims description 16
- 150000003505 terpenes Chemical class 0.000 claims description 14
- 235000007586 terpenes Nutrition 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 239000005011 phenolic resin Substances 0.000 claims description 11
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 10
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 10
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 10
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 8
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 7
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 7
- 239000002313 adhesive film Substances 0.000 claims description 7
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 claims description 6
- 239000004156 Azodicarbonamide Substances 0.000 claims description 5
- 235000019399 azodicarbonamide Nutrition 0.000 claims description 5
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000011049 filling Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 3
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 3
- 150000002513 isocyanates Chemical group 0.000 description 15
- 239000004698 Polyethylene Substances 0.000 description 7
- 239000006260 foam Substances 0.000 description 7
- 239000004342 Benzoyl peroxide Substances 0.000 description 6
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 6
- 235000019400 benzoyl peroxide Nutrition 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- WPMYUUITDBHVQZ-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoic acid Chemical compound CC(C)(C)C1=CC(CCC(O)=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
- C08J9/102—Azo-compounds
- C08J9/103—Azodicarbonamide
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/04—N2 releasing, ex azodicarbonamide or nitroso compound
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- C08J2205/00—Foams characterised by their properties
- C08J2205/04—Foams characterised by their properties characterised by the foam pores
- C08J2205/044—Micropores, i.e. average diameter being between 0,1 micrometer and 0,1 millimeter
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- C08J2205/00—Foams characterised by their properties
- C08J2205/04—Foams characterised by their properties characterised by the foam pores
- C08J2205/052—Closed cells, i.e. more than 50% of the pores are closed
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- C08J2353/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2353/02—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
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- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2433/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C08J2433/10—Homopolymers or copolymers of methacrylic acid esters
- C08J2433/12—Homopolymers or copolymers of methyl methacrylate
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C09J2433/00—Presence of (meth)acrylic polymer
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Abstract
The invention discloses a high energy absorption type modified acrylic buffer material, which comprises a modified acrylic resin layer and surface rubber layers attached to two sides of the modified acrylic resin layer; the raw materials for preparing the modified acrylic resin layer comprise a foaming material, a curing agent, an auxiliary agent, color paste and modified acrylic resin liquid; the modified acrylic resin liquid is prepared by reacting resin preparation raw materials in a solvent, wherein the resin preparation raw materials comprise a monomer, an initiator, a curing agent and rubber particles; the raw materials for preparing the surface adhesive layer comprise acrylic adhesive, tackifying resin, curing agent and color paste. The invention also provides a preparation method of the high energy absorption type modified acrylic buffer material. The buffer material disclosed by the invention has excellent impact-resistant and energy-absorbing effects, is higher in design modulus, can provide better operability for die cutting processing of a rear section, and greatly expands the application field.
Description
Technical Field
The invention relates to the technical field of buffer materials, in particular to a high-energy-absorption modified acrylic buffer material and a preparation method thereof.
Background
Among the currently available various buffer materials, the most widely and mature buffer material is foam, which can be further divided into PE (polyethylene) foam, PP (polypropylene) foam, PU (polyurethane) foam, and vhb (very High bonding) buffer material. In the above classification, PE, PP and PU belong to slow impact buffer materials, i.e. they have a certain energy absorption function under the action of slow external force, and can slowly recover to original shape after the external force is removed. However, the above three materials all perform poorly for fast impact action (i.e. transient impacts such as dropping), compared to VHB materials which exhibit the desired impact resistance. VHB materials are widely known for their superior adhesion, and few consider their performance characteristics in terms of impact resistance; through falling ball drop test, the impact resistance of the PE, PP and PU foam tapes can only reach 0.15-0.22J and the impact resistance of the VHB material can reach 0.25-0.35J in the above four materials with the same size (25mm by 2mm), so that the requirements of most impact-resistant applications can be met.
With the increasingly strong technological sense of design of electronic products such as smart phones, pads, smart watches, notebook computers and the like, the thickness and the screen size are greatly changed compared with the traditional design, and the requirement on bonding buffer materials in the electronic products is also higher and higher; compared with the traditional 2mm-3mm frame bonding buffer material, the narrowest frame bonding buffer material is changed into 0.5mm-1 mm; although the bond width is narrowed, there is a higher demand for the properties of the bonded cushioning material, i.e., the bonding and energy absorption properties of the bonded cushioning material are significantly improved compared to the conventional materials.
At present, through a large number of comparisons, the impact resistance of the yakeli type VHB is superior to that of three types of foam cotton, namely PE, PP and PU, while the traditional VHB material is usually formed by coating in one step or multiple steps through a UV (ultraviolet) light curing method, for example, 49 series products and 59 series products of 3M are formed by coating acrylate prepolymer, acrylic acid series diluent monomer and photoinitiator through UV curing and laminating for multiple times, wherein different layers are compounded by connecting layers; the VHB material is usually composed of pure acrylic resin, the viscoelasticity is more biased to viscosity, and excellent adhesion performance can be endowed to the material; however, in terms of impact resistance, the VHB material has an obvious bottleneck, because the loss modulus is greater than the storage modulus in the viscoelastic property of the acrylic resin, and when the VHB material is instantaneously impacted by an external force, the VHB material is often damaged by cohesion, and excellent impact resistance cannot be realized; in addition, korean brand companies such as Anyone in korea have developed a PET-containing reinforced VHB material, which has significant advantages in dimensional stability and die-cutting property because a thin PET layer is embedded inside the VHB material, but in terms of impact resistance, since PET is a rigid material rather than a face glue layer, the interface between the PET face and the face glue layer is easily separated when the material is instantaneously impacted by external force, thereby damaging the material.
Moreover, 864 series VHB materials obtained by the 3M company of America through electron beam crosslinking curing are improved in impact resistance compared with the traditional VHB materials, but the final VHB overall modulus is too low, so that great troubles are brought to the subsequent application end, such as difficult die cutting, low yield and other processing problems; and the product developed by adopting the electron beam crosslinking and curing method has poor cohesion and insufficient high temperature resistance, so the application is limited to a certain extent.
In view of the above disadvantages, a high energy absorption type modified acrylic VHB material needs to be developed, and the impact resistance thereof can reach a higher level, so as to meet the special application requirements of impact resistance in most of the current electronic products.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a high energy absorption type modified acrylic buffer material and a preparation method thereof; the buffer material has excellent impact-resistant and energy-absorbing effects, is high in design modulus, can provide better operability for die cutting of the rear section, and greatly expands the application field.
In order to achieve the technical purpose and achieve the technical effect, the invention is realized by the following technical scheme:
a high energy-absorbing modified acrylic buffer material comprises a modified acrylic resin layer and surface rubber layers attached to two sides of the modified acrylic resin layer;
the modified acrylic resin layer is prepared from the following raw materials in percentage by mass: 0.05-5% of foaming material, 0.5-0.8% of curing agent, 0.5-1.5% of auxiliary agent, 2-10% of color paste and the balance of modified acrylic resin liquid;
the modified acrylic resin solution is prepared by reacting resin preparation raw materials in a solvent, wherein the resin preparation raw materials comprise the following components in percentage by mass: 10-30% of monomer, 0.05-1.5% of initiator, 0.5-0.8% of curing agent and the balance of rubber particles;
the preparation raw materials of the surface glue layer comprise the following components in percentage by mass: 70-90% of acrylic adhesive, 5-25% of tackifying resin, 0.5-5% of curing agent and 2-5% of color paste.
Further, the foaming material is at least one of azodicarbonamide, 4-oxybis (benzenesulfonyl hydrazide) and foaming particles.
Furthermore, the auxiliary agent in the modified acrylic resin layer is one or a combination of two of an antioxidant 1076 and an antioxidant 1010.
Furthermore, the monomer in the raw material for preparing the resin is the combination of more than two of butyl acrylate, hydroxyethyl acrylate, methyl methacrylate, acrylic acid, ethyl acrylate and isooctyl acrylate.
Furthermore, the rubber particles in the raw materials for preparing the resin are at least one of styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, hydrogenated SBS and polyacrylonitrile.
Further, the initiator in the raw materials for preparing the resin is one or the combination of two of BPO or AIBN.
Furthermore, the tackifying resin used for preparing the surface adhesive layer is at least one of rosin resin, modified terpene resin, terpene phenol resin, rosin terpene phenol resin, styrene modified terpene resin, petroleum resin and phenolic resin.
Further, the curing agent is an isocyanate type curing agent.
The invention also provides a preparation method of the high energy absorption type modified acrylic buffer material, which comprises the following steps:
(1) fully dissolving rubber particles and monomers in a solvent, and then filling nitrogen into the dissolved solution to fully remove oxygen; heating to 65-75 ℃, and adding an initiator; reacting for 4-5h at 65-75 ℃, adding a curing agent, and finally cooling to terminate the reaction to obtain a modified acrylic resin solution;
(2) adding a foaming material, a curing agent, an auxiliary agent and color paste into the modified acrylic resin solution, and fully stirring to obtain a modified acrylic resin layer preparation solution;
(3) fully stirring and mixing acrylic adhesive, tackifying resin, curing agent and color paste to obtain a surface adhesive layer preparation solution;
(4) uniformly coating the modified acrylic resin layer preparation solution on a release film, and drying to obtain a modified acrylic resin film; uniformly coating the surface adhesive layer preparation solution on a release film, and drying to obtain a surface adhesive film; and respectively attaching the obtained surface adhesive films to two sides of the modified acrylic resin film, and curing to obtain the high-energy-absorption modified acrylic buffer material.
The invention has the beneficial effects that:
according to the invention, a monomer, an initiator, a curing agent and rubber particles are adopted to synthesize the modified acrylic resin through a solvent method synthesis process, the acrylic resin is subjected to viscoelastic modification, the elastic modulus of the acrylic resin is improved, and then when the modified acrylic resin is used for preparing a modified acrylic resin layer, a foaming material is added, so that the modified acrylic resin layer finally obtained through curing is of a closed microcellular foam structure; the high elastic modulus of the modified acrylic resin is matched with the closed microporous bubble structure of the modified acrylic resin layer, so that the impact resistance and energy absorption effects of the modified acrylic resin layer are improved; the surface adhesive layer is prepared from a modified acrylic adhesive, and the modified acrylic adhesive is prepared by adding tackifying resin, a curing agent and color paste into the traditional acrylic adhesive and modifying; the modified acrylic adhesive has good adhesion property to different surfaces, and a surface adhesive layer prepared from the acrylic adhesive has good adhesion with a modified acrylic resin layer, so that the overall modified acrylic buffer material is ensured to have excellent impact-resistant and energy-absorbing effects; in addition, the modified acrylic resin layer is a cross-linking copolymerization modified material, has higher design modulus, and can provide better operability for die cutting processing of a rear section, thereby greatly expanding the application field of the modified acrylic buffer material.
Drawings
Fig. 1 is a schematic structural diagram of the high energy absorption type modified acrylic buffer material of the present invention.
Detailed Description
The technical solutions in the present invention will be described clearly and completely with reference to specific embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a high energy absorption type modified acrylic buffer material, which comprises a modified acrylic resin layer 1 and surface rubber layers 2 attached to two sides of the modified acrylic resin layer 1;
the modified acrylic resin layer 1 is prepared from the following raw materials in percentage by mass: 0.05-5% of foaming material, 0.5-0.8% of curing agent, 0.5-1.5% of auxiliary agent, 2-10% of color paste and the balance of modified acrylic resin liquid;
the modified acrylic resin solution is prepared by reacting resin preparation raw materials in a solvent, wherein the resin preparation raw materials comprise the following components in percentage by mass: 10-30% of monomer, 0.05-1.5% of initiator, 0.5-0.8% of curing agent and the balance of rubber particles;
the preparation raw materials of the surface glue layer 2 comprise the following components in percentage by mass: 70-90% of acrylic adhesive, 5-25% of tackifying resin, 0.5-5% of curing agent and 2-5% of color paste; the acrylic adhesive is a conventional acrylic adhesive sold in the market.
Wherein the foaming material is at least one of azodicarbonamide, 4-oxybis (benzenesulfonyl hydrazide) and foaming particles (5-80 μm).
The auxiliary agent in the modified acrylic resin layer is one or a combination of two of an antioxidant 1076 (beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid n-octadecyl ester) and an antioxidant 1010 (tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester).
The monomer in the raw material for preparing the resin is a mixed monomer, and preferably a combination of two or more of acrylic monomers such as butyl acrylate, hydroxyethyl acrylate, methyl methacrylate, acrylic acid, ethyl acrylate, isooctyl acrylate and the like.
Wherein, the rubber particles in the raw materials for preparing the resin are at least one of styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), hydrogenated SBS and polyacrylonitrile.
Wherein, the initiator in the raw materials for preparing the resin is one or the combination of two of Benzoyl Peroxide (BPO) or Azobisisobutyronitrile (AIBN).
Wherein the tackifying resin used for preparing the surface adhesive layer is at least one of rosin resin, modified terpene resin, terpene phenol resin, rosin terpene phenol resin, styrene modified terpene resin, petroleum resin and phenolic resin.
The curing agent in the raw material for preparing the modified acrylic resin layer, the curing agent in the raw material for preparing the resin and the curing agent in the raw material for preparing the surface glue layer are isocyanate type curing agents, and are preferably an adduct of Toluene Diisocyanate (TDI) and Trimethylolpropane (TMP), a Toluene Diisocyanate (TDI) trimer, a Hexamethylene Diisocyanate (HDI) polymer and the like.
The color paste is black or white color paste.
The invention also provides a preparation method of the high energy absorption type modified acrylic buffer material, which comprises the following steps:
(1) fully dissolving rubber particles and monomers in a solvent, and then filling nitrogen into the dissolved solution to fully remove oxygen for 1 h; heating to 65-75 ℃, and adding an initiator; reacting for 4-5h at 65-75 ℃, adding a curing agent, and finally cooling to terminate the reaction to obtain a modified acrylic resin solution;
(2) adding a foaming material, a curing agent, an auxiliary agent and color paste into the modified acrylic resin solution, and fully stirring to obtain a modified acrylic resin layer preparation solution;
(3) fully stirring and mixing acrylic adhesive, tackifying resin, curing agent and color paste to obtain a surface adhesive layer preparation solution;
(4) uniformly coating the modified acrylic resin layer preparation solution on a release film, and drying to obtain a modified acrylic resin film; uniformly coating the surface adhesive layer preparation solution on a release film, and drying to obtain a surface adhesive film; respectively attaching the obtained surface adhesive films to two sides of the modified acrylic resin film, and curing to obtain the high-energy-absorption modified acrylic buffer material; in the step, the modified acrylic resin layer and the surface glue layer are coated by a solvent method.
In the high energy absorption type modified acrylic buffer material, the thickness of the modified acrylic resin layer is 60-200 μm, the thickness of the surface glue layer is 10-100 μm, and the thickness of the final modified acrylic buffer material is 80-400 μm.
Example 1
A high energy-absorbing modified acrylic buffer material comprises a modified acrylic resin layer 1 and surface rubber layers 2 attached to two sides 1 of the modified acrylic resin layer;
the modified acrylic resin layer 1 is prepared from the following raw materials in percentage by mass: 0.5 percent of azodicarbonamide, 0.5 percent of isocyanate type curing agent, 10100.5 percent of antioxidant, 2 percent of color paste and the balance of modified acrylic resin liquid; the modified acrylic resin solution is prepared by reacting resin preparation raw materials in a solvent, wherein the resin preparation raw materials comprise the following components in percentage by mass: 10 percent of monomer, 0.05 percent of benzoyl peroxide, 0.5 percent of isocyanate type curing agent and the balance of SBS rubber particles; wherein the monomer is a mixed monomer comprising butyl acrylate, methyl methacrylate and hydroxyethyl acrylate;
the raw materials for preparing the surface glue layer 2 comprise the following components in percentage by mass: 70% of acrylic adhesive, 20% of rosin resin, 5% of isocyanate type curing agent and 5% of color paste.
Example 2
A high energy-absorbing modified acrylic buffer material comprises a modified acrylic resin layer 1 and surface rubber layers 2 attached to two sides 1 of the modified acrylic resin layer;
the modified acrylic resin layer 1 is prepared from the following raw materials in percentage by mass: 1% of azodicarbonamide, 0.5% of isocyanate type curing agent, 10101% of antioxidant, 5% of color paste and the balance of modified acrylic resin liquid; the modified acrylic resin solution is prepared by reacting resin preparation raw materials in a solvent, wherein the resin preparation raw materials comprise the following components in percentage by mass: 15 percent of monomer, 1 percent of benzoyl peroxide, 0.5 percent of isocyanate type curing agent and the balance of SBS rubber particles; wherein the monomer is a mixed monomer comprising butyl acrylate, methyl methacrylate and hydroxyethyl acrylate;
the raw materials for preparing the surface glue layer 2 comprise the following components in percentage by mass: 75 percent of acrylic adhesive, 15 percent of rosin resin, 5 percent of isocyanate type curing agent and 5 percent of color paste.
Example 3
A high energy-absorbing modified acrylic buffer material comprises a modified acrylic resin layer 1 and surface rubber layers 2 attached to two sides of the modified acrylic resin layer 1;
the modified acrylic resin layer 1 is prepared from the following raw materials in percentage by mass: 3 percent of 4, 4-oxybis (benzenesulfonyl hydrazide), 0.6 percent of isocyanate type curing agent, 10101.5 percent of antioxidant, 5 percent of color paste and the balance of modified acrylic resin liquid; the modified acrylic resin solution is prepared by reacting resin preparation raw materials in a solvent, wherein the resin preparation raw materials comprise the following components in percentage by mass: 20% of monomer, 1.5% of benzoyl peroxide, 0.8% of isocyanate type curing agent and the balance of SIS rubber particles; wherein the monomer is a mixed monomer comprising butyl acrylate, methyl methacrylate and hydroxyethyl acrylate;
the raw materials for preparing the surface glue layer 2 comprise the following components in percentage by mass: 80% of acrylic adhesive, 10% of rosin terpene phenol resin, 5% of isocyanate type curing agent and 5% of color paste.
Example 4
A high energy-absorbing modified acrylic buffer material comprises a modified acrylic resin layer 1 and surface rubber layers 2 attached to two sides of the modified acrylic resin layer;
the modified acrylic resin layer 1 is prepared from the following raw materials in percentage by mass: 5% of foaming particles, 0.8% of isocyanate type curing agent, 10101.5% of antioxidant, 10% of color paste and the balance of modified acrylic resin liquid; the modified acrylic resin solution is prepared by reacting resin preparation raw materials in a solvent, wherein the resin preparation raw materials comprise the following components in percentage by mass: 30% of monomer, 1.5% of azodiisobutyronitrile, 0.8% of isocyanate type curing agent and the balance of SIS rubber particles; wherein the monomer is a mixed monomer comprising butyl acrylate, methyl methacrylate and hydroxyethyl acrylate;
the raw materials for preparing the surface glue layer 2 comprise the following components in percentage by mass: 90% of acrylic adhesive, 5% of rosin terpene phenol resin, 3% of isocyanate type curing agent and 2% of color paste.
The preparation method of the high energy absorption type modified acrylic buffer material comprises the following steps:
(1) fully dissolving rubber particles and monomers in a certain amount of solvent (ethyl acetate and toluene) according to mass percent, and then filling nitrogen into the dissolved solution to fully remove oxygen for 1 h; heating to 65-75 ℃, and adding an initiator; reacting for 4-5h at the temperature of 65-75 ℃, then adding an isocyanate type curing agent, and finally cooling to terminate the reaction to obtain a modified acrylic resin solution;
(2) adding a foaming material, a curing agent, an auxiliary agent and color paste into the modified acrylic resin solution, and fully stirring to obtain a modified acrylic resin layer preparation solution;
(3) fully stirring and mixing acrylic adhesive, tackifying resin, curing agent and color paste to obtain a surface adhesive layer preparation solution;
(4) uniformly coating the modified acrylic resin layer preparation solution on a release film, and fully drying the release film by using an oven to obtain a modified acrylic resin film; uniformly coating the surface glue layer preparation solution on a release film, and fully drying the release film by using an oven to obtain a surface glue film; and respectively attaching the obtained surface adhesive films to two sides of the modified acrylic resin film, and curing to obtain the high-energy-absorption modified acrylic buffer material with the modified acrylic resin layer 1 and the surface adhesive layer 2.
Samples of the high-energy-absorption modified acrylic buffer material with different thicknesses are prepared by adjusting the coating weight according to the formula of the embodiment 2 so as to carry out the impact resistance test.
Sample 1 of high energy absorption type modified acrylic cushioning material: the thickness of the modified acrylic resin layer is 80 microns, the thickness of the surface glue layer is 35 microns, and the total thickness is 150 microns;
high energy absorption type modified acrylic cushioning material sample 2: the thickness of the modified acrylic resin layer is 100 micrometers, the thickness of the surface glue layer is 50 micrometers, and the total thickness is 200 micrometers;
high energy absorption type modified acrylic cushioning material sample 3: the thickness of the modified acrylic resin layer is 100 micrometers, the thickness of the surface glue layer is 75 micrometers, and the total thickness is 250 micrometers;
high energy absorption type modified acrylic cushioning material sample 4: the thickness of the modified acrylic resin layer is 150 micrometers, the thickness of the surface glue layer is 75 micrometers, and the total thickness is 300 micrometers.
Respectively carrying out impact resistance tests on the high-energy-absorption modified acrylic buffer material samples 1-4, 864 series VHB buffer materials of American 3M company and traditional PE foam; the test results are: the impact energy of the high energy absorption type modified acrylic buffer material samples 1-4 is 1.25J, 1.32J, 1.35J and 1.5J in sequence, namely the impact energy is more than 1J; the impact energy of 864 series VHB buffer materials of 3M company in the United states is 0.5J, and the impact energy of traditional PE foam is 0.32J. Therefore, the high energy absorption type modified acrylic buffer material has more excellent impact resistance.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. The utility model provides a high energy-absorbing type modified acrylic buffer material which characterized in that: the adhesive comprises a modified acrylic resin layer and surface adhesive layers attached to two sides of the modified acrylic resin layer;
the modified acrylic resin layer is prepared from the following raw materials in percentage by mass: 0.05-5% of foaming material, 0.5-0.8% of curing agent, 0.5-1.5% of auxiliary agent, 2-10% of color paste and the balance of modified acrylic resin liquid;
the modified acrylic resin solution is prepared by reacting resin preparation raw materials in a solvent, wherein the resin preparation raw materials comprise the following components in percentage by mass: 10-30% of monomer, 0.05-1.5% of initiator, 0.5-0.8% of curing agent and the balance of rubber particles;
the preparation raw materials of the surface glue layer comprise the following components in percentage by mass: 70-90% of acrylic adhesive, 5-25% of tackifying resin, 0.5-5% of curing agent and 2-5% of color paste.
2. The high energy absorption type modified acrylic buffer material as claimed in claim 1, wherein: the foaming material is at least one of azodicarbonamide, 4-oxybis (benzenesulfonyl hydrazide) and foaming particles.
3. The high energy absorption type modified acrylic buffer material as claimed in claim 1, wherein: the auxiliary agent in the modified acrylic resin layer is one or the combination of two of antioxidant 1076 and antioxidant 1010.
4. The high energy absorption type modified acrylic buffer material as claimed in claim 1, wherein: the monomer in the raw material for preparing the resin is the combination of more than two of butyl acrylate, hydroxyethyl acrylate, methyl methacrylate, acrylic acid, ethyl acrylate and isooctyl acrylate.
5. The high energy absorption type modified acrylic buffer material as claimed in claim 1, wherein: the rubber particles in the raw materials for preparing the resin are at least one of styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, hydrogenated SBS and polyacrylonitrile.
6. The high energy absorption type modified acrylic buffer material as claimed in claim 1, wherein: the initiator in the raw materials for preparing the resin is one or the combination of BPO and AIBN.
7. The high energy absorption type modified acrylic buffer material as claimed in claim 1, wherein: the tackifying resin used for preparing the surface adhesive layer is at least one of rosin resin, modified terpene resin, terpene phenol resin, rosin terpene phenol resin, styrene modified terpene resin, petroleum resin and phenolic resin.
8. The high energy absorption type modified acrylic buffer material as claimed in claim 1, wherein: the curing agent is isocyanate curing agent.
9. The preparation method of the high energy absorption type modified acrylic buffer material as claimed in any one of claims 1 to 8, characterized by comprising the following steps:
(1) fully dissolving rubber particles and monomers in a solvent, and then filling nitrogen into the dissolved solution to fully remove oxygen; heating to 65-75 ℃, and adding an initiator; reacting for 4-5h at 65-75 ℃, adding a curing agent, and finally cooling to terminate the reaction to obtain a modified acrylic resin solution;
(2) adding a foaming material, a curing agent, an auxiliary agent and color paste into the modified acrylic resin solution, and fully stirring to obtain a modified acrylic resin layer preparation solution;
(3) fully stirring and mixing acrylic adhesive, tackifying resin, curing agent and color paste to obtain a surface adhesive layer preparation solution;
(4) uniformly coating the modified acrylic resin layer preparation solution on a release film, and drying to obtain a modified acrylic resin film; uniformly coating the surface adhesive layer preparation solution on a release film, and drying to obtain a surface adhesive film; and respectively attaching the obtained surface adhesive films to two sides of the modified acrylic resin film, and curing to obtain the high-energy-absorption modified acrylic buffer material.
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CN110396160A (en) * | 2019-08-07 | 2019-11-01 | 新纶科技(常州)有限公司 | A kind of novel acrylic modified rubber foam resin and preparation method thereof |
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