CN114230711A - Strong-adhesion insulating non-silicon heat-conducting gasket - Google Patents
Strong-adhesion insulating non-silicon heat-conducting gasket Download PDFInfo
- Publication number
- CN114230711A CN114230711A CN202111598741.0A CN202111598741A CN114230711A CN 114230711 A CN114230711 A CN 114230711A CN 202111598741 A CN202111598741 A CN 202111598741A CN 114230711 A CN114230711 A CN 114230711A
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- China
- Prior art keywords
- heat
- conducting
- gasket
- silicon
- strongly
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 34
- 239000010703 silicon Substances 0.000 title claims abstract description 34
- 239000011812 mixed powder Substances 0.000 claims abstract description 21
- 239000000084 colloidal system Substances 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003999 initiator Substances 0.000 claims abstract description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- 229940065472 octyl acrylate Drugs 0.000 claims abstract description 7
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims abstract description 4
- 238000002360 preparation method Methods 0.000 claims abstract description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 3
- 238000012986 modification Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 abstract description 3
- 229920000178 Acrylic resin Polymers 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000011159 matrix material Substances 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract 1
- 238000007781 pre-processing Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a strongly-adhesive insulating non-silicon heat-conducting gasket which is manufactured by the following main steps: (1) the preparation method comprises the following steps of (1) preprocessing heat conducting powder to form modified mixed powder, (2) preparing heat conducting colloid by utilizing the modified mixed powder and other components, and (3) adding epoxy curing agents into the heat conducting colloid, stirring and molding the heat conducting colloid to form a non-silicon heat conducting gasket, wherein the heat conducting colloid mainly comprises octyl acrylate, styrene, acrylic acid, the modified mixed powder and an initiator. The strongly-adhesive insulating non-silicon heat-conducting gasket adopts a non-silicon system, takes acrylic resin as a matrix, and fills heat-conducting powder to manufacture a heat-conducting sheet, so that the problem of dirt caused by permeation is solved, the viscosity of the gasket is improved, the heat conductivity coefficient of the non-silicon heat-conducting gasket is greatly improved, the heat conductivity coefficient is up to 5W/mK, and the 180-degree stripping force is up to more than 5N/in.
Description
Technical Field
The invention relates to the technical field of heat conduction materials, in particular to a strongly-adhesive insulating non-silicon heat conduction gasket.
Background
A heat conduction gasket is usually adopted in an IC or an integrated circuit, most of traditional insulation heat conduction gaskets are silicon systems, silicone oil is easy to permeate when the traditional insulation heat conduction gaskets are attached to the surface of the IC/the integrated circuit, dirt is formed, follow-up operation is inconvenient, and the heat conduction coefficient of non-silicon heat conduction gaskets on the market is mostly within 3W/mK.
To this end, we propose a strongly-adhesive insulating non-silicon thermal pad to solve the above problems.
Disclosure of Invention
The invention aims to provide a strongly-adhesive insulating non-silicon heat-conducting gasket, which is prepared by adopting a non-silicon system, taking acrylic resin as a matrix and filling heat-conducting powder into the non-silicon system to prepare a heat-conducting sheet so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a strongly-adhesive insulating non-silicon heat-conducting gasket mainly comprises the following manufacturing steps:
(1) pretreating the heat conducting powder to form modified mixed powder;
(2) preparing a heat-conducting colloid by using the modified mixed powder and other components;
(3) and adding epoxy curing agent into the heat-conducting colloid, and stirring to form the non-silicon heat-conducting gasket.
The heat-conducting colloid mainly comprises octyl acrylate, styrene, acrylic acid, modified mixed powder and an initiator.
Preferably: the initiator adopts azodiisobutyronitrile.
In a further embodiment, the heat conducting powder in the modified mixed powder formed by pretreating the heat conducting powder in step (1) is mainly formed by blending spherical alumina, boron nitride and aluminum nitride with different particle sizes, and the silane coupling agent is added in the heat conducting powder for modification to form the modified mixed powder.
In a further embodiment, the heat conductive colloid comprises the following components:
70-90g of octyl acrylate, 10-25g of styrene, 1-5g of acrylic acid, 1500g of modified mixed powder and 1-5g of azodiisobutyronitrile initiator.
Preferably: 80g of octyl acrylate, 20g of styrene, 4g of acrylic acid, 1000g of modified mixed powder and 4g of azodiisobutyronitrile initiator.
In a further embodiment, the epoxy-based curing agent is present in an amount of 1 to 5 g.
Preferably: the epoxy curing agent amount was 4 g.
In a further embodiment, the heat conductive colloid in (2) is stirred at 40-48 ℃ for 2-5 hours.
In a further embodiment, the non-silicon heat conducting pad in (3) needs to be stirred under vacuum at the temperature of 100 ℃ and 120 ℃ for 10-15 minutes and then is pressed and molded.
Compared with the prior art, the invention has the beneficial effects that:
the strongly-adhesive insulating non-silicon heat-conducting gasket adopts a non-silicon system, takes acrylic resin as a matrix, and fills heat-conducting powder to manufacture a heat-conducting sheet, so that the problem of dirt caused by permeation is solved, the viscosity of the gasket is improved, the heat conductivity coefficient of the non-silicon heat-conducting gasket is greatly improved, the heat conductivity coefficient is up to 5W/mK, and the 180-degree stripping force is up to more than 5N/in.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The strongly-adhesive insulating non-silicon heat-conducting gasket mainly comprises the following steps:
(1) pretreatment of heat conducting powder to form modified mixed powder
The heat conducting powder in the modified mixed powder formed by pretreating the heat conducting powder is mainly formed by blending spherical alumina, boron nitride and aluminum nitride with different particle sizes, and the silane coupling agent is added in the heat conducting powder for modification to form the modified mixed powder;
(2) preparation of heat-conducting colloid from modified mixed powder and other components
Wherein the heat-conducting colloid mainly comprises 80g of octyl acrylate, 20g of styrene, 4g of acrylic acid, 1000g of modified mixed powder and 4g of azodiisobutyronitrile initiator, and is stirred for 2-5 hours at the temperature of 40-48 ℃;
(3) placing the heat-conducting colloid in vacuum equipment, adding 4g of epoxy curing agent, stirring for 10-15 minutes, and performing compression molding at the temperature of 100-150 ℃ to obtain the non-silicon heat-conducting gasket;
tests show that the heat conductivity coefficient of the non-silicon heat-conducting gasket is as high as 5W/mK, the 180-degree stripping force is as high as more than 5N/in, and the heat conductivity coefficient of the non-silicon heat-conducting gasket on the market is mostly within 3W/mK.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. The utility model provides a glue insulating non-silicon heat conduction gasket by force which characterized in that: the preparation method mainly comprises the following steps:
(1) pretreating the heat conducting powder to form modified mixed powder;
(2) preparing a heat-conducting colloid by using the modified mixed powder and other components;
(3) adding epoxy curing agent into the heat-conducting colloid, stirring and forming the non-silicon heat-conducting gasket,
the heat-conducting colloid mainly comprises octyl acrylate, styrene, acrylic acid, modified mixed powder and an initiator.
2. The strongly-adhesive insulating non-silicon heat-conducting gasket as set forth in claim 1, wherein: the heat conducting powder in the modified mixed powder formed by pretreating the heat conducting powder in the step (1) is mainly formed by blending spherical aluminum oxide, boron nitride and aluminum nitride, and the silane coupling agent is added in the heat conducting powder for modification to form the modified mixed powder.
3. The strongly-adhesive insulating non-silicon heat-conducting gasket as set forth in claim 1, wherein: the heat-conducting colloid comprises the following components: 70-90g of octyl acrylate, 10-25g of styrene, 1-5g of acrylic acid, 1500g of modified mixed powder and 1-5g of initiator.
4. The strongly-adhesive insulating non-silicon heat-conducting gasket as set forth in claim 1, wherein: the curing amount of the epoxy is 1-5 g.
5. The strongly-adhesive insulating non-silicon heat-conducting gasket as set forth in claim 1, wherein: the initiator adopts azodiisobutyronitrile.
6. The strongly-adhesive insulating non-silicon heat-conducting gasket as set forth in claim 1, wherein: the heat-conducting colloid in the step (2) needs to be stirred for 2-5 hours at the temperature of 40-48 ℃.
7. The strongly-adhesive insulating non-silicon heat-conducting gasket as set forth in claim 1, wherein: the non-silicon heat conducting gasket in the step (3) needs to be stirred for 10-15 minutes under the vacuum condition of 100-120 ℃ and then is pressed and molded.
8. The strongly-adhesive insulating non-silicon heat-conducting gasket as set forth in claim 2, wherein: the spherical alumina, boron nitride and aluminum nitride can be different in particle size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111598741.0A CN114230711A (en) | 2021-12-24 | 2021-12-24 | Strong-adhesion insulating non-silicon heat-conducting gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111598741.0A CN114230711A (en) | 2021-12-24 | 2021-12-24 | Strong-adhesion insulating non-silicon heat-conducting gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114230711A true CN114230711A (en) | 2022-03-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111598741.0A Pending CN114230711A (en) | 2021-12-24 | 2021-12-24 | Strong-adhesion insulating non-silicon heat-conducting gasket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114230711A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103319829A (en) * | 2013-06-13 | 2013-09-25 | 深圳德邦界面材料有限公司 | Silicon-free heat-conducting gasket and preparation method thereof |
| CN109762480A (en) * | 2018-12-26 | 2019-05-17 | 苏州赛伍应用技术股份有限公司 | A kind of high heat-conducting copper foil belt and its preparation method and application |
| CN113773613A (en) * | 2021-11-15 | 2021-12-10 | 北京高科宏烽电力技术有限公司 | High-filling ultrahigh-thermal-conductivity epoxy resin material and preparation method thereof |
-
2021
- 2021-12-24 CN CN202111598741.0A patent/CN114230711A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103319829A (en) * | 2013-06-13 | 2013-09-25 | 深圳德邦界面材料有限公司 | Silicon-free heat-conducting gasket and preparation method thereof |
| CN109762480A (en) * | 2018-12-26 | 2019-05-17 | 苏州赛伍应用技术股份有限公司 | A kind of high heat-conducting copper foil belt and its preparation method and application |
| CN113773613A (en) * | 2021-11-15 | 2021-12-10 | 北京高科宏烽电力技术有限公司 | High-filling ultrahigh-thermal-conductivity epoxy resin material and preparation method thereof |
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Application publication date: 20220325 |
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