CN114228147A - Multispectral synthesis ultraviolet light source module and DLP surface projection system - Google Patents
Multispectral synthesis ultraviolet light source module and DLP surface projection system Download PDFInfo
- Publication number
- CN114228147A CN114228147A CN202111520949.0A CN202111520949A CN114228147A CN 114228147 A CN114228147 A CN 114228147A CN 202111520949 A CN202111520949 A CN 202111520949A CN 114228147 A CN114228147 A CN 114228147A
- Authority
- CN
- China
- Prior art keywords
- light source
- dlp
- ultraviolet light
- light
- ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/277—Arrangements for irradiation using multiple radiation means, e.g. micromirrors or multiple light-emitting diodes [LED]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2066—Reflectors in illumination beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/208—Homogenising, shaping of the illumination light
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a multispectral synthesized ultraviolet light source module and a DLP surface projection system, which comprise at least two first ultraviolet light sources, at least one second ultraviolet light source, a first collimation mechanism, a second collimation mechanism and a light beam synthesis mechanism, wherein the peak wavelengths of the at least two first ultraviolet light sources are different, the peak wavelengths of the second ultraviolet light source and the first ultraviolet light source are different, light beams emitted by the first ultraviolet light sources are emitted into the light beam synthesis mechanism through the first collimation mechanism, light beams emitted by the second ultraviolet light sources are emitted into the light beam synthesis mechanism through the second collimation mechanism, and the light beam synthesis mechanism is used for overlapping the light beams emitted by the first ultraviolet light sources and the light beams emitted by the second ultraviolet light sources into coaxial light beams. Compared with the prior art, the invention can ensure that the ultraviolet light curing or photoresist etching effect is better, and simultaneously, the synthesis of a plurality of light sources increases the luminous flux and can obviously improve the ultraviolet light curing and etching speed.
Description
Technical Field
The invention relates to an ultraviolet surface projection system, in particular to a multispectral synthesized ultraviolet light source module and a DLP surface projection system.
Background
In the prior art, an ultraviolet curing or exposure system turns from a traditional mercury lamp light source to a semiconductor LED or laser light source, the traditional mercury lamp has great limitation, and an LED or laser UV ultraviolet lamp can well make up for the defects of the mercury lamp. Currently, semiconductor LED light sources have been commonly applied in uv-cured additive 3D printing systems, including DLP-3D printing and DLP-LCD3D printing. The PCB etching exposure also begins to adopt a surface exposure DLP maskless etching technology, and a semiconductor LED or laser is used as a light source. Current additive 3D printing systems and DLP maskless exposure systems mainly use a single ultraviolet wavelength, such as 405nm or 385 nm. Such systems are simple in architecture, but are power limited and the efficiency of the photocurable resin material or photoresist material is less than optimal. And the same material increase 3D printing equipment can be used for printing different light-cured resin materials, different resin materials can have higher sensitivity to different peak wavelengths or have better light-cured effect on multiple wavelengths, and the common photoresist material is used for optimizing the performance of the traditional mercury lamp, so the etching effect of single wavelength light is not ideal.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a multispectral synthetic ultraviolet light source module and a DLP surface projection system, which are helpful for improving the light curing or etching exposure efficiency and further improving the printing and etching speed, aiming at the defects of the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme.
A multispectral synthesized ultraviolet light source module comprises at least two first ultraviolet light sources, at least one second ultraviolet light source, a first collimating mechanism, a second collimating mechanism and a light beam synthesizing mechanism, wherein the peak wavelengths of the at least two first ultraviolet light sources are different, the peak wavelengths of the second ultraviolet light source and the first ultraviolet light source are different, light beams emitted by the first ultraviolet light sources are emitted into the light beam synthesizing mechanism through the first collimating mechanism, light beams emitted by the second ultraviolet light sources are emitted into the light beam synthesizing mechanism through the second collimating mechanism, and the light beam synthesizing mechanism is used for overlapping the light beams emitted by the first ultraviolet light sources and the light beams emitted by the second ultraviolet light sources into coaxial light beams.
Preferably, the at least two first ultraviolet light sources are packaged on the same substrate.
Preferably, the beam combining mechanism comprises a dichroic plate for reflecting the light beams emitted by the at least two first uv light sources and for transmitting the light beams emitted by the at least one second uv light source.
Preferably, the light beam combining mechanism includes two dichroic plates, a wedge angle is formed between the two dichroic plates, and the two dichroic plates are respectively used for reflecting the two light beams with different wavelengths emitted by the two first ultraviolet light sources and for transmitting the light beam emitted by the second ultraviolet light source.
Preferably, the two first ultraviolet light sources have peak wavelengths of 365nm and 385nm, respectively, and the second ultraviolet light source has a peak wavelength of 405 nm.
Preferably, the two first uv light sources have peak wavelengths of 365nm and 425nm, respectively, and the second uv light source has a peak wavelength of 405 nm.
Preferably, the spectral bandwidths of the first and second ultraviolet light sources are 15nm to 25 nm.
A DLP surface projection system for 3D photocuring printing comprises an ultraviolet light source module, a first light homogenizer, a first focusing optical mechanism, a first DLP panel, a TIR prism mechanism and a projection mechanism, wherein coaxial light beams emitted by the ultraviolet light source module sequentially pass through the first light homogenizer, the first focusing optical mechanism and the TIR prism mechanism to enter the projection mechanism, and the first DLP panel is arranged on one side of the TIR prism mechanism, which faces away from the projection mechanism; the DLP surface projection system is used for realizing ultraviolet curing of the whole surface pattern, and finishing layer-by-layer curing through the lifting or pulling-down action of a preset execution mechanism, so that 3D photocuring printing of resin materials is realized.
A DLP surface projection system for large-format PCB exposure etching comprises an ultraviolet light source module, a second light homogenizer, a second focusing optical mechanism, a second DLP panel, a DLP light homogenizing illuminating mechanism and a PCB etching projection mechanism, wherein coaxial light beams emitted by the ultraviolet light source module sequentially pass through the second light homogenizer, the second focusing optical mechanism and the DLP light homogenizing illuminating mechanism to be emitted into the PCB etching projection mechanism, and the second DLP panel is arranged on one side of the DLP light homogenizing illuminating mechanism, which is back to the PCB etching projection mechanism; the DLP surface projection system is used for realizing the whole surface type etching of the photoresist material and realizing the exposure etching of a large-breadth PCB by the rolling scanning of a preset scanning mechanism.
Preferably, the system comprises at least 2 DLP surface projection systems, wherein the DLP surface projection system array is formed by the at least 2 DLP surface projection systems, and is used for realizing splicing of surface projection pictures and realizing large-format rolling scanning 3D printing or PCB etching by matching with a precise moving mechanism.
The invention discloses a multispectral synthetic ultraviolet light source module, which is simultaneously provided with at least three light sources with peak wavelengths, wherein chips of two light sources are packaged on the same substrate, the light sources pass through the same light beam collimation channel and a light beam collimation channel of another independent packaged light source, and then the light sources pass through a dichroic plate to form a coaxial multispectral light beam, wherein the light source chips of two adjacent wavelength peaks are packaged on the same substrate, the light beam of the channel is reflected by the dichroic plate, the light source with the other peak wavelength is packaged on an independent substrate, and the light beam of the channel can penetrate through the dichroic plate. Compared with a module adopting a single-wavelength ultraviolet light source in the prior art, the ultraviolet light curing and etching system adopts a multispectral synthesis mode, so that the ultraviolet light curing or photoresist etching effect is better, meanwhile, the synthesis of a plurality of light sources increases the luminous flux, so that the light output power is higher, the ultraviolet light curing and etching speed can be obviously improved, in addition, the system has a compact structure, is convenient for heat dissipation design, is beneficial to forming an array system by a plurality of DLP surface projection system units or PCB exposure equipment units, and better meets the application requirements.
Drawings
FIG. 1 is a schematic structural diagram of an ultraviolet light source module according to a first embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an ultraviolet light source module according to a second embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a DLP surface projection system according to a third embodiment of the present invention;
fig. 4 is a schematic structural diagram of a PCB exposure apparatus in a fourth embodiment of the present invention.
Detailed Description
The invention is described in more detail below with reference to the figures and examples.
Example one
The present embodiment provides a multispectral synthesized ultraviolet light source module, please refer to fig. 1, which includes at least two first ultraviolet light sources 1, at least one second ultraviolet light source 2, a first collimating mechanism 3, a second collimating mechanism 4, and a light beam synthesizing mechanism, where peak wavelengths of the at least two first ultraviolet light sources 1 are different, peak wavelengths of the second ultraviolet light source 2 and the first ultraviolet light source 1 are different, a light beam emitted from the first ultraviolet light source 1 enters the light beam synthesizing mechanism through the first collimating mechanism 3, a light beam emitted from the second ultraviolet light source 2 enters the light beam synthesizing mechanism through the second collimating mechanism 4, and the light beam synthesizing mechanism is configured to overlap a light beam emitted from the first ultraviolet light source 1 and a light beam emitted from the second ultraviolet light source 2 into a coaxial light beam.
In this embodiment, two first uv light sources 1 and one second uv light source 2 may be provided, wherein the two first uv light sources 1 are packaged on the same substrate.
In order to realize beam combination, in the present embodiment, the beam combination mechanism includes a dichroic plate 5, and the dichroic plate 5 is used for reflecting the light beams emitted by the at least two first ultraviolet light sources 1 and transmitting the light beams emitted by the at least one second ultraviolet light source 2.
In the structure, at least three light sources with peak wavelengths are arranged simultaneously, wherein chips of two light sources are packaged on the same substrate, the light sources pass through the same light beam collimation channel and a light beam collimation channel of another independent packaged light source and then are combined into a coaxial multispectral light beam by a dichroic plate, the light source chips of two adjacent wavelength peaks are packaged on the same substrate, the light beam of the channel is reflected by the dichroic plate, the light source with the other peak wavelength is packaged on an independent substrate, and the light beam of the channel penetrates through the dichroic plate. Compared with the prior art, the multispectral synthesis ultraviolet light source module can synthesize light beams of at least three spectrums by utilizing two optical channels, and compared with the module adopting a single-wavelength ultraviolet light source in the prior art, the multispectral synthesis mode is adopted, so that the ultraviolet light curing or photoresist etching effect is better, meanwhile, the synthesis of a plurality of light sources increases the luminous flux, the light output power is higher, the ultraviolet light curing and etching speed can be obviously improved, in addition, the system has a compact structure, is convenient for heat dissipation design, is beneficial to a plurality of DLP surface projection system units or PCB exposure equipment units to form an array system, and better meets the application requirements.
Example two
The difference between the present embodiment and the first embodiment is that, referring to fig. 2, the light beam combining mechanism includes two dichroic plates 5, a wedge angle 50 is formed between the two dichroic plates 5, and the two dichroic plates 5 are respectively used for reflecting two light beams with different wavelengths emitted by the two first ultraviolet light sources 1 and for transmitting a light beam emitted by the second ultraviolet light source 2.
Specifically, the present embodiment includes two first ultraviolet light sources 1 and one second ultraviolet light source 2. The peak wavelengths of the two first ultraviolet light sources 1 are 365nm and 385nm respectively, and the peak wavelength of the second ultraviolet light source 2 is 405 nm. The spectral bandwidths of the first ultraviolet light source 1 and the second ultraviolet light source 2 are 15 nm-25 nm.
The specific principle is illustrated as follows: the light sources with the three peak wavelengths of the embodiment comprise 365nm,385nm and 405nm peak wavelength light beams and a spectral bandwidth of 15-25 nm FWHM, wherein 365nm and 385nm light source chips are packaged on the same substrate, and the 405nm light source is a main wavelength and is packaged on another substrate through the same light beam collimation channel and passes through the other light beam collimation channel. Collimated light beams emitted by the two optical channels are combined into light beams with the same optical axis by dichroic plates arranged in front of and behind each other at a certain wedge angle, wherein the collimated light beam of a 365nm light source is incident on the dichroic plate arranged in front of the dichroic plate at a certain angle and reflected, and the collimated light beam of the 385nm light source passes through the dichroic plate arranged in front of the dichroic plate again after being reflected by the dichroic plate arranged in back of the dichroic plate and is overlapped with the reflected light beam of 365nm in front of the dichroic plate to form light with the same optical axis. The collimated beam of a 405nm light source will pass through the two dichroic plates.
However, the above-mentioned light source configuration is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and other types of light sources may be configured according to design requirements, for example: the peak wavelengths of the two first ultraviolet light sources 1 are 365nm and 425nm respectively, and the peak wavelength of the second ultraviolet light source 2 is 405 nm. Specifically, the light sources with the three peak wavelengths include 365nm,405nm and 425nm peak wavelength light beams, and the spectral bandwidths are 15-25 nm FWHM, wherein the 365nm and 425nm light source chips are packaged on the same substrate, and pass through the same light beam collimation channel, the 405nm light source is a main wavelength, is packaged on another substrate, and passes through the other light beam collimation channel. Collimated light beams emitted by the two optical channels are combined into light beams with the same optical axis by dichroic plates arranged in front of and behind each other at a certain wedge angle, wherein the collimated light beam of a 365nm light source is incident on the front dichroic plate at a certain angle and reflected, and the collimated light beam of a 425nm light source passes through the front dichroic plate again after being reflected by the rear dichroic plate through the front dichroic plate and is overlapped with the reflected light beam of the front 365nm into light with the same optical axis. The collimated beam of a 405nm light source will pass through the two dichroic plates. The 425nm wavelength is the best to the etching effect of the solder resist white oil of the PCB, so that the synthesized light source containing the 425nm wavelength can effectively penetrate through the solder resist white oil during the PCB etching, and the most efficient PCB maskless surface projection etching is achieved.
EXAMPLE III
Referring to fig. 3, the present invention provides a DLP surface projection system for 3D photocuring printing, which includes an ultraviolet light source module, a first light homogenizer 6, a first focusing optical mechanism 7, a first DLP panel 8, a TIR prism mechanism 9 and a projection mechanism 10, wherein a coaxial light beam emitted from the ultraviolet light source module sequentially passes through the first light homogenizer 6, the first focusing optical mechanism 7 and the TIR prism mechanism 9 and enters the projection mechanism 10, and the first DLP panel 8 is disposed on a side of the TIR prism mechanism 9 opposite to the projection mechanism 10;
the DLP surface projection system is used for realizing ultraviolet curing of the whole surface pattern, and finishing layer-by-layer curing through the lifting or pulling-down action of a preset execution mechanism, so that 3D photocuring printing of resin materials is realized.
Please refer to the first embodiment or the second embodiment for the specific structure and principle of the ultraviolet light source module.
Specifically, this embodiment can include 2 at least DLP surface projection systems, and 2 at least DLP surface projection systems constitute a DLP surface projection system array, DLP surface projection system array is used for realizing the concatenation of plane projection picture, cooperates accurate moving mechanism again to realize big breadth roll scanning 3D and prints.
In this embodiment, an ultraviolet curing DLP-3D printing system is specifically provided, which includes the compact ultraviolet light source module with multispectral synthesis, a light homogenizer, a focusing optics, a TIR prism, a DLP panel, and a projection system. The focusing optics converge and illuminate the DLP panel through TIR after passing through the light homogenizer, reading light modulated by the DLP panel enters the projection system through TIR, an ultraviolet image is formed on a 3D printing plane to cure resin materials so as to realize surface projection curing printing, and a 3D structure which can be printed one by one can be formed by lifting or pulling down through the movement of a precise structure. The 3D printing system may have several DLP projection systems spliced into an array and may be installed on a precisely moving platform to realize rolling projection exposure so as to realize large-format 3D printing.
Example four
Referring to fig. 4, the present embodiment provides a DLP surface projection system for large-format PCB exposure etching, which includes an ultraviolet light source module, a second light homogenizer 11, a second focusing optical mechanism 12, a second DLP panel 13, a DLP light homogenizing illumination mechanism 14, and a PCB etching projection mechanism 15, wherein a coaxial light beam emitted from the ultraviolet light source module sequentially passes through the second light homogenizer 11, the second focusing optical mechanism 12, and the DLP light homogenizing illumination mechanism 14 to enter the PCB etching projection mechanism 15, and the second DLP panel 13 is disposed on a side of the DLP light homogenizing illumination mechanism 14 facing away from the PCB etching projection mechanism 15;
the DLP surface projection system is used for realizing the whole surface type etching of the photoresist material and realizing the exposure etching of a large-breadth PCB by the rolling scanning of a preset scanning mechanism.
The embodiment preferably comprises at least 2 DLP surface projection systems, wherein at least 2 DLP surface projection systems form a DLP surface projection system array, and the DLP surface projection system array is used for realizing splicing of surface projection pictures and is matched with a precise moving mechanism to realize large-format PCB etching.
Specifically, in this embodiment, another DLP surface projection system of the compact ultraviolet light source module with multispectral synthesis is a maskless exposure device for a PCB, and includes the compact ultraviolet light source module with multispectral synthesis, a DLP dodging illumination system and a PCB etching projection system. Wherein the DLP dodging illumination system comprises at least one dodger, one focusing optics and a TIR prism, the illumination system will form an evenly distributed illumination spot on the DLP panel. The PCB etching projection system at least comprises a DLP panel and a projection objective lens, and a circuit board Layout displayed on the DLP is clearly imaged on a PCB substrate. The maskless exposure equipment of the PCB can be provided with a plurality of DLP projection systems which are spliced into an array and can be arranged on a precisely moving platform to realize rolling projection exposure so as to realize large-format etching exposure.
In summary, the multispectral synthesis ultraviolet light source module, the DLP surface projection system and the PCB exposure apparatus disclosed by the invention have the beneficial effects that firstly, the multispectral synthesis principle is adopted, so that the ultraviolet curing or photoresist etching effect is better; secondly, the synthesis of a plurality of light sources increases the luminous flux, so that the output power is higher, and the ultraviolet curing and etching speed is greatly improved; moreover, the wavelength of 425nm is increased in the ultraviolet light source module, so that the etching effect of the solder resist white oil is improved during PCB photoetching; in addition, the invention has compact structure, is suitable for being applied to the DLP projection system forming the array and has better technical effect.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the technical scope of the present invention should be included in the scope of the present invention.
Claims (10)
1. A multispectral synthesized ultraviolet light source module is characterized by comprising at least two first ultraviolet light sources (1), at least one second ultraviolet light source (2), a first collimation mechanism (3), a second collimation mechanism (4) and a light beam synthesis mechanism, wherein the peak wavelengths of the at least two first ultraviolet light sources (1) are different, the second ultraviolet light source (2) has a peak wavelength different from that of the first ultraviolet light source (1), the light beam emitted by the first ultraviolet light source (1) enters the light beam synthesizing mechanism through the first collimating mechanism (3), the light beam emitted by the second ultraviolet light source (2) enters the light beam synthesizing mechanism through the second collimating mechanism (4), the light beam combining mechanism is used for overlapping the light beam emitted by the first ultraviolet light source (1) and the light beam emitted by the second ultraviolet light source (2) into a coaxial light beam.
2. The multi-spectral synthetic uv light source module according to claim 1, wherein at least two first uv light sources (1) are encapsulated on the same substrate.
3. The multi-spectral synthesizing uv light source module according to claim 1, wherein the beam synthesizing means comprises a dichroic plate (5), the dichroic plate (5) being adapted to reflect the light beams emitted by at least two first uv light sources (1) and to transmit the light beams emitted by at least one second uv light source (2).
4. The uv light source module according to claim 1, wherein the beam combining means comprises two dichroic plates (5), a wedge angle (50) being formed between the two dichroic plates (5), the two dichroic plates (5) being adapted to reflect two light beams of different wavelengths emitted from the two first uv light sources (1) and to transmit a light beam emitted from the second uv light source (2), respectively.
5. The multi-spectral synthetic uv light source module according to claim 4, wherein the peak wavelengths of the two first uv light sources (1) are 365nm and 385nm, respectively, and the peak wavelength of the second uv light source (2) is 405 nm.
6. The multi-spectral synthetic uv light source module according to claim 4, wherein the peak wavelengths of the two first uv light sources (1) are 365nm and 425nm, respectively, and the peak wavelength of the second uv light source (2) is 405 nm.
7. The multi-spectral synthetic uv light source module according to claim 4, wherein the spectral bandwidths of the first uv light source (1) and the second uv light source (2) are between 15nm and 25 nm.
8. A DLP surface projection system for 3D photocuring printing, comprising the ultraviolet light source module, the first light homogenizer (6), the first focusing optical mechanism (7), the first DLP panel (8), the TIR prism mechanism (9) and the projection mechanism (10) of any one of claims 1 to 7, wherein the coaxial light beam emitted from the ultraviolet light source module sequentially passes through the first light homogenizer (6), the first focusing optical mechanism (7) and the TIR prism mechanism (9) and is emitted into the projection mechanism (10), and the first DLP panel (8) is disposed on a side of the TIR prism mechanism (9) facing away from the projection mechanism (10);
the DLP surface projection system is used for realizing ultraviolet curing of the whole surface pattern, and finishing layer-by-layer curing through the lifting or pulling-down action of a preset execution mechanism, so that 3D photocuring printing of resin materials is realized.
9. A DLP surface projection system for large-format PCB exposure etching, comprising the ultraviolet light source module, the second light homogenizer (11), the second focusing optical mechanism (12), the second DLP panel (13), the DLP light homogenizing illumination mechanism (14) and the PCB etching projection mechanism (15) according to any one of claims 1 to 7, wherein coaxial light beams emitted from the ultraviolet light source module sequentially pass through the second light homogenizer (11), the second focusing optical mechanism (12) and the DLP light homogenizing illumination mechanism (14) and are emitted into the PCB etching projection mechanism (15), and the second DLP panel (13) is disposed on one side of the DLP light homogenizing illumination mechanism (14) facing away from the PCB etching projection mechanism (15);
the DLP surface projection system is used for realizing the whole surface type etching of the photoresist material and realizing the exposure etching of a large-breadth PCB by the rolling scanning of a preset scanning mechanism.
10. The DLP surface projection system according to claim 8 or 9, comprising at least 2 DLP surface projection systems, wherein the at least 2 DLP surface projection systems form a DLP surface projection system array, and the DLP surface projection system array is used for realizing splicing of surface projection images, and is further matched with a precision moving mechanism to realize large-format scrolling scanning 3D printing or PCB etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111520949.0A CN114228147A (en) | 2021-12-13 | 2021-12-13 | Multispectral synthesis ultraviolet light source module and DLP surface projection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111520949.0A CN114228147A (en) | 2021-12-13 | 2021-12-13 | Multispectral synthesis ultraviolet light source module and DLP surface projection system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114228147A true CN114228147A (en) | 2022-03-25 |
Family
ID=80755330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111520949.0A Pending CN114228147A (en) | 2021-12-13 | 2021-12-13 | Multispectral synthesis ultraviolet light source module and DLP surface projection system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114228147A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105924571A (en) * | 2016-05-19 | 2016-09-07 | 深圳长朗三维科技有限公司 | Continuous photo-curing three-dimensional printing material |
| CN211979418U (en) * | 2020-04-10 | 2020-11-20 | 河南百合特种光学研究院有限公司 | Three-band UV-LED exposure light source |
| CN212658942U (en) * | 2020-07-24 | 2021-03-05 | 安徽地势坤光电科技有限公司 | Photoetching direct-writing optical structure of composite wavelength LED light source and direct-writing photoetching machine |
| CN113741131A (en) * | 2020-05-28 | 2021-12-03 | 迪擎有限责任公司 | Compact size multi-channel optical engine projection device |
-
2021
- 2021-12-13 CN CN202111520949.0A patent/CN114228147A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105924571A (en) * | 2016-05-19 | 2016-09-07 | 深圳长朗三维科技有限公司 | Continuous photo-curing three-dimensional printing material |
| CN211979418U (en) * | 2020-04-10 | 2020-11-20 | 河南百合特种光学研究院有限公司 | Three-band UV-LED exposure light source |
| CN113741131A (en) * | 2020-05-28 | 2021-12-03 | 迪擎有限责任公司 | Compact size multi-channel optical engine projection device |
| CN212658942U (en) * | 2020-07-24 | 2021-03-05 | 安徽地势坤光电科技有限公司 | Photoetching direct-writing optical structure of composite wavelength LED light source and direct-writing photoetching machine |
Non-Patent Citations (1)
| Title |
|---|
| 王苏滨 等: "《显示控制系统100问》", 北京：国防工业出版社, pages: 997 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7040767B2 (en) | Integrator module with a compact light source and projection display having the same | |
| JP6085025B2 (en) | Light source device and projection display device | |
| US8994916B2 (en) | Double-sided maskless exposure system and method | |
| TWI448833B (en) | An exposure device and a light source device | |
| JP6089616B2 (en) | Light source device and projector | |
| US20020126479A1 (en) | High power incoherent light source with laser array | |
| CN110361917B (en) | Light source device and image projection device | |
| JP2020154024A (en) | Light source optical system, light source device, and image projection device | |
| KR20140123421A (en) | Light source device and exposure device | |
| JP2022084619A (en) | Light source optical system, light source device and image projection | |
| KR20160016571A (en) | Light source device and exposure device | |
| WO2018211886A1 (en) | Projection display device | |
| CN212658942U (en) | Photoetching direct-writing optical structure of composite wavelength LED light source and direct-writing photoetching machine | |
| JP7009910B2 (en) | Light source device and projector | |
| CN113296341B (en) | Lighting system | |
| CN111176059A (en) | Lighting system | |
| CN113391506B (en) | Illumination system and projection device | |
| WO2021105790A1 (en) | Light-source optical system, light-source device, and image display apparatus | |
| CN114228147A (en) | Multispectral synthesis ultraviolet light source module and DLP surface projection system | |
| CN217521472U (en) | Laser projection device | |
| CN113253555B (en) | Lighting system and method for manufacturing the same | |
| CN217689745U (en) | Light source device and projector | |
| CN114815481A (en) | Laser projection device | |
| JP2022138861A (en) | Light source device and projector | |
| JP2021096381A (en) | Light source device and projection-type image display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |