CN114222227A - Vibrating diaphragm and preparation method thereof, sound production device and electronic equipment - Google Patents
Vibrating diaphragm and preparation method thereof, sound production device and electronic equipment Download PDFInfo
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- CN114222227A CN114222227A CN202111656246.0A CN202111656246A CN114222227A CN 114222227 A CN114222227 A CN 114222227A CN 202111656246 A CN202111656246 A CN 202111656246A CN 114222227 A CN114222227 A CN 114222227A
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/025—Magnetic circuit
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/04—Construction, mounting, or centering of coil
- H04R9/045—Mounting
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/001—Moulding aspects of diaphragm or surround
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/025—Diaphragms comprising polymeric materials
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Abstract
The application discloses vibrating diaphragm and preparation method, sound generating mechanism, electronic equipment thereof, vibrating diaphragm include main part and main conducting part, the main part includes compound rubber layer and thermoplasticity elastomer layer together, main conducting part inlays and locates thermoplasticity elastomer layer, and at least a part of main conducting part exposes in thermoplasticity elastomer layer and keeps away from a side surface on rubber layer to be connected with voice coil and external circuit electricity, main conducting part contains silicon class compound and conductive particle. According to the vibrating diaphragm of this application embodiment, compromise intensity, thickness, modulus and resilience that can be better, change and realize ultra-thin design, realize high performance, high waterproof demand. The rubber layer can compensate the not enough of thermoplastic elastomer material in the temperature resistant, and thermoplastic elastomer material can play the intensity of compensateing the rubber layer and promote the effect of the whole modulus of vibrating diaphragm, and the vibrating diaphragm has thinner thickness to can provide more vibration spaces for the vibrating diaphragm vibration, more be favorable to realizing ultra-thin design.
Description
Technical Field
The application relates to the technical field of electroacoustic, and more particularly relates to a vibrating diaphragm of a sound generating device, a preparation method of the vibrating diaphragm, the sound generating device using the vibrating diaphragm and an electronic device using the sound generating device.
Background
The sound generating device generally includes a diaphragm and a voice coil coupled to one side of the diaphragm, and an electrical connection member electrically connecting an internal circuit and an external circuit of the sound generating device. Wherein, the voice coil includes two voice coil lead wires, and two voice coil lead wires are connected with two pads electricity of electric connector respectively through modes such as spot welding, and external circuit is connected to electric connector electricity simultaneously to the signal of telecommunication control voice coil through terminal product. Generally, the lead of the voice coil needs to be threaded out to a certain length, and the lead is suspended to be electrically connected with the electrical connector. Although the suspension lead structure can realize higher sensitivity, the amplitude of the voice coil cannot be too large due to the suspension limitation of the lead, the wire breaking risk is higher, the low-frequency effect is not obvious enough, and better user auditory experience cannot be provided for a user.
In some prior art products, a centering pad is further included in some sound generating devices, and the centering pad is usually combined on one side of the diaphragm, and the centering pad can be used as an electrical connection part between the voice coil and the outside. Specifically, the connection line of the voice coil is connected to the spider, and the spider is connected to an external circuit, thereby achieving electrical connection. In fact, although the hidden danger of voice coil loudspeaker voice coil lead wire broken string has effectively been solved in the application of centering branch piece, the existence of centering branch piece can occupy sound generating mechanism's inner space to lose the acoustic performance of product to a certain extent, and then reduced user's audio frequency and experienced.
In the related art, a diaphragm having a conductive function is proposed, which makes the conductive film widely used in a sound generating device. For the conductive film, the main current application methods include electrophoresis of conductors, electroplating of conductors, injection molding of conductors, addition of conductive coatings, addition of conductive ink layers, laser etching and the like in the diaphragm. However, the above methods all have the defects of large technical implementation difficulty, low mass productivity, high cost, and low reliability and acoustic performance to different degrees.
Moreover, the diaphragm prepared by the methods has larger thickness, reduces the vibration space of the diaphragm and is not beneficial to the ultra-thin design of products.
Disclosure of Invention
An aim at of this application provides a vibrating diaphragm has not only realized the electricity of voice coil loudspeaker voice coil and external circuit, under the prerequisite that realizes the high performance, has thinner thickness, provides more vibration spaces for the vibrating diaphragm vibration.
Another object of the present application is to provide a method for manufacturing the diaphragm.
Still another object of this application is to provide a sound generating device that above-mentioned vibrating diaphragm is constituteed.
Still another object of this application is to provide an electronic device comprising the above sound generating device.
In order to achieve the above object, the present application provides the following technical solutions.
The diaphragm according to the embodiment of the first aspect of the present application includes a main body portion and a main conductive portion, the main body portion includes a rubber layer and a thermoplastic elastomer layer that are combined together, the main conductive portion is embedded in the thermoplastic elastomer layer, and at least a portion of the main conductive portion is exposed on a side surface of the thermoplastic elastomer layer away from the rubber layer to be electrically connected with a voice coil and an external circuit, and the main conductive portion includes a silicon compound and conductive particles.
According to the vibrating diaphragm of this application embodiment, through adopting thermoplastic elastomer and rubber layer composite construction with the main part, compromise intensity, thickness, modulus and resilience that can be better, change the ultra-thin design that realizes the vibrating diaphragm, realize high performance, high waterproof demand. The rubber layer can compensate the thermoplastic elastomer material not enough in temperature resistance and resilience performance, and thermoplastic elastomer material can play the intensity of compensateing the rubber layer and promote the effect of the whole modulus of vibrating diaphragm, and the promotion of the whole modulus of vibrating diaphragm can realize under the prerequisite of high performance, and the vibrating diaphragm has thinner thickness to can provide more vibration spaces for the vibrating diaphragm vibration, more be favorable to realizing ultra-thin design.
According to some embodiments of the present application, the thermoplastic elastomer layer includes a first thermoplastic elastomer layer and a second thermoplastic elastomer layer, the first thermoplastic elastomer layer and the second thermoplastic elastomer layer are respectively compounded with opposite sides of the rubber layer, the main conductive part includes a first main conductive part and a second main conductive part, the first main conductive part is embedded in the first thermoplastic elastomer layer, and at least a portion of the first main conductive part is exposed on a side surface of the first thermoplastic elastomer layer away from the rubber layer, the second main conductive part is embedded in the second thermoplastic elastomer layer, and at least a portion of the second main conductive part is exposed on a side surface of the second thermoplastic elastomer layer away from the rubber layer.
According to some embodiments of the present application, the body portion further comprises an adhesive layer located between the rubber layer and the thermoplastic elastomer layer to bond the rubber layer and the thermoplastic elastomer layer.
According to some embodiments of the present application, the adhesive layer is selected from at least one of an acrylate-based pressure sensitive adhesive, a silicone-based pressure sensitive adhesive, and a polyurethane-based pressure sensitive adhesive.
According to some embodiments of the present application, the rubber layer is injection molded integrally with the thermoplastic elastomer layer.
According to some embodiments of the present application, the main body portion includes a folded ring portion, an outer edge portion disposed outside the folded ring portion, and an inner edge portion disposed inside the folded ring portion, and the main conductive portion is disposed on the folded ring portion and the inner and outer edge portions.
According to some embodiments of the present application, the main conductive portion includes a first electrical connection portion at the inner edge portion and a second electrical connection portion at the outer edge portion, the first electrical connection portion being electrically connected with the voice coil, the second electrical connection portion being electrically connected with the external circuit.
According to some embodiments of the application, the thickness of the diaphragm is 30 μm to 200 μm, and the thickness of the rubber layer is not less than the thickness of the thermoplastic elastomer layer.
According to some embodiments of the application, the thermoplastic elastomer layer has a thickness of 1 μm to 100 μm.
According to some embodiments of the present application, a portion of the main body portion located in an orthographic projection area of the main conductive portion on the main body portion and the main conductive portion form a composite portion, and the composite portion has an elongation at break equal to or greater than 50%.
According to some embodiments of the present application, the rubber material of the rubber layer comprises at least one of methyl vinyl silicone rubber, dimethyl silicone rubber, phenyl silicone rubber, fluorosilicone rubber.
According to some embodiments of the present application, the thermoplastic elastomer layer comprises at least one of a polyurethane-based thermoplastic elastomer, a polyester-based thermoplastic elastomer, a silicone-based thermoplastic elastomer, a polyamide-based thermoplastic elastomer, an acrylate-based thermoplastic elastomer, a dynamically vulcanized thermoplastic elastomer.
According to some embodiments of the present application, the silicon based compound comprises at least one of silica, a silicate compound, an organosilicon compound.
According to some embodiments of the present application, the content of the conductive particles in the main conductive part is more than or equal to 50% wt; and/or the particle size of the conductive particles is less than or equal to 80 um; and/or the conductive particles comprise at least one of metal particles and carbonaceous particles.
According to some embodiments of the application, the diaphragm further includes a secondary conductive part, the thermoplastic elastomer layer is compounded with one side surface of the rubber layer, the secondary conductive part is embedded in one side of the rubber layer far away from the thermoplastic elastomer layer, part of the surface of the secondary conductive part is exposed out of one side surface of the rubber layer far away from the thermoplastic elastomer layer, and the secondary conductive part contains a silicon compound and conductive particles.
The preparation method of the diaphragm according to the embodiment of the second aspect of the application comprises the following steps: placing conductive slurry consisting of silicon compounds and conductive particles on one side surface of the thermoplastic elastomer layer for solidification and shaping to form a composite part of the conductive part and the thermoplastic elastomer layer; placing the composite part on a forming module, adding a rubber material on one side of the thermoplastic elastomer layer, which is far away from the conductive part, forming the composite part and the rubber material into a whole by adopting a hot-press forming or injection molding mode, and embedding the conductive part in the thermoplastic elastomer layer to form a vibrating diaphragm substrate; and cutting the vibrating diaphragm base material to obtain the vibrating diaphragm with a set shape.
According to some embodiments of the present application, the hot press forming includes at least one of vacuum forming, air pressure forming and compression forming.
According to this application third aspect embodiment's sound generating mechanism, including the casing and establish magnetic circuit in the casing and with magnetic circuit matched with vibration system, vibration system includes the vibrating diaphragm and combines the voice coil loudspeaker voice coil on one side of the vibrating diaphragm, the magnetic circuit drive the voice coil loudspeaker voice coil vibration is in order to drive the vibrating diaphragm sound production, the vibrating diaphragm be according to above-mentioned embodiment.
According to this application fourth aspect embodiment's sound generating mechanism, include the casing and establish magnetic circuit and vibration system in the casing, vibration system includes voice coil loudspeaker voice coil, first vibrating diaphragm and second vibrating diaphragm, the top of voice coil loudspeaker voice coil with first vibrating diaphragm links to each other, the magnetic circuit drive the voice coil loudspeaker voice coil vibration is in order to drive first vibrating diaphragm sound production, the both ends of second vibrating diaphragm respectively with the casing with the bottom of voice coil loudspeaker voice coil links to each other, the second vibrating diaphragm be according to above-mentioned embodiment the vibrating diaphragm.
An electronic device according to an embodiment of the fifth aspect of the present application includes the sound generating device described in the above embodiments.
Further features of the present application and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which is to be read in connection with the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.
FIG. 1 is a schematic structural diagram of a diaphragm according to an embodiment of the present application;
FIG. 2 is a partial cross-sectional view of a diaphragm according to one embodiment of the present application;
FIG. 3 is a partial cross-sectional view of a diaphragm according to another embodiment of the present application;
FIG. 4 is a partial cross-sectional view of a diaphragm according to yet another embodiment of the present application;
FIG. 5 is a partial cross-sectional view of a diaphragm according to yet another embodiment of the present application;
FIG. 6 is a top view of a diaphragm according to one embodiment of the present application;
FIG. 7 is a partial cross-sectional view of a sound generating device according to one embodiment of the present application;
fig. 8 is a partial cross-sectional view of a sound emitting device according to another embodiment of the present application.
Reference numerals
A diaphragm 10;
a main body portion 11; a folded loop portion 111; an outer edge portion 112; an inner edge portion 113; a rubber layer 114; a thermoplastic elastomer layer 115; an adhesive layer 116;
a main conductive part 12; a first electrical connection portion 121; a second electrical connection 122; a third electrical connection portion 123;
a secondary conductive portion 13;
a voice coil 20; a first diaphragm 21; a second diaphragm 22.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The diaphragm 10 according to an embodiment of the present application is described in detail below with reference to the drawings.
As shown in fig. 1 to 8, a diaphragm 10 according to an embodiment of the present application includes a main body portion 11 and a main conductive portion 12, the main body portion 11 includes a rubber layer 114 and a thermoplastic elastomer layer 115 which are combined together, the main conductive portion 12 is embedded in the thermoplastic elastomer layer 115, and at least a portion of the main conductive portion 12 is exposed on a side surface (e.g., an upper surface) of the thermoplastic elastomer layer 115 away from the rubber layer 114 to be electrically connected to a voice coil 20 and an external circuit, and the main conductive portion 12 includes a silicon-based compound and conductive particles.
In other words, as shown in fig. 2, the diaphragm 10 according to the embodiment of the present application is mainly composed of two parts, namely, a main body part 11 and a main conductive part 12, wherein the main body part 11 is a composite structure formed by compounding a rubber layer 114 and a thermoplastic elastomer layer 115, one side of the thermoplastic elastomer layer 115 is attached to the main body part 11, the main conductive part 12 is embedded in the other side of the thermoplastic elastomer layer 115, at least a part of the main conductive part 12 is exposed on the other side surface of the thermoplastic elastomer layer 115, and the main conductive part 12 exposed on the other side surface of the thermoplastic elastomer layer 115 can be electrically connected to a voice coil and an external circuit. The structure is used as an electric connector for realizing the internal circuit and the external circuit of the sound generating device, and has the following advantages:
(1) the main conductive part 12 is prepared from conductive paste containing silicon compounds and conductive particles, and compared with a pure conductor or a surface coating or plating layer and the like, the main conductive part 12 has stronger bonding capability with a thermoplastic elastomer material, which is beneficial to the vibration consistency of the diaphragm during working;
(2) the main conductive part 12 is a structural design of the main body part 11 embedded in the diaphragm 10, and the main body part 11 plays a role in protecting the main conductive part 12 in the vibration process, so that the fracture risk of the main conductive part 12 during vibration and large displacement can be effectively reduced;
(3) at least one surface of the main conductive part 12 is exposed out of the surface of the diaphragm 10, and the circuit connection operation is simple. Meanwhile, due to the existence of the silicon compound of the main conductive part 12, the conductive particles can be protected to a certain degree, and the main conductive part 12 has better oxidation resistance, corrosion resistance and other properties.
From this, according to vibrating diaphragm 10 according to this application embodiment, through adopting thermoplastic elastomer and rubber layer 114 composite construction with main part 11, compromise intensity, thickness, modulus and resilience that can be better, change the ultra-thin design that realizes vibrating diaphragm 10, realize high performance, high waterproof demand. Rubber layer 114 can compensate thermoplastic elastomer material in temperature resistance and resilience not enough, and thermoplastic elastomer material can play the intensity of making up rubber layer 114 and promote the effect of the whole modulus of vibrating diaphragm 10, and the promotion of the whole modulus of vibrating diaphragm 10 can realize under the prerequisite of high performance, and vibrating diaphragm 10 has thinner thickness to can provide more vibration spaces for vibrating diaphragm 10 vibration, more be favorable to realizing ultra-thin design.
In addition, according to vibrating diaphragm 10 of this application embodiment, realized vibrating diaphragm 10 and connected sound generating mechanism's internal circuit and external circuit, the internal vibration space of loss and the easy fracture scheduling problem of voice coil loudspeaker voice coil lead wire that connecting pieces such as saving centering disk arouse, simultaneously because the special material composition of main conducting part 12 and the structural design of local embedding, the cohesion of main conducting part 12 and main part 11 is more excellent, vibrating diaphragm 10 has higher compliance, more excellent vibration uniformity, can satisfy product large displacement, high loudness, demands such as high sensitivity.
In the present application, the thermoplastic elastomer layer 115 may be a single layer, as shown in fig. 2, the thermoplastic elastomer layer 115 is compounded on one side surface of the rubber layer 114, and the main conductive part 12 is embedded on one side surface of the thermoplastic elastomer layer 115 away from the rubber layer 114.
In other embodiments of the present application, the thermoplastic elastomer layer 115 includes a first thermoplastic elastomer layer and a second thermoplastic elastomer layer, the first thermoplastic elastomer layer and the second thermoplastic elastomer layer are respectively compounded on two opposite sides of the rubber layer 114, the main conductive part 12 includes a first main conductive part and a second main conductive part, the first main conductive part is embedded in the first thermoplastic elastomer layer, at least a portion of the first main conductive part is exposed on one side surface of the first thermoplastic elastomer layer away from the rubber layer 114, the second main conductive part is embedded in the second thermoplastic elastomer layer, and at least a portion of the second main conductive part is exposed on one side surface of the second thermoplastic elastomer layer away from the rubber layer 114.
In other words, as shown in fig. 3, in the present application, the thermoplastic elastomer layer 115 may be two layers, the two thermoplastic elastomer layers 115 are respectively located at two sides of the rubber layer 114, and one main conductive part 12 may be respectively embedded on the two thermoplastic elastomer layers 115, wherein the structure and material of the first thermoplastic elastomer layer and the second thermoplastic elastomer layer may be the same, so that the first thermoplastic elastomer layer and the second thermoplastic elastomer layer are both labeled as the thermoplastic elastomer layer 115 in fig. 3, and accordingly, the first main conductive part and the second main conductive part are also both labeled as the main conductive part 12.
In other embodiments of the present application, the diaphragm 10 further includes a secondary conductive portion 13, the thermoplastic elastomer layer 115 is combined with a side surface of the rubber layer 114, the secondary conductive portion 13 is embedded in a side of the rubber layer 114 away from the thermoplastic elastomer layer 115, a part of a surface of the secondary conductive portion 13 is exposed out of a side surface of the rubber layer 114 away from the thermoplastic elastomer layer 115, and the secondary conductive portion 13 contains a silicon compound and conductive particles.
As shown in fig. 5, the diaphragm 10 also includes two conductive parts, i.e., a main conductive part 12 and a sub-conductive part 13, wherein the main conductive part 12 is embedded in a thermoplastic elastomer layer 115 compounded on a first side of a rubber layer 114, and the sub-conductive part 13 is directly embedded in the other side of the rubber layer 114. The sub conductive portion 13 may be made of the same material as the main conductive portion 12.
Therefore, according to the vibration requirement of the product diaphragm 10, the main conductive part 12 may be located on the same surface of the diaphragm 10, or may be designed to be distributed on the upper and lower surfaces of the diaphragm 10. The main conductive part 12 acts as a reinforcing rib for the main body part 11, so that the toughness of the diaphragm 10 can be enhanced, and the occurrence of a film rupture phenomenon can be avoided. Moreover, through the arrangement, the requirement for wiring at a plurality of different positions can be met, and the flexibility of wiring of the voice coil can be improved.
According to some embodiments of the present application, the body portion 11 further comprises an adhesive layer 116, the adhesive layer 116 being located between the rubber layer 114 and the thermoplastic elastomer layer 115 to bond the rubber layer 114 and the thermoplastic elastomer layer 115.
Optionally, the adhesive layer 116 is selected from at least one of acrylate pressure sensitive adhesives, silicone pressure sensitive adhesives, and polyurethane pressure sensitive adhesives.
Specifically, as shown in fig. 4, an adhesive layer 116 is further disposed between the rubber layer 114 and the thermoplastic elastomer layer 115, and the presence of the adhesive layer 116 provides damping for the diaphragm 10, and on the other hand, can play a role in connection and buffering, so that an interaction force between the rubber layer 114 and the thermoplastic elastomer layer 115 in a vibration process is reduced, and the problem of delamination during large displacement is effectively avoided.
In some embodiments of the present application, the rubber layer 114 is injection molded integrally with the thermoplastic elastomer layer 115. The two are integrally formed by injection molding, the forming mode is simple and feasible, and the preparation is convenient.
According to some embodiments of the present application, the main body portion 11 includes a folded portion 111, an outer edge portion 112 disposed outside the folded portion 111, and an inner edge portion 113 disposed inside the folded portion 111, and the main conductive portion 12 is disposed on the folded portion 111 and the inner and outer edge portions 113 and 112.
As shown in fig. 1 and 6, the main body portion 11 is composed of an outer edge portion 112, a corrugated portion 111, and an inner edge portion 113 from the outside to the inside, and the main conductive portion 12 penetrates the outer edge portion 112, the corrugated portion 111, and the inner edge portion 113 and is provided in the main body portion 11. Thereby making it possible to facilitate electrical connection of the diaphragm 10 to the voice coil and an external circuit.
In some embodiments of the present application, the main conductive portion 12 includes a first electrical connection portion 121 located at the inner edge portion 113 and a second electrical connection portion 122 located at the outer edge portion 112, the first electrical connection portion 121 being electrically connected to the voice coil, and the second electrical connection portion 122 being electrically connected to an external circuit.
As shown in fig. 6, the inner edge portion 113 is provided with a first electrical connection portion 121, the outer edge portion 112 is provided with a second electrical connection portion 122, the corrugated portion 111 is provided with a third electrical connection portion 123 capable of electrically connecting the first electrical connection portion 121 and the second electrical connection portion 122, and the first electrical connection portion 121, the second electrical connection portion 122 and the third electrical connection portion 123 together form the main electrical connection portion 12.
Note that, the electrical connection relationship between each part of the main conductive part 12 and the voice coil and the external circuit is not particularly limited as long as the effect of electrically connecting the voice coil and the external circuit is satisfied. In consideration of the assembly relationship of the diaphragm 10 with the voice coil and the external circuit, the first electrical connection portion 121 may be electrically connected with the voice coil, and the second electrical connection portion 122 may be electrically connected with the external circuit.
The diaphragm 10 of the present application may include two or more main conductive portions 12 separated from each other, and the main conductive portions 12 are located at the corrugated portion 111 of the diaphragm 10 and the outer edge portion 112 and the inner edge portion 113 connected thereto. The positive and negative poles of the circuit are respectively connected with different conductive parts 12, and simultaneously, the main conductive part 12 is communicated with the folded ring part 111 and the outer edge part 112 and the inner edge part 113 which are connected with the folded ring part, so that the circuit connection is easier to operate, and the mass production performance is stronger.
Since the rubber layer 114 made of a rubber material having a relatively low modulus is included in the body portion 11 of the diaphragm 10, a certain thickness is required to satisfy the stiffness required for the product F0 and vibration. However, the thicker the thickness is, the vibration space of the product is lost, and the development trend of ultra-thinning of the product is not met. The thermoplastic elastomer layer 115 is matched, so that the strength of the rubber layer 114 can be made up, meanwhile, the overall modulus of the vibrating diaphragm 10 is easier to improve, and the thickness of the vibrating diaphragm 10 is reduced. However, the main conductive part 12 contains conductive particles, the main conductive part 12 has insufficient flexibility, which is an embedded structure, and if the thickness of the main body part 11 is too thin, the toughness of the diaphragm 10 at the main conductive part 12 is insufficient, and the risk of membrane rupture is likely to occur.
In view of the above, in some embodiments of the present application, the thickness of the diaphragm 10 is 30 μm to 200 μm, preferably 50 μm to 150 μm, and the thickness of the rubber layer 114 is not less than the thickness of the thermoplastic elastomer layer 115.
Alternatively, the thickness of the thermoplastic elastomer layer 115 is 1 μm to 100 μm. It can be understood that the thickness of the diaphragm 10 is too thick, the compliance of the diaphragm 10 is reduced, the vibration space loss is reduced, the thickness of the diaphragm 10 is too thin, and the conductive particles in the forming process cause insufficient interface strength, so that the risk of membrane rupture is easy to occur.
According to one embodiment of the present application, the main conductive part 12 and the portion of the main body part 11 located in the orthographic projection area of the main conductive part 12 on the main body part 11 form a composite part, and the elongation at break of the composite part is equal to or greater than 50%.
Specifically, the composite portion refers to a composite structure of a portion of the diaphragm 10 located in an orthographic projection area of the main conductive portion 12 and the main conductive portion 12, and may also be understood as an area of the diaphragm 10 on which the main conductive portion 12 is located, and the elongation at break of the composite portion is greater than or equal to 50%, and preferably greater than or equal to 100%, and the value may be obtained by a static tensile mode test of a DMA device.
The material of the main conductive part 12 has good extensibility by adjusting the particle size, the degree of dispersion, and the binding ability with the silicon-based compound of the conductive particles in the main conductive part 12. When the vibrating diaphragm 10 is made of the rubber material of the main body portion 11 of the vibrating diaphragm 10, if the main conductive portion 12 is insufficient in toughness and insufficient in binding force with the main body material, the vibrating diaphragm 10 is insufficient in flexibility, and the main conductive portion 12 cracks or even breaks in the vibrating process, so that the circuit communication fails. When the elongation at break of the region of the diaphragm 10 where the main conductive part 12 is disposed is set to be greater than or equal to 50%, the toughness required by the diaphragm 10 in the vibration process of the product can be substantially full, and the vibration displacement of the product can be increased along with the pursuit of high performance of the product, so that a scheme that the elongation at break is greater than or equal to 100% can be further preferred.
In some embodiments of the present application, the rubber material of the rubber layer 114 comprises at least one of methyl vinyl silicone rubber, dimethyl silicone rubber, phenyl silicone rubber, fluorosilicone rubber.
Optionally, the thermoplastic elastomer layer 115 comprises at least one of a polyurethane-based thermoplastic elastomer, a polyester-based thermoplastic elastomer, a silicone-based thermoplastic elastomer, a polyamide-based thermoplastic elastomer, an acrylate-based thermoplastic elastomer, a dynamically vulcanized thermoplastic elastomer.
According to some embodiments of the present application, the silicon-based compound comprises at least one of silica, a silicate compound, an organosilicon compound.
In other words, the main conductive part 12 according to the present application contains a silicon-based compound, and in order to obtain better vibration uniformity, the rubber material of the rubber layer 114 is preferably a polymer containing silicon, for example, at least one selected from methyl vinyl silicone rubber, dimethyl silicone rubber, phenyl silicone rubber, fluorosilicone rubber, and the like. The silicon-based compound of the main conductive portion 12 contains at least one of silicon dioxide, a silicate compound, and an organosilicon compound.
Therefore, the main body part 11 and the main conductive part 12 made of the material have better vibration consistency, so that the diaphragm 10 has better performance.
In other embodiments of the present application, the content of the conductive particles in the main conductive portion 12 is greater than or equal to 50% wt; and/or the particle size of the conductive particles is less than or equal to 80 um; and/or the conductive particles comprise at least one of metal particles and carbonaceous particles.
Specifically, the principle of the main conductive part 12 for achieving circuit conduction is that the particle diameter and the number of conductive particles directly affect the resistivity and flexibility of the main conductive part 12. The conductive particles comprise at least one of metal particles and carbon-containing particles, and the larger the conductive particle size is, the lower the toughness of the conductive material is, and the conductive material is easy to break when vibrated. The higher the conductive particle content, the lower the resistance, the higher the product performance, but the increased conductive particles may result in insufficient toughness of the main conductive portion 12. Therefore, in order to ensure that the diaphragm 10 has good conductive effect and conductive stability, the content of the conductive particles in the main conductive portion 12 is greater than or equal to 50% wt, and the particle size of the conductive particles is less than or equal to 80 um. For example, the conductive part 12 may have a conductive particle content of 60% wt, 70% wt, etc., and the conductive particles may have a particle diameter of 10um, 20um, 30um, 40um, 50um, 60um, and 70um, etc.
The following describes a method for manufacturing the diaphragm 10 according to an embodiment of the present application.
The preparation method of the diaphragm 10 according to the embodiment of the present application includes the following steps:
the conductive paste composed of the silicon compound and the conductive particles is placed on one surface of the thermoplastic elastomer layer 115 to be cured and shaped, so that a composite of the conductive portion and the thermoplastic elastomer layer 115 is formed.
The composite part is placed on a forming module, a rubber material is added on one side of the thermoplastic elastomer layer 115, which is far away from the conductive part, the composite part and the rubber material are formed into a whole in a hot-press forming or injection molding mode, and the conductive part is embedded in the thermoplastic elastomer layer 115 to form the vibrating diaphragm 10 base material.
And cutting the base material of the diaphragm 10 to obtain the diaphragm 10 with a set shape.
The hot-press forming mode can include at least one of vacuum forming, air pressure forming and compression forming.
In other words, the preparation method of the diaphragm 10 according to the embodiment of the present application may include the following steps:
the first step is as follows: the conductive part material with a certain shape is placed on the surface of the thermoplastic elastomer film by adopting a printing, coating or printing mode, and the conductive part is shaped according to the shaping conditions of the conductive part material (such as heating solidification, UV light solidification, low-temperature sintering, moisture solidification and the like).
The second step is that: and placing the thermoplastic elastomer film with the conductive part on a vibrating diaphragm forming die, wherein the conductive part is in contact with the die, then adding the rubber layer used by the main body part on one side of the thermoplastic elastomer material without the conductive part, and forming the rubber layer and the thermoplastic elastomer film with the conductive part together by adopting a hot pressing or injection molding mode.
The third step: and cutting to a required size according to the design requirements of the product to obtain the conductive diaphragm 10.
Therefore, the diaphragm 10 of the present application can be simply and rapidly manufactured by the above method.
It should be noted that the diaphragm 10 provided in the present application may constitute a sound generating device with any configuration. As shown in fig. 7, the sound generating apparatus according to the embodiment of the present application includes a housing, a magnetic circuit system disposed in the housing, and a vibration system matched with the magnetic circuit system, where the vibration system includes a diaphragm 10 and a voice coil 20 combined on one side of the diaphragm 10, the magnetic circuit system drives the voice coil 20 to vibrate to drive the diaphragm 10 to generate sound, and the diaphragm 10 is the diaphragm 10 of the above embodiment. Specifically, when sound generating mechanism during operation, voice coil 20 circular telegram back under magnetic circuit's magnetic field force effect, the voice coil loudspeaker voice coil can vibrate in order to drive the vibrating diaphragm vibration from top to bottom, can carry out the sound production during the vibrating diaphragm vibration.
The sound generating device includes a diaphragm 10 prepared according to the above embodiment of the present application, the diaphragm 10 may include a main body portion 11 and a conductive portion 12, the main body portion 11 includes an outer edge portion 112, a corrugated portion 111, and an inner edge portion 113 from outside to inside, and the conductive portion 12 penetrates through a side surface of the main body portion 11 of the outer edge portion 112, the corrugated portion 111, and the inner edge portion 113.
As shown in fig. 8, the sound generating apparatus according to the present application includes a housing, and a magnetic circuit system and a vibration system that are disposed in the housing, where the vibration system includes a voice coil 20, a first diaphragm 21 and a second diaphragm 22, a top of the voice coil 20 is connected to the first diaphragm 21, the magnetic circuit system drives the voice coil 20 to vibrate to drive the first diaphragm 21 to generate sound, two ends of the second diaphragm 22 are respectively connected to an external circuit and a bottom of the voice coil 20, and the second diaphragm 22 is the diaphragm of the above embodiment.
That is to say, the sound generating apparatus according to the embodiment of the present application may further include two diaphragms prepared according to the above embodiments of the present application, that is, the first diaphragm 21 and the second diaphragm 22, where the first diaphragm 21 may be configured to vibrate and generate sound, and the second diaphragm 22 may be configured to balance the vibration of the voice coil 20. Specifically, when the sound generating device works, after the voice coil 20 is powered on, under the action of the magnetic field force of the magnetic circuit system, the voice coil 20 can vibrate up and down to drive the first vibrating diaphragm 21 to vibrate, and the first vibrating diaphragm 21 can generate sound when vibrating. The second diaphragm 22 can also vibrate up and down along with the voice coil 20, because the two ends of the second diaphragm 22 are respectively connected with the external circuit and the bottom of the voice coil 20, the second diaphragm 22 can balance the vibration of the voice coil 20, so that the phenomenon of polarization of the voice coil 20 can be prevented, and the sound production effect of the sound production device can be improved.
It should be noted that, the first diaphragm 21 and the second diaphragm 22 may be both the diaphragms of the embodiments of the present application, or one of the first diaphragm 21 and the second diaphragm 22 may be the diaphragm of the embodiments of the present application, which is not limited in this application.
According to the electronic equipment of this application embodiment includes the sound generating mechanism of above-mentioned embodiment, and sound generating mechanism adopts the vibrating diaphragm of above-mentioned embodiment, because the vibrating diaphragm according to the above-mentioned embodiment of this application has above-mentioned technological effect, consequently, the electronic equipment according to this application embodiment also has corresponding technological effect, can be in order to avoid in the prior art because the internal vibration space of loss and the easy scheduling problem that splits of voice coil loudspeaker voice coil lead wire that connecting pieces such as assembly centering branch piece arouse to can satisfy the demand of product ultra-thin design.
The diaphragm and the sound generating device of the present application will be specifically described below with reference to specific embodiments.
As shown in fig. 7 and 8, the sound generating device includes a housing, a vibration system disposed in the housing, and a magnetic circuit system matched with the vibration system, where the vibration system includes a diaphragm 10 and a voice coil 20 combined on one side of the diaphragm 10, the magnetic circuit system drives the voice coil 20 to vibrate to drive the diaphragm 10 to generate sound, and the diaphragm 10 is a conductive diaphragm 10 provided in the following embodiments.
Example 1
The diaphragm 10 is composed of a main body portion 11 and a main conductive portion 12, the main conductive portion 12 is partially embedded in the main body portion 11, and each independent main conductive portion 12 penetrates through an outer edge portion 112, a corrugated portion 111 and an inner edge portion 113. The outer edge 112 is connected to a pad in the housing, and the inner edge 113 is connected to the start line or the end line of the voice coil 20 by soldering or conductive adhesive. The main body 11 adopts a composite structure of silicon rubber (methyl vinyl silicone rubber with 50A hardness) and thermoplastic polyester elastomer (with 50D hardness), the thickness of the diaphragm is 80um-100um, and the thickness of the thermoplastic polyester elastomer layer is 12 μm. The main conductive portion 12 includes silver and a silicon compound, and dimethylsiloxane, which is a preferable elastomer, is used as the silicon compound.
The manufacturing process of the conductive diaphragm 10 is as follows:
the first step is as follows: according to the design of the main conductive part 12, conductive paste with a certain shape is coated on one surface of the thermoplastic polyester elastomer film by adopting the processes of coating, silk-screen printing and the like, and the main conductive part 12 is cured and shaped according to the curing conditions (150 ℃ for 1h) of the conductive paste.
The second step is that: and (2) placing the diaphragm obtained in the first step on a mould of a diaphragm forming machine, attaching one surface of the main conductive part 12 to the mould, fixing the main conductive part 12 by using a tooling plate, placing the matched silicon rubber raw rubber material in the mould, and after pressurizing and heating (the forming pressure is more than or equal to 1MPa, and the forming highest temperature is more than or equal to 140 ℃) for a proper time, uniformly distributing the silicon rubber and completing the shape shaping of the diaphragm together with the thermoplastic polyester elastomer.
The third step: and opening the die, taking out the vibrating diaphragm, and properly cutting to obtain the required vibrating diaphragm. And then assembling the diaphragm.
According to the design requirement, when the vibrating diaphragm is molded, the shell can also be integrally molded with the vibrating diaphragm.
Fig. 2 shows a cross-sectional view of the diaphragm 10 at the main conductive portion 12 after molding, and at least one surface of the main conductive portion 12 is on the outer layer of the thermoplastic elastomer layer.
Example 2
For products with large displacement and high damping requirements, a structural design can also be adopted, namely a damping adhesive layer 116 is arranged between the rubber layer 114 and the thermoplastic elastomer layer 115, and the damping adhesive layer 116 is selected from one of acrylate pressure-sensitive adhesives, silicone pressure-sensitive adhesives, polyurethane pressure-sensitive adhesives and the like. The specific implementation mode is as follows:
the diaphragm 10 is composed of a main body portion 11 and a main conductive portion 12, the main conductive portion 12 is partially embedded in the main body portion 11, and each independent main conductive portion 12 penetrates through an outer edge portion 112, a corrugated portion 111 and an inner edge portion 113. The outer edge 112 is connected to a pad in the housing, and the inner edge 113 is connected to the start line or the end line of the voice coil 20 by soldering or conductive adhesive. The main body 11 adopts a composite structure of silicone rubber (methyl vinyl silicone rubber with a hardness of 50A), silicone pressure-sensitive adhesive and thermoplastic polyester elastomer (with a hardness of 50D), and the thickness of the diaphragm 10 is 80um-100um, wherein the thickness of the thermoplastic polyester elastomer layer is 12 μm, and the thickness of the silicone pressure-sensitive adhesive is 15 um. The main conductive part 12 comprises silver and a silicon compound, the silicon compound is dimethyl siloxane with better elastomer, the silver content of the main conductive part 12 is more than or equal to 80 wt%, and the grain diameter is less than 20 um.
The manufacturing process of the conductive diaphragm 10 is as follows:
the first step is as follows: and (3) sticking the organic silicon pressure-sensitive adhesive with the thermoplastic polyester elastomer in a direct coating or transfer sticking manner to obtain the composite material of the polyester elastomer and the organic silicon pressure-sensitive adhesive.
The second step is that: according to the design of the conductive part, coating conductive slurry in a certain shape on the surface of the thermoplastic polyester elastomer film by adopting the processes of coating, silk-screen printing and the like, and curing and shaping the conductive part according to the curing condition (150 ℃ for 1h) of the conductive slurry.
The third step: and (3) placing the diaphragm obtained in the second step on a mould of a vibrating diaphragm forming machine, attaching one side of the conductive part to the mould, fixing the conductive part by using a tooling plate to place the conductive part at a proper position, then placing the raw silicone rubber material required by the main body part into the mould, and after pressurizing and heating for a proper time (the forming pressure is more than or equal to 1MPa, and the forming highest temperature is more than or equal to 140 ℃), uniformly distributing the silicone rubber and completing composite forming with the thermoplastic polyester elastic and organic silicon pressure-sensitive adhesive composite material. (as shown in FIG. 3)
The third step: and opening the die, taking out the vibrating diaphragm, and properly cutting to obtain the required vibrating diaphragm. And then assembling the diaphragm.
According to the design requirement, when the vibrating diaphragm is molded, the shell can also be integrally molded with the vibrating diaphragm.
Fig. 4 shows a cross-sectional view of the diaphragm 10 at the main conductive portion 12 after molding, and at least one surface of the main conductive portion 12 is on the outer layer of the thermoplastic elastomer layer.
Example 3
The sound generating device includes a casing, and a magnetic circuit system and a vibration system that are arranged in the casing, the vibration system (as shown in fig. 8) includes a voice coil 20, a first vibrating diaphragm 21 and a second vibrating diaphragm 22, the top of the voice coil 20 is connected with the first vibrating diaphragm 21, the magnetic circuit system drives the voice coil 20 to vibrate so as to drive the first vibrating diaphragm 21 to generate sound, two ends of the second vibrating diaphragm 22 are respectively connected with the external circuit and the bottom of the voice coil 20, and the second vibrating diaphragm 22 is the vibrating diaphragm of the above embodiment 1.
Compared with the preparation of the sounding device in embodiment 1, in this embodiment, after the diaphragm is formed, the edge portion without the conductive portion is cut to be hollow, and the final shape may be an arc shape, a sector shape, a fold line shape, or the like, which is not limited herein. The main conductive portion 12 may be located at the long axis, or the short axis, or the four corners of the voice coil 20. In order to ensure the vibration consistency of the vibrating diaphragms, the conductive parts of the second vibrating diaphragms are preferably assembled in a symmetrical mode. The conductive diaphragm 10 is in communication with the voice coil 20 and an external pad, and the communication means may be conductive adhesive communication or welding. The generator designed by adopting the structure can lose part of vibration space, but has better polarization suppression capability.
In summary, according to the diaphragm 10 of the embodiment of the present application, the main body portion 11 is made of the thermoplastic elastomer and the rubber layer 114, which can better give consideration to strength, thickness, modulus and resilience, and facilitate the realization of an ultra-thin design, thereby meeting the requirements of high performance and high water resistance. The rubber layer 114 can compensate the insufficiency of the thermoplastic elastomer material in temperature resistance, the thermoplastic elastomer material can play the roles of compensating the strength of the rubber layer 114 and improving the overall modulus of the vibrating diaphragm 10, the improvement of the overall modulus of the vibrating diaphragm 10 can realize the thinner thickness of the vibrating diaphragm 10 on the premise of high performance, thereby providing more vibration spaces for the vibration of the vibrating diaphragm 10 and being more beneficial to realizing the ultra-thin design.
Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.
Claims (20)
1. A diaphragm is characterized by comprising a main body part and a main conducting part, wherein the main body part comprises a rubber layer and a thermoplastic elastomer layer which are compounded together, the main conducting part is embedded in the thermoplastic elastomer layer, at least one part of the main conducting part is exposed out of one side surface of the thermoplastic elastomer layer far away from the rubber layer so as to be electrically connected with a voice coil and an external circuit, and the main conducting part contains a silicon compound and conducting particles.
2. The diaphragm of claim 1, wherein the thermoplastic elastomer layer includes a first thermoplastic elastomer layer and a second thermoplastic elastomer layer, the first thermoplastic elastomer layer and the second thermoplastic elastomer layer are respectively compounded on two opposite sides of the rubber layer, the main conductive part includes a first main conductive part and a second main conductive part, the first main conductive part is embedded in the first thermoplastic elastomer layer, at least a portion of the first main conductive part is exposed on one side surface of the first thermoplastic elastomer layer away from the rubber layer, the second main conductive part is embedded in the second thermoplastic elastomer layer, and at least a portion of the second main conductive part is exposed on one side surface of the second thermoplastic elastomer layer away from the rubber layer.
3. The diaphragm of claim 1, wherein the body portion further includes an adhesive layer between the rubber layer and the thermoplastic elastomer layer to bond the rubber layer and the thermoplastic elastomer layer.
4. The diaphragm of claim 3, wherein the adhesive layer is at least one of an acrylate pressure sensitive adhesive, a silicone pressure sensitive adhesive, and a polyurethane pressure sensitive adhesive.
5. The diaphragm of claim 1 wherein the rubber layer is injection molded integrally with the thermoplastic elastomer layer.
6. The diaphragm of claim 1, wherein the main body portion includes a loop portion, an outer edge portion disposed outside the loop portion, and an inner edge portion disposed inside the loop portion, and the main conductive portion is disposed in the loop portion and the inner and outer edge portions.
7. The diaphragm of claim 6, wherein the main conductive portion includes a first electrical connection portion at the inner edge portion and a second electrical connection portion at the outer edge portion, the first electrical connection portion being electrically connected to the voice coil, and the second electrical connection portion being electrically connected to the external circuit.
8. The diaphragm of claim 1, wherein the thickness of the diaphragm is 30 μm to 200 μm, and the thickness of the rubber layer is not less than the thickness of the thermoplastic elastomer layer.
9. The diaphragm of claim 1 wherein the thickness of the thermoplastic elastomer layer is 1 μm to 100 μm.
10. The diaphragm of claim 1, wherein a portion of the main body portion located in an orthographic projection area of the main conductive portion on the main body portion and the main conductive portion form a composite portion, and the elongation at break of the composite portion is greater than or equal to 50%.
11. The diaphragm of claim 1, wherein the rubber material of the rubber layer comprises at least one of methyl vinyl silicone rubber, dimethyl silicone rubber, phenyl silicone rubber, and fluorosilicone rubber.
12. The diaphragm of claim 1, wherein the thermoplastic elastomer layer includes at least one of a polyurethane-based thermoplastic elastomer, a polyester-based thermoplastic elastomer, a silicone-based thermoplastic elastomer, a polyamide-based thermoplastic elastomer, an acrylate-based thermoplastic elastomer, and a dynamically vulcanized thermoplastic elastomer.
13. The diaphragm of claim 1, wherein the silicon-based compound comprises at least one of silicon dioxide, a silicate compound, and an organosilicon compound.
14. The diaphragm of claim 1, wherein the content of the conductive particles in the main conductive part is greater than or equal to 50% wt;
and/or the particle size of the conductive particles is less than or equal to 80 um;
and/or the conductive particles comprise at least one of metal particles and carbonaceous particles.
15. The diaphragm of claim 1, further comprising a secondary conductive portion, wherein the thermoplastic elastomer layer is combined with a surface of one side of the rubber layer, the secondary conductive portion is embedded in a side of the rubber layer away from the thermoplastic elastomer layer, a part of a surface of the secondary conductive portion is exposed out of a surface of the rubber layer away from the thermoplastic elastomer layer, and the secondary conductive portion contains a silicon compound and conductive particles.
16. The preparation method of the diaphragm is characterized by comprising the following steps:
placing conductive slurry consisting of silicon compounds and conductive particles on one side surface of the thermoplastic elastomer layer for solidification and shaping to form a composite part of the conductive part and the thermoplastic elastomer layer;
placing the composite part on a forming module, adding a rubber material on one side of the thermoplastic elastomer layer, which is far away from the conductive part, forming the composite part and the rubber material into a whole by adopting a hot-press forming or injection molding mode, and embedding the conductive part in the thermoplastic elastomer layer to form a vibrating diaphragm substrate;
and cutting the vibrating diaphragm base material to obtain the vibrating diaphragm with a set shape.
17. The method of manufacturing a diaphragm according to claim 16, wherein the hot press molding includes at least one of vacuum forming, air pressure forming, and compression molding.
18. A sound production device, comprising a housing, a magnetic circuit system disposed in the housing, and a vibration system cooperating with the magnetic circuit system, wherein the vibration system includes a diaphragm and a voice coil coupled to one side of the diaphragm, the magnetic circuit system drives the voice coil to vibrate to drive the diaphragm to produce sound, and the diaphragm is a diaphragm according to any one of claims 1 to 15.
19. A sound production device is characterized by comprising a shell, and a magnetic circuit system and a vibration system which are arranged in the shell, wherein the vibration system comprises a voice coil, a first vibrating diaphragm and a second vibrating diaphragm, the top of the voice coil is connected with the first vibrating diaphragm, the magnetic circuit system drives the voice coil to vibrate so as to drive the first vibrating diaphragm to produce sound, two ends of the second vibrating diaphragm are respectively connected with the shell and the bottom of the voice coil, and the second vibrating diaphragm is the vibrating diaphragm of any one of claims 1-15.
20. An electronic device characterized by comprising the sound emitting apparatus of claim 18 or 19.
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WO2024156264A1 (en) * | 2023-01-29 | 2024-08-02 | 歌尔股份有限公司 | Diaphragm for sound production apparatus, sound production apparatus, and electronic device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004015761A1 (en) * | 2002-08-09 | 2004-02-19 | Jsr Corporation | Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method |
KR20110067003A (en) * | 2009-12-12 | 2011-06-20 | 고어텍 인크 | Moving-coil type mini microphone |
CN103024638A (en) * | 2012-11-25 | 2013-04-03 | 歌尔声学股份有限公司 | Electroacoustic transducer |
WO2017148077A1 (en) * | 2016-03-04 | 2017-09-08 | 歌尔股份有限公司 | Loudspeaker diaphragm, method for manufacturing same, and moving-coil loudspeaker |
CN110691306A (en) * | 2019-09-29 | 2020-01-14 | 歌尔科技有限公司 | A conducting film and sound generating mechanism for sound generating mechanism |
-
2021
- 2021-12-30 CN CN202111656246.0A patent/CN114222227B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004015761A1 (en) * | 2002-08-09 | 2004-02-19 | Jsr Corporation | Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method |
US20050272282A1 (en) * | 2002-08-09 | 2005-12-08 | Jsr Corporation | Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method |
KR20110067003A (en) * | 2009-12-12 | 2011-06-20 | 고어텍 인크 | Moving-coil type mini microphone |
CN103024638A (en) * | 2012-11-25 | 2013-04-03 | 歌尔声学股份有限公司 | Electroacoustic transducer |
WO2017148077A1 (en) * | 2016-03-04 | 2017-09-08 | 歌尔股份有限公司 | Loudspeaker diaphragm, method for manufacturing same, and moving-coil loudspeaker |
CN110691306A (en) * | 2019-09-29 | 2020-01-14 | 歌尔科技有限公司 | A conducting film and sound generating mechanism for sound generating mechanism |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024156264A1 (en) * | 2023-01-29 | 2024-08-02 | 歌尔股份有限公司 | Diaphragm for sound production apparatus, sound production apparatus, and electronic device |
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