CN114220588A - Ink-jet printing HIT low-temperature silver paste and preparation method thereof - Google Patents

Ink-jet printing HIT low-temperature silver paste and preparation method thereof Download PDF

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Publication number
CN114220588A
CN114220588A CN202111399633.0A CN202111399633A CN114220588A CN 114220588 A CN114220588 A CN 114220588A CN 202111399633 A CN202111399633 A CN 202111399633A CN 114220588 A CN114220588 A CN 114220588A
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silver paste
nano
conductive component
temperature silver
ink
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CN202111399633.0A
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CN114220588B (en
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孟祥浩
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Suzhou Sierwei Nanotechnology Co ltd
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Suzhou Sierwei Nanotechnology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Abstract

The invention provides ink-jet printing HIT low-temperature silver paste and a preparation method thereof, wherein the low-temperature silver paste comprises the following raw materials: the conductive coating comprises a first conductive component, a second conductive component, resin, an additive, an organic solvent and an auxiliary agent; the first conductive component includes nano-metal particles; the second conductive component includes a metal salt or an inorganic acid. According to the low-temperature silver paste disclosed by the invention, the nano metal particles are used as the main conductive agent, the second conductive component is used as the welding conduction adhesive of the main conductive agent, the first conductive component and the second conductive component are matched with each other, the conductivity is greatly improved, the conductivity is close to that of block silver, the silver content is reduced by 20% -50% compared with that of the existing low-temperature silver paste, and the cost of the silver paste is greatly reduced; the low-temperature silver paste is suitable for an ink-jet printing process, the diameter of the adaptive nozzle is as small as 3um, the low-temperature silver paste can be stable for a long time, the blockage phenomenon is avoided, and the processing efficiency of the battery piece is high; the low-temperature silver paste has good ink-jet formability and the aspect ratio is more than 0.8.

Description

Ink-jet printing HIT low-temperature silver paste and preparation method thereof
Technical Field
The invention relates to the technical field of low-temperature silver paste for solar cells, in particular to ink-jet printing HIT low-temperature silver paste and a preparation method thereof.
Background
The HIT solar cell has the advantages of high conversion efficiency, high stability, capability of generating power on two sides, and the like, and is the most promising solar cell. However, low temperature sintered (< 250 degrees celsius) silver pastes must be used because high temperatures can damage the TCO layer (transparent conductive layer, such as ITO). To meet the conductivity requirement, the silver content of the low temperature silver paste used for the HIT solar cell is high, which results in very high cost.
At present, a screen printing process is adopted in the photovoltaic industry to prepare a main grid and an auxiliary grid of a cell, especially for low-temperature silver paste for HIT, the screen printing efficiency is low, the formability and the line uniformity are poor, and the grid line of the photovoltaic cell is required to be large in height-width ratio and high in precision (the width is less than 20 mu m, the narrower the grid line is, the better the grid line is, the obstruction to light is reduced, and the light utilization rate is high).
The ink-jet printing process can realize a high-efficiency and high-precision cell manufacturing process, and grid line manufacturing with the width smaller than 5um level can be obtained under proper control conditions. But the low temperature silver thick liquid thick liquids of adaptation can't obtain, and the low temperature silver thick liquid thick liquids conductive agent granule of experiment at present is great, the formability is poor, thixotropy is poor on the one hand, has caused the aspect ratio of inkjet printing list county low, the homogeneity is poor, the width is big, can even have the problem of blockking up the shower nozzle. In order to improve the problem, the prior art adds more organisms to improve the thixotropy and the formability, but causes the problem of poor conductivity of the grid line.
Based on the problems of the current low-temperature silver paste, improvement on the problem is needed.
Disclosure of Invention
In view of the above, the present invention provides an inkjet printing HIT low temperature silver paste and a method for preparing the same, so as to solve or at least partially solve the technical problems in the prior art.
In a first aspect, the invention provides an inkjet printing HIT low-temperature silver paste which comprises the following raw materials in parts by mass: 15-60% of a first conductive component, 1-20% of a second conductive component, 0.5-15% of resin, 0-10% of an additive, 10-40% of an organic solvent and 0.1-15% of an auxiliary agent;
wherein the first conductive component comprises nano-metal particles;
the second conductive component includes a metal salt or an inorganic acid.
Preferably, the inkjet printing HIT low-temperature silver paste is prepared by inkjet printing, and the nano metal particles comprise at least one of silver nanoparticles, copper nanoparticles, nano thallium particles, gold nanoparticles, silver-coated copper nanoparticles, gold-coated silver nanoparticles, gold-coated organic nanoparticles, platinum-coated organic nanoparticles and thallium-coated organic nanoparticles;
the metal salt comprises at least one of silver salt, copper salt, gold salt, thallium salt, platinum salt, palladium salt and rhodium salt;
the inorganic acid comprises at least one of nitric acid, hydrofluoric acid, sulfuric acid, hydrochloric acid and phosphoric acid.
Preferably, in the inkjet-printing HIT low-temperature silver paste, the morphology of the nano metal particles includes at least one of a nano sphere, a nano rod, a nano wire, a nano core shell and a nano cluster.
Preferably, the diameter of the nano spherical, nano rod-like, nano core-shell-like and nano cluster-like nano metal particles in the inkjet printing HIT low-temperature silver paste is 1-200 nm;
the diameter of the nano-wire-shaped nano-metal particles is 1-100 nm, and the length of the nano-wire-shaped nano-metal particles is 0.1-3 mu m.
Preferably, the inkjet printing HIT low temperature silver paste comprises a thermosetting resin or a UV curable resin.
Preferably, the ink-jet printing HIT low-temperature silver paste includes at least one of a viscosity regulator, a thixotropic regulator, sodium dodecyl sulfate, polyvinyl alcohol, methyl cellulose and ethyl cellulose.
Preferably, the inkjet printing HIT low temperature silver paste includes at least one of diethylene glycol monobutyl ether, n-butanol, terpineol, neodecanoic acid, decene, dodecanol ester, dimethyl phthalate, ethyl acetate, butyl acetate, acetone, butanone, phthalic acid, and toluene.
Preferably, the inkjet printing HIT low-temperature silver paste comprises at least one of a formability regulator, a homogeneity regulator and a curing welding regulator;
the formability regulator comprises at least one of fluorocarbon surfactant, fluorosilicone surfactant and fatty alcohol-polyoxyethylene ether sodium sulfate;
the homogeneity regulator comprises at least one of polyacrylamide and fatty acid polyglycol ester;
the curing and welding regulator comprises at least one of a silane coupling agent, a resin initiator and an adhesion promoter.
In a second aspect, the invention further provides a preparation method of the inkjet printing HIT low-temperature silver paste, which comprises the following steps:
stirring and mixing the first conductive component, the organic solvent, the auxiliary agent and the additive to obtain a first mixture;
and adding the second conductive component into the first mixture, continuously stirring, grinding, adding resin, and curing to obtain the ink-jet printing HIT low-temperature silver paste.
Preferably, in the preparation method of the ink-jet printing HIT low-temperature silver paste, the first conductive component, the organic solvent, the additive and the additive are stirred and mixed to obtain a first mixture, specifically: adding an additive and an auxiliary agent into an organic solvent at the temperature of 10-80 ℃ and the stirring speed of 300-1000 r/min, increasing the rotating speed to 700-5000 r/min after the addition is finished, continuously stirring for 30-60 min, then adding a first conductive component, and continuously stirring to obtain a first mixture;
adding the second conductive component into the first mixture, continuously stirring, grinding, and adding resin to obtain the ink-jet printing HIT low-temperature silver paste, which specifically comprises the following steps: and adding the second conductive component into the first mixture at the temperature of 0-85 ℃ and the stirring speed of 100-5000 r/min, then placing the mixture into a planetary stirrer to be stirred and mixed, grinding the mixture in a three-roll grinder for 1-3 hours, and adding resin to obtain the ink-jet printing HIT low-temperature silver paste.
Compared with the prior art, the ink-jet printing HIT low-temperature silver paste and the preparation method thereof have the following beneficial effects:
(1) the ink-jet printing HIT low-temperature silver paste comprises a first conductive component and a second conductive component, wherein the first conductive component comprises nano metal particles, the second conductive component comprises metal salt or inorganic acid, the nano metal particles are used as a main conductive agent, the second conductive component is used as a welding conduction adhesive of the main conductive agent, the first conductive component and the second conductive component are matched with each other, the conductivity is greatly improved, the conductivity is close to that of bulk silver, the silver content is reduced by 20% -50% compared with that of the existing low-temperature silver paste, and the cost of the silver paste is greatly reduced; the low-temperature silver paste is suitable for an ink-jet printing process, the diameter of the adaptive nozzle is as small as 3um, the low-temperature silver paste can be stable for a long time, the blockage phenomenon is avoided, and the processing efficiency of the battery piece is high; the low-temperature silver paste has good ink-jet formability, and the aspect ratio is more than 0.8; according to the low-temperature silver paste disclosed by the invention, the resin can be UV curing resin, and the low-temperature silver paste is used for a UV curing process and is high in curing efficiency.
Detailed Description
In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The embodiment of the application provides an inkjet printing HIT low-temperature silver paste, which comprises the following raw materials in percentage by mass: 15-60% of a first conductive component, 1-20% of a second conductive component, 0.5-15% of resin, 0-10% of an additive, 10-40% of an organic solvent and 0.1-15% of an auxiliary agent;
wherein the first conductive component comprises nano-metal particles;
the second conductive component includes a metal salt or an inorganic acid.
In some embodiments, the nano-metal particles comprise at least one of silver nanoparticles, copper nanoparticles, gold nanoparticles, nano-thallium particles, silver-coated copper nanoparticles, gold-coated silver nanoparticles, gold-coated organic nanoparticles, platinum-coated organic nanoparticles, thallium-coated organic nanoparticles;
the metal salt comprises at least one of silver salt, copper salt, gold salt, thallium salt, platinum salt, palladium salt and rhodium salt;
the inorganic acid comprises at least one of nitric acid, hydrofluoric acid, sulfuric acid, hydrochloric acid and phosphoric acid.
Specifically, in the above embodiments, the silver salt may be an organic silver salt or an inorganic silver salt, and may be, for example, silver nitrate, silver fluoride, silver citrate, silver malate, silver fatty acid, silver acetate, or the like; the copper salt can be organic or inorganic copper salt, such as copper nitrate, copper sulfate, copper phosphate, copper citrate, fatty acid copper, etc.; the gold salt can be organic or inorganic, such as gold cyanide, gold fatty acid, etc.; thallium salts include thallium fluoride, thallium chloride, thallium iodide, and the like; the platinum salt comprises chloroplatinic acid, potassium tetrachloroplatinate, potassium hexachloroplatinate and the like; palladium salts include palladium chloride, palladium nitrate, palladium sulfate, and the like; rhodium salts including rhodium chloride, chlororhodic acid, and the like; the gold-coated organic nano-sphere particles can be gold-coated polystyrene microsphere nano-particles, the platinum-coated organic nano-sphere particles can be platinum-coated polystyrene microsphere nano-particles, and the thallium-coated organic nano-sphere particles can be thallium-coated polystyrene microsphere nano-particles.
In some embodiments, the morphology of the nano-metal particles comprises at least one of nano-spheres, nano-rods, nano-wires, nano-core-shell, nano-clusters;
the diameters of the nano spherical, nano rod-shaped, nano core-shell-shaped and nano cluster-shaped nano metal particles are all 1-200 nm;
the nano-wire-shaped metal nanoparticles have a diameter of 1 to 100nm and a length of 0.1 to 3 μm.
In some embodiments, the resin comprises a thermosetting resin or a UV curable resin.
Specifically, the thermosetting resin includes epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, melamine formaldehyde resin, furan resin, polybutadiene resin, silicone resin, and the like; UV curable resins include epoxy acrylates, urethane acrylates, polyester acrylates, polyether acrylates, amino acrylates, acrylates and other acrylates and the like.
In some embodiments, the additive comprises at least one of a viscosity modifier, a thixotropic modifier, sodium laurate, polyvinyl alcohol, methyl cellulose, ethyl cellulose.
Specifically, the viscosity regulator can adopt ethanol, ethylene glycol, N-propanol, isopropanol, propylene glycol, glycerol, polyethylene glycol, polypropylene glycol, pentanediol, cyclohexanol, 2-pyrrolidone, N-methyl-2-pyrrolidone and the like, and the low-temperature silver paste has good stability and is not easy to layer by adopting the viscosity regulator; thixotropic modifiers include fumed silica, polyamide waxes, and the like.
In some embodiments, the organic solvent comprises at least one of diethylene glycol monobutyl ether, n-butanol, terpineol, neodecanoic acid, decene, dodecanol ester, dimethyl phthalate, ethyl acetate, butyl acetate, acetone, butanone, phthalic acid, toluene.
In some embodiments, the auxiliary agent comprises at least one of a formability modifier, a homogeneity modifier, a curing solder modifier;
the formability regulator comprises at least one of fluorocarbon surfactant, fluorine-silicon surfactant and fatty alcohol-polyoxyethylene ether sodium sulfate;
the homogeneity regulator comprises at least one of polyacrylamide and fatty acid polyglycol ester;
the curing and welding regulator comprises at least one of silane coupling agent, resin initiator and adhesion promoter.
Specifically, the fluorocarbon surfactant can adopt Zonyl series products of Dupont and perfluorohexyl polyethenoxy ether sulfonate; the fluorine silicon surfactant adopts N-dimethylamino propyl-N-triethoxy silane and the like. The resin initiator comprises an organic peroxide initiator, an inorganic peroxide initiator, an azo initiator, a redox initiator and the like; the adhesion promoters include resin adhesion promoters, silane coupling agent adhesion promoters, titanate coupling agent adhesion promoters, and the like.
The application discloses an ink-jet printing HIT low-temperature silver paste which comprises a first conductive component and a second conductive component, wherein the first conductive component comprises nano metal particles, the second conductive component comprises metal salt or inorganic acid, the nano metal particles are used as a main conductive agent, the second conductive component is used as a welding conduction 'adhesive' of the main conductive agent, the first conductive component and the second conductive component are matched with each other, the conductivity is greatly improved, the conductivity is close to that of block silver, meanwhile, the silver content is reduced by 20% -50% compared with that of the existing low-temperature silver paste, and the cost of the silver paste is greatly reduced; the low-temperature silver paste is suitable for an ink-jet printing process, the diameter of the adaptive nozzle is as small as 3um, the low-temperature silver paste can be stable for a long time, the blockage phenomenon is avoided, and the processing efficiency of the battery piece is high; the low-temperature silver paste has good ink-jet formability, and the aspect ratio is more than 0.4; the low-temperature silver paste is characterized in that the resin can be UV curing resin, and the low-temperature silver paste is used for a UV curing process and is high in curing efficiency.
Based on the same inventive concept, the embodiment of the application also provides a preparation method of the inkjet printing HIT low-temperature silver paste, which comprises the following steps:
s1, stirring and mixing the first conductive component, the organic solvent, the auxiliary agent and the additive to obtain a first mixture;
and S2, adding the second conductive component into the first mixture, continuously stirring, grinding, adding resin, and curing to obtain the ink-jet printing HIT low-temperature silver paste.
In some embodiments, a method of preparing an inkjet printed HIT low temperature silver paste comprises the steps of:
s1, adding the additive and the auxiliary agent into the organic solvent at the temperature of 10-80 ℃ and the stirring speed of 300-1000 r/min, increasing the rotating speed to 700-5000 r/min after the addition is finished, continuously stirring for 30-60 min, then adding the first conductive component, and continuously stirring to obtain a first mixture;
and S2, adding the second conductive component into the first mixture at the temperature of 0-85 ℃ and the stirring speed of 100-5000 r/min, then placing the mixture into a planetary stirrer to be stirred and mixed, grinding the mixture in a three-roll grinder for 1-3 h, adding resin, and curing to obtain the ink-jet printing HIT low-temperature silver paste.
The prepared ink-jet printing HIT low-temperature silver paste is printed on an HIT battery through an ink-jet printing process, and then is cured, if the resin is thermosetting resin, the curing conditions are as follows: curing at 160-230 ℃ for 10-30 min; if the resin is a UV curing resin, the curing conditions are as follows: at 600-2Irradiating for 30-300 s under the ultraviolet light.
In some embodiments, a method of preparing an inkjet printed HIT low temperature silver paste comprises the steps of:
s1, adding the additive and the auxiliary agent into the organic solvent at the temperature of 10-80 ℃ and the stirring speed of 300-1000 r/min, increasing the rotating speed to 700-5000 r/min after the addition is finished, continuously stirring for 30-60 min, then adding the first conductive component, and continuously stirring to obtain a first mixture;
and S2, adding the second conductive component into the first mixture at the temperature of 0-85 ℃ and the stirring speed of 100-5000 r/min, then placing the mixture into a planetary stirrer to be stirred and mixed, grinding the mixture in a three-roll grinder for 1-3 h, adding resin, and curing to obtain the ink-jet printing HIT low-temperature silver paste.
The following further describes a method for preparing the HIT low-temperature silver paste for inkjet printing according to the present application with specific examples.
Example 1
The embodiment of the application provides an inkjet printing HIT low-temperature silver paste, which comprises the following components: the conductive coating comprises a first conductive component, a second conductive component, resin, an organic solvent and an auxiliary agent;
wherein the first conductive component comprises 400g of nano silver particles (with the diameter of 50-100 nm), 40g of nano silver rods (with the diameter of 50nm and the length of less than 1um) and 10g of nano thallium particles (with the diameter of 50-100 nm);
the second conductive component comprises 0.5g of silver fluoride, 26g of silver citrate, 0.5g of palladium cyanide and 4g of 35% phosphoric acid by mass;
the organic solvent comprises 200g of butyl acetate, 60g of terephthalic acid and 10g of decene;
the auxiliary agent comprises 12g of diacyl peroxide initiator (specifically dibenzoyl peroxide), 12g of tetraethyl titanate and 6g of fluorocarbon surfactant (specifically perfluorohexyl polyvinyl ether sulfonate);
the resin was 80g of a UV curable resin, specifically, the UV curable resin type was OLESTER RA 5000.
The preparation method of the ink-jet printing HIT low-temperature silver paste comprises the following steps:
s1, mixing the first conductive component with the mass;
s2, adding the auxiliary agents into the organic solvent respectively at the stirring speed of 600r/min at 25 ℃, increasing the rotating speed to 2000r/min after the addition is finished, continuing to stir for 30min, then adding the raw materials in the first conductive component, and continuing to stir for 60min to obtain a first mixture;
s3, adding the raw materials in the second conductive component into the first mixture at the stirring speed of 600r/min at 65 ℃, then placing the mixture into a planetary stirrer to be stirred and mixed for 60min, and keeping the temperature not to exceed 85 ℃ in the stirring and mixing process;
s4, grinding the mixture in the step S3 in a three-roll grinder for 1h, keeping the grinding environment temperature not to exceed 85 ℃, finally adding UV curing resin, and storing at-15-5 ℃.
Example 2
The embodiment of the application provides an inkjet printing HIT low-temperature silver paste, which comprises the following components: the conductive coating comprises a first conductive component, a second conductive component, resin, an organic solvent and an auxiliary agent;
wherein the first conductive component comprises 350g of nano silver particles (with the diameter of 50-100 nm), 20g of nano gold particles (with the diameter of 50-100 nm) and 80g of nano thallium particles (with the diameter of 50-100 nm);
the second conductive component comprises 2g of fatty acid silver, 30g of malic acid silver, 3g of palladium cyanide and 6g of 35% phosphoric acid by mass concentration;
the organic solvent comprises 200g of dimethyl phthalate, 60g of ethyl acetate and 10g of butyl acetate;
the auxiliary agent comprises 12g of diacyl peroxide initiator (specifically dibenzoyl peroxide), 12g of tetraethyl titanate and 6g of fluorocarbon surfactant (specifically perfluorohexyl polyvinyl ether sulfonate);
the resin was 80g of a UV curable resin, specifically, the UV curable resin type was OLESTER RA 5000.
The preparation method of the ink-jet printing HIT low-temperature silver paste comprises the following steps:
s1, mixing the first conductive component with the mass;
s2, adding the auxiliary agents into the organic solvent respectively at the stirring speed of 600r/min at 25 ℃, increasing the rotating speed to 2000r/min after the addition is finished, continuing to stir for 30min, then adding the raw materials in the first conductive component, and continuing to stir for 60min to obtain a first mixture;
s3, adding the raw materials in the second conductive component into the first mixture at the stirring speed of 600r/min at 65 ℃, then placing the mixture into a planetary stirrer to be stirred and mixed for 60min, and keeping the temperature not to exceed 85 ℃ in the stirring and mixing process;
s4, grinding the mixture in the step S3 in a three-roll grinder for 1h, keeping the grinding environment temperature not to exceed 85 ℃, finally adding UV curing resin, and storing at-15-5 ℃.
Example 3
The embodiment of the application provides an inkjet printing HIT low-temperature silver paste, which comprises the following components: the conductive coating comprises a first conductive component, a second conductive component, resin, an organic solvent and an auxiliary agent;
wherein the first conductive component comprises 400g of nano silver particles (with the diameter of 50-100 nm), 40g of nano copper particles (with the diameter of 50-100 nm) and 10g of nano thallium particles (with the diameter of 50-100 nm);
the second conductive component comprises 0.5g of copper citrate, 26g of silver acetate, 0.5g of palladium chloride and 4g of phosphoric acid with the mass concentration of 35%;
the organic solvent comprises 200g of n-butanol, 60g of terpineol and 10g of acetone;
the auxiliary agent comprises 12g of inorganic peroxide initiator (specifically potassium persulfate), 12g of tetraethyl titanate and 6g of fluorocarbon surfactant (specifically perfluorohexyl polyethenoxy ether sulfonate);
the resin was 80g of a UV curable resin, specifically, the UV curable resin type was OLESTER RA 5000.
The preparation method of the ink-jet printing HIT low-temperature silver paste comprises the following steps:
s1, mixing the first conductive component with the mass;
s2, adding the auxiliary agents into the organic solvent respectively at the stirring speed of 600r/min at 25 ℃, increasing the rotating speed to 2000r/min after the addition is finished, continuing to stir for 30min, then adding the raw materials in the first conductive component, and continuing to stir for 60min to obtain a first mixture;
s3, adding the raw materials in the second conductive component into the first mixture at the stirring speed of 600r/min at 65 ℃, then placing the mixture into a planetary stirrer to be stirred and mixed for 60min, and keeping the temperature not to exceed 85 ℃ in the stirring and mixing process;
s4, grinding the mixture in the step S3 in a three-roll grinder for 1h, keeping the grinding environment temperature not to exceed 85 ℃, finally adding UV curing resin, and storing at-15-5 ℃.
Comparative example 1
The comparative example provides an inkjet printing HIT low-temperature silver paste, which comprises the following components: conductive component, resin, organic solvent and auxiliary agent;
wherein the conductive component comprises 400g of nano silver particles (with the diameter of 50-100 nm), 40g of nano silver rods (with the diameter of 50nm and the length of less than 1um) and 10g of nano thallium particles (with the diameter of 50-100 nm);
the organic solvent comprises 200g of butyl acetate, 60g of terephthalic acid and 10g of decene;
the auxiliary agent comprises 12g of diacyl peroxide initiator (specifically dibenzoyl peroxide), 12g of tetraethyl titanate and 6g of fluorocarbon surfactant (specifically perfluorohexyl polyvinyl ether sulfonate);
the resin was 80g of a UV curable resin, specifically, the UV curable resin type was OLESTER RA 5000.
The preparation method of the ink-jet printing HIT low-temperature silver paste comprises the following steps:
s1, mixing the first conductive component with the mass;
s2, adding the auxiliary agents into the organic solvent respectively at the stirring speed of 600r/min at 25 ℃, increasing the rotating speed to 2000r/min after the addition is finished, continuing to stir for 30min, then adding the raw materials in the conductive component, and continuing to stir for 60min to obtain a mixture; then placing the mixture in a planetary stirrer to be stirred and mixed for 60min, and keeping the temperature not to exceed 85 ℃ in the stirring and mixing process;
s3, grinding the mixture in the step S2 in a three-roll grinder for 1h, keeping the grinding environment temperature not to exceed 85 ℃, finally adding UV curing resin, and storing at-15-5 ℃.
The product obtained in example 1 above was usedInk-jet printing HIT low-temperature silver paste, printing on the HIT battery by ink-jet printing, and then printing at 1500W/m2Is irradiated for 300s under ultraviolet light to be cured, and the resistivity of the cured silver paste circuit is measured to be 3.8 multiplied by 10-6Omega/cm and welding tension of 1.6N.
The ink-jet printing HIT low-temperature silver paste obtained in the example 2 is printed on an HIT battery through ink-jet printing and then is printed at 1500W/m2Is irradiated for 300s under ultraviolet light to be cured, and the resistivity of the cured silver paste circuit is measured to be 3.86 multiplied by 10-6Omega/cm and welding tension of 1.82N.
The ink-jet printing HIT low-temperature silver paste obtained in the example 3 is printed on an HIT battery through ink-jet printing and then is printed at 1500W/m2Is irradiated for 300s under ultraviolet light to be cured, and the resistivity of the cured silver paste circuit is measured to be 3.92 multiplied by 10-6Omega/cm and welding tension of 1.73N.
The ink-jet printing HIT low-temperature silver paste obtained in the comparative example 1 is printed on an HIT battery through ink-jet printing and then is printed at 1500W/m2Is irradiated for 300s under ultraviolet light to be cured, and the resistivity of the cured silver paste circuit is measured to be 4.21 multiplied by 10-6Omega/cm and welding tension of 1.38N.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (10)

1. The HIT low-temperature silver paste for ink-jet printing is characterized by comprising the following raw materials in percentage by mass: 15-60% of a first conductive component, 1-20% of a second conductive component, 0.5-15% of resin, 0-10% of an additive, 10-40% of an organic solvent and 0.1-15% of an auxiliary agent;
wherein the first conductive component comprises nano-metal particles;
the second conductive component includes a metal salt or an inorganic acid.
2. The inkjet-printing HIT low temperature silver paste of claim 1, wherein the nano-metal particles comprise at least one of silver nanoparticles, copper nanoparticles, nano-thallium particles, gold nanoparticles, silver-coated copper nanoparticles, gold-coated silver nanoparticles, gold-coated organic nanoparticles, platinum-coated organic nanoparticles, thallium-coated organic nanoparticles;
the metal salt comprises at least one of silver salt, copper salt, gold salt, thallium salt, platinum salt, palladium salt and rhodium salt;
the inorganic acid comprises at least one of nitric acid, hydrofluoric acid, sulfuric acid, hydrochloric acid and phosphoric acid.
3. The inkjet-printed HIT low temperature silver paste of claim 2, wherein the morphology of the nano-metal particles comprises at least one of nano-spheres, nano-rods, nano-wires, nano-core-shell, nano-clusters.
4. The ink-jet printing HIT low temperature silver paste according to claim 3, wherein the diameters of the nano-spherical, nano-rod, nano-core-shell and nano-cluster nano-metal particles are all 1-200 nm;
the diameter of the nano-wire-shaped nano-metal particles is 1-100 nm, and the length of the nano-wire-shaped nano-metal particles is 0.1-3 mu m.
5. The inkjet-printed HIT low temperature silver paste of claim 1, wherein the resin comprises a thermosetting resin or a UV curable resin.
6. The inkjet-printing HIT low temperature silver paste of claim 1, wherein the additive comprises at least one of a viscosity modifier, a thixotropic modifier, sodium dodecylate, polyvinyl alcohol, methyl cellulose, ethyl cellulose.
7. The ink-jet printing HIT low temperature silver paste of claim 1, wherein the organic solvent comprises at least one of diethylene glycol monobutyl ether, n-butanol, terpineol, neodecanoic acid, decene, dodecanol ester, dimethyl phthalate, ethyl acetate, butyl acetate, acetone, methyl ethyl ketone, phthalic acid, toluene.
8. The inkjet-printing HIT low temperature silver paste of claim 1, wherein the additive comprises at least one of a formability modifier, a homogeneity modifier, a curing solder modifier;
the formability regulator comprises at least one of fluorocarbon surfactant, fluorosilicone surfactant and fatty alcohol-polyoxyethylene ether sodium sulfate;
the homogeneity regulator comprises at least one of polyacrylamide and fatty acid polyglycol ester;
the curing and welding regulator comprises at least one of a silane coupling agent, a resin initiator and an adhesion promoter.
9. The preparation method of the ink-jet printing HIT low-temperature silver paste as claimed in any one of claims 1 to 8, is characterized by comprising the following steps:
stirring and mixing the first conductive component, the organic solvent, the auxiliary agent and the additive to obtain a first mixture;
and adding the second conductive component into the first mixture, continuously stirring, grinding, and adding resin to obtain the ink-jet printing HIT low-temperature silver paste.
10. The method for preparing the HIT low-temperature silver paste for inkjet printing according to claim 9, wherein the first conductive component, the organic solvent, the additive and the additive are stirred and mixed to obtain a first mixture, which is specifically: adding an additive and an auxiliary agent into an organic solvent at the temperature of 10-80 ℃ and the stirring speed of 300-1000 r/min, increasing the rotating speed to 700-5000 r/min after the addition is finished, continuously stirring for 30-60 min, then adding a first conductive component, and continuously stirring to obtain a first mixture;
adding the second conductive component into the first mixture, continuously stirring, grinding, and adding resin to obtain the ink-jet printing HIT low-temperature silver paste, which specifically comprises the following steps: and adding the second conductive component into the first mixture at the temperature of 0-85 ℃ and the stirring speed of 100-5000 r/min, then placing the mixture into a planetary stirrer to be stirred and mixed, grinding the mixture in a three-roll grinder for 1-3 hours, and adding resin to obtain the ink-jet printing HIT low-temperature silver paste.
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CN106876502A (en) * 2017-03-20 2017-06-20 华东理工大学 A kind of method that 3D inkjet printings prepare HIT electrodes
CN111180102A (en) * 2020-01-04 2020-05-19 浙江大学 Preparation method of conductive silver paste based on silver-coated graphite conductive agent
CN112863733A (en) * 2021-02-05 2021-05-28 苏州思尔维纳米科技有限公司 Low-temperature silver paste for HIT solar cell and preparation method thereof

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CN106876502A (en) * 2017-03-20 2017-06-20 华东理工大学 A kind of method that 3D inkjet printings prepare HIT electrodes
CN111180102A (en) * 2020-01-04 2020-05-19 浙江大学 Preparation method of conductive silver paste based on silver-coated graphite conductive agent
CN112863733A (en) * 2021-02-05 2021-05-28 苏州思尔维纳米科技有限公司 Low-temperature silver paste for HIT solar cell and preparation method thereof

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* Cited by examiner, † Cited by third party
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