CN114217387A - Substrate, photoelectric device and packaging method of photoelectric device - Google Patents
Substrate, photoelectric device and packaging method of photoelectric device Download PDFInfo
- Publication number
- CN114217387A CN114217387A CN202111531239.8A CN202111531239A CN114217387A CN 114217387 A CN114217387 A CN 114217387A CN 202111531239 A CN202111531239 A CN 202111531239A CN 114217387 A CN114217387 A CN 114217387A
- Authority
- CN
- China
- Prior art keywords
- groove
- substrate
- optical fiber
- chip
- guide groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The embodiment of the application provides a substrate, a photoelectric device and a packaging method of the photoelectric device, wherein the substrate comprises: a mounting groove recessed from an upper surface of the substrate to a lower surface of the substrate, for accommodating a chip; wherein the upper surface and the lower surface are opposite surfaces of the substrate; the boss is positioned in the assembly groove, and one side of the boss, which is relatively close to the upper surface, is used for supporting the chip; wherein, along the thickness direction of the substrate, the thickness of the boss is smaller than the depth of the assembling groove; and the guide groove is sunken from the upper surface to the lower surface, is communicated with the assembly groove and is used for accommodating the optical fiber.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to a substrate, a photoelectric device and a packaging method of the photoelectric device.
Background
With the advent of the era of big data, intellectualization, mobile internet and cloud computing, higher requirements are put on transmission of communication networks, high-performance computers and high-end servers. The optical integration technology is gaining more and more favor in the fields of optical interconnection, optical communication and the like by virtue of the advantages of small volume, low energy consumption, large bandwidth and the like. The silicon-based optoelectronic integrated circuit not only has the advantages of ultra-high bandwidth, ultra-fast transmission rate, electromagnetic interference resistance, low energy consumption and the like, but also is compatible with a CMOS (complementary metal oxide semiconductor) process, receives high attention from the industry, and becomes a popular research and development in recent years.
The silicon-based photoelectric integration technology is a technology that optical devices and electronic elements are integrated into a single chip, and laser beams are adopted to replace electronic signals to transmit data. Similar to the electronic chip using copper wire to transmit electrons, an optical waveguide is disposed in the silicon photonic integrated chip for transmitting laser beam, and the optical input/output between the silicon photonic integrated chip and the outside is realized by coupling and aligning the end face of the optical fiber and the cross section of the optical waveguide. However, since the silicon photonic integrated chip has a smaller size and the optical waveguide cross-section in the chip has a smaller size, it is not easy to align the optical fiber end face with the optical waveguide cross-section.
Disclosure of Invention
The embodiment of the application provides a substrate, a photoelectric device and a packaging method of the photoelectric device.
According to a first aspect of the present application, there is provided a substrate comprising:
a mounting groove recessed from an upper surface of the substrate to a lower surface of the substrate, for accommodating a chip; wherein the upper surface and the lower surface are opposite surfaces of the substrate;
the boss is positioned in the assembly groove, and one side of the boss, which is relatively close to the upper surface, is used for supporting the chip; wherein, along the thickness direction of the substrate, the thickness of the boss is smaller than the depth of the assembling groove;
and the guide groove is sunken from the upper surface to the lower surface, is communicated with the assembly groove and is used for accommodating the optical fiber.
In some embodiments, the base plate comprises a plurality of said bosses;
the section of the assembly groove parallel to the lower surface is a polygon; and the joint of the two adjacent side surfaces of the assembling groove is provided with one boss.
In some embodiments, the substrate further comprises: a receiving groove recessed from an upper surface of the substrate to a lower surface of the substrate;
the guide groove penetrates through the accommodating groove; the size of the accommodating groove is larger than that of the guide groove in the direction perpendicular to the extending direction of the guide groove.
According to a second aspect of the present application, there is provided a photovoltaic device comprising:
any one of the substrates as provided in the first aspect of the present application;
the chip is arranged in the assembling groove and positioned on the boss, and a limiting groove is arranged on one side of the chip, which is relatively far away from the lower surface, wherein the limiting groove is communicated with the guide groove, and one end of the limiting groove is exposed out of the coupling surface of the chip;
the first bonding layer is arranged on one side, close to the lower surface, of the chip and fixedly connected with the chip and the assembling groove; and the number of the first and second groups,
the optical fiber is arranged in the guide groove and the limiting groove; wherein, the end face of the optical fiber in the limiting groove is aligned with the coupling face.
In some embodiments, the optoelectronic device further comprises a conductive metal layer arranged on one side of the first adhesive layer relatively far away from the chip, and the conductive metal layer is arranged in a grounded mode;
the first adhesive includes a conductive adhesive electrically connecting the chip and the conductive metal layer.
In some embodiments, the optoelectronic device further comprises:
the cover plate covers the part of the optical fiber, which is positioned in the limiting groove; and the number of the first and second groups,
and the second bonding layer is filled in the limiting groove and fixedly connected with the optical fiber, the cover plate and the limiting groove.
In some embodiments, the substrate further comprises: a receiving groove recessed from an upper surface of the substrate to a lower surface of the substrate; the guide groove and the optical fiber positioned in the guide groove penetrate through the accommodating groove, wherein the size of the accommodating groove is larger than that of the guide groove in the direction perpendicular to the extending direction of the guide groove;
and a third bonding layer is arranged in the accommodating groove and fixedly connected with the optical fiber and the accommodating groove.
According to a third aspect of the present application, there is provided, for example, a method of packaging an optoelectronic device, comprising:
forming an assembly groove and a guide groove communicated with the assembly groove on the upper surface of the substrate; the assembling groove and the guide groove are recessed from the upper surface of the substrate to the lower surface of the substrate, a boss is arranged in the assembling groove, the height of the boss is smaller than the depth of the assembling groove in the thickness direction of the substrate, and the upper surface and the lower surface are opposite surfaces of the substrate;
filling a first adhesive into the assembling groove;
placing a chip on the boss in the assembly groove; one side of the chip, which is relatively close to the lower surface, is contacted with the first adhesive, one side of the chip, which is relatively far away from the lower surface, is provided with a limiting groove communicated with the guide groove, and the chip further comprises a coupling surface exposed through one end of the limiting groove;
placing an optical fiber in the guide groove and the limiting groove; the end face of the optical fiber in the limiting groove is aligned to the coupling face;
and fixing the optical fiber in the limiting groove.
In some embodiments, securing the optical fiber in the retaining groove comprises:
filling a second adhesive into the limiting groove until the second adhesive is contacted with the optical fiber;
arranging a cover plate on the part of the optical fiber, which is positioned in the limiting groove;
and curing the second adhesive to fixedly connect the optical fiber, the cover plate and the limiting groove.
In some embodiments, the substrate further comprises: a receiving groove recessed from an upper surface of the substrate to a lower surface of the substrate; the guide groove penetrates through the accommodating groove, wherein the size of the accommodating groove is larger than that of the guide groove in the direction perpendicular to the extending direction of the guide groove;
the placing optic fibre in guide way with in spacing recess includes:
clamping the optical fiber by using a clamping device;
the clamping device extends into the accommodating groove so as to place the optical fiber in the guide groove and the limiting groove; the clamping device extends into the part of the accommodating groove, which is larger than the guide groove, in the direction perpendicular to the extending direction of the guide groove.
In the substrate provided by the embodiment of the application, since the position and the size of the guide groove are determined according to the position of the optical fiber when the optical fiber and the optical waveguide are aligned in a coupling manner, the optical fiber and the optical waveguide can be aligned in a coupling manner only by placing the chip into the assembly groove and placing the optical fiber into the guide groove. Therefore, the substrate provided by the embodiment of the application can improve the coupling quality of the optical fiber and the optical waveguide, and is short in coupling alignment time and high in coupling efficiency. In addition, the substrate provided by the embodiment of the application can also reduce the packaging size in the thickness direction of the substrate, and the volume of the packaged optical integrated module is reduced. Further, in the substrate provided by the embodiment of the application, a boss is arranged in the assembling groove. The boss can limit the position of the chip in the thickness direction of the substrate, ensures the assembly precision of the chip in the thickness direction of the substrate, and is beneficial to the coupling alignment of the optical fiber and the optical waveguide.
Drawings
Fig. 1 is a schematic structural diagram of a substrate according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another substrate according to an embodiment of the present disclosure;
fig. 3 is an exploded view of a photovoltaic device provided in an embodiment of the present application;
fig. 4 is a schematic flow chart of a packaging method of an optoelectronic device provided in an embodiment of the present application;
fig. 5A to 5E are schematic structural diagrams of a photoelectric device provided in an embodiment of the present application in an encapsulation process.
Description of reference numerals:
10: substrate, 11: assembly groove, 12: boss, 13: guide groove, 14: a receiving groove, 15: an exhaust groove;
20: chip, 21: spacing recess, 22: a coupling surface;
30: optical fiber, 31: optical core, 32: a cladding layer;
41: a first adhesive; 42: second adhesive, 43: and a third adhesive.
Detailed Description
The technical solution of the present application is further described in detail with reference to the drawings and specific embodiments of the specification.
In the description of the present application, it is to be understood that the terms "length," "width," "depth," "upper," "lower," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.
The optical fiber and optical waveguide coupling method may include: designing a V-shaped groove at the front end of a light waveguide on a silicon optical integrated chip, arranging a fixing groove on a cushion block for placing an optical fiber, fixing the silicon optical integrated chip on a substrate, fixing the optical fiber in the fixing groove of the cushion block, adjusting the positions of the cushion block in the X direction and the Y direction to accurately place the optical core exposed by the optical fiber in the V-shaped groove on the silicon optical integrated chip, and finally bonding the cushion block on the substrate. The coupling method not only increases the packaging size in the thickness direction of the substrate, which results in larger volume of the packaged photoelectric device, but also has processing errors of the cushion block, processing errors of the fixing groove on the cushion block and assembly errors of the optical fiber and the cushion block, so that the total error in the Z direction is increased when the optical fiber and the optical waveguide are aligned in a coupling manner, and the coupling quality of the optical fiber and the optical waveguide is influenced. In addition, the coupling method is to perform coupling alignment of the end face of the optical fiber and the cross section of the optical waveguide by the movement of the cushion block in the X direction and the Y direction, so that an optical detection device for auxiliary coupling is needed to detect the coupling loss value of the optical fiber and the optical waveguide in real time in the movement process of the cushion block, and when the coupling loss value is minimum, the cushion block is stopped to move and is adhered and fixed. Moreover, the coupling method also needs to limit the moving range of the cushion block through the rest block during the coupling process. Therefore, the coupling method has high assembly difficulty and more assembly steps, influences the coupling efficiency and the coupling quality of the optical fiber and the optical waveguide, and increases the packaging cost.
Here, the X direction and the Y direction are parallel to the upper surface of the substrate, and the X direction and the Y direction are perpendicular to each other. The Z direction is perpendicular to the upper surface of the substrate, i.e., the Z direction is parallel to the thickness direction of the substrate.
In addition, the coupling alignment of the optical fiber and the optical waveguide, or the coupling alignment of the end surface of the optical fiber and the cross section of the optical waveguide, described herein, refers to the coupling alignment of the end surface of the optical core of the optical fiber and the cross section of the optical waveguide.
In view of the above problems, embodiments of the present application provide a substrate to improve the coupling quality and efficiency of an optical fiber and an optical waveguide. Fig. 1 is a schematic structural diagram of a substrate according to an embodiment of the present disclosure. As shown in fig. 1, a substrate 10 provided in the embodiment of the present application includes a fitting groove 11, a boss 12, and a guide groove 13. Wherein, assembly groove 11 is sunken from the upper surface of base plate 10 to the lower surface of base plate 10 for hold the chip, and boss 12 is located assembly groove 11, and one side that boss 12 is close to the upper surface relatively is used for supporting the chip to, along the thickness direction of base plate 10, the thickness of boss 12 is less than the degree of depth of assembly groove 11, and guide way 13 is sunken from the upper surface to the lower surface, and communicates with assembly groove 11, is used for holding optic fibre.
Here, the upper surface and the lower surface are opposite surfaces of the substrate 10, and both the upper surface and the lower surface are perpendicular to the thickness direction of the substrate 10. The substrate 10 further includes a side surface parallel to the thickness direction of the substrate 10.
One end of the guide groove 13 communicates with the fitting groove 11, and the other end penetrates the side surface of the substrate 10. In this manner, when the optical fiber is fitted in the guide groove, one end of the optical fiber is optically interconnected with the chip fitted in the fitting groove 11, and the other end extends out of the substrate 10. It will be appreciated that the other end of the optical fiber extending beyond the substrate may be optically interconnected with other optical chips or optical devices.
In the substrate provided by the embodiment of the application, the assembly groove 11 is arranged on the upper surface of the substrate and used for accommodating a chip, and the guide groove 13 communicated with the assembly groove is also arranged and used for accommodating an optical fiber. Since the position of the guide groove is determined according to the position of the optical fiber when the optical fiber and the optical waveguide are coupled and aligned, and the size of the fitting groove is set according to the size of the chip, the depth and width dimensions of the guide groove are set according to the size of the optical fiber. Therefore, the coupling alignment of the optical fiber and the optical waveguide can be realized only by placing the chip into the assembly groove and placing the optical fiber into the guide groove.
Further, in the substrate provided by the embodiment of the present application, the boss 12 is disposed in the assembling groove. When the chip is placed in the assembly groove, the lug boss can form a gap between the chip and the bottom surface of the assembly groove, and the gap is used for containing the adhesive to enable the chip to be adhered and fixed to the assembly groove. Meanwhile, the boss can limit the position of the chip, so that the position of the chip in the Z direction cannot be influenced by slightly more or less adhesive or uneven adhesive thickness, the assembly precision of the chip in the Z direction can be ensured to be higher, and the coupling alignment of the optical fiber and the optical waveguide is facilitated.
Therefore, the substrate provided by the embodiment of the application can improve the coupling quality of the optical fiber and the waveguide, the steps of moving the cushion block and arranging the leaning block are omitted, the assembling step and the coupling alignment time can be reduced, and the coupling efficiency is improved; secondly, coupling alignment can be realized only by placing the optical fiber into the guide groove, and optical detection equipment is not needed, so that passive coupling can be realized, the coupling cost is reduced, and the coupling efficiency is further improved because the steps of installing and dismantling the optical detection equipment are omitted; and thirdly, the packaging size in the thickness direction of the substrate can be reduced, the size of the packaged photoelectric device is reduced, and the cost for processing the cushion block and the leaning block can be saved.
It should be noted that the substrate provided in the embodiments of the present application is not only suitable for coupling alignment between a chip having a V-groove structure and an optical fiber, but also suitable for coupling alignment between a chip having no V-groove structure and an optical fiber. For a chip without a V-groove structure, the end face of an optical fiber needs to be aligned with a certain designated position on the side face of the chip, but in the substrate provided by the application, the position and the size of the guide groove can be designed to align the optical fiber with the certain designated position on the side face of the chip, so that the coupling alignment of the optical fiber and the optical waveguide is realized.
The number of bosses is not limited in the present application. In some embodiments, the substrate 10 includes a plurality of bosses 12, the plurality of bosses 12 are arranged at intervals on the bottom surface of the fitting groove 11, and the heights of the plurality of bosses 12 are uniform along the thickness direction of the substrate 10. Here, the provision of the plurality of bosses 12 improves the chip support, and the chip is supported in a balanced and reliable manner.
The present application does not limit the layout of the plurality of bosses. For example, the plurality of bosses 12 may be uniformly arranged along the side surface of the assembly groove 11, or the plurality of bosses 12 may be arranged in an array at the bottom of the assembly groove 11. In the present embodiment, the section of the fitting groove 11 parallel to the lower surface is polygonal, wherein a boss 12 is provided at the junction of two adjacent side surfaces of the fitting groove 11. That is, the plurality of bosses 12 are respectively located at the junctions of the adjacent two side surfaces of the fitting groove 11. Since the chip is generally quadrangular, the section of the mounting groove 11 parallel to the lower surface is generally quadrangular. As shown in fig. 1, four bosses 12 are disposed in the mounting groove 11, and each boss 12 is located at a joint of two adjacent side surfaces of the mounting groove 11, that is, four bosses 12 are located at four corners of the bottom surface of the mounting groove 11. So set up, can comparatively support the chip uniformly to strengthened the support to four angles that the chip intensity is relatively weak, further improved the support reliability.
Here, the boss 12 and the base plate 10 may be of an integral structure, and both side surfaces of the boss 12 are in contact with and connected to the corresponding both side surfaces of the fitting groove 11. Therefore, the boss can be machined only by machining the boss without contacting with the side face of the assembling groove, and the process time for machining the boss is shortened.
In some embodiments, substrate 10 further includes receiving groove 14, and receiving groove 14 is recessed from an upper surface of substrate 10 to a lower surface of substrate 10. The guide groove 13 passes through the receiving groove 14, wherein the size of the receiving groove 14 is larger than the size of the guide groove 13 in a direction perpendicular to the extending direction of the guide groove 13. Specifically, referring to fig. 1, the guide groove 13 extends in the X direction, and the distance between the opposite side surfaces of the accommodating groove 14 is greater than the distance between the opposite side surfaces of the guide groove 13 in the Y direction. Further, in the Y direction, the symmetry axes of the opposite side faces of the accommodation groove 14 coincide with the symmetry axes of the opposite side faces of the guide groove 13.
In this embodiment, the accommodating groove is provided for accommodating the clamping device, so that the optical fiber is conveniently placed in the guide groove by using the clamping device, and on the other hand, after the clamping device is moved out of the accommodating groove, the accommodating groove may be filled with a third adhesive to fix the optical fiber to the substrate.
In some embodiments, referring to fig. 1, in the extending direction along guide groove 13 (in the X direction), the distance from the side of receiving groove 14 relatively close to fitting groove 11 is smaller than the distance from the side of receiving groove 14 relatively far from fitting groove 11 to the side of substrate 10. In other words, the receiving groove 14 is located closer to the mounting groove 11 in the middle of the guide groove 13, so as to facilitate the clamping device to finely adjust the position of the optical fiber in the guide groove 13, so that the optical fiber and the optical waveguide can be precisely coupled and aligned.
In some embodiments, referring to fig. 2, the substrate 10 further includes an exhaust groove 15 recessed from the upper surface of the substrate 10 toward the lower surface of the substrate 10, the exhaust groove 15 communicating with the mounting groove 11. And, the exhaust groove 15 is located under the side of the boss 12 relatively far from the lower surface of the substrate 10 relatively close to the side of the lower surface of the substrate 10, so as to exhaust the air in the assembly groove 11 when the chip is put into the assembly groove 11 to reduce the chip putting resistance, or exhaust the air in the assembly groove 11 below the chip when the adhesive in the assembly groove 11 is heated and cured later, to reduce the upward thrust applied to the chip, resulting in affecting the bonding effect.
Illustratively, the depth of the air discharge groove 15 and the depth of the fitting groove 11 are substantially equal in the thickness direction of the substrate 10, or the depth of the air discharge groove 15 is larger than the depth of the fitting groove 11.
In some embodiments, the substrate comprises a low temperature co-fired ceramic (LTCC). The function of the chip is greatly influenced by the external environment, and the chip can only be effectively packaged to play the function. In consideration of the matching property of the thermal expansion coefficient, the low-temperature co-fired ceramic substrate is generally adopted to carry out heterogeneous integrated packaging on the chip.
The embodiment of the application also provides a photoelectric device using the substrate 10. Fig. 3 is an exploded structural schematic diagram of an optoelectronic device provided in an embodiment of the present application. As shown in fig. 3, an optoelectronic device provided in an embodiment of the present application includes:
a base plate 10 including a fitting groove 11, a boss 12 and a guide groove 13, the fitting groove 11 being recessed from an upper surface of the base plate 10 toward a lower surface of the base plate 10, the boss 12 being located in the fitting groove 11 and having a thickness of the boss 12 smaller than a depth of the fitting groove 11 in a thickness direction of the base plate 10, the guide groove 13 being recessed from the upper surface of the base plate 10 toward the lower surface of the base plate 10 to communicate with the fitting groove 11;
the chip 20 is arranged in the assembling groove 11 and positioned on the boss 12, one side of the chip 20, which is relatively far away from the lower surface of the substrate 10, is provided with a limiting groove 21, wherein the limiting groove 21 is communicated with the guide groove 13, and one end of the limiting groove 21 is exposed out of a coupling surface 22 of the chip 20;
the first adhesive layer is arranged on one side of the chip 20 relatively close to the lower surface and fixedly connected with the chip 20 and the assembling groove 11; and the number of the first and second groups,
the optical fiber 30 is arranged in the guide groove 13 and the limiting groove 21; wherein the end face of the optical fiber 30 located in the limiting groove 21 is aligned with the coupling face 22.
In the photoelectric device provided by the embodiment of the application, the assembly groove is formed in the upper surface of the substrate and used for accommodating the chip, and the guide groove communicated with the assembly groove is further formed and used for accommodating the optical fiber. Since the position of the guide groove is determined according to the position of the optical fiber when the optical fiber and the optical waveguide are coupled and aligned, the size of the guide groove is designed according to the size of the optical fiber. Therefore, as long as the chip is placed in the assembly groove, the optical fiber is placed in the guide groove, the optical fiber can be placed in the limiting groove on the chip, so that the end face of the optical fiber in the limiting groove is aligned with the coupling surface, and the coupling alignment of the optical fiber and the optical waveguide is realized.
Further, in the optoelectronic device provided in the embodiment of the present application, a boss is further disposed in the mounting groove to limit the position of the chip in the Z direction.
In some embodiments, the first adhesive is flexible and deforms or flows when an external force is applied. If the first adhesive is filled in the assembly groove and the chip is directly placed on the first adhesive, the chip is affected in the Z-direction by a slightly larger or smaller amount of the first adhesive or a slightly uneven thickness of the first adhesive when the assembly groove has no bump, which is not favorable for coupling the optical fiber and the optical waveguide. In the embodiment of the application, the boss is arranged in the assembling groove, and the chip is arranged on the boss. In the process of assembling and forming the photoelectric device, the lug boss can enable a gap to be formed between the chip and the bottom surface of the assembling groove for containing the first adhesive, so that the assembling precision of the chip in the Z direction can be ensured, and the subsequent optical fiber and optical waveguide coupling alignment is facilitated.
Therefore, the substrate provided by the embodiment of the application can improve the coupling quality of the optical fiber and the optical waveguide, and can reduce the assembling steps and the coupling alignment time, so that the coupling efficiency is improved; secondly, the optical fiber can be positioned in the limiting groove of the chip only by placing the optical fiber into the guide groove, so that the coupling alignment of the optical fiber and the optical waveguide is realized, optical detection equipment is not needed, and therefore passive coupling can be realized; and thirdly, the packaging size in the thickness direction of the substrate can be reduced, the size of the packaged photoelectric device is reduced, and the cost for processing the cushion block and the leaning block can be saved.
When the end surface of the optical fiber 30 is coupled to the cross section of the optical waveguide, the end surface of the optical fiber 30 may be directly coupled to the cross section of the optical waveguide or may be coupled to the cross section of the optical waveguide without contact. In other words, as long as the end face of the optical fiber 30 is aligned with the cross section of the optical waveguide, the coupling alignment of the optical fiber and the optical waveguide can be achieved. It will be appreciated that in general, the distance between the end face of the optical fibre and the cross-section of the optical waveguide should be less than or equal to a predetermined distance.
In the embodiment of the present application, the cross section of the optical waveguide is disposed in the chip and is not directly exposed in the limiting groove 21. The limiting groove 21 only exposes the coupling surface 22 of the chip 20, and the cross section of the optical waveguide is aligned with the coupling surface 22, so that the optical fiber 30 can be coupled with the optical waveguide by aligning the end surface of the optical fiber 30 with the coupling surface 22.
Here, the distance from the cross-section of the optical waveguide to the coupling surface 22 is defined as a first distance, and the distance from the end face of the optical fiber 30 to the coupling surface 22 is defined as a second distance. In order to make the distance between the end face of the optical fiber 30 and the end face of the optical waveguide smaller than or equal to a preset distance, the first distance is set smaller than or equal to the preset distance, and the end face of the optical fiber 30 is disposed in contact with the coupling face 22. Further illustratively, the first distance is set to be smaller than the preset distance, the second distance is set to be smaller than the preset distance, and the sum of the first distance and the second distance is smaller than or equal to the preset distance.
In some embodiments, referring to fig. 3, in a direction perpendicular to the extending direction of the limiting groove 21, the cross-sectional shape of the limiting groove 21 is V-shaped, that is, the limiting groove 21 has a V-groove structure. The end of the limiting groove 21 relatively far away from the guide groove 13 exposes the coupling surface 22 of the chip 20, so that the coupling surface 22 is arranged in a triangle. Here, the limiting groove 21 is configured as a V-groove structure, which can limit the movement of the portion of the optical fiber 30 located in the limiting groove 21 in the Y direction, and is convenient for processing. It is understood that the cross-sectional shape of the stopper groove may also be U-shaped.
In some embodiments, the optical fiber 30 includes an optical core 31 and a cladding 32, the cladding 32 wraps a portion of the optical core 31 located in the guide groove 13, and a portion of the optical core 31 located in the limiting groove 21 is exposed. Therefore, the end face of the optical core 31 can be coupled and aligned with the cross section of the optical waveguide without a deep limiting groove 21, so that the size design of the chip 20 can be smaller, and the volume of the packaged photoelectric device can be reduced.
In addition, the length of the bare optical core 31 can be controlled to be slightly less than or equal to the length of the limiting groove 21, so that the optical fiber 30 is placed in the limiting groove 21 and the guide groove 13, and when the end face of the cladding 32 close to the chip 20 abuts against the side face of the chip 20, the second distance from the end face of the optical core 31 to the coupling face 22 meets the requirement that the distance between the end face of the optical fiber 30 and the cross section of the optical waveguide is less than or equal to the preset distance. Illustratively, the length of the bare optical core 31 may be controlled to be equal to the length of the limiting groove 21, so that the optical fiber 30 is placed in the limiting groove 21 and the guiding groove 13, and when the cladding 32 abuts against the side surface of the chip 20 near the end surface of the chip 20, the end surface of the optical core 31 is just in contact with the coupling surface 22.
In some embodiments, chip 20 comprises a silicon photonic integrated chip. The silicon optical integrated chip can be an active silicon optical integrated chip or a passive silicon optical integrated chip.
In some embodiments, the optoelectronic device further comprises a conductive metal layer disposed on a side of the first adhesive layer opposite from the chip 20, the conductive metal layer being disposed to ground. The first adhesive layer includes a conductive adhesive, electrically connecting the chip 20 and the conductive metal layer.
Since high frequency signals are usually present in the silicon photonic integrated chip, the silicon photonic integrated chip is usually grounded to reduce signal interference. In this embodiment, the grounded conductive metal layer is disposed on the substrate 10, and the silicon optical integrated chip is electrically connected to the conductive metal layer through the conductive adhesive, so that the silicon optical integrated chip can be grounded, and the package size of the silicon optical integrated chip can be reduced.
Illustratively, the conductive adhesive includes, but is not limited to, conductive silver paste.
The arrangement of the conductive metal layer in the assembly groove 11 is not limited in this application. Illustratively, the substrate 10 includes a conductive metal layer, and the bottom surface of the assembly groove 11 exposes the conductive metal layer in the substrate 10.
In some embodiments, referring to fig. 3, the substrate 10 includes a plurality of lands 12, and the chip 20 is positioned on the plurality of lands 12 for good support. Further, the cross section of the assembly groove 11 parallel to the lower surface is polygonal, wherein a boss 12 is provided at the joint of two adjacent side surfaces of the assembly groove 11, so that the chip 20 can be more uniformly and reliably supported.
In some embodiments, the side of the chip 20 relatively close to the upper surface of the substrate 10 is located in the mounting groove 11, that is, in the Z direction, the thickness of the chip 20 is smaller than the height difference between the side of the boss 12 relatively close to the substrate 10 and the upper surface of the substrate 10, and the chip 20 is entirely sunk into the mounting groove 11, so that the packaging strength of the chip 20 can be improved.
In some embodiments, the optoelectronic device further includes a cover plate covering the portion of the optical fiber 30 located in the limiting groove 21, and a second adhesive layer filled in the limiting groove 21 and fixedly connecting the optical fiber 30, the cover plate and the limiting groove 21. Here, the second adhesive layer may be filled in the gap between the end surface of the optical fiber 30 and the coupling surface 22 to more reliably fix the optical fiber 30 at a position aligned with the optical waveguide coupling, and eliminate an air gap between the end surface of the optical fiber 30 and the coupling surface 22, reducing the coupling loss value.
After the optical fiber 30 is placed in the guide groove 13 and the limiting groove 21, the limiting groove 21 is filled with the second adhesive, and the second adhesive generates buoyancy to the optical fiber 30, so that the optical fiber 30 is deviated and away from a position aligned with the optical waveguide coupling, and the coupling quality is deteriorated. To this end, in the embodiment of the present application, a cover plate is provided on a portion of the optical fiber 30 located in the stopper groove 21, and the cover plate applies pressure to the optical fiber 30 to press the optical fiber 30 in the coupling alignment position before the second adhesive is cured, and then the second adhesive is cured to fix the optical fiber 30 in the coupling alignment position with the optical waveguide. Here, the second adhesive forms a second adhesive layer after being cured.
Illustratively, the material of the second adhesive layer includes UV glue. The UV glue can be cured quickly under the action of ultraviolet rays to fix the optical fiber 30 quickly, reduce the probability of the optical fiber 30 deviating from the coupling alignment position in the process of moving the substrate 10, and ensure that the optical fiber 30 and the optical waveguide have good coupling quality.
In some embodiments, substrate 10 further includes receiving groove 14, and receiving groove 14 is recessed from an upper surface of substrate 10 to a lower surface of substrate 10. The guide groove 13 and the optical fiber 30 positioned in the guide groove 13 pass through the accommodating groove 14, wherein the accommodating groove 14 has a size larger than that of the guide groove 13 in a direction perpendicular to an extending direction of the guide groove 13. A third adhesive layer is disposed in the accommodating groove 14, and the third adhesive layer fixedly connects the optical fiber 30 and the accommodating groove 14.
An embodiment of the present application further provides a packaging method for obtaining the above-mentioned optoelectronic device, fig. 4 is a schematic flow chart of the packaging method for the optoelectronic device provided in the embodiment of the present application, and as shown in fig. 4, the packaging method for the optoelectronic device provided in the embodiment of the present application includes:
s100: forming an assembly groove and a guide groove communicated with the assembly groove on the upper surface of the substrate; the assembling groove and the guide groove are recessed from the upper surface of the substrate to the lower surface of the substrate, a boss is arranged in the assembling groove, the height of the boss is smaller than the depth of the assembling groove in the thickness direction of the substrate, and the upper surface and the lower surface are opposite surfaces of the substrate;
s200: filling a first adhesive into the assembly groove;
s300: placing a chip on the boss in the assembly groove; one side of the chip relatively close to the lower surface is contacted with the first adhesive, one side of the chip relatively far away from the lower surface is provided with a limiting groove communicated with the guide groove, and the chip further comprises a coupling surface exposed through one end of the limiting groove;
s400: placing the optical fiber in the guide groove and the limiting groove; wherein, the end surface of the optical fiber in the limit groove 21 is aligned with the coupling surface;
s500: and fixing the optical fiber in the limiting groove.
The following further describes an encapsulation method of a photovoltaic device provided in an embodiment of the present application, with reference to fig. 1 and schematic structural diagrams of the photovoltaic device provided in an embodiment of the present application in an encapsulation process, which are shown in fig. 5A to 5E.
Referring to fig. 1, a mounting groove 11, a guide groove 13 communicating with the mounting groove 11, and a boss 12 are formed on an upper surface of a substrate 10.
In some embodiments, the substrate 10 is etched using a laser beam to form the assembly grooves 11 and/or the guide grooves 13. The laser beam etching efficiency is high, the accuracy is high, the processing error can be controlled within the range of +/-10 mu m, and the coupling quality of the optical fiber 30 and the optical waveguide is improved.
Generally, when the diameter of the optical fiber 30 is 250 μm, the width dimension of the guide groove processed by the laser beam can be controlled to 250 + -10 μm and the depth dimension is about 250 to 300 μm. Here, the guide groove 13 has a length dimension of about 3mm to 8mm, typically 5mm, in order to provide a space for disposing the accommodation groove 14.
In some embodiments, the base plate 10 includes a plurality of bosses 12, and a cross section of the mounting groove 11 parallel to the lower surface is polygonal, wherein one boss 12 is provided at a junction of two adjacent side surfaces of the mounting groove 11. Referring to fig. 1, in the present embodiment, 4 bosses 12 are provided at four corners of the bottom of the mounting groove 11 to balance the supporting chip 20.
Referring to fig. 5A, a first adhesive 41 is filled into the mounting groove 11.
The first adhesive 41 is filled in the bottom of the mounting groove 11, and the first adhesive 41 does not cover the side of the boss 12 relatively far from the lower surface of the substrate 10, that is, the first adhesive 41 does not cover the surface of the boss 12 for supporting the chip 20, so as to ensure the mounting accuracy of the chip 20 in the Z direction.
In some embodiments, the first adhesive is somewhat flexible. It is understood that the first adhesive is substantially not deformed and flows or flows very little in the absence of an external force, and the first adhesive is deformed or flows to reduce its thickness by the external force.
Illustratively, the first adhesive comprises conductive silver paste. When the conductive silver paste is filled into the fitting groove 11, the conductive silver paste substantially maintains its state when filled into the fitting groove 11, and does not flow to the side of the cover land 12 relatively far from the lower surface of the substrate 10. And the thickness of the conductive silver adhesive is greater than or equal to that of the lug boss. When the thickness of the conductive silver paste is equal to the thickness of the lands 12, the chip 20 may be contacted with the conductive silver paste to be adhesively fixed when the chip 20 is placed on the lands 12 in a subsequent step. When the thickness of the conductive silver paste is greater than that of the lands 12, when the chip 20 is placed on the lands 12 in a subsequent step, the chip 20 comes into contact with the conductive silver paste and presses the conductive silver paste as the chip 20 gradually approaches the lands 12. The conductive silver paste gradually flows under the extrusion of the chip 20, extends between the chip 20 and the bottom surface of the assembly groove 11, and fills between the chip 20 and the bottom surface of the assembly groove 11 to form a first adhesive layer after the chip 21 contacts with the boss 12. Thus, before the chip 20 is placed, the thickness of the conductive silver paste is larger than that of the boss 12, so that the chip 20 can be in full contact with the conductive silver paste, and the chip 20 can be reliably fixed.
Illustratively, the first adhesive 41 is cured at normal temperature, resulting in a first adhesive layer. Here, the normal temperature curing method can reduce the internal stress of the first adhesive layer, reduce the probability that the chip 20 is jacked up by the first adhesive layer, and ensure that the chip 20 is always positioned on the boss 12, so as to ensure the assembly precision of the chip 20 in the Z direction.
With continued reference to fig. 5A and 5B, the chip 20 is placed on the boss 12 in the fitting groove 11, and the stopper groove 21 of the chip 20 and the guide groove 13 are made to communicate.
In the process of placing the chip 20 into the mounting groove 11, after the chip 20 contacts the first adhesive 41, the first adhesive 41 is pressed by the pressure of the chip 20 to form a first adhesive layer.
Referring to fig. 5C and 5D, the optical fiber 30 is placed in the guide groove 13 and the stopper groove 21 such that the end surface of the optical fiber 30 located in the stopper groove 21 is positioned in alignment with the coupling surface 22.
In some embodiments, the optical fiber 30 includes an optical core 31 and a cladding 32 wrapped around the optical core 31, and thus, placing the optical fiber 30 in the guide groove 13 and the limiting groove 21 includes:
removing part of the cladding 32 to expose the optical core 31;
placing the optical fiber 30 in the guide groove 13 and the limiting groove 21; wherein the bare optical core 31 is located in the limiting groove 21.
Therefore, the end face of the optical core 31 can be coupled and aligned with the cross section of the optical waveguide without a deep limiting groove 21, so that the size design of the chip 20 can be smaller, and the volume of the packaged photoelectric device can be reduced.
In some embodiments, the substrate 10 further includes a receiving groove 14, the receiving groove 14 is recessed from the upper surface of the substrate 10 to the lower surface of the substrate 10, and the guide groove 13 passes through the receiving groove 14, wherein a dimension of the receiving groove 14 (i.e., a distance between opposite side surfaces of the receiving groove) is greater than a dimension of the guide groove 13 (i.e., a distance between opposite side surfaces of the guide groove) in a direction perpendicular to an extending direction of the guide groove 13. The placing of the optical fiber 30 in the guide groove 13 and the limiting groove 21 includes:
clamping the optical fiber 30 with a clamping device;
inserting the holding device into the accommodating groove 14 to place the optical fiber 30 in the guide groove 13 and the limiting groove 21; wherein the holding device extends into a portion of the receiving groove 14 which is larger than the guide groove 13 in a direction perpendicular to the extending direction of the guide groove 13.
In some embodiments, the size of the receiving groove 14 in the extending direction of the guide groove 13 (in the X direction) is about 1mm to 2mm, and is typically 1.5 mm. The size of the accommodation groove 14 is about 1mm to 2mm, and generally 1.5mm, in a direction perpendicular to the extending direction of the guide groove 13 (in the Y direction). In the Z direction, the size of the receiving groove 14 is about 0.2mm to 0.4mm, and is generally the same as or slightly larger than the depth of the guide groove 13. For example, the size of the receiving groove 14 may be 1.5mm × 1.5mm × 0.3 mm. Here, the width dimension of the accommodating groove 14 in the Y direction is 1.5mm, which is larger than the width of the guide groove 13 by 250 μm. When the optical fiber 30 is placed using the holding device, the holding device is inserted into a portion of the receiving groove 14 larger than the guide groove 13 to place the optical fiber 30 in the guide groove 13. Furthermore, the clamping device can adjust the position of the optical fiber 30 along the extending direction (X direction) of the guide groove 13 so that the second distance from the end face of the optical fiber 30 to the coupling face 22 satisfies the above requirement that the distance between the end face of the optical fiber 30 and the cross section of the optical waveguide is less than or equal to the preset distance. Here, the end face of the optical fiber 30 may be disposed in contact with the coupling face 22.
Illustratively, the gripping device comprises a fiber gripping clamp.
In some embodiments, referring to fig. 5C, in the extending direction along guide groove 13 (in the X direction), the distance from the side of receiving groove 14 relatively close to fitting groove 11 is smaller than the distance from the side of receiving groove 14 relatively far from fitting groove 11 to the side of substrate 10. In other words, the receiving groove 14 is located closer to the mounting groove 11 in the middle of the guide groove 13, so as to facilitate the clamping device to finely adjust the position of the optical fiber 30 in the guide groove 13, so that the optical fiber 30 and the optical waveguide can be precisely coupled and aligned.
Referring to fig. 5E, the second adhesive 42 is filled into the stopper groove 21 until the second adhesive 42 contacts the optical fiber 30. Here, the second adhesive 42 is also filled into the gap between the end face of the optical fiber 30 and the coupling face 22.
After the optical fiber 30 is placed in the guide groove 13 and the limiting groove 21 and the second adhesive 42 is filled in the limiting groove 21, the optical fiber 30 is deviated away from a position where precise coupling alignment occurs due to buoyancy of the second adhesive 42 to the optical fiber 30, resulting in deterioration of coupling quality. To this end, in some embodiments, securing the optical fiber 30 in the retaining groove 21 includes:
filling the second adhesive 42 into the limiting groove 21 until the second adhesive 42 contacts the optical fiber 30;
the cover plate is arranged on the part of the optical fiber 30 positioned in the limiting groove 21;
the second adhesive 42 is cured to fixedly connect the optical fiber 30, the cover plate, and the stopper groove 21.
Thus, a cover plate is provided on the portion of the optical fiber 30 located in the stopper groove 21, and the cover plate applies pressure to the optical fiber 30 to press the optical fiber 30 into coupling alignment with the optical waveguide before the second adhesive 42 is cured, and then the second adhesive 42 is cured to fix the optical fiber 30 in coupling alignment with the optical waveguide.
Illustratively, the second adhesive 42 includes UV glue. Correspondingly, curing the second adhesive 42 includes: ultraviolet light is supplied to the second adhesive 42 to be cured. Here, the UV glue is rapidly cured by ultraviolet rays, so that the optical fiber 30 can be rapidly fixed, the probability of the optical fiber 30 deviating from the coupling alignment position during the movement of the substrate 10 is reduced, and the optical fiber 30 and the optical waveguide have good coupling quality.
In some embodiments, after curing the second adhesive 42, the encapsulation method further comprises:
filling the third adhesive 43 into the accommodating groove 14 until the third adhesive 43 contacts the optical fiber 30;
the third adhesive 43 is fixed to fixedly connect the optical fiber 30 and the receiving groove 14.
Here, the third adhesive 43 is cured to obtain a third adhesive layer, and the third adhesive layer fixedly connects the optical fiber 30 and the accommodating groove 14.
In some embodiments, when using a holding device to position optical fiber 30, the holding device is removed from receiving groove 14 before filling receiving groove 14 with third adhesive 43.
In addition, to determine whether the optical fiber 30 is coupled to the optical waveguide, the coupling loss value of the optical fiber 30 and the optical waveguide may be tested during the coupling process. Therefore, in some embodiments, placing the optical fiber 30 in the guide groove 13 and the limiting groove 21 further comprises the following steps:
placing the optical fiber 30 in the guide groove 13 and the limiting groove 21;
adjusting the position of the optical fiber 30 and simultaneously detecting the coupling loss value of the optical fiber 30 and the optical waveguide;
when the coupling loss value is less than or equal to the preset coupling loss value, it is determined that the optical fiber 30 is aligned with the coupling surface 22 relatively close to the end surface of the chip 20.
By means of the arrangement, the optical fiber 30 and the optical waveguide can be accurately judged to achieve coupling alignment through the coupling loss value. It should be noted that the substrate 10 provided in the embodiments of the present application can achieve coupling alignment between the optical fiber 30 and the optical waveguide, and make the coupling loss value less than or equal to 0.5 dB. Therefore, the above-described procedure of testing the coupling loss values of the optical fiber 30 and the optical waveguide in real time is not essential.
The scope of the present disclosure is not limited to the specific embodiments described herein, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present disclosure. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A substrate, comprising:
a mounting groove recessed from an upper surface of the substrate to a lower surface of the substrate, for accommodating a chip; wherein the upper surface and the lower surface are opposite surfaces of the substrate;
the boss is positioned in the assembly groove, and one side of the boss, which is relatively close to the upper surface, is used for supporting the chip; wherein, along the thickness direction of the substrate, the thickness of the boss is smaller than the depth of the assembling groove; and the number of the first and second groups,
and the guide groove is sunken from the upper surface to the lower surface, is communicated with the assembly groove and is used for accommodating the optical fiber.
2. The substrate of claim 1,
the substrate comprises a plurality of the bosses;
the section of the assembly groove parallel to the lower surface is a polygon; and the joint of the two adjacent side surfaces of the assembling groove is provided with one boss.
3. The substrate of claim 1, further comprising: a receiving groove recessed from an upper surface of the substrate to a lower surface of the substrate;
the guide groove penetrates through the accommodating groove; the size of the accommodating groove is larger than that of the guide groove in the direction perpendicular to the extending direction of the guide groove.
4. An optoelectronic device, comprising:
the substrate of any one of claims 1 to 3;
the chip is arranged in the assembling groove and positioned on the boss, and a limiting groove is arranged on one side of the chip, which is relatively far away from the lower surface, wherein the limiting groove is communicated with the guide groove, and one end of the limiting groove is exposed out of the coupling surface of the chip;
the first bonding layer is arranged on one side, close to the lower surface, of the chip and fixedly connected with the chip and the assembling groove; and the number of the first and second groups,
the optical fiber is arranged in the guide groove and the limiting groove; wherein, the end face of the optical fiber in the limiting groove is aligned with the coupling face.
5. The optoelectronic device according to claim 4, further comprising a conductive metal layer disposed on a side of the first adhesive layer opposite to the chip, the conductive metal layer being grounded;
the first adhesive includes a conductive adhesive electrically connecting the chip and the conductive metal layer.
6. The optoelectronic device according to claim 4, further comprising:
the cover plate covers the part of the optical fiber, which is positioned in the limiting groove; and the number of the first and second groups,
and the second bonding layer is filled in the limiting groove and fixedly connected with the optical fiber, the cover plate and the limiting groove.
7. The optoelectronic device according to claim 4, wherein the substrate further comprises: a receiving groove recessed from an upper surface of the substrate to a lower surface of the substrate; the guide groove and the optical fiber positioned in the guide groove penetrate through the accommodating groove, wherein the size of the accommodating groove is larger than that of the guide groove in the direction perpendicular to the extending direction of the guide groove;
and a third bonding layer is arranged in the accommodating groove and fixedly connected with the optical fiber and the accommodating groove.
8. A method of packaging an optoelectronic device, comprising:
forming an assembly groove and a guide groove communicated with the assembly groove on the upper surface of the substrate; the assembling groove and the guide groove are recessed from the upper surface of the substrate to the lower surface of the substrate, a boss is arranged in the assembling groove, the height of the boss is smaller than the depth of the assembling groove in the thickness direction of the substrate, and the upper surface and the lower surface are opposite surfaces of the substrate;
filling a first adhesive into the assembling groove;
placing a chip on the boss in the assembly groove; one side of the chip, which is relatively close to the lower surface, is contacted with the first adhesive, one side of the chip, which is relatively far away from the lower surface, is provided with a limiting groove communicated with the guide groove, and the chip further comprises a coupling surface exposed through one end of the limiting groove;
placing an optical fiber in the guide groove and the limiting groove; the end face of the optical fiber in the limiting groove is aligned to the coupling face;
and fixing the optical fiber in the limiting groove.
9. The method of claim 8, wherein securing the optical fiber in the retaining groove comprises:
filling a second adhesive into the limiting groove until the second adhesive is contacted with the optical fiber;
arranging a cover plate on the part of the optical fiber, which is positioned in the limiting groove;
and curing the second adhesive to fixedly connect the optical fiber, the cover plate and the limiting groove.
10. The method of packaging an optoelectronic device according to claim 8, wherein the substrate further comprises: a receiving groove recessed from an upper surface of the substrate to a lower surface of the substrate; the guide groove penetrates through the accommodating groove, wherein the size of the accommodating groove is larger than that of the guide groove in the direction perpendicular to the extending direction of the guide groove;
the placing optic fibre in guide way with in spacing recess includes:
clamping the optical fiber by using a clamping device;
the clamping device extends into the accommodating groove so as to place the optical fiber in the guide groove and the limiting groove; the clamping device extends into the part of the accommodating groove, which is larger than the guide groove, in the direction perpendicular to the extending direction of the guide groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111531239.8A CN114217387B (en) | 2021-12-14 | 2021-12-14 | Substrate, photoelectric device and packaging method of photoelectric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111531239.8A CN114217387B (en) | 2021-12-14 | 2021-12-14 | Substrate, photoelectric device and packaging method of photoelectric device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114217387A true CN114217387A (en) | 2022-03-22 |
| CN114217387B CN114217387B (en) | 2023-06-02 |
Family
ID=80702146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111531239.8A Active CN114217387B (en) | 2021-12-14 | 2021-12-14 | Substrate, photoelectric device and packaging method of photoelectric device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114217387B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110609352A (en) * | 2019-09-23 | 2019-12-24 | 深圳国人通信技术服务有限公司 | Optical cable fusion platform and optical cable fusion method |
| CN111474642A (en) * | 2019-09-06 | 2020-07-31 | 南通赛勒光电科技有限公司 | Coupling alignment structure and method |
| CN111492281A (en) * | 2017-12-13 | 2020-08-04 | 思科技术公司 | Passive optical fiber coupler with UV window |
| CN113359248A (en) * | 2021-06-02 | 2021-09-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2021
- 2021-12-14 CN CN202111531239.8A patent/CN114217387B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111492281A (en) * | 2017-12-13 | 2020-08-04 | 思科技术公司 | Passive optical fiber coupler with UV window |
| CN111474642A (en) * | 2019-09-06 | 2020-07-31 | 南通赛勒光电科技有限公司 | Coupling alignment structure and method |
| CN110609352A (en) * | 2019-09-23 | 2019-12-24 | 深圳国人通信技术服务有限公司 | Optical cable fusion platform and optical cable fusion method |
| CN113359248A (en) * | 2021-06-02 | 2021-09-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114217387B (en) | 2023-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3593185B1 (en) | Integrated electrical and optoelectronic package | |
| EP1008879B1 (en) | Ferrule assembly and optical module | |
| KR100583646B1 (en) | Connection apparatus for parallel optical interconnect module and parallel optical interconnect module Using the same | |
| US7062144B2 (en) | Architecture of connecting optical PCB, transceiver modules for optical PCB and optical connection block | |
| US5625733A (en) | Arrangement for interconnecting an optical fiber to an optical component | |
| EP3125008A1 (en) | Method to manufacture optoelectronic modules | |
| US20050063651A1 (en) | Optical semiconductor module and its manufacturing method | |
| US11782225B2 (en) | Multi-fiber interface apparatus for photonic integrated circuit | |
| US20220196931A1 (en) | Micro-lens array optically coupled with a photonics die | |
| CA2422986A1 (en) | Method to align optical components to a substrate and other optical components | |
| CN111638577B (en) | Surface-mounted integrated optical module | |
| CN112236697A (en) | Optical fiber connecting member and method for manufacturing optical device | |
| US20020175339A1 (en) | Optical interconnect structure, system and transceiver including the structure, and method of forming the same | |
| US6868207B2 (en) | Method to diffract and attenuate an optical signal | |
| EP1491926A1 (en) | Optical device and method for fabricating the same | |
| CN114217387B (en) | Substrate, photoelectric device and packaging method of photoelectric device | |
| CN214409387U (en) | Optical coupling module and optical communication device | |
| Karppinen et al. | Passively aligned fiber-optic transmitter integrated into LTCC module | |
| KR100341216B1 (en) | Optical device subassemblies comprising a mold housing and a silicon optical bench and method for fabricating thereof | |
| JP2019526839A (en) | Optical module for optical fiber and method of manufacturing the same | |
| KR102687746B1 (en) | Optical connector module and optical interconnection module comprising it | |
| WO2002077691A2 (en) | Optical interconnect structure, system and transceiver including the structure, and method of forming the same | |
| JP2005222003A (en) | Mount, optical component, optical transmission/reception module, and bidirectional optical communication module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |