CN114216403A - Discontinuous deformation measurement method based on infrared and visible light double-light camera - Google Patents
Discontinuous deformation measurement method based on infrared and visible light double-light camera Download PDFInfo
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Abstract
The invention relates to a discontinuous deformation measuring method based on an infrared and visible light double-light camera, which comprises the following steps: uniformly spraying a heat-conducting coating on the surface of the quasi-brittle material to form a conductive film, and preparing a random speckle pattern on the surface of the conductive film; acquiring a visible light image and a fused image of infrared and visible light of the quasi-brittle material at the loading moment by using a double-light fusion camera; detecting the boundary of the expansion crack of the visible light image to obtain the position of the crack expansion tip, determining the initial coordinate of the expansion of the micro crack in the corresponding fusion image according to the position, and further determining the range of the initial area where the micro crack is located; and taking the position of the visible light image corresponding to the region range of the fused image micro crack as a secondary image analysis region, analyzing the secondary image analysis region to obtain the full-field main tensile strain, and accurately positioning the position of the contour of the micro crack. The infrared image and the visible light image are subjected to coupling analysis, and the method can be popularized and applied in the fields of scientific research and practical engineering.
Description
Technical Field
The invention relates to the technical field of discontinuous deformation measurement, in particular to a discontinuous deformation measurement method based on an infrared and visible light double-light camera.
Background
In the case of common quasi-brittle materials such as concrete, rock, low-doped steel fiber reinforced cement-based composite materials and the like, the generation of fine cracks and macro cracks is usually accompanied in the deformation process, the fine cracks are mainly concentrated in the crack expansion tip area, and the fine cracks gradually expand into macroscopic cracks visible to the naked eye along with the increasing of external force. Chinese patent ZL 201810294857.7 discloses a discontinuous deformation measuring method, which is characterized in that images corresponding to the whole process of quasi-brittle material fracture damage are recorded by means of a visible light camera, and simultaneously, macroscopic crack propagation tracks and whole-field displacement and strain information of the quasi-brittle material can be obtained by means of a conventional Digital Image Correlation (DIC) method, but for fine cracks, ideal crack detection and displacement and strain measurement results cannot be obtained by the method.
The infrared imaging is a technology for converting the temperature distribution of the surface of a measured object into an intuitive thermal image by acquiring the infrared radiation energy of the surface of the object, and can detect the surface crack of the quasi-brittle material, but the width of a temperature rise area in the infrared image is larger than that of a real crack area, namely, the expansion size of the crack can not be directly acquired through the infrared image, and the automatic measurement of the crack can not be realized by external equipment such as a magnifying glass for the fine crack.
Based on the analysis, a discontinuous deformation measurement method based on an infrared and visible light double-optical camera is provided, and displacement and strain information of all cracks (including the vicinity of macro cracks and micro crack regions) of the quasi-brittle material can be automatically acquired.
Disclosure of Invention
The invention aims to solve the technical problem of providing a discontinuous deformation measurement method based on an infrared and visible light double-optical camera aiming at the deformation measurement problem near a fine crack region in the fracture and damage process of a quasi-brittle material.
The technical scheme adopted by the invention for solving the problems is as follows: the method for measuring the discontinuous deformation based on the infrared and visible light double-light camera comprises the following steps:
the first step is as follows: uniformly spraying a layer of heat-conducting paint on the surface of the quasi-brittle material to form a conductive film, preparing a random speckle pattern on the surface of the conductive film, placing 1 double-light (infrared and visible light) fusion camera right in front of the speckle pattern, applying voltage to the conductive film, starting a testing machine to load the brittle material, and acquiring a visible light image and a fusion image of infrared and visible light corresponding to the whole process of fracture and damage;
the second step is that: acquiring a visible light image at a certain load moment, detecting the boundary of an expansion crack, identifying the boundary of the expansion crack if the expansion crack is detected, obtaining a crack expansion area, stripping the crack expansion area, obtaining the position of a crack expansion tip, recording the position of the crack expansion tip as the coordinate position of a macroscopic crack expansion tip, accordingly determining the initial coordinate of the expansion of the micro crack in a corresponding fusion image, and simultaneously determining the area range of the micro crack according to the temperature rise area and the initial coordinate position in the fusion image;
the third step: taking the position of the visible light image corresponding to the region range of the fusion image fine crack as a secondary image analysis region, analyzing the secondary image analysis region by adopting a DIC method to obtain the full-field main tensile strain, and accurately positioning the position of the fine crack outline according to the distribution gradient information of the main tensile strain;
the fourth step: and stripping the fine crack region according to the position of the fine crack profile determined in the third step to obtain an image after the fine crack is stripped, and analyzing the image after the fine crack is stripped by adopting a DIC (digital image computer) method to obtain displacement and strain information near the fine crack region of the quasi-brittle material.
Compared with the prior art, the invention has the beneficial effects that:
the method is based on the infrared imaging and visible light imaging technology, the infrared image and the visible light image are subjected to coupling analysis, the full-field displacement and strain information near a fine crack region in the fracture and damage process of the quasi-brittle material can be automatically obtained, and the method can be popularized and applied in the fields of scientific research and practical engineering. The measuring method provides a new idea for the accurate measurement of the fine cracks.
Drawings
FIG. 1 is a schematic diagram of a temperature rise region in an infrared image when micro cracks are generated on the surface of a quasi-brittle material;
FIG. 2 is a schematic elevational view of an apparatus used in the present invention;
FIG. 3 is a schematic diagram (unit: mm) showing the size, conductive film and speckle layout of a three-point bending beam test piece prepared in the example;
FIG. 4 is a comparison graph of a visible light image and a crack detection result corresponding to a certain loading moment;
FIG. 5 is a horizontal strain contrast chart (unit: 10) of the invention patent 'a discontinuous deformation measurement method' and the invention method-6με)；
In the figure, a quasi-brittle material 1, a conductive film and artificial speckles 2, a conductive medium 3, a power line 4, a light source 5, a voltage source 6, an infrared camera 7, a visible light camera 8, a data transmission wire 9 and a computer 10.
Detailed Description
In order to make the purpose and technical solution of the present invention clearer, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. The invention is not limited to the specific embodiments, and any equivalent modifications and improvements made by those skilled in the art without substantial innovations shall fall within the scope of the invention.
The invention provides a discontinuous deformation measuring method based on an infrared and visible light double-light camera, which comprises the following specific operation steps:
the first step is as follows: uniformly spraying a layer of heat-conducting paint on the surface of a quasi-brittle material 1 to form a conductive film, preparing a random speckle pattern on the surface of the conductive film to form the conductive film and artificial speckles 2, placing 1 double-light (an infrared camera 7+ a visible light camera 8) fusion camera right in front of the speckle pattern surface, applying voltage to the conductive film through a conductive medium 3 by means of a voltage source 6, and simultaneously starting a testing machine to load the brittle material 1 so as to obtain a visible light image and a fused image of infrared and visible light corresponding to the whole fracture and damage process;
the second step is that: according to the invention patent of 'a discontinuous deformation measurement method', a coordinate position (such as a point c in a figure 4 (a)) of a macroscopic crack extension tip in a visible light image analysis area at a certain load moment is obtained, an initial coordinate of the propagation of the microscopic crack in a fusion image is determined according to the coordinate position, and meanwhile, a region range where the microscopic crack is located is determined according to a temperature rise area and the initial coordinate position in the fusion image;
the third step: taking the position of the visible light image corresponding to the region range where the fusion image fine cracks are located as a secondary image analysis region, analyzing the secondary image analysis region by adopting a DIC (digital image computer) method to obtain the full-field main tensile strain, and accurately positioning the position of the fine crack outline according to the distribution gradient information of the main tensile strain;
the fourth step: and stripping the fine crack region according to the position of the fine crack profile determined in the third step to obtain an image after the fine crack is stripped, and analyzing the image after the fine crack is stripped by adopting a DIC (digital image computer) method to obtain displacement and strain information near the fine crack region of the quasi-brittle material.
The specific manufacturing process of the conductive film is as follows: taking fig. 3 as an example, firstly, a conductive medium 3 (generally, a thin copper sheet is adopted) is pasted at the left and right boundary positions of the analysis area, and a layer of heat-conducting paint is uniformly coated in the middle area of the conductive medium, so that the conductive medium and the heat-conducting paint form a passage;
the conductive film has a certain elongation, when the surface of the quasi-brittle material generates fine cracks, the resistance value of the conductive film in the fine crack area is increased, the heating value is obviously improved compared with that of an uncracked area, and the conductive film is torn along with the continuous expansion of the cracks and does not transmit temperature information any more.
The artificial speckles are prepared on the surface of the heat-conducting coating, and the specific preparation process is as follows: firstly, uniformly spraying a layer of white spray paint as a background, and then randomly spraying black spots to form a speckle pattern;
the double-optical fusion camera can synchronously acquire a visible light image, an image obtained by fusing the visible light image and an infrared image, and after the position of a macroscopic crack extension tip of the visible light image is determined, the position corresponding to a fine crack in the fused image can be accurately positioned, namely the coordinates of the initial point of the fine crack in the fused image are determined, and in addition, the position of an area where the fine crack is located can be determined according to the temperature rise pixel point in the fused image;
the second step can only determine the approximate region range of the micro-cracks in the fused image finally, and the specific reasons are as follows: when a micro crack is generated on the surface of the quasi-brittle material 1 (as shown by a dotted line in fig. 1), the width of a temperature-rising area (as shown by a frame 1 to a frame 6 in fig. 1) in the fused image is obviously larger than the real expansion boundary of the micro crack, that is, the position of the boundary of the micro crack cannot be accurately determined;
the third step is to find a rectangular region (e.g., a rectangular region surrounded by the upper right corner of the box 3 and the lower left corner of the box 4 in fig. 1) corresponding to the fine cracks in the fused image in the visible light image according to the result obtained in the second step, and the DIC method performs analysis on the rectangular region.
In the full-field main tensile strain result obtained by the DIC method, if the difference between the strain value of the A pixel point and the strain values of the surrounding pixel points is 1 order of magnitude, the position of the A pixel point is the position of the fine crack, and the positions of all the fine cracks are found out according to the difference, so that an accurate position area of the fine crack profile is formed.
The measuring method can measure the crack expansion condition under any loading condition, can obtain a visible light image and a visible light and infrared fusion image at the same sampling moment, and can strip out the macro cracks under the current loading and determine the initial positions of the micro cracks based on the visible light image. The approximate region range where the fine cracks are located can be obtained based on the fusion image, the accurate range of the fine cracks is determined by combining the visible light image, and the processes of automatic detection, identification and analysis of the fine cracks are realized by organic combination and cyclic utilization of the visible light image and the fusion image.
Examples
The test of the embodiment is carried out in the research center of civil engineering technology in Hebei province, and a steel fiber cement-based composite material three-point bending beam test piece with a notch is prepared. FIG. 3 shows the detailed dimensional information (unit: mm) of the test piece, point a being the external force application point, point b representing the initial pre-crack tip position, and the cross-sectional I-I dimensional information having been given on the right side of FIG. 3. Referring to the elevation of the device shown in FIG. 2, test equipment required by the test is placed, the loading rate is set to be 0.15mm/min, the testing machine is started, and the visible light image and the infrared and visible light fusion image corresponding to the whole loading process are synchronously acquired.
Taking the 85% peak load moment of the descent segment as an example, fig. 4(a) is a collected visible light image, it can be seen that an obvious vertical crack is generated in front of the point b, fig. 4(b) and fig. 4(c) are crack detection comparison results obtained by adopting the invention patent 'a discontinuous deformation measurement method' and the invention method, and the comparison can be found: the method provided by the invention can be used for acquiring the boundary position of the fine crack. Fig. 5 shows a non-continuous deformation measurement method and a full-field strain cloud chart obtained by the method of the present invention, and it can be seen that: when the surface of the test piece generates cracks, the method provided by the invention can obtain the accurate position of the crack propagation tip, and can obtain a more reasonable strain measurement result and reflect the real deformation damage state of the quasi-brittle material.
Nothing in this specification is said to apply to the prior art.
Claims (6)
1. A discontinuous deformation measurement method based on an infrared and visible light double-light camera comprises the following steps:
the first step is as follows: uniformly spraying a heat-conducting coating on the surface of the quasi-brittle material to form a conductive film, and preparing a random speckle pattern on the surface of the conductive film;
the second step is that: acquiring a visible light image and a fused image of infrared and visible light of the quasi-brittle material at the loading moment by using a double-light fusion camera; detecting the boundary of the expansion crack of the visible light image, if the expansion crack is detected, identifying the boundary of the expansion crack to obtain a crack expansion area, stripping the crack expansion area to obtain the position of a crack expansion tip, recording the position of the crack expansion tip as the coordinate position of a macroscopic crack expansion tip, accordingly determining the initial coordinate of the expansion of the micro crack in the corresponding fusion image, and simultaneously determining the area range of the micro crack according to the temperature rise area and the initial coordinate position in the fusion image;
the third step: taking the position of the visible light image corresponding to the region range of the fusion image fine crack as a secondary image analysis region, analyzing the secondary image analysis region by adopting a DIC method to obtain the full-field main tensile strain, and accurately positioning the position of the fine crack outline according to the distribution gradient information of the main tensile strain;
the fourth step: and stripping the fine crack region according to the position of the fine crack profile determined in the third step to obtain an image after the fine crack is stripped, and analyzing the image after the fine crack is stripped by adopting a DIC (digital image computer) method to obtain displacement and strain information near the fine crack region of the quasi-brittle material.
2. The method according to claim 1, wherein when the surface of the quasi-brittle material generates the micro cracks, the resistance value of the conductive film in the micro crack area is increased, the heating value is obviously increased compared with that of the non-cracked area, and the conductive film is torn along with the continuous expansion of the cracks and does not transmit the temperature information any more.
3. The method according to claim 1, wherein the conductive film is produced by a specific process comprising: pasting a conductive medium at the left and right boundary positions of the quasi-brittle material analysis area, and uniformly brushing a layer of heat-conducting paint in the middle area of the conductive medium to enable the conductive medium and the heat-conducting paint to form a passage;
the artificial speckles are prepared on the surface of the heat-conducting coating, and the specific preparation process comprises the following steps: firstly, uniformly spraying a layer of white spray paint as a background, and then randomly spraying black spots to form a speckle pattern.
4. The measurement method according to claim 1, wherein the measurement method can obtain a visible light image and a fused image of infrared and visible light corresponding to the whole fracture damage process, including the crack change at the initial fracture damage and the crack condition at the terminal fracture damage.
5. The measuring method according to claim 1, wherein the area range of the fine crack determined in the second step is calculated according to pixel points, the temperature rise area in the fused image is represented by a plurality of pixel points, and a rectangular area framed by the positions of the two most marginal pixel points is taken as the area range of the initial fine crack.
6. The measuring method according to claim 1, wherein the process of accurately positioning the position of the fine crack profile according to the gradient information of the main tensile strain distribution is as follows: in the full-field main tensile strain result obtained by the DIC method, if the difference between the strain value of the A pixel point and the strain values of the surrounding pixel points is 1 order of magnitude, the position of the A pixel point is the position of the fine crack, and the positions of all the fine cracks are found out according to the difference, so that an accurate position area of the fine crack outline is formed.
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| US11650112B1 (en) * | 2022-10-20 | 2023-05-16 | Hebei University Of Technology | Crack propagation and deformation measurement method coupling infrared and visible light images |
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