CN114214003A - Solid bonding module for paving and pasting ceramic tiles and preparation method thereof - Google Patents
Solid bonding module for paving and pasting ceramic tiles and preparation method thereof Download PDFInfo
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- CN114214003A CN114214003A CN202111579566.0A CN202111579566A CN114214003A CN 114214003 A CN114214003 A CN 114214003A CN 202111579566 A CN202111579566 A CN 202111579566A CN 114214003 A CN114214003 A CN 114214003A
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- 239000007787 solid Substances 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000000919 ceramic Substances 0.000 title abstract description 15
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims abstract description 15
- LJSBEPFUQWPNBZ-UHFFFAOYSA-N cyclopent-3-en-1-amine Chemical compound NC1CC=CC1 LJSBEPFUQWPNBZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 13
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 12
- 239000000654 additive Substances 0.000 claims abstract description 11
- CQDDDLREQHQBRR-UHFFFAOYSA-N 1-cyanoethyl prop-2-enoate Chemical compound N#CC(C)OC(=O)C=C CQDDDLREQHQBRR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000000996 additive effect Effects 0.000 claims abstract description 10
- 239000003999 initiator Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 17
- 239000011159 matrix material Substances 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000013008 thixotropic agent Substances 0.000 claims description 10
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 8
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 6
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 6
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 6
- 229910021485 fumed silica Inorganic materials 0.000 claims description 6
- 229910000281 calcium bentonite Inorganic materials 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 3
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000035484 reaction time Effects 0.000 claims description 2
- 150000008366 benzophenones Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 14
- 230000006355 external stress Effects 0.000 abstract description 5
- 238000003860 storage Methods 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 13
- 229940009868 aluminum magnesium silicate Drugs 0.000 description 5
- WMGSQTMJHBYJMQ-UHFFFAOYSA-N aluminum;magnesium;silicate Chemical compound [Mg+2].[Al+3].[O-][Si]([O-])([O-])[O-] WMGSQTMJHBYJMQ-UHFFFAOYSA-N 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 125000004093 cyano group Chemical group *C#N 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004570 mortar (masonry) Substances 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000011083 cement mortar Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- -1 amino, hydroxyl Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000009920 chelation Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000701 coagulant Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/18—Homopolymers or copolymers of nitriles
- C09J133/22—Homopolymers or copolymers of nitriles containing four or more carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a solid bonding module for paving and pasting ceramic tiles and a preparation method thereof, wherein the bonding module comprises the following raw materials: butyl acrylate, methyl methacrylate, lauryl methacrylate, 2-cyano-2-ethyl acrylate, 1-amino-3-cyclopentene, an initiator, and an additive. The solid bonding module can be kept stable in the transportation and storage processes, can be rapidly bonded with a wall body and a ceramic tile when receiving external stress, and has excellent bonding strength.
Description
Technical Field
The invention belongs to the field of adhesives, relates to a tile adhesive, and particularly relates to a solid adhesive module for tile paving and pasting and a preparation method thereof.
Background
The ceramic tile adhesive is mainly used for adhering decorative materials such as ceramic tiles, face tiles, floor tiles and the like, is widely applied to decorative surface decorative places of buildings such as inner and outer wall surfaces, floors, bathrooms, kitchens and the like, and is attractive, luxurious and clean. The traditional tile sticking method mostly adopts cement mortar, namely sand and cement are mixed on site to prepare simple cement mortar, the mortar is coated on the back of a pre-impregnated or pre-wetted tile, the tile coated with the mortar is pressed on the surface pre-wetted, and then the tile is tapped to ensure that the tile has consistent flatness, and the mortar has the defects of weak bonding force, poor durability and easy falling off phenomenon after being used for a long time.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a solid adhesive module for tile installation, which can be stably maintained during transportation and storage, can be rapidly adhered to a wall and tiles when external stress is applied thereto, and has excellent adhesive strength, and a method for manufacturing the same.
In order to achieve the technical effect, the invention adopts the following technical scheme:
one of the purposes of the invention is to provide a solid bonding module for paving ceramic tiles, which is characterized in that the raw materials of the bonding module comprise: butyl acrylate, methyl methacrylate, lauryl methacrylate, 2-cyano-2-ethyl acrylate, 1-amino-3-cyclopentene, an initiator, and an additive.
In the invention, a polymerization monomer with cyano and amino is selected to be combined with butyl acrylate and methyl methacrylate monomers, and the cyano and amino which can generate coordination are introduced into adhesive molecules in the polymerization process. Because the blank of the ceramic tile inevitably contains a certain amount of metal components, the surface of the blank contains certain pores, and because of the existence of the thixotropic agent, a binding agent enters the pores in the extrusion process of the ceramic tile and the colloid, cyano-group and amino in a coagulant molecule can generate coordination with the metal components on the surface of the blank, thereby increasing the combination effect of the ceramic tile binding agent and the blank.
In a preferred embodiment of the present invention, the butyl acrylate is present in an amount of 25 to 35 parts by weight, such as 26 parts, 27 parts, 28 parts, 29 parts, 30 parts, 31 parts, 32 parts, 33 parts, or 34 parts, but the present invention is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
Preferably, the amount of the methyl methacrylate is 20 to 30 parts by weight, such as 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts or 29 parts, but is not limited to the recited values, and other values not recited within the range of the values are also applicable.
Preferably, the lauryl methacrylate is present in an amount of 2 to 5 parts by weight, such as 2.5 parts, 3 parts, 3.5 parts, 4 parts or 4.5 parts, but not limited to the recited values, and other values not recited within the range of values are equally applicable.
In a preferred embodiment of the present invention, the amount of the ethyl 2-cyano-2-acrylate is 5 to 10 parts by weight, for example, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts, or 9.5 parts, but is not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.
Preferably, the 1-amino-3-cyclopentene is 5 to 10 parts by weight, such as 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts, or 9.5 parts, but not limited to the enumerated values, and other unrecited values within the range of values are also applicable.
Preferably, the initiator is present in an amount of 0.5 to 1 part by weight, such as 0.6, 0.7, 0.8 or 0.9 parts by weight, but not limited to the recited amounts, and other values not recited within the range are equally applicable.
As a preferred technical scheme of the invention, the additive is polyhydroxy benzophenone, a thixotropic agent and tackifying resin.
In the invention, the binder also contains polyhydroxy benzophenone, and hydroxyl has coordination function and is not combined with the main chain molecules of the binder, so that chelation can be generated together with the main chain molecules of the binder, and the binding strength is further increased.
In the invention, the thixotropic agent is added into the adhesive component, and the selected polymeric monomer and the additive contain more amino, hydroxyl and cyano, so that the polymeric monomer and the additive have more hydrogen bond sites, and more intramolecular hydrogen bonds are generated in the adhesive after curing reaction, and the thixotropic agent can be self-healed to the original curing state after the internal hydrogen bonds of the adhesive are broken (namely after shear thinning) when external force is applied. After the internal hydrogen bonds are broken, the coordination effect can be generated in the bonding process, so that the bonding strength of the bonding agent is further improved.
Preferably, the thixotropic agent is present in an amount of 1 to 3 parts by weight, such as 1.2 parts, 1.5 parts, 1.8 parts, 2 parts, 2.2 parts, 2.5 parts, or 2.8 parts, but not limited to the recited amounts, and other unrecited amounts within the range are equally applicable.
As a preferable technical scheme of the invention, the raw materials of the bonding module comprise the following components in parts by weight:
the amount of the polyhydroxybenzophenone may be 2.5 parts, 3 parts, 3.5 parts, 4 parts or 4.5 parts, and the amount of the tackifier resin may be 10.5 parts, 11 parts, 11.5 parts, 12 parts, 12.5 parts, 13 parts, 13.5 parts, 14 parts or 14.5 parts, but the amount is not limited to the above-mentioned values, and other values not listed in the above-mentioned ranges of values are also applicable.
As a preferable technical scheme of the invention, the raw materials of the bonding module comprise the following components in parts by weight:
as a preferred embodiment of the present invention, the initiator includes any one of or a combination of at least two of benzoyl peroxide, sodium persulfate or azobisisoheptonitrile, and typical but non-limiting examples thereof are a combination of benzoyl peroxide and sodium persulfate, a combination of sodium persulfate and azobisisoheptonitrile, a combination of azobisisoheptonitrile and benzoyl peroxide, or a combination of benzoyl peroxide, sodium persulfate and azobisisoheptonitrile, and the like.
Preferably, the thixotropic agent comprises any one of fumed silica, magnesium aluminum silicate or calcium bentonite, or a combination of at least two of these, typical but non-limiting examples being: a combination of fumed silica and aluminum magnesium silicate, a combination of aluminum magnesium silicate and calcium bentonite, and a combination of calcium bentonite and fumed silica.
Another object of the present invention is to provide a method for preparing a solid adhesive block for tile attachment, the method comprising:
mixing the butyl acrylate, the methyl methacrylate, the lauryl methacrylate, the 2-cyano-2-ethyl acrylate, the 1-amino-3-cyclopentene and the initiator and then reacting to obtain a bonding matrix;
and mixing the bonding matrix with the additive to obtain the bonding module.
In a preferred embodiment of the present invention, the reaction temperature is 90 to 120 ℃, for example, 95 ℃, 100 ℃, 105 ℃, 110 ℃ or 115 ℃, but the reaction temperature is not limited to the recited values, and other values not recited in the above range are also applicable.
Preferably, the reaction time is 1 to 3 hours, such as 1.2 hours, 1.5 hours, 1.8 hours, 2 hours, 2.2 hours, 2.5 hours, or 2.8 hours, but not limited to the recited values, and other values not recited in the range of the values are also applicable.
In a preferred embodiment of the present invention, the rotation speed of mixing the adhesive base and the additive is 300 to 800rpm, such as 350rpm, 400rpm, 450rpm, 500rpm, 550rpm, 600rpm, 650rpm, 700rpm, or 750rpm, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned value range are also applicable.
Preferably, the mixing time is 1 to 3 hours, such as 1.2 hours, 1.5 hours, 1.8 hours, 2 hours, 2.2 hours, 2.5 hours, or 2.8 hours, but not limited to the recited values, and other values not recited in the range of the values are also applicable.
Compared with the prior art, the invention has at least the following beneficial effects:
the invention provides a solid bonding module for tile paving and a preparation method thereof, wherein the solid bonding module can keep stable in the transportation and storage processes, can be rapidly bonded with a wall body and tiles when external stress is received, and has excellent bonding strength.
Detailed Description
For the purpose of facilitating an understanding of the present invention, the present invention will now be described by way of examples. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
The embodiment provides a solid bonding module for paving ceramic tiles, which comprises the following raw materials in parts by weight:
the preparation method comprises the following steps:
mixing the butyl acrylate, the methyl methacrylate, the lauryl methacrylate, the 2-cyano-2 ethyl acrylate, the 1-amino-3-cyclopentene and the benzoyl peroxide according to the formula, and reacting at 90 ℃ for 3 hours to obtain a bonding matrix;
the bonding matrix was mixed with fumed silica and tackifying resin at 300rpm for 3h to obtain the bonding module.
Example 2
The embodiment provides a solid bonding module for paving ceramic tiles, which comprises the following raw materials in parts by weight:
the preparation method comprises the following steps:
mixing the butyl acrylate, the methyl methacrylate, the lauryl methacrylate, the 2-cyano-2 ethyl acrylate, the 1-amino-3-cyclopentene and the azobisisoheptonitrile according to the formula, and reacting at 120 ℃ for 1h to obtain a bonding matrix;
the bonding matrix was mixed with the fumed silica and tackifying resin at 800rpm for 1h to obtain the bonding module.
Example 3
The embodiment provides a solid bonding module for paving ceramic tiles, which comprises the following raw materials in parts by weight:
the preparation method comprises the following steps:
mixing the butyl acrylate, the methyl methacrylate, the lauryl methacrylate, the 2-cyano-2 ethyl acrylate, the 1-amino-3-cyclopentene and the sodium persulfate according to the formula, and reacting at 110 ℃ for 2 hours to obtain a bonding matrix;
and mixing the bonding matrix with aluminum magnesium silicate and tackifying resin at 500rpm for 2h to obtain the bonding module.
Example 4
The embodiment provides a solid bonding module for paving ceramic tiles, which comprises the following raw materials in parts by weight:
the preparation method comprises the following steps:
mixing the butyl acrylate, the methyl methacrylate, the lauryl methacrylate, the 2-cyano-2 ethyl acrylate, the 1-amino-3-cyclopentene and the sodium persulfate according to the formula, and reacting at 110 ℃ for 2 hours to obtain a bonding matrix;
and mixing the bonding matrix with aluminum magnesium silicate and tackifying resin at 500rpm for 2h to obtain the bonding module.
Example 5
The embodiment provides a solid bonding module for paving ceramic tiles, which comprises the following raw materials in parts by weight:
the preparation method comprises the following steps:
mixing the butyl acrylate, the methyl methacrylate, the lauryl methacrylate, the 2-cyano-2 ethyl acrylate, the 1-amino-3-cyclopentene and the sodium persulfate according to the formula, and reacting at 110 ℃ for 2 hours to obtain a bonding matrix;
and mixing the bonding matrix with aluminum magnesium silicate and tackifying resin at 500rpm for 2h to obtain the bonding module.
Comparative example 1
This comparative example was conducted under the same conditions as in example 5 except that ethyl 2-cyano-2-acrylate was replaced with butyl acrylate of an equal mass.
Comparative example 2
This comparative example is identical to example 5 except that 1-amino-3-cyclopentene was replaced with an equal mass of butyl acrylate.
Comparative example 3
This comparative example was conducted under the same conditions as in example 5 except that the polyhydroxybenzophenone was replaced with a tackifying resin of equal quality.
Comparative example 4
This comparative example was the same as example 5 except that the rheological agent was replaced with an equal mass of tackifying resin.
The adhesive strength of examples 1 to 5 and comparative examples 1 to 4 was tested to bond commercially available tiles and general walls. The test was carried out with the application of external stress (application manner: hammer blow, force: 100N, frequency: 1Hz, time: 0.5min), without the application of external stress, and with the adhesive module placed on a shaker for 30min (simulated transport environment), respectively, and the results are shown in Table 1. The test method is GB-T12954-2008.
TABLE 1
As can be seen from the test results in table 1, the bonding modules prepared in examples 1 to 5 of the present invention have good adhesion when bonding ordinary tiles and cavities. When no stress exists, the bonding strength is low, the bonding can be quickly carried out after stress is applied, the bonding strength is high after bonding, and the bonding module is hardly influenced by transportation. Comparative example 1, comparative example 2 and comparative example 3, in which ethyl 2-cyano-2-acrylate, 1-amino-3-cyclopentene and polyhydroxybenzophenone were not added, respectively, resulted in a decrease in adhesive strength, and it can be seen that the addition of the above components can improve the adhesive module to have an adhesive effect. Comparative example 4 no thixotropic agent was added and the bonded module could not be restored to its original state after stress was applied, resulting in a great decrease in bonding strength.
The applicant states that the present invention is illustrated by the above examples to show the detailed process equipment and process flow of the present invention, but the present invention is not limited to the above detailed process equipment and process flow, i.e. it does not mean that the present invention must rely on the above detailed process equipment and process flow to be implemented. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. A solid bonding module for tile tiling, the bonding module comprising: butyl acrylate, methyl methacrylate, lauryl methacrylate, 2-cyano-2-ethyl acrylate, 1-amino-3-cyclopentene, an initiator, and an additive.
2. The bonding module of claim 1, wherein the butyl acrylate is present in an amount of 25 to 35 parts by weight;
preferably, the weight part of the methyl methacrylate is 20-30 parts;
preferably, the weight part of the lauryl methacrylate is 2-5 parts.
3. The bonding module of claim 1 or 2, wherein the ethyl 2-cyano-2-acrylate is present in an amount of 5 to 10 parts by weight;
preferably, the weight part of the 1-amino-3-cyclopentene is 5-10 parts;
preferably, the initiator is 0.5-1 part by weight.
4. The adhesive module of any of claims 1-3 wherein the additives are polyhydroxy benzophenones, thixotropic agents, and tackifying resins;
preferably, the weight part of the thixotropic agent is 1-3 parts.
5. The bonding module of claim 4, wherein the raw materials of the bonding module comprise, in parts by weight:
6. the bonding module of claim 5, wherein the raw materials of the bonding module comprise, in parts by weight:
7. the bonding module of any one of claims 4-6, wherein the initiator comprises any one of benzoyl peroxide, sodium persulfate, or azobisisoheptonitrile, or a combination of at least two thereof;
preferably, the thixotropic agent comprises any one of fumed silica, magnesium aluminum silicate or calcium bentonite, or a combination of at least two thereof.
8. A method of making a bonded module according to any of claims 1-7, comprising:
mixing the butyl acrylate, the methyl methacrylate, the lauryl methacrylate, the 2-cyano-2-ethyl acrylate, the 1-amino-3-cyclopentene and the initiator and then reacting to obtain a bonding matrix;
and mixing the bonding matrix with the additive to obtain the bonding module.
9. The preparation method according to claim 8, wherein the reaction temperature is 90-120 ℃;
preferably, the reaction time is 1-3 h.
10. The preparation method according to claim 8, wherein the mixing speed of the bonding matrix and the additive is 300-800 rpm;
preferably, the mixing time is 1-3 h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111579566.0A CN114214003A (en) | 2021-12-22 | 2021-12-22 | Solid bonding module for paving and pasting ceramic tiles and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111579566.0A CN114214003A (en) | 2021-12-22 | 2021-12-22 | Solid bonding module for paving and pasting ceramic tiles and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN114214003A true CN114214003A (en) | 2022-03-22 |
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| CN202111579566.0A Pending CN114214003A (en) | 2021-12-22 | 2021-12-22 | Solid bonding module for paving and pasting ceramic tiles and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105189679A (en) * | 2013-02-26 | 2015-12-23 | 汉高股份有限及两合公司 | Hot melt adhesive comprising cyanoacrylate curing compounds |
| CN107488426A (en) * | 2017-09-07 | 2017-12-19 | 武汉市华林粘合剂有限公司 | A kind of water-based tile adhesives and preparation method thereof |
| CN107916083A (en) * | 2016-10-10 | 2018-04-17 | 湖南神力铃胶粘剂制造有限公司 | A kind of one pack system stone material waterproof back mesh glue and preparation method |
| CN110467883A (en) * | 2019-08-31 | 2019-11-19 | 巴壁虎(深圳)建材有限公司 | A kind of superpower ceramic tile bond |
-
2021
- 2021-12-22 CN CN202111579566.0A patent/CN114214003A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105189679A (en) * | 2013-02-26 | 2015-12-23 | 汉高股份有限及两合公司 | Hot melt adhesive comprising cyanoacrylate curing compounds |
| CN107916083A (en) * | 2016-10-10 | 2018-04-17 | 湖南神力铃胶粘剂制造有限公司 | A kind of one pack system stone material waterproof back mesh glue and preparation method |
| CN107488426A (en) * | 2017-09-07 | 2017-12-19 | 武汉市华林粘合剂有限公司 | A kind of water-based tile adhesives and preparation method thereof |
| CN110467883A (en) * | 2019-08-31 | 2019-11-19 | 巴壁虎(深圳)建材有限公司 | A kind of superpower ceramic tile bond |
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