CN114200786B - Digital laser direct-writing exposure machine partition alignment method - Google Patents

Digital laser direct-writing exposure machine partition alignment method Download PDF

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Publication number
CN114200786B
CN114200786B CN202111671014.2A CN202111671014A CN114200786B CN 114200786 B CN114200786 B CN 114200786B CN 202111671014 A CN202111671014 A CN 202111671014A CN 114200786 B CN114200786 B CN 114200786B
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Prior art keywords
exposure
exposure machine
alignment
points
mark points
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CN114200786A (en
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白国梁
梅文辉
汪孝军
罗覃东
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Zhongshan Xinnuo Microelectronics Co ltd
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Zhongshan Aiscent Technologies Co ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention discloses a zoning alignment method of a digital laser direct writing exposure machine. The method comprises the following steps: s1, manufacturing primary exposure data, wherein a plurality of mark points are arranged on two sides of a rectangular primary exposure image according to a camera field of view; s2, exposing the substrate with exposure data once on a first exposure machine; s3, manufacturing secondary exposure data; s4, selecting four corner mark points as counterpoint points to generate counterpoint data; s5, adding alignment points according to the scanning axis track of the primary exposure machine; s6, placing the substrate on a second exposure machine, and acquiring actual coordinate data of mark points serving as counterpoint points on the substrate through a counterpoint camera; and S7, carrying out partition alignment expansion, rotation and offset on the secondary exposure pattern according to the actual coordinate data and the theoretical coordinate data of the mark point serving as the opposite point, so that the secondary exposure pattern is attached to the primary exposure pattern.

Description

Digital laser direct-writing exposure machine partition alignment method
Technical Field
The invention relates to the technical field of digital laser direct writing exposure, in particular to a zonal alignment method of a digital laser direct writing exposure machine.
Background
The laser direct-writing exposure machine generally needs to perform a first exposure on the material, and then needs to perform a second exposure after a certain process flow, and the second exposure generally needs to perform alignment exposure on the original basis. The alignment exposure needs to grasp a plurality of Mark points in the primary exposure pattern by a camera to perform alignment, and the translation, rotation and expansion and contraction of the secondary exposure pattern are performed by the difference value between the theoretical position and the actual position of the spot.
In general, four-point alignment is adopted for alignment, and Mark points are distributed on the rectangular graph and are close to four vertexes as much as possible. However, the laser scanning axis is reflected as a curve in a certain precision, and the linearity of the scanning axis is inconsistent, so that the situation that the four-point alignment exposure is not locally aligned is caused.
Disclosure of Invention
It is an object of the present invention to provide a method which overcomes or at least alleviates at least one of the above-mentioned disadvantages of the prior art.
In order to achieve the above purpose, the present invention provides a method for aligning a digital laser direct writing exposure machine in a partitioned manner, the method comprising:
s1, manufacturing one-time exposure data, wherein a plurality of mark points (as shown in figure I) are arranged on two sides of a rectangular one-time exposure image according to a camera field of view;
the plurality of mark points comprise 4 corner mark points and middle mark points positioned between the corner mark points;
namely, setting the distance between adjacent mark points so that only one mark point appears at a time in the field of view of the alignment camera;
s2, exposing the substrate with one exposure data (a plurality of mark points are also exposed on the substrate) on a first exposure machine;
s3, manufacturing secondary exposure data;
s4, selecting four corner mark points as counterpoint points to generate counterpoint data; (selecting four corner mark points of the primary exposure data and four corner mark points of the secondary exposure data on the substrate)
S5, adding alignment points according to the scanning axis track of the primary exposure machine; ( Specifically, on the basis of 4 corner mark points, middle pairs of points are added; in effect, a portion of the mark points in S1 is selected as the added intermediate alignment points )
S6, placing the substrate on a second exposure machine, and acquiring actual coordinate data of mark points serving as counterpoint points on the substrate through a counterpoint camera;
s7, carrying out partition alignment expansion, rotation and offset on the secondary exposure pattern according to the actual coordinate data and the theoretical coordinate data of the mark point serving as the alignment point, so that the secondary exposure pattern is attached to the primary exposure pattern;
s8, exposing the substrate on a second exposure machine to obtain a secondary exposure pattern which is subjected to regional alignment expansion, rotation and offset.
Preferably, in S5, mark points close to the peaks and valleys of the scanning axis track of the primary exposure machine are selected as alignment points.
Preferably, mark points are added as alignment points according to the number of peaks and troughs of the scanning axis track of the primary exposure machine.
Preferably, in S1, the distance between adjacent mark points is set to be equal to or greater than a set threshold value, so that only one mark point appears at a time in the field of view of the alignment camera.
Preferably, in S1, the distance between adjacent mark points is set to be in the range of 1.5D-3D, where D is the field of view diameter of the alignment camera. (the alignment camera herein specifically refers to an alignment camera on the second machine)
Preferably, the scanning axis trajectory of the primary exposure machine is measured using a laser interferometer and laser interferometer measurement software.
Preferably, the scan axis trajectory of the primary exposure machine is measured in the following way: and scanning the edge of the primary exposure pattern in the scanning exposure direction by using a camera on the secondary exposure machine, and grabbing enough point coordinates of the edge of the primary exposure pattern by using an image recognition algorithm to form a scanning axis track of the primary exposure machine.
The method can improve the efficiency and the alignment precision; moreover, the high-precision alignment exposure can be compatible for different machines.
Drawings
FIG. 1 is a schematic diagram of one-time theoretical exposure data.
Fig. 2 is a schematic diagram of a one-time actual exposure pattern.
FIG. 3 is a diagram of the second theoretical exposure data.
FIG. 4 is a schematic diagram of a mark point selected from the second theoretical exposure data.
FIG. 5 is a flow chart of a method for zone alignment of a digital laser direct write exposure machine according to one embodiment of the invention.
Detailed Description
And (3) identifying and calculating coordinates by using a camera through the Mark points reserved in the primary exposure pattern, and performing secondary exposure of the designated coordinate positions, namely para-exposure.
The zoning alignment method of the digital laser direct writing exposure machine comprises the following steps.
S1, manufacturing or designing one-time exposure data, wherein a plurality of mark points are arranged on two sides of a rectangular one-time exposure image according to a camera field of view (as shown in figure 1). The plurality of mark points includes 4 corner mark points A1, A2, A3, A4, and an intermediate mark point located between the corner mark points.
Four corner Mark points are distributed at positions, close to four vertexes, of the rectangular graph as far as possible.
In the illustrated embodiment, the middle mark points include B1, B2, B3, B4, B5, B6, B7 on the left side of FIG. 1, and C1, C2, C3, C4, C5, C6, C7 on the right side. It is to be noted that the number of intermediate mark points on one side is not limited to 7, but may be set to 2 or more. Typically the number of intermediate mark points on one side is greater than 5.
Setting as many intermediate mark points as possible is beneficial to improving the alignment accuracy under the condition that the vision of the alignment camera is allowed. In other words, the distribution of the data of one exposure on two sides of the rectangular chart is convenient for selecting the corresponding Mark points according to the peaks and valleys of the scanning axis track during the partition alignment because of the more points distributed according to the field of view of the camera, as shown in fig. 2.
That is, in an alternative embodiment, in S1, the distance between adjacent mark points (generally, adjacent mark points on the same side) is set to be equal to or greater than a set threshold value, so that only one mark point appears at a time in the field of view of the alignment camera. This is advantageous in avoiding mark point grabbing errors by the alignment camera. Further, in S1, the distance between the adjacent mark points may be set in the range of 1.5D-3D, where D is the field of view diameter of the alignment camera. The alignment camera is an alignment camera on the second exposure machine.
S2, exposing the substrate with the exposure data once on the first exposure machine. It will be appreciated that a plurality of mark points above are also exposed on the substrate.
Referring to fig. 2, during exposure, mark points on both sides may not be in a straight line because the scanning axis movement track is not an exact straight line.
S3, manufacturing or designing secondary exposure data. Two sides of the double exposure pattern of the double exposure data are also provided with a plurality of mark points (as shown in fig. 3). The plurality of mark points includes 4 corner mark points a1, a2, a3, a4, and an intermediate mark point located between the corner mark points. In the illustrated embodiment, the middle mark points include b1, b2, b3, b4, b5, b6, b7 on the left side of fig. 1, and c1, c2, c3, c4, c5, c6, c7 on the right side. It is to be noted that the number of intermediate mark points on one side is not limited to 7, but may be set to 2 or more. Typically the number of intermediate mark points on one side is greater than 5.
In an alternative embodiment, the number of intermediate mark points in the secondary exposure data and the positions of the intermediate mark points correspond to, or are the same as, the number of intermediate mark points in the primary exposure data.
S4, selecting four corner mark points as counterpoint points to generate counterpoint data. Specifically, four corner mark points of the primary exposure data and four corner mark points of the secondary exposure data on the substrate are selected.
S5, adding alignment points according to the scanning axis track of the primary exposure machine.
That is, the middle pair of sites is added on the basis of 4 corner mark points. In effect, a portion of the intermediate mark points in S2 are selected for use as incremental intermediate pair points, corresponding to the intermediate mark points in S3.
S6, placing the substrate on a second exposure machine, and acquiring actual coordinate data of mark points serving as opposite points on the substrate through an opposite camera.
And S7, carrying out partition alignment expansion, rotation and offset on the secondary exposure pattern according to the actual coordinate data and the theoretical coordinate data of the mark point serving as the opposite point, so that the secondary exposure pattern is attached to the primary exposure pattern.
S8, exposing the substrate on a second exposure machine to obtain a secondary exposure pattern which is subjected to regional alignment expansion, rotation and offset.
Preferably, in S5, mark points close to the peaks and valleys of the scanning axis track of the primary exposure machine are selected as alignment points. Namely B2, B2, C2, C2, B4, B4, C4 c4, B6, C6 as alignment sites.
That is, in some embodiments of the present invention, mark points are added as alignment points according to the number of peaks and valleys of the scanning axis track of the one-shot exposure machine.
The scanning axis trajectory of the primary exposure machine can be measured using a laser interferometer and laser interferometer measurement software.
The scanning axis track of the primary exposure machine can also be measured by the following method: and scanning the edge of the primary exposure pattern in the scanning exposure direction by using a camera on the secondary exposure machine, and grabbing enough point coordinates of the edge of the primary exposure pattern by using an image recognition algorithm to form a scanning axis track of the primary exposure machine.
The method can improve the efficiency and the alignment precision; moreover, the high-precision alignment exposure can be compatible for different machines.
And measuring the scanning axis direction edge of the primary exposure pattern by using a secondary alignment exposure machine camera to obtain a curve. Calculating the number of wave crests and wave troughs of the curve, and simulating Mark points for the wave crests and the wave troughs. Before the second alignment exposure, four Mark points are selected for the alignment data, and the Mark points are distributed near four vertexes of the rectangular graph as much as possible. And during automatic alignment, mark points closest to the wave crest and the wave trough of the scanning axis track are selected to identify and record coordinates except for the four Mark points.
And transmitting all the identified Mark point data to a server, and carrying out regional alignment expansion and contraction and designated coordinate exposure.
The scanning axis tracks have consistency, so that each measurement is not needed for the exposure image of the same machine. The scanning axis tracks have consistency, so that the same data exposed by the same machine can share the same set of theoretical alignment point data.
Before the second alignment exposure, the alignment data need to select Mark points closest to the peak and trough of the scanning axis track for identifying and recording coordinates except four Mark points when automatic alignment is needed.
And transmitting all the identified Mark point data to a server, and carrying out regional alignment expansion and contraction and designated coordinate exposure.
The embodiment of the invention provides a method for dividing and aligning Mark points on a simulation track according to a scanning axis moving track. The alignment method has the advantages that 4 cameras are identified, the rest Mark points are calculated and simulated according to the scanning axis track of the current machine and the scanning track of the exposure machine, so that the efficiency is improved, the alignment precision is improved, and the compatibility of high-precision alignment exposure of different machines is realized.
Finally, it should be pointed out that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting. Those of ordinary skill in the art will appreciate that: the technical schemes described in the foregoing embodiments may be modified or some of the technical features may be replaced equivalently; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (7)

1. The zonal alignment method of the digital laser direct writing exposure machine is characterized by comprising the following steps of:
s1, manufacturing one-time exposure data, wherein a plurality of mark points are arranged on two sides of a rectangular one-time exposure image according to a camera field of view, and each of the plurality of mark points comprises 4 corner mark points and a middle mark point positioned between the corner mark points;
s2, exposing the substrate with exposure data once on a first exposure machine;
s3, manufacturing secondary exposure data;
s4, selecting four corner mark points as counterpoint points to generate counterpoint data;
s5, adding alignment points according to the scanning axis track of the primary exposure machine;
s6, placing the substrate on a second exposure machine, and acquiring actual coordinate data of mark points serving as counterpoint points on the substrate through a counterpoint camera;
s7, carrying out partition alignment expansion, rotation and offset on the secondary exposure pattern according to the actual coordinate data and the theoretical coordinate data of the mark point serving as the alignment point, so that the secondary exposure pattern is attached to the primary exposure pattern;
s8, exposing the substrate on a second exposure machine to obtain a secondary exposure pattern which is subjected to regional alignment expansion, rotation and offset.
2. The method for aligning a digital laser direct writing exposure machine according to claim 1, wherein in S5, mark points close to the peak and the trough of the scanning axis trace of the primary exposure machine are selected as alignment points.
3. The method for aligning the digital laser direct-writing exposure machine according to claim 2, wherein Mark points are added as alignment points according to the number of peaks and troughs of the scanning axis track of the one-time exposure machine.
4. The method for aligning a digital laser direct-write exposure machine in accordance with claim 1, wherein in S1, a distance between adjacent mark points is set to be equal to or greater than a set threshold value, so that only one mark point appears at a time in a field of view of an alignment camera.
5. The method for zoned alignment of a digital laser direct-write exposure machine according to claim 4, wherein in S1, a distance between adjacent mark points is set to be in a range of 1.5D-3D, where D is a field diameter of an alignment camera.
6. The method for aligning the digital laser direct writing exposure machine according to claim 1, wherein the scanning axis track of the primary exposure machine is measured by using a laser interferometer and laser interferometer measuring software.
7. The method for aligning the digital laser direct writing exposure machine according to claim 1, wherein the scanning axis track of the primary exposure machine is measured by the following method: and scanning the edge of the primary exposure pattern in the scanning exposure direction by using a camera on the secondary exposure machine, and grabbing enough point coordinates of the edge of the primary exposure pattern by using an image recognition algorithm to form a scanning axis track of the primary exposure machine.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483571B1 (en) * 1998-04-22 2002-11-19 Nikon Corporation Exposure apparatus and method for transferring a pattern from a plurality of masks onto at least one substrate
CN105307397A (en) * 2015-09-16 2016-02-03 广州美维电子有限公司 Circuit board exposure method and device
CN106154768A (en) * 2016-07-01 2016-11-23 无锡中微掩模电子有限公司 A kind of ic substrate re-expose method based on mask plate
CN113589656A (en) * 2021-07-06 2021-11-02 中山新诺科技股份有限公司 Roll-to-roll double-sided digital laser direct writing exposure machine and exposure alignment method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483571B1 (en) * 1998-04-22 2002-11-19 Nikon Corporation Exposure apparatus and method for transferring a pattern from a plurality of masks onto at least one substrate
CN105307397A (en) * 2015-09-16 2016-02-03 广州美维电子有限公司 Circuit board exposure method and device
CN106154768A (en) * 2016-07-01 2016-11-23 无锡中微掩模电子有限公司 A kind of ic substrate re-expose method based on mask plate
CN113589656A (en) * 2021-07-06 2021-11-02 中山新诺科技股份有限公司 Roll-to-roll double-sided digital laser direct writing exposure machine and exposure alignment method

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