CN114199806B - Method for detecting organic matter distribution on micro-nano roughened copper foil surface by AFM-IR - Google Patents
Method for detecting organic matter distribution on micro-nano roughened copper foil surface by AFM-IR Download PDFInfo
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- CN114199806B CN114199806B CN202111513883.2A CN202111513883A CN114199806B CN 114199806 B CN114199806 B CN 114199806B CN 202111513883 A CN202111513883 A CN 202111513883A CN 114199806 B CN114199806 B CN 114199806B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 239000011889 copper foil Substances 0.000 title claims abstract description 45
- 238000009826 distribution Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000005416 organic matter Substances 0.000 title abstract description 8
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 32
- 238000002329 infrared spectrum Methods 0.000 claims abstract description 10
- 238000001514 detection method Methods 0.000 claims abstract description 8
- 238000001228 spectrum Methods 0.000 claims abstract description 8
- 238000000862 absorption spectrum Methods 0.000 claims abstract description 4
- 238000004630 atomic force microscopy Methods 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 claims abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 5
- 239000011888 foil Substances 0.000 description 9
- 239000000523 sample Substances 0.000 description 6
- 238000004566 IR spectroscopy Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000012512 characterization method Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- -1 polydithio-dipropyl Polymers 0.000 description 3
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 2
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3563—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing solids; Preparation of samples therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
- G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
Abstract
The method for detecting micro-nano rough copper foil surface organic matter distribution by AFM-IR comprises the steps of carrying out infrared spectrum full spectrum scanning on any point on the surface of a copper foil for a PCB (printed circuit board) by using an atomic force microscopy imaging-infrared spectrum technology, obtaining an infrared characteristic absorption spectrum of a silane coupling agent adsorbed on the surface of the copper foil, selecting a characteristic peak with the maximum intensity of the silane coupling agent in the spectrum as an infrared detection wavelength of AFM-IR, then scanning a 5 mu m x 5 mu m region by using the detection wavelength to obtain signal intensity distribution data of the silane coupling agent in the region, carrying out data processing by using data processing software, generating a three-dimensional distribution image of the silane coupling agent on the surface of the copper foil, and representing the space distribution state of the silane coupling agent.
Description
Technical Field
The invention relates to a method for detecting trace organic matter distribution on the surface of a metal foil by using atomic force microscopy imaging-infrared spectroscopy (AFM-IR), in particular to a method for detecting coupling agent distribution on the rugged surface of a copper foil for a high-frequency high-speed Printed Circuit Board (PCB).
Background
Characterization of trace amounts of organics on the surface of metal foils (aluminum foil, copper foil, silver foil, gold foil, etc.), in the past, methods of in situ infrared ATR of surfaces have been used, characterized by average infrared spectral signal distribution in a regionThe spatial resolution is 5 μm, and the distribution of the nanometer resolution of trace organic matters cannot be accurately measured. Patent document 1: CN 108603303 reports the measurement of the adhesion amount of silane on the surface of copper foil by using a fluorescent X-ray analyzer. The concentration limit of the measured sample of the total reflection X-ray fluorescence spectrum can reach 10 -3 -10 -6 Mu g/g, but this method measures 500 μm in the range of low spatial resolution. The surface of the copper foil for PCB has micro-nano roughness (surface roughness Rz of 0.1 μm to 1.5 μm), and none of the conventional analysis methods can characterize the ultra-high resolution spatial distribution on the concave-convex surface.
The ultra-low profile copper foil is one of the basic materials of high frequency and high speed Printed Circuit Boards (PCBs) for 5G communication, and the enhancement of the adhesion performance between the copper foil and the resin matrix in the PCBs becomes an important influencing factor in industrial applications. In the existing copper foil production process, various additives are added during electrolytic production of the copper foil, and common additives comprise sodium polydithio-dipropyl Sulfonate (SP), hydroxyethyl cellulose (HEC), polyethylene glycol (PEG), nonylphenol polyoxyethylene ether, fatty amine ethoxy sulfonate, rare earth salt, gelatin, thiourea and the like. At present, the surface of the copper foil is mainly treated by using a silane coupling agent to enhance the adhesive property of the copper foil, and an additive added in the electrolytic process can be adsorbed on the surface of the copper foil to influence the enhancing effect of the silane coupling agent on the adhesive property of the surface of the copper foil. Infrared spectroscopy is a common characterization means for detecting organic structures. The intensity of the infrared spectrum peak of the organic matter can be used to describe the relative content of the organic matter. However, the diffraction limit of the conventional optical device is limited, the spatial resolution of the infrared spectrometer is only about 5 μm, the type and the content of the total organic matters existing in the region can be expressed, and the stereoscopic distribution on the concave-convex surface cannot be measured. Patent document 2: CN 110366686A, no thickness distribution of the organic coating on the micro-nano roughness surface is reported.
Disclosure of Invention
The purpose of the invention is that: the distribution of trace organic matters on the surface of the metal foil (aluminum foil, copper foil, silver foil, gold foil and the like) is detected by using AFM-IR, and the distribution characteristics are analyzed on a nanoscale scale.
Method for detecting organic matter distribution on micro-nano roughened copper foil surface by AFM-IRComprising the steps of: performing infrared spectrum full spectrum scanning on a plurality of points on the surface of the copper foil for the PCB by using an AFM-IR technology to obtain an infrared characteristic absorption spectrum of a silane coupling agent adsorbed on the surface of the copper foil, and selecting a characteristic peak 1720cm with the maximum intensity of the silane coupling agent in the spectrum -1 As the infrared detection wavelength of AFM-IR, an arbitrary 5 μm by 5 μm region was scanned with this wavelength to obtain distribution data of the silane coupling agent in the region, while simultaneously measuring the surface morphology of the region using an atomic force microscope in the technique for AFM-IR. Data processing is carried out by using Surface Works software of the instrument, and the measured morphology of the copper foil Surface and the characteristic infrared spectrum peak 1720cm of the silane coupling agent are measured -1 The Surface Works software can automatically generate 1720cm of the silane coupling agent by combining the spatial distribution data of the silane coupling agent -1 A three-dimensional stereo distribution image of intensity. 1720cm of silane coupling agent -1 The relative intensity of the characteristic peak represents the relative thickness of the silane coupling agent at the point, and the relative thickness of the silane coupling agent on the surface of the copper foil is determined by the method, so that the space distribution state of the silane coupling agent on the micro-nano rough surface is represented.
All AFM-IR experiments in the present invention were performed on a VistaScope Vista-IR microscope.
Principle based on atomic force microscopy-infrared spectroscopy (AFM-IR):
AFM-IR combines atomic force microscopy with infrared spectroscopy, utilizes light induced force technology, obtains local polarization of a sample by enhanced illumination of a tip, and uses an atomic force microscope probe with ultra-high sensitivity to measure local polarization force between a tip and the sample, wherein the local polarization force reflects near-field optical interaction between the tip and the sample. This method replaces the conventional optical detection method. The application of the photoinduction force technology greatly improves the resolution of the infrared spectrum, and the spatial resolution is about 10nm, so that the device can detect the distribution condition of different organic matters on the same position on the surface of the sample. The type of the organic matter is judged according to the relation between the wavelength of the infrared absorption peak and the corresponding group. By detecting the relative intensity of the absorption peak, the relative content of the organic matters is obtained, and the distribution state of the organic matters is obtained.
The high-frequency high-speed PCB for 5G communication can use the copper foil with ultra-low profile, and in order to meet the specific requirements of use, the surface of the copper foil needs to be subjected to ultra-fine roughening treatment, and the treatment mode can enable the surface of the copper foil to have uneven morphology. The surface of the copper foil is treated by using a silane coupling agent, and the distribution of the silane coupling agent on different morphologies of the surface of the copper foil influences the adhesive property of the copper foil.
The method has the advantages that:
the AFM-IR technology is utilized to detect the surface morphology of the copper foil and the distribution state of the silane coupling agent, and the basis is provided for improving the adhesion performance between the copper foil and the substrate.
The method can be widely applied to the distribution detection of trace organic matters on the surfaces of aluminum foils, silver foils, gold foils and other metal foils.
Drawings
Fig. 1: AFM-IR detection of infrared spectrogram of copper foil surface after silane coupling agent treatment
Fig. 2: at 1720cm -1 Three-dimensional distribution of characteristic peak infrared intensity characterization copper foil surface silane coupling agent
The specific implementation method comprises the following steps:
examples
Selecting copper foil with the surface roughness Rz of 1.5-1.8 mu m, coating a silane coupling agent acryloxypropyl trimethoxy silane according to a common spraying method, cutting the copper foil into squares with the side length of 2em, washing the surface with water, and drying to obtain the washed copper foil. AFM-IR experiments were all performed on vistas-IR (Molecular Vista, U.S.A.). And carrying out infrared spectrum full spectrum scanning on any point on the surface of the copper foil to obtain a complete infrared absorption spectrum of the silane coupling agent acryloyloxy propyl trimethoxy silane. Then, different infrared absorption peak wavelengths were selected to scan a 5 μm×5 μm region to obtain distribution data thereof. Data processing was performed using Surface Works software on the instrument itself. The surface topography of the copper foil and the three-dimensional graph of the infrared intensity distribution are shown in FIG. 2, wherein different colors in the three-dimensional graph of the infrared distribution represent carbonyl stretching vibration absorption peaks (1720) in the infrared spectrum of the silane coupling agent on the surface of the copper foilcm -1 ) The greater the strength and the greater the relative strength, the darker the color, indicating that the thicker the deposition of the silane coupling agent was at that location on the copper foil surface.
Claims (1)
1. A method for detecting the distribution of organic matters on the surface of micro-nano roughened copper foil by AFM-IR is characterized by using atomic force microscopy principle to detect infrared spectrum, carrying out infrared spectrum full spectrum scanning on any point on the surface of copper foil used by a high-frequency high-speed printed circuit board, obtaining an infrared characteristic absorption spectrum of a silane coupling agent adsorbed on the surface of the copper foil, selecting a characteristic peak with the maximum intensity of the silane coupling agent in the spectrum as an infrared detection wavelength of AFM-IR, then scanning a 5 mu m x 5 mu m region by using the detection wavelength to obtain signal intensity distribution data of the silane coupling agent in the region, carrying out data processing by using data processing software, automatically generating three-dimensional distribution images of the silane coupling agent on the surface of the copper foil by the data processing software, determining the relative thickness of the silane coupling agent on different positions on the surface of the copper foil, and characterizing the spatial distribution of the silane coupling agent.
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Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005105158A (en) * | 2003-09-30 | 2005-04-21 | Choshun Jinzo Jushisho Kofun Yugenkoshi | Organic-inorganic hybrid film material and method for producing the same |
JP2007137041A (en) * | 2005-10-17 | 2007-06-07 | Hitachi Chem Co Ltd | Copper foil with adhesion assistant, printed wiring board and valuation method for curing degree |
JP2010212470A (en) * | 2009-03-11 | 2010-09-24 | Hitachi Cable Ltd | Copper foil for printed wiring board and method of manufacturing the same, and printed wiring board |
WO2011030626A1 (en) * | 2009-09-11 | 2011-03-17 | Jx日鉱日石金属株式会社 | Copper foil for lithium ion battery current collector |
JP2014208893A (en) * | 2013-03-28 | 2014-11-06 | 古河電気工業株式会社 | Surface-treated copper foil, method of treating surface of the copper foil, copper-clad laminate sheet and method of producing the laminate sheet |
JP2018122587A (en) * | 2017-02-02 | 2018-08-09 | 東レ株式会社 | Laminate and method for manufacturing the laminate |
CN108603303A (en) * | 2016-02-10 | 2018-09-28 | 古河电气工业株式会社 | Surface treatment copper foil and the copper-clad laminated board being fabricated using it |
CN110121644A (en) * | 2016-08-22 | 2019-08-13 | 布鲁克纳米公司 | It is characterized using the infrared light of the sample of oscillation mode |
JP2019155684A (en) * | 2018-03-12 | 2019-09-19 | 東レ株式会社 | Laminate film |
WO2019230569A1 (en) * | 2018-05-30 | 2019-12-05 | Agc株式会社 | Method for producing resin-clad metal foil, resin-clad metal foil, laminate, and printed circuit board |
JP2020181897A (en) * | 2019-04-25 | 2020-11-05 | 株式会社Sumco | Semiconductor wafer analysis method, semiconductor wafer manufacturing process evaluation method, and semiconductor wafer manufacturing method |
CN114107974A (en) * | 2021-12-10 | 2022-03-01 | 南京大学 | Process for coating silane coupling agent on surface of copper foil for PCB |
CN114182264A (en) * | 2021-12-10 | 2022-03-15 | 南京大学 | Method for removing trace impurities on surface of copper foil for PCB (printed Circuit Board) by using sodium carbonate/citric acid aqueous solution |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8869602B2 (en) * | 2007-05-15 | 2014-10-28 | Anasys Instruments Corp. | High frequency deflection measurement of IR absorption |
WO2019227101A1 (en) * | 2018-05-25 | 2019-11-28 | The Regents Of The University Of Colorado, A Body Corporate | Methods and systems for scanning probe sample property measurement and imaging |
JP7060276B2 (en) * | 2018-05-31 | 2022-04-26 | 国立大学法人大阪大学 | Joined body and its manufacturing method |
EP3847464A1 (en) * | 2018-09-06 | 2021-07-14 | Centre national de la recherche scientifique | System for measuring the absorption of a laser emission by a sample |
-
2021
- 2021-12-10 CN CN202111513883.2A patent/CN114199806B/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005105158A (en) * | 2003-09-30 | 2005-04-21 | Choshun Jinzo Jushisho Kofun Yugenkoshi | Organic-inorganic hybrid film material and method for producing the same |
JP2007137041A (en) * | 2005-10-17 | 2007-06-07 | Hitachi Chem Co Ltd | Copper foil with adhesion assistant, printed wiring board and valuation method for curing degree |
JP2010212470A (en) * | 2009-03-11 | 2010-09-24 | Hitachi Cable Ltd | Copper foil for printed wiring board and method of manufacturing the same, and printed wiring board |
WO2011030626A1 (en) * | 2009-09-11 | 2011-03-17 | Jx日鉱日石金属株式会社 | Copper foil for lithium ion battery current collector |
JP2014208893A (en) * | 2013-03-28 | 2014-11-06 | 古河電気工業株式会社 | Surface-treated copper foil, method of treating surface of the copper foil, copper-clad laminate sheet and method of producing the laminate sheet |
CN108603303A (en) * | 2016-02-10 | 2018-09-28 | 古河电气工业株式会社 | Surface treatment copper foil and the copper-clad laminated board being fabricated using it |
CN110121644A (en) * | 2016-08-22 | 2019-08-13 | 布鲁克纳米公司 | It is characterized using the infrared light of the sample of oscillation mode |
JP2018122587A (en) * | 2017-02-02 | 2018-08-09 | 東レ株式会社 | Laminate and method for manufacturing the laminate |
JP2019155684A (en) * | 2018-03-12 | 2019-09-19 | 東レ株式会社 | Laminate film |
WO2019230569A1 (en) * | 2018-05-30 | 2019-12-05 | Agc株式会社 | Method for producing resin-clad metal foil, resin-clad metal foil, laminate, and printed circuit board |
JP2020181897A (en) * | 2019-04-25 | 2020-11-05 | 株式会社Sumco | Semiconductor wafer analysis method, semiconductor wafer manufacturing process evaluation method, and semiconductor wafer manufacturing method |
CN114107974A (en) * | 2021-12-10 | 2022-03-01 | 南京大学 | Process for coating silane coupling agent on surface of copper foil for PCB |
CN114182264A (en) * | 2021-12-10 | 2022-03-15 | 南京大学 | Method for removing trace impurities on surface of copper foil for PCB (printed Circuit Board) by using sodium carbonate/citric acid aqueous solution |
Non-Patent Citations (12)
Title |
---|
5G PCB板材及基础核心原材料需求和挑战;高峰;《第二十一届中国覆铜板技术研讨会论文集》;第1-41页 * |
ARGET ATRP合成大分子偶联剂PMMA-b-PTMSPMA及其对玻璃表面的接枝;孙婷婷 等;《高分子材料科学与工程》;20130615;第29卷(第6期);第5-9页 * |
Hybrid joining of polyamide and hydrogenated acrylonitrile butadiene rubber through heat-resistant functional layer of silane coupling agent;Sang, Jing 等;《APPLIED SURFACE SCIENCE》;20170615;第412卷;第121-130页 * |
New method for chemical characterization of polymer materials in industrial devices : AFM-IR with FIB sample preparation;Baden, Naoki等;《PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS》;第496-499页 * |
Observation of nanoscale opto-mechanical molecular damping as the origin of spectroscopic contrast in photo induced force microscopy;Almajhadi, Mohammad A. 等;《NATURE COMMUNICATIONS》;20201216;第11卷(第1期);第5691页 * |
Surface Plasma Treatment of Polyimide Film for Cu Metallization;Cho, Sang-Jin 等;《JAPANESE JOURNAL OF APPLIED PHYSICS》;20110101;第50卷(第1期);第01AK02页 * |
Wang, Xiuli等.Self-assembled multilayer films of poor water-soluble copper(II) complexes constructed from dipyrido[3,2-d : 2 ',3 '-f]quinoxaline (Dpq) ligand as well as their fluorescent properties.《JOURNAL OF SOLID STATE CHEMISTRY》.2007,第180卷(第10期),第2950-2957页. * |
受限态对高分子的玻璃化转变及扩散行为影响的研究;李林玲;《中国博士学位论文全文数据库工程科技Ⅰ辑》(第6期);第B014-49页 * |
史浩飞 等.《石墨烯薄膜与柔性光电器件》.华东理工大学出版社,2021,(第1版),第123-126页. * |
基于振动光谱成像技术的聚合物共混体系研究进展;黎青霞 等;《光散射学报》;第27卷(第04期);第364-373页 * |
蓝宝石衬底上单晶InAlGaN外延膜的RF-MBE生长;王保柱 等;《半导体学报》;第27卷(第8期);第1382-1385页 * |
表面处理对三维浅交弯联机织复合材料界面及弯曲性能的影响;冯古雨 等;《宇航材料工艺》;20160415(第02期);第22-25页 * |
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