CN114193092A - Precision machining method for core part of semiconductor equipment - Google Patents
Precision machining method for core part of semiconductor equipment Download PDFInfo
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- CN114193092A CN114193092A CN202111474478.4A CN202111474478A CN114193092A CN 114193092 A CN114193092 A CN 114193092A CN 202111474478 A CN202111474478 A CN 202111474478A CN 114193092 A CN114193092 A CN 114193092A
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- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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Abstract
The invention discloses a precision machining method for a core part of semiconductor equipment, which comprises the steps of refining, CNC (computerized numerical control) roughing, ultra-deep cold and hot treatment, semi-finishing of appearance, CNC semi-precision machining, elimination of internal stress, fine grinding of the appearance of a workpiece, and finish milling and removing of a station foot of the workpiece.
Description
Technical Field
The invention relates to the field of military industry, semiconductors and medical instruments, in particular to the precision machining of multiple parts with high hardness, high flatness and high precision.
Background
In recent years, with the rapid development of science and technology in China, high-strength parts with higher rigidity, stronger toughness, high heat resistance, high pressure resistance and impact resistance are required in fields such as China Shangshi, flood dragon diving and Tiangong butt joint, China and household appliances, public transportation, biomedical treatment and the like, wherein machine tool cutting and grinding are the mainstream of current precision manufacturing in the precision manufacturing field, the hardness of parts directly determines the feasibility of cutting and machining of the parts, and the traditional machining method generally selects linear cutting or electric spark machining when parts with high hardness are subjected to linear cutting, wherein the linear cutting can only machine conductors, the machining speed is slow, and blind holes and blind grooves cannot be machined; electrode materials need to be replaced for 2 times when a part is produced, electric sparks can only machine conductors, machining speed is low, machining efficiency is low, electrode loss during batch machining is large, size of the part is easy to be out of tolerance, and certain defects exist.
Disclosure of Invention
The invention aims to provide a precision machining method for a core part of semiconductor equipment, which is used for precision machining of high-hardness parts in multiple fields such as military industry, semiconductors, medical instruments and the like, and aims to solve the problems in the background technology.
The invention achieves the aim through the following technical scheme, and the method for precisely processing the core part of the semiconductor equipment comprises the following steps: s1, opening the concentrated material, manually using a tool to detect whether the material and the size of the incoming material meet the requirements, detecting whether the incoming material has the bad conditions of collision, scratch, collision, deformation, bending, corrosion and the like, eliminating the bad incoming material, customizing a special size detection tool to detect whether the incoming material size is smaller than the required size when detecting the incoming material size, correspondingly classifying the incoming material with the bad conditions of collision, scratch, collision, deformation, bending, corrosion and the like, wherein the collision, scratch and collision are 'defective', the product cannot be repaired, the deformed, bent and corroded products are 'defective products', and the product can be repaired to be used as a good product;
s2, roughing the CNC, and processing the good product in the S1 by using a numerically controlled lathe, wherein the processed material standard is a sheet material with the shape single-side allowance of 0.3mm and the hole diameter reserved by 0.8-1 mm;
s3, ultra-deep cold and hot treatment, wherein ultra-deep cold and hot treatment equipment is used for carrying out deep cold heat treatment on the thin plate material in the step S2, and after the deep cold heat treatment, coarse grinding equipment is used for carrying out coarse grinding on the shape of the thin plate material;
s4, performing semi-finishing of the shape, using coarse grinding equipment to perform coarse grinding on the shape of the thin plate after deep cooling heat treatment, then performing semi-finishing, wherein the rough grinding shape is used as the reference of the semi-finishing by the semi-finishing, a grinding wheel used for the coarse grinding shape is a resin carborundum grinding wheel No. 120, the lower tool length is 0.01mm, after the coarse grinding, cleaning the workpiece after the coarse grinding is needed, and the modes of washing, wiping, blowing by an air gun and the like can be adopted;
s5, CNC semi-precision machining, wherein a numerical control milling machine is used for milling edges and holes of a sheet material in S4, during edge milling, the length and width of a single edge allowance is 0.05mm, the step chamfer allowance is 0.1-0.15mm, during hole milling, the fine hole allowance is 0.1-0.15mm, during machining, a stand foot for avoiding bending deformation of a workpiece caused by subsequent grinding machine machining is reserved, during machining of a large-area groove part, a support part reserved for avoiding elastic deformation of the back of a concave area during grinding machine machining is called as a stand foot, the number of the stand feet of the workpiece is distributed according to the material, the size and the size of the groove, and the stand foot is cylindrical;
s6, eliminating internal stress, namely tempering the semi-precision processed workpiece in the S5 in a tempering furnace to eliminate the internal stress, wherein the adopted tempering method is a tempering method after SUS440C quenching processing, the temperature of the tempering furnace is controlled to be 325-375 ℃, the tempering time is controlled to be 5 hours, and the workpiece is naturally cooled to normal temperature after tempering;
s7, performing finish grinding on the workpiece after tempering in S6 by using finish grinding equipment, wherein the finish grinding allowance in the length direction, the width direction and the thickness direction of the workpiece is 0.1mm during finish grinding, a grinding wheel used for finish grinding is a resin carborundum wheel 180#, the cutter setting amount is 0.001mm, the perpendicularity, the flatness and the parallelism of the workpiece after finish grinding are guaranteed to be within 0.02mm, and the workpiece can be cleaned by adopting a water washing or wiping mode after finish grinding;
s8, finish milling of the workpiece, wherein finish milling equipment is used for finish milling of the arc, step and chamfer position of the workpiece, after finish milling of the workpiece is completed, a boring cutter is replaced, finish boring is performed on the workpiece, when the arc, step and chamfer position of the workpiece are finish milled, the rotating speed of a machine tool spindle is 550rpm, and the whole process is fed at a constant speed;
and S9, removing the stand legs by using a numerical control machine, after removing the stand legs, fully inspecting the quality personnel according to the size and the requirement of the drawing, packaging and delivering the products according to the packaging requirement, fully inspecting the qualified products according to the size and the requirement of the drawing, packaging and delivering the products according to the packaging requirement, fully inspecting the unqualified products, filling abnormal orders, and coordinating evaluation and processing of all processing departments.
Preferably, in the steps S5 and S8, the whole process is performed by using a high-hardness alloy milling cutter and a chamfering cutter, the whole process is performed at a constant speed, and the cutter feeding amount is strictly controlled to prevent the workpiece from deforming.
The invention matches the numerical control processing with the ultra-deep cold and hot treatment and the tempering process, compared with the processing mode of melting metal by electrode discharge, the production efficiency is greatly improved, the processing cost is reduced, and the numerical control processing mode is adopted, the cutter compensation of the machine tool can be adjusted, the processing precision is ensured, and the electrode material does not need to be replaced.
Drawings
FIG. 1 is a flow chart of a method of the present invention;
FIG. 2 is a schematic diagram of CNC roughing of a part to be machined according to the present invention;
FIG. 3 is a schematic diagram of CNC semi-finishing of a part to be machined according to the present invention;
FIG. 4 is a schematic view of CNC finishing of a part to be machined according to the present invention;
FIG. 5 is a schematic diagram of a CNC workstation for a part to be machined according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present invention provides an embodiment, referring to fig. 1-5, a method for precision machining a core component of a semiconductor device, the method comprising the steps of: firstly, opening fine materials, manually using a tool to detect whether the materials and the sizes of incoming materials meet requirements or not, detecting whether the incoming materials have bad conditions such as collision, scratch, collision, deformation, bending and corrosion or not, removing the bad incoming materials, customizing a special size detection tool to detect whether the incoming materials are smaller than the required sizes or not when the incoming materials are detected to be in size, correspondingly classifying the incoming materials with the bad conditions such as collision, scratch, collision, deformation, bending and corrosion, wherein the collision, scratch and collision are 'defective', the products cannot be repaired, the deformed, bent and corroded products are 'defective products', and the products can be repaired to be used as good products;
secondly, CNC roughing, namely processing the good product in S1 by using a numerical control lathe, wherein the processed material standard is a sheet material with the shape single side allowance of 0.3mm and the hole diameter reserved by 0.8-1 mm;
thirdly, ultra-deep cold and hot treatment, wherein the ultra-deep cold and hot treatment equipment carries out deep cold heat treatment on the sheet material in the step S2, and after the deep cold heat treatment, coarse grinding equipment is used for carrying out coarse grinding on the appearance of the sheet material;
fourthly, performing semi-finishing of the shape, namely performing rough grinding on the shape of the thin plate material subjected to deep-cooling heat treatment by using rough grinding equipment, and then performing semi-finishing, wherein the rough grinding shape is used as the standard of the semi-finishing, a grinding wheel used for the rough grinding shape is a resin carborundum grinding wheel No. 120, the lower tool length is 0.01mm, after rough grinding, the workpiece subjected to rough grinding needs to be cleaned, and the modes of washing, wiping, blowing by an air gun and the like can be adopted;
fifthly, CNC semi-precision machining, wherein a numerical control milling machine is used for milling edges and holes of the sheet material in S4, during edge milling, the length and width of the single-edge allowance is 0.05mm, the step chamfer allowance is 0.1-0.15mm, during hole milling, the fine hole allowance is 0.1-0.15mm, during machining, a stand foot for avoiding bending deformation of a workpiece caused by subsequent grinding machine machining is reserved, during machining of a large-area groove part, a support part reserved for avoiding elastic deformation of the back of a concave area during grinding machine machining is called as a stand foot, the number of the stand feet of the workpiece is distributed according to the material and size of the part and the size of the groove, and the stand foot is cylindrical;
sixthly, eliminating internal stress, namely tempering the semi-precision processed workpiece in the step S5 in a tempering furnace to eliminate the internal stress, wherein the adopted tempering method is a tempering method after SUS440C quenching processing, the temperature of the tempering furnace is controlled to be 325-375 ℃, the tempering time is controlled to be 5 hours, and the workpiece is naturally cooled to normal temperature after tempering;
seventhly, accurately grinding the appearance of the workpiece, namely accurately grinding the workpiece tempered in the S6 by using accurate grinding equipment, wherein the accurate grinding allowance in the length direction, the width direction and the thickness direction of the appearance is 0.1mm during accurate grinding, a grinding wheel used for accurate grinding of the appearance is a resin carborundum wheel 180#, the cutter setting amount is 0.001mm, the workpiece after accurate grinding is ensured to have verticality, flatness and parallelism within 0.02mm, and the workpiece can be cleaned by adopting a water washing or wiping mode after accurate grinding;
step eight, finish milling of the workpiece, wherein finish milling equipment is used for finish milling the arc, step and chamfer positions of the appearance of the workpiece, after finish milling of the workpiece is finished, a boring cutter is replaced, finish boring is carried out on the workpiece, when the arc, step and chamfer of the appearance are finish milled, the rotating speed of a main shaft of a machine tool is 550rpm, and the whole process is fed at a constant speed;
and ninthly, removing the stand legs by using a numerical control machine, after the stand legs are removed, fully checking the quality personnel according to the size and the requirement of the drawing, packaging and delivering the products according to the packaging requirement, fully checking the qualified products according to the size and the requirement of the drawing, packaging and delivering the products according to the packaging requirement, fully checking the unqualified products, filling abnormal orders, and coordinating evaluation and treatment of each processing department.
In the machining process, the whole process is carried out by using a high-hardness alloy milling cutter and a chamfering cutter, the whole process is fed at a constant speed, and the cutter feeding amount is strictly controlled to prevent the workpiece from deforming.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The invention discloses a precision machining method for a core part of semiconductor equipment, which is characterized by comprising the following steps of: s1, opening the concentrate, manually using a tool to detect whether the material and the size of the incoming material meet the requirements, detecting whether the incoming material has the unfavorable conditions of collision, scratch, bruise, deformation, bending, corrosion and the like, and removing the unfavorable incoming material;
s2, roughing the CNC, and processing the good product in the S1 by using a numerically controlled lathe, wherein the processed material standard is a sheet material with the shape single-side allowance of 0.3mm and the hole diameter reserved by 0.8-1 mm;
s3, ultra-deep cold and hot treatment, wherein ultra-deep cold and hot treatment equipment is used for carrying out deep cold heat treatment on the thin plate material in the step S2, and after the deep cold heat treatment, coarse grinding equipment is used for carrying out coarse grinding on the shape of the thin plate material;
s4, semi-finishing the shape, namely, using coarse grinding equipment to perform coarse grinding on the shape of the sheet material subjected to deep cooling heat treatment, and then performing semi-finishing, wherein the rough grinding shape is used as the reference of the semi-finishing;
s5, CNC semi-precision machining, wherein a numerical control milling machine is used for milling edges and holes of the sheet material in the S4, during edge milling, the length and width of the single edge allowance of the shape is 0.05mm, the step chamfer allowance is 0.1-0.15mm, during hole milling, the fine hole allowance is 0.1-0.15mm, and during machining, a stand foot for avoiding workpiece bending deformation caused by subsequent grinding machine machining is reserved;
s6, eliminating internal stress, namely putting the semi-precision machined workpiece in the step S5 into a tempering furnace for tempering to eliminate the internal stress, controlling the temperature of the tempering furnace to be 325-375 ℃, controlling the tempering time to be 5h, and naturally cooling the workpiece to normal temperature after tempering;
s7, fine grinding the appearance of the workpiece, namely, fine grinding the workpiece tempered in the S6 by using fine grinding equipment, wherein the fine grinding allowance in the length direction, the width direction and the thickness direction of the appearance is 0.1mm during fine grinding;
s8, finish milling of the workpiece, wherein finish milling equipment is used for finish milling of arcs, steps and chamfers of the workpiece, and after finish milling of the workpiece is completed, a boring cutter is replaced to finish boring the workpiece;
and S9, removing the stand legs by using a numerical control machine, fully inspecting the stand legs according to the size and the requirement of the drawing by quality personnel after removing the stand legs, and packaging and delivering the products according to the packaging requirement.
2. The precision machining method for the core part of the semiconductor device according to claim 1, characterized in that: when the incoming material size is detected in the S1, a special size detection tool is customized to detect whether the incoming material size is smaller than a required size, incoming materials with bad conditions such as collision, scratch, bruise, deformation, bending and corrosion are classified correspondingly, the collision, scratch and bruise are 'defective', the products cannot be repaired, the deformed, bent and corroded products are 'defective products', and the products can be repaired to be used as good products.
3. The precision machining method for the core part of the semiconductor device according to claim 1, characterized in that: the number of the stand legs of the workpiece is distributed according to the material and the size of the part and the size of the groove, the stand legs are cylindrical, and the hardness of the deep cooling heat treatment needs to be between HRC50 and HRC 60.
4. The precision machining method for the core part of the semiconductor device according to claim 1, characterized in that: in the S5 and S8, the whole process is carried out by using a high-hardness alloy milling cutter and a chamfering cutter, the whole process is fed at a constant speed, and the cutter feeding amount is strictly controlled to prevent the workpiece from deforming.
5. The precision machining method for the core part of the semiconductor device according to claim 1, characterized in that: the grinding wheel used for the rough grinding of the S4 is a resin carborundum wheel 120#, the lower tool amount is 0.01mm, the grinding wheel used for the fine grinding of the S7 is a resin carborundum wheel 180#, and the lower tool amount is 0.001 mm.
6. The precision machining method for the core part of the semiconductor device according to claim 1, characterized in that: the quenching and tempering method used in S6 is a quenching and tempering method after SUS440C quenching.
7. The precision machining method for the core part of the semiconductor device according to claim 1, characterized in that: after the rough grinding of the step S4, the workpiece after the rough grinding needs to be cleaned, and the modes of water washing, wiping, air gun blowing and the like can be adopted.
8. The precision machining method for the core part of the semiconductor device according to claim 1, characterized in that: when the shape arcs, steps and chamfers are finely milled in the step S8, the rotating speed of a machine tool spindle is 550rpm, and the whole process is fed at a constant speed.
9. The precision machining method for the core part of the semiconductor device according to claim 1, characterized in that: in the step S7, the workpiece after finish grinding must ensure that the verticality, the planeness and the parallelism are within 0.02mm, and the workpiece is cleaned by adopting a water washing or wiping mode after finish grinding.
10. The precision machining method for the core part of the semiconductor device according to claim 1, characterized in that: in the step S9, the quality staff completely checks the qualified products according to the size of the drawing and the requirements, packages the qualified products according to the packaging requirements, completely checks the unqualified products, fills in the exception list, and coordinates the evaluation and processing of each processing department.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115519324A (en) * | 2022-11-03 | 2022-12-27 | 苏州耀玮彤机械有限公司 | Surface precision milling method for special-shaped hardware parts of automobile |
| CN116100266A (en) * | 2023-04-17 | 2023-05-12 | 深圳市玉沣科技有限公司 | Precision machining method for conveying fingers by semiconductor wafer robot |
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2021
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| JP2004130413A (en) * | 2002-10-09 | 2004-04-30 | Yunitakku Kk | Deep hole cutting tool |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115519324A (en) * | 2022-11-03 | 2022-12-27 | 苏州耀玮彤机械有限公司 | Surface precision milling method for special-shaped hardware parts of automobile |
| CN116100266A (en) * | 2023-04-17 | 2023-05-12 | 深圳市玉沣科技有限公司 | Precision machining method for conveying fingers by semiconductor wafer robot |
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