CN114182337A

CN114182337A - Circular electroplating equipment for machining and using method thereof

Info

Publication number: CN114182337A
Application number: CN202111663830.9A
Authority: CN
Inventors: 肖灯彪
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-03-15

Abstract

The invention discloses a circular electroplating device for machining and a using method thereof, relating to the technical field of circular electroplating devices; in order to realize the circulation electroplating; the circulating electroplating device comprises an electroplating box and a backflow mechanism, wherein the inner wall of one side of the electroplating box is movably connected with a guide column, the outer wall of the circumference of the guide column is provided with more than two arc-shaped stirring plates, the outer wall of one side of the guide column is provided with a rotating disc, the outer wall of one side of the rotating disc is movably connected with a rocker, the outer wall of the rocker is movably connected with a bracket, the outer wall of one side of the bracket is provided with a sliding column, the outer wall of one side of the sliding column is provided with a rack, and the inner wall of the bottom of the electroplating box is provided with a limiting plate; the using method of the circulating electroplating device comprises the following steps: the plated pieces are placed according to the type. The electroplating tank is arranged to place the electroplating solution, and the reflux mechanism is arranged to reflux the electroplating solution.

Description

Circular electroplating equipment for machining and using method thereof

Technical Field

The invention relates to the technical field of circulating electroplating equipment, in particular to circulating electroplating equipment for machining and a using method thereof.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using an electrolysis principle, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using an electrolysis effect so as to play roles of preventing metal oxidation, improving wear resistance, conductivity, light reflection, corrosion resistance, enhancing attractiveness and the like.

Through the retrieval, chinese patent application number is CN 201810967369.8's patent, discloses a cyclic electroplating equipment for machining, relates to machining technical field, including the plating bath, the upper portion difference fixedly connected with supporting seat of wall body about the plating bath passes rotary rod an in the supporting seat, the left side wall body fixedly connected with casing of plating bath, the inside downside of casing is provided with the driving piece, the mounting hole fixedly connected with actuating mechanism of driving piece, the upper portion of driving piece is provided with the sheave that has four radial grooves, and the mounting hole that has the sheave of four radial grooves is fixed to be cup jointed rotary rod b.

Although one of the above-mentioned patents is a cyclic electroplating apparatus for machining, the rotation of the workpiece can be realized in an automatic cycle mode, but a plurality of servo motors are needed to work in the electroplating process, so that the consumption of electric energy is relatively high, and the electroplating cost is increased.

Disclosure of Invention

The invention aims to solve the defects that in the prior art, a plurality of servo motors are required to work in the electroplating process, so that the consumption of electric energy is high, and the electroplating cost is increased.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a circulation electroplating device for machining, includes electroplating box and backward flow mechanism, electroplating box one side inner wall swing joint has the guide post, guide post circumference outer wall is provided with the arc board of dialling more than two, guide post one side outer wall is provided with the rotary disk, rotary disk one side outer wall swing joint has the rocker, rocker outer wall swing joint has the support, support one side outer wall is provided with the slip post, slip post one side outer wall is provided with the rack, electroplating box bottom inner wall is provided with the limiting plate, and slip post circumference outer wall sliding connection in limiting plate inner wall, electroplating box one side inner wall swing joint has the regulation post, it has the gear through the key-type connection to adjust post circumference outer wall, it is provided with places the subassembly to adjust post one side outer wall.

Preferably: the placing assembly comprises two first rotating plates and a second mounting frame, the second mounting frame is arranged on the outer wall of one side of the adjusting column, the outer wall of one side of each first rotating plate is movably connected to the outer wall of one side of the second mounting frame, and the outer wall of the other side of each first rotating plate is movably connected with the same first mounting frame.

Preferably: two the outer wall of the bottom of the first rotating plate is provided with a placing rack, and the outer wall of one side of the first mounting rack and the inner wall of one side of the second mounting rack are movably connected with the second rotating plate.

Preferred for the present invention are: the two outer walls of the rotating plate are slidably connected with more than two sliding sleeves, the outer wall of the top of each sliding sleeve is connected with a threaded fastener through threads, and the outer wall of the bottom of each sliding sleeve is provided with a hook.

As a preferable aspect of the present invention: the backflow mechanism comprises a booster pump and a mounting plate, the mounting plate is arranged on the outer wall of one side of the electroplating box, the booster pump is arranged on the outer wall of the top of the mounting plate, and a liquid outlet hole is formed in the inner wall of the bottom of the electroplating box.

As a preferable aspect of the present invention: the booster pump output is provided with connecting pipe one, the booster pump input is provided with connecting pipe two, the one end that the booster pump was kept away from to connecting pipe two sets up in the bottom outer wall of electroplating tank, the connecting pipe one end is provided with the shower nozzle, shower nozzle bottom outer wall is provided with more than two nozzles.

Further: the outer wall of one side of the support is provided with a hollow cylinder, the inner wall of the circumference of the hollow cylinder is movably connected with a rotating rod, and the outer wall of the circumference of the rotating rod is provided with a universal ball.

As a further scheme of the invention: the outer wall of the spherical surface of the universal ball is provided with a connecting column, and the outer wall of one side of the connecting column is provided with a hollow frame.

As a still further scheme of the invention: go out liquid hole circumference inner wall and be provided with the backplate, backplate top outer wall swing joint has the column spinner, column spinner circumference outer wall is provided with more than two fixed plates, fixed plate circumference outer wall is provided with more than two stirring vane.

A using method of a circular electroplating device for machining comprises the following steps:

s1: placing the electroplated parts according to different types;

s2: starting a booster pump to enable electroplating solution to flow back;

s3: the first mounting frame and the second mounting frame are driven to rotate by the sliding column, so that the electroplated part is in full contact with the electroplating solution;

s4: and taking down the electroplated part after the electroplating is finished.

The invention has the beneficial effects that:

1. can make the plating solution flow back through being provided with backward flow mechanism, the plating solution after the backward flow can act on more than two the arc dials the movable plate surface, make the arc dial the movable plate and can drive the guide post under the impact of plating solution and rotate, thereby can make the rotary disk rotate, thereby make the rack can be at reciprocating motion along the horizontal direction under the regulatory action of rocker, the rack can drive the gear at reciprocating motion's in-process and rotate, thereby can make and place the subassembly and can rotate, can place the plated item through being provided with the subassembly, the rack can drive the rotatory a week of gear at the in-process of accomplishing a motion cycle simultaneously, thereby can guarantee that each plated item on placing the subassembly all can electroplate.

2. Can hang plated item through being provided with the couple, can inject the sliding sleeve for the position of rotor plate two through rotating threaded fastener, can place the plated item that can't hang through being provided with the rack, thereby can electroplate the plated item according to actual conditions, rotor plate one and rotor plate two all rotate simultaneously and connect between mounting bracket one and mounting bracket two, thereby can guarantee that mounting bracket one and mounting bracket two are carrying out rotatory in-process, make rack and couple to remain throughout and be perpendicular with the horizontal plane.

3. Can be with electroplating solution leading-in to connecting pipe two in through being provided with out the liquid hole, can carry out the pressure boost backward flow to electroplating solution through being provided with the booster pump to make electroplating solution act on the surface of more than two arc striking plates through the nozzle at last, thereby can realize leading and move the post and rotate.

4. Can place great plated item through being provided with hollow frame, hollow frame can carry out synchronous motion along with the horizontal migration of support simultaneously to can guarantee that plating solution can the homogeneous action on great plated item surface, simultaneously because universal ball can utilize the bull stick to carry out horizontal swing along hollow section of thick bamboo, thereby can further improve the effect of electroplating.

5. The in-process of plating solution in entering into the liquid outlet can produce the vortex phenomenon to make the plating solution can drive stirring vane and rotate, thereby can utilize stirring vane to stir the plating solution, thereby can guarantee that the plating solution can and the plated item between carry out even contact.

Drawings

FIG. 1 is a schematic view of the overall structure of a cyclic electroplating apparatus for machining according to the present invention;

FIG. 2 is a schematic structural view of a circular electroplating apparatus for machining according to the present invention;

FIG. 3 is a schematic view of a top view of a part of a circular plating apparatus for machining according to the present invention;

FIG. 4 is a schematic diagram of the overall structure of a plating assembly of the cyclic plating equipment for machining according to the present invention;

FIG. 5 is a schematic structural view of a plated part placement assembly of the cyclic plating apparatus for machining according to the present invention;

FIG. 6 is a schematic structural view of a hollow frame assembly of the cyclic electroplating equipment for machining according to the present invention.

In the figure: 1-electroplating box, 2-arc stirring plate, 3-spray head, 4-connecting pipe I, 5-rotating disc, 6-spray nozzle, 7-rotating column, 8-booster pump, 9-mounting plate, 10-connecting pipe II, 11-stirring blade, 12-limiting plate, 13-fixing plate, 14-protecting plate, 15-liquid outlet hole, 16-mounting rack I, 17-rack, 18-adjusting column, 19-bracket, 20-guide column, 21-rocker, 22-sliding column, 23-gear, 24-rotating plate I, 25-placing rack, 26-mounting rack II, 27-rotating plate II, 28-threaded fastener, 29-sliding sleeve, 30-hook, 31-universal ball, 32-hollow cylinder, etc, 33-rotating rod, 34-connecting rod and 35-hollow frame.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not to be construed as limiting the device, structure, or element to which reference is made to have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Example 1:

a circular electroplating device for machining is shown in figures 1-4 and comprises an electroplating box 1 and a backflow mechanism, wherein the inner wall of one side of the electroplating box 1 is rotatably connected with a guide column 20, the circumferential outer wall of the guide column 20 is fixedly provided with more than two arc-shaped stirring plates 2 through bolts, the outer wall of one side of the guide column 20 is fixedly provided with a rotary table 5 through bolts, the outer wall of one side of the rotary table 5 is rotatably connected with a rocker 21, the outer wall of the rocker 21 is rotatably connected with a support 19, the outer wall of one side of the support 19 is fixedly provided with a sliding column 22 through bolts, the outer wall of one side of the sliding column 22 is fixedly provided with a rack 17 through bolts, the inner wall of the bottom of the electroplating box 1 is fixedly provided with a limiting plate 12 through bolts, the circumferential outer wall of the sliding column 22 is slidably connected with the inner wall of the limiting plate 12, the inner wall of one side of the electroplating box 1 is rotatably connected with an adjusting column 18, the circumferential outer wall of the adjusting column 18 is connected with a gear 23 through a key, a placing component is fixed on the outer wall of one side of the adjusting column 18 through a bolt; the electroplating solution can be placed through the electroplating box 1, the electroplating solution can flow back through the backflow mechanism, the backflow electroplating solution can act on the surfaces of more than two arc-shaped stirring plates 2, so that the arc-shaped poking plate 2 can drive the guide column 20 to rotate under the impact of the electroplating solution, thereby rotating the rotating disc 5, so that the rack 17 can reciprocate along the horizontal direction under the adjusting action of the rocker 21, the rack 17 can drive the gear 23 to rotate in the reciprocating process, thereby enabling the placing component to rotate, placing the electroplated part by the placing component, meanwhile, the rack 17 can drive the gear 23 to rotate for a circle in the process of completing one movement period, so that each electroplated part on the assembly can be ensured to be electroplated.

For placing the plated item; as shown in fig. 1-5, the placing assembly includes two first rotating plates 24 and a second mounting frame 26, the second mounting frame 26 is fixed to the outer wall of one side of the adjusting column 18 through bolts, the outer walls of one side of the two first rotating plates 24 are rotatably connected to the outer wall of one side of the second mounting frame 26, the outer wall of the other side of the two first rotating plates 24 is rotatably connected to the same first mounting frame 16, the outer walls of the bottoms of the two first rotating plates 24 are both fixed with a placing frame 25 through bolts, the outer wall of one side of the first mounting frame 16 and the inner wall of one side of the second mounting frame 26 are rotatably connected with two second rotating plates 27, the outer walls of the two rotating plates 27 are slidably connected with more than two sliding sleeves 29, the outer wall of the tops of the sliding sleeves 29 is connected with threaded fasteners 28 through threads, and the outer wall of the bottoms of the sliding sleeves 29 is fixed with hooks 30 through bolts; can hang the plated item through being provided with couple 30, can prescribe a limit to the position of sliding sleeve 29 for rotor plate two 27 through rotating threaded fastener 28, can place the plated item that can't hang through being provided with rack 25, thereby can electroplate the plated item according to actual conditions, rotor plate one 24 and rotor plate two 27 all rotate simultaneously and connect between mounting bracket one 16 and mounting bracket two 26, thereby can guarantee that mounting bracket one 16 and mounting bracket two 26 are carrying out rotatory in-process, make rack 25 and couple 30 can remain throughout and be perpendicular with the horizontal plane.

In order to realize the backflow of the electroplating solution; as shown in fig. 1-2, the backflow mechanism comprises a booster pump 8 and a mounting plate 9, the mounting plate 9 is fixed on the outer wall of one side of the electroplating box 1 through a bolt, the booster pump 8 is fixed on the outer wall of the top of the mounting plate 9 through a bolt, a liquid outlet hole 15 is formed in the inner wall of the bottom of the electroplating box 1, the output end of the booster pump 8 is fixed with a first connecting pipe 4 through a bolt, the input end of the booster pump 8 is fixed with a second connecting pipe 10 through a bolt, one end, away from the booster pump 8, of the second connecting pipe 10 is fixed on the outer wall of the bottom of the electroplating box 1 through a bolt, one end of the first connecting pipe 4 is fixed with a spray head 3 through a bolt, and the outer wall of the bottom of the spray head 3 is fixed with more than two spray nozzles 6 through a bolt; can be with the plating solution leading-in to connecting pipe two 10 in through being provided with out liquid hole 15, can carry out the pressure boost backward flow to the plating solution through being provided with booster pump 8 to make the plating solution can act on 2 surfaces of plate are dialled to two above arcs through nozzle 6 at last, thereby can realize leading and move the post 20 ground and rotate.

This embodiment is when using, at first the plated item that will need electroplate develops on couple 30 and rack 25 according to the difference of kind, inject electroplating solution into electroplating tank 1 in succession, control booster pump 8 in succession, thereby make the electroplating solution can realize the backward flow through booster pump 8, the electroplating solution can dial 2 surfaces of movable plate to two above arcs at the in-process of backward flow and produce the impact force, thereby make guide post 20 can stir and rotate under the effect of movable plate 2 in the arc, thereby make rack 17 can carry out reciprocating motion along the horizontal direction under the regulatory action of rocker 21, thereby make gear 23 can drive mounting bracket 16 and mounting bracket two 26 rotate, thereby make the plated item can electroplate at rotatory in-process.

Example 2:

a circulation electroplating device for machining, as shown in figures 1-3 and 6, for electroplating a large-volume electroplated part; this example is supplemented by example 1 with the following: a hollow cylinder 32 is fixed on the outer wall of one side of the support 19 through bolts, a rotating rod 33 is rotatably connected on the inner wall of the circumference of the hollow cylinder 32, a universal ball 31 is welded on the outer wall of the circumference of the rotating rod 33, a connecting column 34 is welded on the spherical outer wall of the universal ball 31, and a hollow frame 35 is fixed on the outer wall of one side of the connecting column 34 through bolts; can place great plated item through being provided with hollow frame 35, hollow frame 35 can carry out synchronous motion along with the horizontal migration of support 19 simultaneously to can guarantee that the plating solution can the homogeneous action on great plated item surface, simultaneously because universal ball 31 can utilize bull stick 33 to carry out horizontal swing along hollow section of thick bamboo 32, thereby can further improve the effect of electroplating.

For stirring the plating solution; as shown in fig. 1-4, a guard plate 14 is fixed on the circumferential inner wall of the liquid outlet hole 15 through a bolt, the outer wall of the top of the guard plate 14 is rotatably connected with a rotating column 7, more than two fixed plates 13 are fixed on the circumferential outer wall of the rotating column 7 through bolts, and more than two stirring blades 11 are welded on the circumferential outer wall of the fixed plates 13; the plating solution can produce the vortex phenomenon at the in-process that enters into out liquid hole 15 to make the plating solution can drive stirring vane 11 and rotate, thereby can utilize stirring vane 11 to stir the plating solution, thereby can guarantee to carry out even contact between plating solution and the plated item.

This embodiment can place great plated item through being provided with hollow frame 35 when using, can stir the plating solution through being provided with stirring vane 11 to can guarantee the electroplating effect of plating solution to plated item.

Example 3:

a method of using the cyclic plating apparatus for machining of embodiment 1, comprising the steps of:

s1: placing the electroplated parts according to different types;

s2: starting the booster pump 8 to enable the electroplating solution to flow back;

s3: the first mounting frame 16 and the second mounting frame 26 are driven to rotate by the sliding column 22, so that the electroplated part is in full contact with the electroplating solution;

The above description is for the purpose of illustrating the preferred embodiments of the present invention and is not intended to be exhaustive or to limit the invention to the precise embodiments disclosed, and all modifications, equivalents, and improvements that may occur to those skilled in the art and that fall within the spirit and scope of the invention are intended to be embraced therein.

Claims

1. The utility model provides a circulation electroplating device for machining, includes electroplating box (1) and backward flow mechanism, characterized by, electroplating box (1) one side inner wall swing joint has guide post (20), guide post (20) circumference outer wall is provided with arc stirring board (2) more than two, guide post (20) one side outer wall is provided with rotary disk (5), rotary disk (5) one side outer wall swing joint has rocker (21), rocker (21) outer wall swing joint has support (19), support (19) one side outer wall is provided with slips post (22), slips post (22) one side outer wall is provided with rack (17), electroplating box (1) bottom inner wall is provided with limiting plate (12), and slips post (22) circumference outer wall sliding connection in limiting plate (12) inner wall, electroplating box (1) one side inner wall swing joint has regulation post (18), the circumference outer wall of the adjusting column (18) is connected with a gear (23) through a key, and a placing assembly is arranged on the outer wall of one side of the adjusting column (18).

2. The circular electroplating equipment for machining according to claim 1, wherein the placing assembly comprises two first rotating plates (24) and a second mounting frame (26), the second mounting frame (26) is arranged on the outer wall of one side of the adjusting column (18), the outer walls of the two first rotating plates (24) are movably connected to the outer wall of one side of the second mounting frame (26), and the outer wall of the other side of the two first rotating plates (24) is movably connected with the same first mounting frame (16).

3. The circular electroplating equipment for machining according to claim 2, wherein the outer walls of the bottoms of the two first rotating plates (24) are respectively provided with a placing frame (25), and the outer wall of one side of the first mounting frame (16) and the inner wall of one side of the second mounting frame (26) are movably connected with the two second rotating plates (27).

4. The cyclic electroplating equipment for machining according to claim 3, wherein more than two sliding sleeves (29) are slidably connected to the outer wall of the second rotating plate (27), the outer wall of the top of each sliding sleeve (29) is connected with a threaded fastener (28) through threads, and the outer wall of the bottom of each sliding sleeve (29) is provided with a hook (30).

5. The circular electroplating equipment for machining according to claim 1, wherein the backflow mechanism comprises a booster pump (8) and a mounting plate (9), the mounting plate (9) is arranged on the outer wall of one side of the electroplating box (1), the booster pump (8) is arranged on the outer wall of the top of the mounting plate (9), and the inner wall of the bottom of the electroplating box (1) is provided with a liquid outlet (15).

6. The circular electroplating equipment for machining according to claim 5, wherein a first connecting pipe (4) is arranged at the output end of the booster pump (8), a second connecting pipe (10) is arranged at the input end of the booster pump (8), one end, far away from the booster pump (8), of the second connecting pipe (10) is arranged on the outer wall of the bottom of the electroplating box (1), a spray head (3) is arranged at one end of the first connecting pipe (4), and more than two spray nozzles (6) are arranged on the outer wall of the bottom of the spray head (3).

7. The circular electroplating equipment for machining according to claim 1, wherein a hollow cylinder (32) is arranged on the outer wall of one side of the support (19), a rotating rod (33) is movably connected to the inner circumferential wall of the hollow cylinder (32), and a universal ball (31) is arranged on the outer circumferential wall of the rotating rod (33).

8. The circulation electroplating equipment for machining according to claim 7, characterized in that the outer wall of the spherical surface of the universal ball (31) is provided with a connecting column (34), and the outer wall of one side of the connecting column (34) is provided with a hollow frame (35).

9. The circular electroplating equipment for machining according to claim 5, wherein a protective plate (14) is arranged on the inner circumferential wall of the liquid outlet hole (15), a rotating column (7) is movably connected to the outer top wall of the protective plate (14), more than two fixed plates (13) are arranged on the outer circumferential wall of the rotating column (7), and more than two stirring blades (11) are arranged on the outer circumferential wall of each fixed plate (13).

10. A method of using the circulation plating apparatus for machining according to any one of claims 1 to 9, comprising the steps of:

s1: placing the electroplated parts according to different types;

s2: starting a booster pump (8) to enable electroplating solution to flow back;

s3: the sliding column (22) is used for driving the first mounting frame (16) and the second mounting frame (26) to rotate, so that the electroplated part is in full contact with the electroplating solution;