CN220907700U - High-brightness acid copper electroplating device - Google Patents
High-brightness acid copper electroplating device Download PDFInfo
- Publication number
- CN220907700U CN220907700U CN202322682891.0U CN202322682891U CN220907700U CN 220907700 U CN220907700 U CN 220907700U CN 202322682891 U CN202322682891 U CN 202322682891U CN 220907700 U CN220907700 U CN 220907700U
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- Prior art keywords
- electroplating
- brightness
- outer side
- glass
- acid copper
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- 238000009713 electroplating Methods 0.000 title claims abstract description 86
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 239000002253 acid Substances 0.000 title claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 34
- 239000010949 copper Substances 0.000 title claims abstract description 34
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims description 38
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 abstract description 20
- 229910052751 metal Inorganic materials 0.000 abstract description 20
- 238000013329 compounding Methods 0.000 abstract description 6
- 238000007747 plating Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a high-brightness acid copper electroplating device, which relates to the technical field of acid copper electroplating and aims to solve the technical problem that the high-brightness acid copper electroplating treatment of a metal piece is inconvenient in the prior art; the acid copper electroplating device comprises an electroplating pool; the inner side of the electroplating pool is provided with a liquid level meter, the outer side of the electroplating pool is provided with a mixing component, the outer side of the electroplating pool is fixedly provided with a fixed back plate, the inner side of the fixed back plate is provided with an upper and lower adjusting component, the outer side of the upper and lower adjusting component is provided with a top plate, the bottom end of the top plate is provided with a lifting hook, the bottom end of the electroplating pool is fixedly provided with supporting legs, and the supporting legs are fixedly provided with four groups; this high bright sour copper electroplating device places the lifting hook department with the metal work piece, drives the roof through upper and lower adjusting part and reciprocates, and inside the electroplating tank was placed in to the metal work piece through the roof drive, carries out the misce bene to the plating solution through the setting of compounding subassembly to the realization is convenient for carry out high bright sour copper electroplating treatment to the metal work piece.
Description
Technical Field
The utility model belongs to the technical field of acid copper electroplating, and particularly relates to a high-brightness acid copper electroplating device.
Background
Nowadays, the application of acid copper electroplating technology is common in the electroplating field, and acid copper electroplating is a process of adhering a layer of metal film on the surface of a metal or other material workpiece by utilizing electrolysis so as to prevent metal oxidation, in particular to a high-brightness acid copper electroplating device.
At present, the utility model patent number is CN202121077784.X discloses an acid copper electroplating device of an electroplating piece, which comprises an electroplating bath, wherein two symmetrically arranged support plates are fixedly connected to the bottom of the electroplating bath, a transverse plate is fixedly connected to the rear side of the inner surface of the electroplating bath, a water inlet pipe is fixedly sleeved in the transverse plate, two symmetrically arranged spray heads are communicated with the lower end of the water inlet pipe, the right end of the water inlet pipe penetrates through the electroplating bath and extends to the outside, a water pump is fixedly sleeved at the lower end of the water inlet pipe, the bottom of the inner surface of the electroplating bath is rotationally connected with a vertical rod through a first rolling bearing, a connecting plate is fixedly sleeved at the upper end of the rod wall of the vertical rod, cleaning plates are fixedly connected to the two ends of the top of the connecting plate, a transmission mechanism is arranged at the lower end of the vertical rod, vertical plates are fixedly connected to the two ends of the top of the transverse plate, and a discharging mechanism is arranged on one side, which is far away from the two vertical plates, so that electroplating uniformity of an electroplating product can be improved, and automatic electroplating is reduced; the electroplating uniformity of the electroplated product can be improved, but in the use process of the high-brightness acid copper electroplating device, a metal part is required to be placed in an electroplating pool manually, uneven electroplating is easy to cause, and the high-brightness acid copper electroplating treatment of the metal part is inconvenient.
Disclosure of utility model
(1) Technical problem to be solved
Aiming at the defects of the prior art, the utility model aims to provide a high-brightness acid copper electroplating device which aims to solve the technical problem that the high-brightness acid copper electroplating treatment of metal parts is inconvenient in the prior art.
(2) Technical proposal
In order to solve the technical problems, the utility model provides a high-brightness acid copper electroplating device, which comprises an electroplating tank; the electroplating device is characterized in that a liquid level meter is arranged on the inner side of the electroplating tank, a mixing component is arranged on the outer side of the electroplating tank, a fixed back plate is fixedly arranged on the outer side of the electroplating tank, an upper adjusting component and a lower adjusting component are arranged on the inner side of the fixed back plate, a top plate is arranged on the outer side of the upper adjusting component and the lower adjusting component, a lifting hook is arranged at the bottom end of the top plate, supporting legs are fixedly arranged at the bottom end of the electroplating tank, and four groups of supporting legs are fixedly arranged.
When the high-brightness acid copper electroplating device of the technical scheme is used, a metal workpiece is placed at the lifting hook, the top plate is driven to move up and down through the upper and lower adjusting assemblies, the metal workpiece is driven to be placed inside the electroplating pool through the top plate, and the electroplating solution is uniformly mixed through the setting of the mixing assembly, so that high-brightness acid copper electroplating treatment of the metal workpiece is facilitated.
Further, the inside of upper and lower adjusting part is including first motor, first motor set up in the upper end of fixed backplate, the output of first motor is provided with the threaded rod, the threaded rod with fixed backplate rotates to be connected, starts first motor drive threaded rod and rotates, carries out drive processing to the threaded rod.
Further, the inside of upper and lower adjusting assembly is including the screwed ring, the screwed ring set up in the outside of threaded rod, the screwed ring with threaded rod transmission is connected, drives the roof and reciprocates through threaded rod and screwed ring's transmission connection.
Further, the inside of upper and lower adjusting part is including the slider, the slider set up in the outside of screwed ring, the one end of slider with the outside interconnect of roof drives the roof through the slider and removes.
Further, the inside of upper and lower adjusting assembly is including the spout, the spout set up in the outside of fixed backplate, the spout with slider sliding connection moves spacing processing through the sliding connection of spout and slider to the roof.
Further, the inside of compounding subassembly is including the second motor, the second motor set up in the outside in electroplating the pond, the output of second motor is provided with the glass center pin, the glass center pin with electroplating the pond and rotating and being connected, start the second motor and drive the glass center pin and rotate, drive the glass ring through the glass center pin and rotate.
Further, the inside of compounding subassembly is including the glass ring, the glass ring set up in the outside of glass center pin, the glass ring is provided with the multiunit, the outside of glass ring is provided with the glass (mixing) shaft, and the glass ring drives the glass (mixing) shaft and rotates, carries out the misce bene to the electroplating solution through the glass (mixing) shaft.
(3) Advantageous effects
Compared with the prior art, the utility model has the beneficial effects that:
1. According to the high-brightness acid copper electroplating device, a metal workpiece is placed at a lifting hook, a first motor is started to drive a threaded rod to rotate, a top plate is driven to move up and down through the transmission connection of the threaded rod and a threaded ring, the top plate is subjected to movement limiting treatment through the sliding connection of a sliding groove and a sliding block, and the top plate drives the metal workpiece to be placed in an electroplating tank, so that the metal workpiece is lifted;
2. The high-brightness acid copper electroplating device provided by the utility model has the advantages that the second motor is started to drive the glass central shaft to rotate, the glass central shaft drives the glass ring to rotate, the glass ring drives the glass stirring shaft to rotate, and the electroplating solution is uniformly mixed by the glass stirring shaft, so that the high-brightness acid copper electroplating treatment on metal parts is facilitated.
Drawings
FIG. 1 is a schematic view of a three-dimensional structure of an embodiment of the present utility model;
FIG. 2 is a schematic view of an expanded structure of an embodiment of the present utility model;
FIG. 3 is a schematic cross-sectional perspective view of an embodiment of the present utility model;
fig. 4 is a schematic cross-sectional perspective view of an embodiment of the present utility model.
The marks in the drawings are: 1. an electroplating pool; 2. a liquid level gauge; 3. a mixing component; 4. fixing the backboard; 5. an up-down adjusting assembly; 6. a top plate; 7. a lifting hook; 8. support legs; 9. a first motor; 10. a threaded rod; 11. a threaded ring; 12. a chute; 13. a slide block; 14. a second motor; 15. a glass central axis; 16. a glass ring; 17. a glass stirring shaft.
Detailed Description
The specific embodiment is used for a high-brightness acid copper electroplating device, the three-dimensional structure of which is shown in fig. 1, the unfolding structure of which is shown in fig. 2, and the acid copper electroplating device comprises an electroplating pool 1; the inside of electroplating bath 1 is provided with liquid level gauge 2, the outside of electroplating bath 1 is provided with compounding subassembly 3, the outside fixed mounting of electroplating bath 1 has fixed backplate 4, the inboard of fixed backplate 4 is provided with upper and lower adjusting part 5, the outside of upper and lower adjusting part 5 is provided with roof 6, the bottom of roof 6 is provided with lifting hook 7, the bottom fixed mounting of electroplating bath 1 has supporting leg 8, supporting leg 8 fixed mounting has four groups.
For the present embodiment, the shape structure of the plating tank 1 is set according to practical application, for example, the plating tank 1 may be a rectangular structure, an arc structure, a polygonal structure, or the like.
The inside of the up-down adjusting assembly 5 comprises a first motor 9, the first motor 9 is arranged at the upper end of the fixed back plate 4, a threaded rod 10 is arranged at the output end of the first motor 9, the threaded rod 10 is rotationally connected with the fixed back plate 4, the first motor 9 is started to drive the threaded rod 10 to rotate, the threaded rod 10 is driven to be processed, the inside of the up-down adjusting assembly 5 comprises a threaded ring 11, the threaded ring 11 is arranged at the outer side of the threaded rod 10, the threaded ring 11 is in transmission connection with the threaded rod 10, and the top plate 6 is driven to move up and down through the transmission connection of the threaded rod 10 and the threaded ring 11.
This embodiment is for high bright acid copper electroplating device, and its section three-dimensional structure schematic diagram is shown as the fig. 3, and its section three-dimensional structure schematic diagram is shown as the fig. 4, the inside of upper and lower adjusting part 5 is including slider 13, slider 13 set up in the outside of screwed ring 11, the one end of slider 13 with the outside interconnect of roof 6 drives roof 6 through slider 13 and removes, the inside of upper and lower adjusting part 5 is including spout 12, spout 12 open in the outside of fixed backplate 4, spout 12 with slider 13 sliding connection carries out the removal limiting process to roof 6 through the sliding connection of spout 12 and slider 13.
Simultaneously, the inside of compounding subassembly 3 is including second motor 14, second motor 14 set up in the outside of electroplating bath 1, the output of second motor 14 is provided with glass center pin 15, glass center pin 15 with electroplating bath 1 rotates to be connected, starts second motor 14 and drives glass center pin 15 and rotate, drives glass ring 16 through glass center pin 15 and rotates, the inside of compounding subassembly 3 is including glass ring 16, glass ring 16 set up in the outside of glass center pin 15, glass ring 16 is provided with the multiunit, the outside of glass ring 16 is provided with glass (mixing) shaft 17, and glass ring 16 drives glass (mixing) shaft 17 and rotates, carries out the misce bene to the plating through glass (mixing) shaft 17.
When the high-brightness acid copper electroplating device of the technical scheme is used, a metal workpiece is placed at the lifting hook 7, the first motor 9 is started to drive the threaded rod 10 to rotate, the top plate 6 is driven to move up and down through the transmission connection of the threaded rod 10 and the threaded ring 11, the top plate 6 is subjected to movement limiting treatment through the sliding connection of the sliding groove 12 and the sliding block 13, the metal workpiece is driven to be placed inside the electroplating tank 1 through the top plate 6, the second motor 14 is started to drive the glass center shaft 15 to rotate, the glass center shaft 15 is used for driving the glass ring 16 to rotate, the glass stirring shaft 17 is driven to rotate, and the electroplating liquid is uniformly mixed through the glass stirring shaft 17, so that the high-brightness acid copper electroplating treatment of the metal workpiece is facilitated.
Claims (7)
1. A high-brightness acid copper electroplating device comprises an electroplating pool; the electroplating device is characterized in that a liquid level meter is arranged on the inner side of the electroplating tank, a mixing component is arranged on the outer side of the electroplating tank, a fixed back plate is fixedly arranged on the outer side of the electroplating tank, an upper adjusting component and a lower adjusting component are arranged on the inner side of the fixed back plate, a top plate is arranged on the outer side of the upper adjusting component and the lower adjusting component, a lifting hook is arranged at the bottom end of the top plate, supporting legs are fixedly arranged at the bottom end of the electroplating tank, and four groups of supporting legs are fixedly arranged.
2. The high-brightness acid copper electroplating device according to claim 1, wherein the upper and lower adjusting components comprise a first motor, the first motor is arranged at the upper end of the fixed back plate, a threaded rod is arranged at the output end of the first motor, and the threaded rod is rotatably connected with the fixed back plate.
3. The high-brightness copper-acid electroplating device according to claim 2, wherein the upper and lower adjusting components comprise threaded rings inside, the threaded rings are arranged on the outer sides of the threaded rods, and the threaded rings are in transmission connection with the threaded rods.
4. A high-brightness copper-acid electroplating device according to claim 3, wherein the upper and lower adjusting components comprise a sliding block, the sliding block is arranged on the outer side of the threaded ring, and one end of the sliding block is connected with the outer side of the top plate.
5. The high-brightness copper acid electroplating device according to claim 4, wherein the upper and lower adjusting components comprise a chute, the chute is arranged on the outer side of the fixed back plate, and the chute is in sliding connection with the sliding block.
6. The high-brightness acid copper electroplating device according to claim 1, wherein the interior of the mixing component comprises a second motor, the second motor is arranged on the outer side of the electroplating tank, a glass central shaft is arranged at the output end of the second motor, and the glass central shaft is rotationally connected with the electroplating tank.
7. The high-brightness acid copper electroplating device according to claim 1, wherein the interior of the mixing component comprises a glass ring, the glass ring is arranged on the outer side of the glass central shaft, a plurality of groups of glass rings are arranged, and a glass stirring shaft is arranged on the outer side of the glass rings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322682891.0U CN220907700U (en) | 2023-10-07 | 2023-10-07 | High-brightness acid copper electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322682891.0U CN220907700U (en) | 2023-10-07 | 2023-10-07 | High-brightness acid copper electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220907700U true CN220907700U (en) | 2024-05-07 |
Family
ID=90916261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322682891.0U Active CN220907700U (en) | 2023-10-07 | 2023-10-07 | High-brightness acid copper electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220907700U (en) |
-
2023
- 2023-10-07 CN CN202322682891.0U patent/CN220907700U/en active Active
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