CN114182305B - Metal recovery system of semiconductor etching liquid - Google Patents

Metal recovery system of semiconductor etching liquid Download PDF

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Publication number
CN114182305B
CN114182305B CN202111667220.6A CN202111667220A CN114182305B CN 114182305 B CN114182305 B CN 114182305B CN 202111667220 A CN202111667220 A CN 202111667220A CN 114182305 B CN114182305 B CN 114182305B
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plate
positioning
copper powder
cathode plate
electrolytic
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CN114182305A (en
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朱俭
李兰
李文涛
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Richun Shanghai Clean Technology Co ltd
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Richun Shanghai Clean Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C5/00—Electrolytic production, recovery or refining of metal powders or porous metal masses
    • C25C5/02—Electrolytic production, recovery or refining of metal powders or porous metal masses from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/06—Operating or servicing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/06—Operating or servicing
    • C25C7/08—Separating of deposited metals from the cathode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

The invention discloses a metal recovery system of semiconductor etching liquid, which comprises an electrolysis device, wherein the electrolysis device is used for electrolyzing the semiconductor etching liquid and is provided with a negative plate, the electrolysis device forms electrolytic copper powder attached to the negative plate by copper ions in the semiconductor etching liquid through an electrolysis reaction, a weight detection and control device is used for detecting the weight of the negative plate so as to judge the time for replacing the negative plate, a copper powder recovery device is used for recovering the negative plate, the copper powder recovery device is electrically connected with the weight detection and control device, when the weight of the negative plate reaches a set weight due to the attachment of the electrolytic copper powder, the weight detection and control device controls the copper powder recovery device to recover the negative plate, the weight of the negative plate of the electrolysis device is detected through the weight detection and control device so as to judge the time when the copper powder recovery device needs to recover the negative plate, and the defects that the negative plate is inconvenient to be manually taken out of the electrolysis device and is not timely are avoided.

Description

Metal recovery system of semiconductor etching liquid
Technical Field
The invention relates to the technical field of metal recovery of etching waste liquid, in particular to a metal recovery system of semiconductor etching liquid.
Background
The PCB etching solution is a waste solution generated by the PCB industry for manufacturing a graphic circuit, the liquid components of the PCB etching solution contain a large amount of ammonia water, ammonium chloride, copper chloride and the like, and the regeneration of the etching waste solution can save resources and recover copper in the etching waste solution.
At present, the copper dissolved in the etching waste liquid due to etching is recovered by adopting an electrolysis method, and an electrolysis device mainly comprises an electrolysis bath, an anode copper plate made of crude copper and a cathode plate made of pure copper, wherein the anode copper plate and the cathode plate are arranged in the electrolysis bath, the anode copper plate and the cathode plate are made of crude copper, the cathode plate is continuously mixed with impurity electrolytic copper powder to be attached along with the progress of an electrolysis reaction, the anode plate is gradually consumed, therefore, the anode plate needs to be periodically replaced to maintain the progress of the electrolysis reaction, and the cathode plate needs to be periodically taken down and the electrolytic copper powder on the cathode plate is peeled off to realize the recovery of the copper of the etching waste liquid.
However, the replacement of the cathode plate is usually performed manually, which easily results in missing the optimal replacement time, resulting in excessive electrolytic copper powder on the cathode copper plate, and thus the preparation efficiency and the preparation purity of the electrolytic copper powder are reduced, and therefore, a metal recovery system capable of timely recovering the electrolytic copper powder on the cathode plate is urgently needed.
Disclosure of Invention
The invention aims to provide a metal recovery system for semiconductor etching liquid, which aims to solve the technical problem that in the prior art, the efficiency and purity of electrolytic copper powder recovery are reduced due to electrolytic reaction caused by excessive adhesion of electric copper powder mixed with impurities on a cathode plate due to untimely replacement of the cathode plate.
In order to solve the technical problems, the invention specifically provides the following technical scheme:
a metal recovery system for semiconductor etching liquid comprises:
the electrolytic device is used for electrolyzing the semiconductor etching liquid and is provided with a negative plate, and the electrolytic device forms copper ions in the semiconductor etching liquid into electrolytic copper powder attached to the negative plate through electrolytic reaction;
the weight detection and control device is used for detecting the weight of the cathode plate so as to judge the moment of replacing the cathode plate;
and the copper powder recovery device is used for recovering the negative plate, the copper powder recovery device is electrically connected with the weight detection and control device, and the weight detection and control device controls the copper powder recovery device to recover the negative plate when the weight of the negative plate reaches a set weight due to the adhesion of the electrolytic copper powder.
As a preferable scheme of the invention, the copper powder recovery device comprises an electric hanger rail, a lifting cylinder mounted on the electric hanger rail, and an insulating fixture mounted on the lifting cylinder, the electric hanger rail is arranged right above the electrolysis device through a bracket, the lifting cylinder clamps and releases the cathode plate through the insulating fixture, the lifting cylinder is slidably mounted on the electric hanger rail, the electric hanger rail transfers and recovers the cathode plate to the outside of the electrolysis device through the lifting cylinder and the insulating fixture, and the electric hanger rail, the lifting cylinder and the insulating fixture are all electrically connected with the weight detection and control device.
As a preferable scheme of the invention, the cathode plate is suspended in the electrolysis device through the insulation clamp, and the insulation clamp is suspended on the lifting cylinder through the weight detection and control device.
As a preferable aspect of the present invention, the insulating jig is provided with a copper electrode electrically connected to the cathode plate by clamping, and the copper electrode electrically connects the negative electrode of the electrolysis device to the cathode plate.
As a preferable aspect of the present invention, the insulating jig includes a clamping jaw cylinder mounted on the weight detecting and controlling device, and a pair of insulating clamping plates mounted on the clamping jaw cylinder, the copper pole is mounted on the inner sides of the pair of insulating clamping plates close to each other, and a positioning isolation groove for positioning and mounting the cathode plate is provided on the inner side of the insulating clamping plate, the positioning isolation groove penetrates through the bottom of the insulating clamping plate opposite to the clamping jaw cylinder, the copper pole is located in the positioning isolation groove, and a sealing ring surrounding the copper pole is mounted on a groove wall of the edge of the positioning isolation groove.
As a preferable scheme of the invention, the copper powder recovery device further comprises a recovery box positioned below the electric hanger rail, the recovery box is arranged adjacent to the electrolysis device, a plate placing chamber for placing the recovered cathode plate and a copper powder collecting chamber positioned below the plate placing chamber are arranged in the recovery box, and the plate placing chamber and the copper powder collecting chamber are communicated through a plurality of through holes;
the electrolytic copper powder collecting chamber is characterized in that a stripping positioning device and a vibration stripping device are installed in the plate placing chamber, the stripping positioning device clamps and fixes the negative plate placed in the plate placing chamber, and the vibration stripping device clamps the stripping positioning device and vibrates the negative plate at high frequency, so that the electrolytic copper powder attached to the negative plate is stripped and falls into the copper powder collecting chamber.
As a preferred scheme of the invention, the stripping positioning device comprises a positioning clamp plate and a push-pull cylinder, the positioning clamp plate is mounted on both sides of the plate placing chamber through the push-pull cylinder, tail jacks are arranged on the outer sides, far away from each other, of the positioning clamp plates on both sides, and a piston rod of the push-pull cylinder is inserted into the tail jacks;
the piston rod of the push-pull air cylinder is sleeved with a vibration reduction rubber sleeve, and the vibration stripping device conducts the generated high-frequency vibration to the clamped cathode plate by connecting the positioning clamping plates on the two sides.
In a preferred embodiment of the present invention, a plurality of rows of triangular ridges are provided on the inner sides of the positioning clips on both sides, the triangular ridges having triangular shapes with bottom surfaces provided on the positioning clips, and the triangular ridges are used for breaking the covering layer of the electrolytic copper powder attached to the side surface of the cathode plate.
As a preferable aspect of the present invention, the vibration peeling device includes a vibrator and a follow-up rail that slidably mounts the vibrator on an inner wall of the board placement chamber, and the follow-up rail assists the positioning clamp plate with the vibrator.
As a preferable scheme of the present invention, the vibrators are connected to both ends of the positioning splint.
Compared with the prior art, the invention has the following beneficial effects:
the weight detection and control device detects the weight of the cathode plate of the electrolysis device, when the weight of the cathode plate reaches a certain value due to continuous attachment of the electrolytic copper powder, the weight detection and control device controls the copper powder recovery device to take the cathode plate out of the electrolytic tank of the electrolysis device and transfer the cathode plate outwards, so that the defects that the cathode plate is inconvenient and untimely to take out of the cathode plate from the electrolysis device manually are avoided, the timely replacement of the cathode plate and the timely cleaning of the electrolytic copper powder are facilitated, and the condition that the preparation purity and the preparation efficiency of the electrolytic copper powder are reduced due to more attachment of the electrolytic copper powder mixed with impurities on the cathode plate is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the insulating holder of the present invention;
FIG. 3 is a schematic view of the installation position of the copper pole of the present invention;
FIG. 4 is a schematic view of the construction of the recycling bin of the present invention;
FIG. 5 is a top view of the recovery tank of the present invention;
fig. 6 is a schematic structural view of the positioning splint of the present invention.
The reference numerals in the drawings denote the following, respectively:
1-an electrolysis device; 2-a weight detection and control device; 3-copper powder recovery device; 4-a scaffold; 5-a copper pole; 6-positioning the isolation groove: 7-sealing ring; 8-stripping the positioning device; 9-a vibration stripping device; 10-tail jack; 11-damping rubber sleeve; 12-triangular edge;
101-a cathode plate;
301-electric hanger rail; 302-a lifting cylinder; 303-an insulating clamp; 304-recovery box
3031-gripper cylinder; 3032-insulating clamp plate;
3041-placing a plate chamber; 3042-a copper powder collection chamber; 3043-passing through the aperture;
801-positioning clamp plate; 802-push-pull cylinder;
901-a vibrator; 902 — follow up track.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 6, the present invention provides a metal recycling system for semiconductor etching liquid, comprising:
the electrolytic device 1 is used for electrolyzing the semiconductor etching solution, the electrolytic device 1 is provided with a cathode plate 101, and the electrolytic device 1 forms copper ions in the semiconductor etching solution into electrolytic copper powder attached to the cathode plate 101 through electrolytic reaction;
a weight detection and control device 2 for detecting the weight of the cathode plate 101 to judge the time of replacing the cathode plate 101;
the copper powder recovery device 3 is used for recovering the negative plate 101, the copper powder recovery device 3 is electrically connected with the weight detection and control device 2, and when the weight of the negative plate 101 reaches a set weight due to the adhesion of electrolytic copper powder, the weight detection and control device 2 controls the copper powder recovery device 3 to recover the negative plate 101.
According to the invention, the weight of the cathode plate 101 of the electrolysis device 1 is detected by the weight detection and control device 2, when the weight of the cathode plate 101 reaches a certain value due to continuous attachment of the electrolytic copper powder, the weight detection and control device 2 controls the copper powder recovery device 3 to take the cathode plate 101 out of the electrolysis tank of the electrolysis device 1 and transfer the cathode plate 101 outwards, so that the defects that the cathode plate 101 is inconvenient and untimely to take out from the electrolysis device 1 manually are avoided, the timely replacement of the cathode plate 101 and the timely cleaning of the electrolytic copper powder are facilitated, and the condition that the preparation purity and the preparation efficiency of the electrolytic copper powder are reduced due to more attachment of the electrolytic copper powder mixed with impurities on the cathode plate 101 is avoided.
Wherein, copper powder recovery unit 3 includes electronic hanger rail 301, install lift cylinder 302 on electronic hanger rail 301, and install the insulating anchor clamps 303 on lift cylinder 302, electronic hanger rail 301 passes through support 4 and sets up directly over electrolytic device 1, lift cylinder 302 carries out centre gripping and release to negative plate 101 through insulating anchor clamps 303, lift cylinder 302 slidable mounting is on electronic hanger rail 301, electronic hanger rail 301 shifts the recovery to electrolytic device 1 outside with negative plate 101 through lift cylinder 302 and insulating anchor clamps 303, electronic hanger rail 301, lift cylinder 302 and insulating anchor clamps 303 all detect and controlling means 2 electric connection with weight.
What further optimizes on the above-mentioned embodiment is that negative plate 101 suspends in midair in electrolytic device 1 through insulating anchor clamps 303, and insulating anchor clamps 303 passes through weight detection and controlling means 2 and hoists on lift cylinder 302, when doing benefit to weight detection and controlling means 2 and carry out the check weighing to negative plate 101 in real time, need not to set up the mechanism of fixed negative plate 101 in addition on electrolytic device 1, has simplified metal recovery system structure and operation step to reach reduce cost and the purpose of raising the efficiency.
The weight detecting and controlling device 2 generally includes a weighing part, preferably a hookless weighing part of an electronic hanging scale, and a controller so that the insulating clamp 303 is stably mounted on the weighing part of the weight detecting and controlling device 2.
It is further optimized in the above embodiment that the insulating fixture 303 is provided with the copper electrode 5 electrically connected with the cathode plate 101 by clamping, and the copper electrode 5 is used for electrically connecting the negative electrode of the electrolysis device 1 with the cathode plate 101, so as to avoid the need of additionally operating the cathode plate 101 to switch on the power supply after the cathode plate 101 is placed in the electrolysis bath of the electrolysis device 1, and further improve the automation degree of the metal recovery system.
Based on the above embodiment, the insulation clamp 303 includes a clamping jaw cylinder 3031 installed on the weight detecting and controlling device 2 and a pair of insulation clamp plates 3032 installed on the clamping jaw cylinder 3031, the copper electrode 5 is installed at the inner sides of the pair of insulation clamp plates 3032 close to each other, and the inner sides of the insulation clamp plates 3032 are provided with positioning isolation grooves 6 for positioning and installing the cathode plate 101, the positioning isolation grooves 6 penetrate through the bottom of the insulation clamp plates 3032 opposite to the clamping jaw cylinder 3031, the copper electrode 5 is located in the positioning isolation grooves 6, and a seal ring 7 surrounding the copper electrode 5 is installed on the groove wall at the edge of the positioning isolation grooves 6, so as to prevent the copper electrode 5 from being exposed in the semiconductor etching liquid to participate in the electrolytic reaction.
It is further optimized in the above embodiment that the copper powder recovery device 3 further comprises a recovery box 304 located below the electric hanger rail 301, the recovery box 304 is disposed adjacent to the electrolysis device 1, a plate placing chamber 3041 for placing the recovered cathode plate 101 is disposed in the recovery box 304, and a copper powder collecting chamber 3042 is located below the plate placing chamber 3041, and the plate placing chamber 3041 and the copper powder collecting chamber 3042 are communicated through a plurality of through holes 3043. A stripping positioning device 8 and a vibration stripping device 9 are installed in the plate placing chamber 3041, the stripping positioning device 8 clamps and fixes the cathode plate 101 placed in the plate placing chamber 3041, and the vibration stripping device 9 performs high-frequency vibration on the cathode plate 101 clamped by the stripping positioning device 8, so that electrolytic copper powder attached to the cathode plate 101 is stripped and falls into the copper powder collecting chamber 3042.
The stripping positioning device 8 comprises a positioning clamp plate 801 and a push-pull cylinder 802, the positioning clamp plate 801 is mounted on two sides of the plate placing chamber 3041 through the push-pull cylinder 802, tail jacks 10 are arranged on the outer sides, far away from each other, of the positioning clamp plates 801 on the two sides, a piston rod of the push-pull cylinder 802 is connected with the tail jacks 10 in an inserted mode, a damping rubber sleeve 11 is sleeved on the piston rod of the push-pull cylinder 802, the vibration stripping device 9 conducts generated high-frequency vibration to the clamped cathode plate 101 through connecting the positioning clamp plates 801 on the two sides, the damping rubber sleeve 11 is arranged to facilitate vibration of the positioning clamp plate 801, and damage of the push-pull cylinder 802 and damage of the connection between the push-pull cylinder 802 and the positioning clamp plate 801 due to conduction of the vibration of the positioning clamp plate 801 to the push-pull cylinder 802 is avoided.
The inner sides of the two side positioning clamping plates 801, which are close to each other, are provided with a plurality of rows of triangular ribs 12, the triangular ribs 12 are triangular, the bottom surfaces of the triangular ribs 12 are arranged on the positioning clamping plates 801, the triangular ribs 12 are used for breaking coatings of electrolytic copper powder attached to the side surfaces of the cathode plate 101 to ensure that the positioning clamping plates 801 stably clamp the cathode plate 101, the two side positioning clamping plates 801 clamp the cathode plate 101 when the cathode plate 101 is clamped by a pair of insulating clamping plates 3032, so that the electrolytic copper powder on the cathode plate 101 is still kept at the same position after being stripped, the next time that the insulating clamping plates 3032 directly clamp the cathode plate 101, from which the electrolytic copper powder is recovered, for an electrolytic reaction of the electrolytic device 1, and the recovery and feeding of the cathode plate 101 can be realized by arranging two plate placing chambers 3041 and arranging stripping positioning devices 8 and vibration stripping devices 9 in the two plate placing chambers 3041.
The triangular rib 12 is integrally formed on the positioning splint 801, and the triangular rib 12 and the positioning splint 801 are both made of steel with high hardness.
The vibration stripping device 9 includes a vibrator 901 and a slider for slidably mounting the vibrator 901 on the inner wall of the board placing chamber, a follow-up rail 902 for slidably mounting the vibrator 901 and a follow-up rail 902 of the vibrator 901 are provided on the inner wall of the board placing chamber 3041, the follow-up rail 902 assists in supporting the positioning clamp plate 801 through the vibrator 901, and the vibrators 901 are connected to both ends of the positioning clamp plate 801.
Then, the overall process of the metal recovery system is to inject the treated semiconductor etching solution into the electrolytic tank of the electrolysis device 1, and then to connect the anode plate and the cathode plate 101 in the electrolytic tank with power, so that the copper ions in the semiconductor etching solution in the electrolytic tank continuously form electrolytic copper powder on the cathode plate 101 as the electrolytic reaction proceeds. Meanwhile, the weight detection and control device 2 detects the weight of the lower cathode plate 101 in real time or intermittently, when the cathode plate 101 reaches the set weight along with the adhesion of the electrolytic copper powder, the weight detection and control device 2 controls the lifting cylinder 302 to ascend through the weight detection and control device 2, the clamping jaw cylinder 3031 and the pair of insulating clamping plates 3032 until the cathode plate 101 clamped by the pair of insulating clamping plates 3032 ascends to the set height, and then the weight detection and control device 2 controls the electric hanger rail 301 to drive the lifting cylinder 302 to move towards the direction of the recovery box 304 for a set stroke, so that the cathode plate 101 is positioned right above the recovery box 304. Then, the lifting cylinder 302 is controlled to place the cathode plate 101 between the two side positioning clamping plates 801 in the recycling box 304, then the two side push-pull cylinders 802 drive the two side positioning clamping plates 801 to clamp the cathode plate 101, the vibrator 901 is started to enable the cathode plate 101 to vibrate at high frequency under the driving of the positioning clamping plates 801, and therefore electroplating copper powder attached to the cathode plate 101 is shaken off into the recycling box 304.
The above embodiments are only exemplary embodiments of the present application, and are not intended to limit the present application, and the protection scope of the present application is defined by the claims. Various modifications and equivalents may be made by those skilled in the art within the spirit and scope of the present application and such modifications and equivalents should also be considered to be within the scope of the present application.

Claims (7)

1. A metal recovery system for semiconductor etching liquid is characterized by comprising:
the electrolytic device (1) is used for electrolyzing the semiconductor etching liquid, the electrolytic device (1) is provided with a cathode plate (101), and the electrolytic device (1) forms copper ions in the semiconductor etching liquid into electrolytic copper powder attached to the cathode plate (101) through electrolytic reaction;
a weight detection and control device (2) for detecting the weight of the cathode plate (101) to determine the time of replacing the cathode plate (101);
the copper powder recovery device (3) is used for recovering the negative plate (101), the copper powder recovery device (3) is electrically connected with the weight detection and control device (2), and when the weight of the negative plate (101) reaches a set weight due to the adhesion of the electrolytic copper powder, the weight detection and control device (2) controls the copper powder recovery device (3) to recover the negative plate (101);
the copper powder recovery device (3) comprises an electric hanging rail (301), a lifting cylinder (302) installed on the electric hanging rail (301), and an insulating clamp (303) installed on the lifting cylinder (302), wherein the electric hanging rail (301) is arranged right above the electrolysis device (1) through a support (4), the lifting cylinder (302) clamps and releases the cathode plate (101) through the insulating clamp (303), the lifting cylinder (302) is installed on the electric hanging rail (301) in a sliding mode, the electric hanging rail (301) transfers and recovers the cathode plate (101) to the outside of the electrolysis device (1) through the lifting cylinder (302) and the insulating clamp (303), and the electric hanging rail (301), the lifting cylinder (302) and the insulating clamp (303) are all electrically connected with the weight detection and control device (2);
the cathode plate (101) is suspended in the electrolysis device (1) through the insulating clamp (303), and the insulating clamp (303) is hung on the lifting cylinder (302) through the weight detection and control device (2);
the insulating clamp (303) is provided with a copper electrode (5) which is electrically connected with the cathode plate (101) through clamping, and the copper electrode (5) electrically connects the cathode of the electrolysis device (1) with the cathode plate (101).
2. A metal reclaiming system for semiconductor etching liquid according to claim 1, wherein the insulating clamp (303) comprises a clamping jaw cylinder (3031) mounted on the weight detecting and controlling device (2) and a pair of insulating clamp plates (3032) mounted on the clamping jaw cylinder (3031), the copper pole (5) is mounted on the inner sides of the pair of insulating clamp plates (3032) which are close to each other;
the inner side of the insulating clamp plate (3032) is provided with a positioning isolation groove (6) for positioning and installing the cathode plate (101), the positioning isolation groove (6) penetrates through the bottom, opposite to the clamping jaw cylinder (3031), of the insulating clamp plate (3032), the copper pole (5) is located in the positioning isolation groove (6), and a sealing ring (7) surrounding the copper pole (5) is installed on the groove wall of the edge of the positioning isolation groove (6).
3. The metal recovery system of the semiconductor etching solution as claimed in claim 1, wherein the copper powder recovery device (3) further comprises a recovery box (304) located below the electric hanger rail (301), the recovery box (304) is disposed adjacent to the electrolysis device (1), a plate placing chamber (3041) for placing the recovered cathode plate (101) is disposed in the recovery box (304), and a copper powder collecting chamber (3042) located below the plate placing chamber (3041), the plate placing chamber (3041) is communicated with the copper powder collecting chamber (3042) through a plurality of through holes (3043);
a stripping positioning device (8) and a vibration stripping device (9) are installed in the plate placing chamber (3041), the stripping positioning device (8) clamps and fixes the cathode plate (101) placed in the plate placing chamber (3041), and the vibration stripping device (9) conducts high-frequency vibration on the cathode plate (101) clamped by the stripping positioning device (8), so that the electrolytic copper powder attached to the cathode plate (101) is stripped and falls into the copper powder collecting chamber (3042).
4. The metal recovery system of a semiconductor etching solution according to claim 3, wherein the stripping positioning device (8) comprises a positioning clamp plate (801) and a push-pull cylinder (802), the positioning clamp plate (801) is mounted on both sides of the plate placing chamber (3041) through the push-pull cylinder (802), tail insertion holes (10) are formed in the outer sides, far away from each other, of the positioning clamp plates (801) on both sides, and piston rods of the push-pull cylinder (802) are inserted into the tail insertion holes (10);
the piston rod of the push-pull air cylinder (802) is sleeved with a vibration damping rubber sleeve (11), and the vibration stripping device (9) conducts the generated high-frequency vibration to the clamped cathode plate (101) by connecting the positioning clamping plates (801) at two sides.
5. The metal recovery system for semiconductor etching liquid as claimed in claim 4, wherein a plurality of rows of triangular ribs (12) are disposed on the inner sides of the positioning clamping plates (801) at two sides, the triangular ribs (12) are triangular with the bottom surfaces disposed on the positioning clamping plates (801), and the triangular ribs (12) are used for breaking the cladding of the electrolytic copper powder attached to the side surfaces of the cathode plate (101).
6. The metal recovery system of a semiconductor etching liquid as recited in claim 4, wherein the vibration stripping device (9) comprises a vibrator (901) and a follow-up rail (902) which slidably mounts the vibrator (901) on the inner wall of the plate placing chamber (3041), the vibrator (901) is connected with an end of the positioning clamp plate (801), and the follow-up rail (902) assists in supporting the positioning clamp plate (801) through the vibrator (901).
7. The metal recovery system of semiconductor etching liquid as claimed in claim 6, wherein the vibrator (901) is connected to both ends of the positioning clamping plate (801).
CN202111667220.6A 2021-12-31 2021-12-31 Metal recovery system of semiconductor etching liquid Active CN114182305B (en)

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