CN114178392B - Unconventional steel plate wafer cutting device and implementation method thereof - Google Patents

Unconventional steel plate wafer cutting device and implementation method thereof Download PDF

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Publication number
CN114178392B
CN114178392B CN202111485787.1A CN202111485787A CN114178392B CN 114178392 B CN114178392 B CN 114178392B CN 202111485787 A CN202111485787 A CN 202111485787A CN 114178392 B CN114178392 B CN 114178392B
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die
steel plate
flat
wafer
double
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CN114178392A (en
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叶浩平
楼亚晖
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Hengdian Group DMEGC Magnetics Co Ltd
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Hengdian Group DMEGC Magnetics Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00Shaping by press-cutting; Perforating
    • B21D28/02Punching blanks or articles with or without obtaining scrap; Notching
    • B21D28/14Dies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00Shaping by press-cutting; Perforating
    • B21D28/02Punching blanks or articles with or without obtaining scrap; Notching
    • B21D28/04Centering the work; Positioning the tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Punching Or Piercing (AREA)

Abstract

The invention discloses an unconventional steel plate wafer cutting device, which belongs to the technical field of stamping and comprises a lower fixed seat and an upper fixed seat positioned above the lower fixed seat, wherein a concave die seat is arranged above the lower fixed seat, a concave die is arranged above the concave die seat, two symmetrical die cavities are arranged inside the concave die, each die cavity comprises a first arc edge and a second arc edge which are oppositely arranged, a convex die seat is arranged below the upper fixed seat, and a convex die is arranged below the convex die seat; the invention also discloses an implementation method of the unconventional steel plate wafer cutting device. According to the invention, the male die and the cavity are designed into the double-flat-position structure corresponding to the wafer product, and compared with a normal wafer, more double-flat-position wafer products can be punched by the steel plate material with the same area, so that the utilization rate of the material is improved; the invention designs two cavities and the male die, and can punch two double-flat-position circular sheet products by one action, thereby greatly improving the processing efficiency of the double-flat-position circular sheet products.

Description

Unconventional steel plate wafer cutting device and implementation method thereof
Technical Field
The invention belongs to the technical field of stamping, and particularly relates to an unconventional steel plate wafer cutting device and an implementation method thereof.
Background
The miniature vibration motor is an indispensable component of electronic products such as mobile phones, tablet computers, handheld game consoles and the like, and provides tactile feedback for users. At present, mobile consumer electronics products in the market generally use a vibration motor as a system feedback component, such as incoming call prompt of a mobile phone, vibration feedback of a game machine, and the like.
The first process of deep drawing and stamping the machine shell part is to cut the wafer, and the specification of the wafer is a regular circle. The normal wafer is suitable for deep drawn press enclosures of cylindrical and double-pancake shapes. But there is a waste of material in the case product using a normal wafer stretch double flat position.
Therefore, an unconventional steel plate wafer cutting device is needed.
Disclosure of Invention
To solve the problems set forth in the background art described above. The invention provides an unconventional steel plate wafer cutting device which has the characteristic of improving the utilization rate of materials.
The invention also aims to provide a realization method of the unconventional steel plate wafer cutting device.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a device is opened to unconventional steel sheet disk, includes fixing base and the last fixing base that is located fixing base top down, the top of fixing base is equipped with the die holder down, the top of die holder is equipped with the die, the inside of die is equipped with the die cavity of two symmetries, the die cavity includes the first arc limit of two relative settings and the second arc limit of two relative settings, and the radius on first arc limit is less than the radius on second arc limit, the below of going up the fixing base is equipped with the convex die seat, the below of convex die seat is equipped with two convex dies corresponding with the die cavity.
In order to press the steel plate material during blanking and realize the positioning of the steel plate material, a material pressing plate is further arranged below the convex die seat and on the side surface of the convex die.
In order to cut off the waste after blanking, a waste cutter is further arranged on one side of the convex die holder.
In order to drive the moving platform to move, so that the punched double-flat-position wafer product is conveyed to the outer side of the die, and the double-flat-position wafer product is rapidly fed.
In order to fix a position two flat position wafer products to be convenient for the manipulator carry out the accurate snatch two flat position wafer products, furtherly, the mobile station includes the base, and the pedestal mounting is equipped with three equidistant locating piece on the base on the output of removal module, and the side of locating piece is the arc structure.
In order to more accurately position the double-flat-position wafer product, a plurality of cushion blocks are arranged on the side wall of the positioning block, and inclined planes are arranged on one sides, far away from the positioning block, of the upper ends of the cushion blocks.
In order to guide the double-flat-position circular sheet product, the double-flat-position circular sheet product can accurately fall onto the moving platform, furthermore, a material guide plate is arranged at the bottom of the female die, and a material discharging groove corresponding to the cavity is formed in the material guide plate. The side wall of the charging conduit is provided with a plurality of guide pins.
Further, the implementation method of the unconventional steel plate wafer cutting device comprises the following steps:
the pressing plate presses the steel plate material above the female die;
secondly, the male die and the female die are matched to punch the steel plate material;
thirdly, the punched steel plate wafer falls onto the moving platform under the action of the guide pins on the material guide plate, and the press drives the upper fixing seat to reset upwards;
fourthly, the moving module drives the moving platform to move outwards, and the steel plate wafer is conveyed to the outer side of the concave die holder;
and (V) taking out the steel plate wafer on the mobile station by the manipulator, and driving the mobile station to reset by the mobile module to wait for the next operation.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the male die and the cavity are designed into the double-flat-position structure corresponding to the wafer product, and compared with a normal wafer, more double-flat-position wafer products can be punched by the steel plate material with the same area, so that the utilization rate of the material is improved;
2. according to the invention, two cavities and the male die are designed, and two double-flat-position circular sheet products can be punched by one action, so that the processing efficiency of the double-flat-position circular sheet products is greatly improved;
3. the moving module drives the moving table to act, so that the punched double-flat-position circular sheet product is conveyed to the outer side of the die, and the quick blanking of the double-flat-position circular sheet product is realized;
4. the base is provided with three positioning blocks at equal intervals, the side edges of the positioning blocks are of arc structures, and the positioning blocks are used for positioning the double-flat-position wafer products, so that a manipulator can conveniently and accurately grab the double-flat-position wafer products, and the double-flat-position wafer products can be conveniently and quickly moved to the next processing procedure;
5. according to the invention, the bottom of the female die is provided with the guide plate, the guide plate is provided with the blanking groove corresponding to the cavity, the side wall of the blanking groove is provided with a plurality of guide pins, and the double-flat-position circular sheet product is guided by the guide pins, so that the double-flat-position circular sheet product can accurately fall onto the moving platform.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic top view of the female mold of the present invention;
FIG. 3 is a schematic top view of a mobile station according to the present invention;
FIG. 4 is a schematic cross-sectional view of a mobile station according to the present invention;
FIG. 5 is a schematic view of a positioning block according to the present invention;
FIG. 6 is a schematic view of the structure of the spacer of the present invention;
FIG. 7 is a schematic view of the structure of a material guiding plate according to the present invention;
FIG. 8 is a schematic top view of a material guide plate according to the present invention;
in the figure: 1. a lower fixed seat; 2. a moving module; 3. a material guide plate; 31. a guide pin; 32. a charging chute; 4. a mobile station; 41. a base; 42. positioning blocks; 421. cushion blocks; 5. a cavity; 51. a first arc edge; 52. a second arc edge; 6. a waste cutter; 7. a male die; 8. a convex die holder; 9. an upper fixed seat; 10. a material pressing plate; 11. a female die; 12. a concave die holder.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-8, the present invention provides the following technical solutions: the utility model provides a device is cut to unconventional steel sheet disk, include fixing base 1 down and the last fixing base 9 that is located fixing base 1 top down, the top of fixing base 1 is equipped with die holder 12 down, the top of die holder 12 is equipped with die 11, the inside of die 11 is equipped with the die cavity 5 of two symmetries, die cavity 5 includes the first arc limit 51 of two relative settings and the second arc limit 52 of two relative settings, and the radius of first arc limit 51 is less than the radius of second arc limit 52, the below of going up fixing base 9 is equipped with the punch holder 8, the below of punch holder 8 is equipped with two terrace dies 7 corresponding with die cavity 5.
By adopting the technical scheme, the male die 7 and the cavity 5 are designed into a double-flat-position structure corresponding to the wafer product, and compared with a normal wafer, the steel plate material with the same area can be used for punching more double-flat-position wafer products, so that the utilization rate of the material is improved; two cavities 5 and the male die 7 are designed, and two double-flat-position circular sheet products can be punched out through one action, so that the processing efficiency of the double-flat-position circular sheet products is greatly improved.
Specifically, a pressure plate 10 is arranged below the male die holder 8 and on the side surface of the male die 7.
By adopting the technical scheme, when punching, the steel plate material is pressed by the pressing plate 10, so that the steel plate material is positioned.
Specifically, a waste material cutter 6 is arranged on one side of the male die holder 8.
Through adopting above-mentioned technical scheme, cut the waste material after the blanking.
Example 2
The present embodiment is different from embodiment 1 in that: specifically, the moving module 2 is arranged inside the concave die holder 12, the moving module 2 is a linear module which is commercially available, and the output end of the moving module 2 is provided with a moving platform 4 corresponding to the die cavity.
Through adopting above-mentioned technical scheme, drive the action of mobile station 4 through removing module 2 to carry the two flat position wafer products that will punch out to the mould outside, realize the quick unloading of two flat position wafer products.
Specifically, the mobile station 4 includes a base 41, the base 41 is installed at the output end of the mobile module 2, three positioning blocks 42 are arranged on the base 41 at equal intervals, the side edges of the positioning blocks 42 are of arc-shaped structures, and two positioning spaces corresponding to the cavities 5 are formed between the three positioning blocks 42.
Through adopting above-mentioned technical scheme, fix a position two flat position disc products through locating piece 42 to be convenient for the manipulator (the attached drawing not shown) carry out the accurate two flat position disc products and snatch, thereby be convenient for quick remove two flat position disc products to next manufacturing procedure on.
Example 3
The present embodiment is different from embodiment 1 in that: specifically, the side wall of the positioning block 42 is provided with a plurality of cushion blocks 421, and one side of the upper ends of the cushion blocks 421, which is far away from the positioning block 42, is provided with an inclined surface.
By adopting the technical scheme, the positioning of the double-flat-position wafer product is more accurate.
Example 4
The present embodiment is different from embodiment 1 in that: specifically, the bottom of the female die 11 is provided with a material guide plate 3, the material guide plate 3 is provided with a material charging chute 32 corresponding to the cavity 5, the side wall of the material charging chute 32 is provided with a plurality of guide pins 31, and the guide pins 31 are formed by bending downwards strip sheets reserved during processing of the material charging chute 32.
By adopting the technical scheme, the double-flat-position wafer product is guided by the guide pins 31, so that the double-flat-position wafer product can accurately fall onto the mobile station 4; in addition, the blanking position of the double-flat-position wafer product can be changed by adjusting the inclination angle of the guide pins 31.
Specifically, the implementation method of the unconventional steel plate wafer cutting device comprises the following steps:
the pressing machine drives the upper fixing seat 9 to move downwards, and the pressure plate 10 presses the steel plate material above the female die 11;
secondly, the male die 7 is matched with the female die 11 to punch the steel plate material;
thirdly, the punched steel plate wafer falls onto the moving platform 4 under the action of the guide pins 31 on the material guide plate 3, and meanwhile, the upper fixed seat 9 is driven by the press to reset upwards;
fourthly, the moving module 2 drives the moving platform 4 to move outwards, and the steel plate wafer is conveyed to the outer side of the concave die holder 12;
and (V) taking out the steel plate wafer on the mobile station 4 by the manipulator, and driving the mobile station 4 to reset by the mobile module 2 to wait for the next operation.
In conclusion, the male die 7 and the cavity 5 are designed into the double-flat-position structure corresponding to the wafer product, and compared with a normal wafer, the steel plate material with the same area can be used for punching more double-flat-position wafer products, so that the utilization rate of the material is improved; according to the invention, two cavities 5 and the male die 7 are designed, and two double-flat-position circular sheet products can be punched by one action, so that the processing efficiency of the double-flat-position circular sheet products is greatly improved; the moving module 2 drives the moving table 4 to move, so that punched double-flat-position circular sheet products are conveyed to the outer side of the die, and quick blanking of the double-flat-position circular sheet products is realized; three positioning blocks 42 which are equidistant are arranged on a base 41, the side edges of the positioning blocks 42 are of arc structures, and the positioning blocks 42 are used for positioning the double-flat-position wafer product, so that a manipulator can conveniently and accurately grab the double-flat-position wafer product, and the double-flat-position wafer product can be conveniently and quickly moved to the next processing procedure; according to the invention, the material guide plate 3 is arranged at the bottom of the female die 11, the material guide plate 3 is provided with the blanking groove 32 corresponding to the die cavity 5, the side wall of the blanking groove 32 is provided with a plurality of guide pins 31, and the double-flat-position wafer product is guided by the guide pins 31, so that the double-flat-position wafer product can accurately fall onto the moving platform 4.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. The utility model provides a device is opened to unconventional steel sheet disk, includes fixing base and the last fixing base that is located fixing base top down, its characterized in that: a concave die holder is arranged above the lower fixing seat, a concave die is arranged above the concave die holder, two symmetrical die cavities are arranged inside the concave die, each die cavity comprises two first arc edges arranged oppositely and two second arc edges arranged oppositely, the radius of each first arc edge is smaller than that of each second arc edge, a convex die holder is arranged below the upper fixing seat, and two convex dies corresponding to the die cavities are arranged below the convex die holder;
a moving module is arranged in the die holder, a moving platform corresponding to the die cavity is arranged at the output end of the moving module, the moving platform comprises a base, the base is arranged at the output end of the moving module, three positioning blocks at equal intervals are arranged on the base, and the side edges of the positioning blocks are of arc structures;
the bottom of the female die is provided with a material guide plate, the material guide plate is provided with a charging chute corresponding to the cavity, and the side wall of the charging chute is provided with a plurality of guide pins.
2. The unconventional steel plate wafer cutting device as claimed in claim 1, wherein: and a material pressing plate is arranged below the convex die seat and on the side surface of the convex die.
3. The unconventional steel plate wafer cutting device as claimed in claim 1, wherein: and a waste material cutter is arranged on one side of the convex die holder.
4. The unconventional steel plate wafer cutting device as claimed in claim 1, wherein: the side wall of the positioning block is provided with a plurality of cushion blocks, and one side of the upper end of each cushion block, which is far away from the positioning block, is provided with an inclined plane.
5. The implementation method of the unconventional steel plate wafer cutting device as claimed in any one of claims 1 to 4, characterized by comprising the following steps:
the pressing plate presses the steel plate material above the female die;
secondly, the male die and the female die are matched to punch the steel plate material;
thirdly, the punched steel plate wafer falls onto the moving platform under the action of the guide pins on the material guide plate, and the press drives the upper fixing seat to reset upwards;
fourthly, the moving module drives the moving platform to move outwards, and the steel plate wafer is conveyed to the outer side of the concave die holder;
and (V) taking out the steel plate wafer on the mobile station by the manipulator, and driving the mobile station to reset by the mobile module to wait for the next operation.
CN202111485787.1A 2021-12-07 2021-12-07 Unconventional steel plate wafer cutting device and implementation method thereof Active CN114178392B (en)

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CN202111485787.1A CN114178392B (en) 2021-12-07 2021-12-07 Unconventional steel plate wafer cutting device and implementation method thereof

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CN114178392B true CN114178392B (en) 2022-12-23

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114907A (en) * 1993-10-19 1995-05-02 Sanko Kinzoku Kogyo Kk Slug for cylindrical container of dry battery
CN104745937A (en) * 2015-03-19 2015-07-01 扬州江峰机械制造有限公司 Machining process for valve key of engine
CN204770099U (en) * 2015-07-16 2015-11-18 蚌埠市立德滤清器有限公司 A unloader for filter screw apron
CN208840291U (en) * 2018-10-10 2019-05-10 青岛仁瑞电器有限公司 One kind can synchronize punching machine die of different shapes
CN210614786U (en) * 2019-07-23 2020-05-26 平湖爱驰威汽车零部件有限公司 Double blanking mould of cold junction baffle
CN214488497U (en) * 2021-03-10 2021-10-26 安徽机电职业技术学院 Micromotor rotor piece upgrades mould stamping die

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114907A (en) * 1993-10-19 1995-05-02 Sanko Kinzoku Kogyo Kk Slug for cylindrical container of dry battery
CN104745937A (en) * 2015-03-19 2015-07-01 扬州江峰机械制造有限公司 Machining process for valve key of engine
CN204770099U (en) * 2015-07-16 2015-11-18 蚌埠市立德滤清器有限公司 A unloader for filter screw apron
CN208840291U (en) * 2018-10-10 2019-05-10 青岛仁瑞电器有限公司 One kind can synchronize punching machine die of different shapes
CN210614786U (en) * 2019-07-23 2020-05-26 平湖爱驰威汽车零部件有限公司 Double blanking mould of cold junction baffle
CN214488497U (en) * 2021-03-10 2021-10-26 安徽机电职业技术学院 Micromotor rotor piece upgrades mould stamping die

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Denomination of invention: A unconventional steel plate disc cutting device and its implementation method

Granted publication date: 20221223

Pledgee: Dongyang Branch of China Construction Bank Co.,Ltd.

Pledgor: HENGDIAN GROUP DMEGC MAGNETICS Co.,Ltd.

Registration number: Y2024330000729