CN114173473A - Flexible radio frequency circuit board, preparation method and electronic equipment - Google Patents
Flexible radio frequency circuit board, preparation method and electronic equipment Download PDFInfo
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- CN114173473A CN114173473A CN202111539215.7A CN202111539215A CN114173473A CN 114173473 A CN114173473 A CN 114173473A CN 202111539215 A CN202111539215 A CN 202111539215A CN 114173473 A CN114173473 A CN 114173473A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 177
- 229910052751 metal Inorganic materials 0.000 claims abstract description 177
- 239000010410 layer Substances 0.000 claims description 411
- 239000012790 adhesive layer Substances 0.000 claims description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 239000011889 copper foil Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a flexible radio frequency circuit board, a preparation method and electronic equipment. The edges of the first metal shielding layer and the second metal shielding layer are pressed to form a Faraday cage, so that the first insulating layer, the circuit layer and the second insulating layer are enclosed in the Faraday cage, and the Faraday cage can shield the leakage of radio frequency signals and the interference of external electromagnetic signals on the radio frequency signals.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a flexible radio frequency circuit board, a preparation method and electronic equipment.
Background
The flexible radio frequency circuit board is one kind of flexible circuit board, is mainly used for transmitting radio frequency signals, and is made of flexible insulating base materials. The flexible radio frequency circuit board provides excellent electrical performance, can meet the design requirements of smaller and higher density mounting, and also contributes to reduced assembly processes and enhanced reliability. The flexible radio frequency circuit board can be freely bent, wound and folded, can be randomly arranged according to the space layout requirement, and can be randomly moved and stretched in a three-dimensional space, so that the integration of component assembly and wire connection is realized. The flexible radio frequency circuit board can greatly reduce the volume and the weight of electronic products, and is suitable for the development of the electronic products towards high density, miniaturization and high reliability.
The flexible radio frequency circuit board generally comprises two forms of strip line and microstrip line. The conventional radio frequency strip line is formed by etching a wave guide line with specified width by using a single-sided copper clad plate or a double-sided flexible copper clad plate or a combination of two copper clad plates, and using top and bottom copper foils as shielding layers and an intermediate copper foil.
The existing radio frequency stripline flexible radio frequency circuit board has the problem of poor shielding effect, on one hand, the poor shielding effect can cause radio frequency signals to leak out, so that the radio frequency signals are weakened, and the leakage of the radio frequency signals can also cause electromagnetic radiation interference on other electronic components of electronic equipment, so that the stability of the electronic equipment is influenced; on the other hand, the poor shielding effect causes interference of external electromagnetic signals to radio frequency signals, and influences the stability of the radio frequency signals.
Disclosure of Invention
The embodiment of the invention provides a flexible radio frequency circuit board, a preparation method and electronic equipment, which can shield radio frequency signals from leaking and shield interference of external electromagnetic signals on the radio frequency signals.
In a first aspect, an embodiment of the present invention provides a flexible radio frequency circuit board, including:
a first metal shielding layer;
a first insulating layer disposed on the first metal shielding layer;
the circuit layer is arranged on one side, away from the first metal shielding layer, of the first insulating layer;
the second insulating layer is arranged on one side, far away from the first insulating layer, of the circuit layer;
the second metal shielding layer is arranged on one side, far away from the circuit layer, of the second insulating layer;
and the edges of the first metal shielding layer and the second metal shielding layer are pressed to form a Faraday cage, so that the first insulating layer, the circuit layer and the second insulating layer are enclosed in the Faraday cage.
Optionally, the first metal shielding layer and the second metal shielding layer after lamination form a reference loop of the circuit layer.
Optionally, the first metal shielding layer and the second metal shielding layer are of a corrugated structure.
Optionally, a first protective layer is disposed on one side of the first metal shielding layer away from the first insulating layer, and a second protective layer is disposed on one side of the second metal shielding layer away from the second insulating layer.
Optionally, one side of the first metal shielding layer close to the first insulating layer is provided with a first adhesive layer, and one side of the second metal shielding layer close to the second insulating layer is provided with a second adhesive layer.
Optionally, the first metal shielding layer is close to the surface of one side of the first insulating layer, and/or the second metal shielding layer is close to the surface of one side of the second insulating layer is provided with a plurality of protruding structures, the protruding structures penetrate through the first adhesive layer and the second adhesive layer, so that the first metal shielding layer is electrically connected with the second metal shielding layer.
Optionally, the first adhesive layer and the second adhesive layer are high-frequency adhesive.
Optionally, the first metal shielding layer and the second metal shielding layer are copper foils.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a flexible radio frequency circuit board, including:
providing a single-sided copper-clad plate, wherein the single-sided copper-clad plate comprises a first insulating layer and a copper foil layer arranged on the first insulating layer;
etching the copper foil layer to form a circuit layer;
forming a second insulating layer on one side of the circuit layer far away from the first insulating layer;
forming a first metal shielding layer on one side of the first insulating layer far away from the circuit layer;
forming a second metal shielding layer on one side of the second insulating layer far away from the circuit layer;
and pressing the edges of the first metal shielding layer and the second metal shielding layer to form a Faraday cage, so that the first insulating layer, the circuit layer and the second insulating layer are enclosed in the Faraday cage.
Optionally, the first metal shielding layer and the second metal shielding layer have an extension region beyond peripheral edges of the first insulating layer, the circuit layer, and the second insulating layer, and the edges of the first metal shielding layer and the second metal shielding layer are pressed together, including:
and pressing the extension areas of the first metal shielding layer and the second metal shielding layer.
Optionally, the edge of the first metal shielding layer and the edge of the second metal shielding layer are pressed, including:
removing a part of the first insulating layer, the circuit layer and the second insulating layer from the side surface of a combination formed by the first metal shielding layer, the first insulating layer, the circuit layer, the second insulating layer and the second metal shielding layer to form a groove, so that the first metal shielding layer and the second metal shielding layer have an extension area exceeding the peripheral edges of the first insulating layer, the circuit layer and the second insulating layer;
and pressing the extension areas of the first metal shielding layer and the second metal shielding layer.
In a third aspect, an embodiment of the present invention further provides an electronic device, including the flexible radio frequency circuit board provided in the first aspect of the present invention.
The flexible radio frequency circuit board provided by the embodiment of the invention comprises a first metal shielding layer, a first insulating layer, a circuit layer, a second insulating layer and a second metal shielding layer, wherein the first insulating layer is arranged on the first metal shielding layer, the circuit layer is arranged on one side, away from the first metal shielding layer, of the first insulating layer, the second insulating layer is arranged on one side, away from the first insulating layer, of the circuit layer, and the second metal shielding layer is arranged on one side, away from the circuit layer, of the second insulating layer. The edges of the first metal shielding layer and the second metal shielding layer are pressed to form a Faraday cage, so that the first insulating layer, the circuit layer and the second insulating layer are enclosed in the Faraday cage, and the Faraday cage can shield the leakage of radio frequency signals and the interference of external electromagnetic signals on the radio frequency signals.
Drawings
The invention is explained in more detail below with reference to the figures and examples.
Fig. 1 is a schematic structural diagram of a flexible radio frequency circuit board according to an embodiment of the present invention;
FIG. 2 is a partial schematic view of a press fit provided by an embodiment of the invention;
fig. 3 is a flowchart of a method for manufacturing a flexible radio frequency circuit board according to an embodiment of the present invention;
FIG. 4 is a schematic view of a second insulating layer formed on the line layer;
FIG. 5 is a schematic diagram of a first metal shielding layer formed on a first insulating layer;
FIG. 6 is a schematic view of a second metal shielding layer formed on a second insulating layer;
FIG. 7 is a schematic view of a press fit provided by the present invention;
fig. 8 is a schematic diagram of a slot according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
Fig. 1 is a schematic structural diagram of a flexible radio frequency circuit board according to an embodiment of the present invention, and as shown in fig. 1, the flexible radio frequency circuit board includes:
the first metal shielding layer 101, the first metal shielding layer 101 is made of a metal material, and may be a complete metal layer or a metal grid formed by etching the metal layer.
A first insulating layer 102, wherein the first insulating layer 102 is disposed on the first metal shielding layer 101. Illustratively, in the embodiment of the present invention, in order to meet the flexibility requirement of the flexible rf circuit board, the first insulating layer 102 is a flexible material, such as polyimide. Specifically, the flexible material used for the first insulating layer 102 is not limited in the present invention.
The circuit layer 103 is disposed on one side of the first insulating layer 102 away from the first metal shielding layer 101, and the circuit layer 103 includes a plurality of metal lines for transmitting radio frequency signals. For example, in the embodiment of the present invention, the material of the circuit layer 103 is copper, and the metal circuit may be formed by etching a metal foil (e.g., a copper foil), which is not described herein again.
And the second insulating layer 104 is arranged on one side of the circuit layer 103 far away from the first insulating layer 102, and the second insulating layer 104 is arranged on the other side of the circuit layer 103. Illustratively, in the embodiment of the present invention, in order to meet the flexibility requirement of the flexible rf circuit board, the second insulating layer 104 is a flexible material, such as Polyimide (PI). Specifically, the present invention does not limit the flexible material used for the second insulating layer 104. Illustratively, in the embodiment of the present invention, the second insulating layer 104 is adhered to the side of the circuit layer 103 away from the first insulating layer 102 by an adhesive layer 112.
The second metal shielding layer 105, the second metal shielding layer 105 is disposed on a side of the second insulating layer 104 away from the circuit layer 103, the second metal shielding layer 105 is made of a metal material, and may be a complete metal layer or a metal mesh formed by etching the metal layer.
The peripheral edges of the first metal shielding layer 101 and the second metal shielding layer 105 are pressed together to form a faraday cage, so that the first insulating layer 102, the circuit layer 103 and the second insulating layer 104 are enclosed in the faraday cage.
A Faraday Cage (Faraday Cage) is a Cage formed of metal or a good conductor. The Faraday cage can shield radio frequency signals from leaking and can shield interference of external electromagnetic signals to the radio frequency signals.
Exemplarily, as shown in fig. 1, in the embodiment of the present invention, the first insulating layer 102, the circuit layer 103, and the second insulating layer 104 have flush edges, the peripheral edges of the first metal shielding layer 101 and the second metal shielding layer 105 exceed the edges of the first insulating layer 102, the circuit layer 103, and the second insulating layer 104 to form an extension region, and when the first metal shielding layer 101 and the second metal shielding layer 105 are laminated, the extension regions of the first metal shielding layer 101 and the second metal shielding layer 105 are laminated to form a faraday cage, so that the first insulating layer 102, the circuit layer 103, and the second insulating layer 104 are enclosed in the faraday cage.
The flexible radio frequency circuit board provided by the embodiment of the invention comprises a first metal shielding layer, a first insulating layer, a circuit layer, a second insulating layer and a second metal shielding layer, wherein the first insulating layer is arranged on the first metal shielding layer, the circuit layer is arranged on one side, away from the first metal shielding layer, of the first insulating layer, the second insulating layer is arranged on one side, away from the first insulating layer, of the circuit layer, and the second metal shielding layer is arranged on one side, away from the circuit layer, of the second insulating layer. The edges of the first metal shielding layer and the second metal shielding layer are pressed to form a Faraday cage, so that the first insulating layer, the circuit layer and the second insulating layer are enclosed in the Faraday cage, and the Faraday cage can shield the leakage of radio frequency signals and the interference of external electromagnetic signals on the radio frequency signals.
In the embodiment of the present invention, the first metal shielding layer 101 and the second metal shielding layer 105 after lamination form a reference loop of the circuit layer. The loop of the radio frequency signal is not directly formed into a loop by a conductor, but is formed by inducing a current in a phase opposite to that of the signal line on the reference loop through the coupling of an electromagnetic field with the faraday cage formed by the first metal shielding layer 101 and the second metal shielding layer 105.
In some embodiments of the present invention, the first metal shielding layer 101 and the second metal shielding layer 105 have a corrugated structure. Under the application scene that needs buckle, the deformation of this kind of fold's copper foil is similar to the deformation of spring, compares in the tensile deformation of pure copper foil, and the life-span of buckling can obtain promoting.
In some embodiments of the present invention, as shown in fig. 1, a side of the first metal shielding layer 101 away from the first insulating layer 102 is provided with a first protection layer 106, and the first protection layer 106 protects the first metal shielding layer 101 from external impact or scratch. For example, the first protection layer 106 may be a PI film or a resin film, and the embodiment of the invention is not limited herein. A second protective layer 107 is disposed on a side of the second metal shielding layer 105 away from the second insulating layer 104, and the second protective layer 107 protects the second metal shielding layer 105 from external impact or scratch. For example, the second protective layer 107 may be a PI film or a resin film, and the embodiment of the invention is not limited herein.
In some embodiments of the present invention, as shown in fig. 1, a first adhesive layer 108 is disposed on a side of the first metal shielding layer 101 close to the first insulating layer 102, and a second adhesive layer 109 is disposed on a side of the second metal shielding layer 105 close to the second insulating layer 104. Illustratively, in the implementation of the present invention, the first metallic shielding layer 101 is formed on the first protection layer 106 in advance to form a first shielding film; the second metal shielding layer 105 is formed on the second protective layer 107 in advance, forming a second shielding film; the circuit layer 103 is formed on the first insulating layer 102 in advance, the second insulating layer 104 is formed on the circuit layer 103 to form a circuit board, and then the first shielding film and the circuit board are bonded by the first adhesive layer 108 and the second shielding film and the circuit board are bonded by the second adhesive layer 109, thereby obtaining the flexible radio frequency circuit board in the embodiment of the present invention.
In the pressing process, a combination layer formed by the first protection layer 106, the first metal shielding layer 101 and the first adhesive layer 108 and a combination layer formed by the second protection layer 107, the second metal shielding layer 105 and the second adhesive layer 109 are pressed together through a hot pressing process, and in the pressing process, the adhesive layer between the first metal shielding layer 101 and the second metal shielding layer 105 is squeezed open, so that the first metal shielding layer 101 and the second metal shielding layer 105 are electrically connected together to form a faraday cage. Illustratively, as shown in fig. 1, the first adhesive layer 108 and the second adhesive layer 109 are extruded into the cavities around the sidewalls of the first insulating layer 102, the circuit layer 103, the adhesive layer 112 and the second insulating layer 104 to form an integrated structure.
Fig. 2 is a partial schematic view of a bonding portion according to an embodiment of the invention, in some embodiments of the invention, considering an effect of an adhesive existing between the first metal shielding layer 101 and the second metal shielding layer 105 on electrical connection, as shown in fig. 2, a plurality of protruding structures 110 are disposed on a surface of one side of the first metal shielding layer 101 close to the first insulating layer 102 and a surface of one side of the second metal shielding layer 105 close to the second insulating layer 104, and the protruding structures 110 penetrate through the first adhesive layer 108 and the second adhesive layer 109, so that the first metal shielding layer 101 and the second metal shielding layer 105 are electrically connected. Illustratively, the bump structure 110 is an integral structure with the first metal shielding layer 101 and the second metal shielding layer 105. During the pressing process, the bump structures 110 pierce the first adhesive layer 108 and the second adhesive layer 109, so that the first metal shielding layer 101 and the second metal shielding layer 105 are electrically connected. The protruding structure 110 improves the stability of the electrical connection between the first metal shielding layer 101 and the second metal shielding layer 105, and on the other hand, the protruding structure 110 increases the contact area with the adhesive layer, thereby improving the firmness and the tightness of the interlayer adhesion.
In some embodiments of the present invention, the first adhesive layer 108 and the second adhesive layer 109 are high frequency adhesives. The high-frequency glue has the characteristic of low loss angle, is suitable for electronic equipment of high-frequency radio-frequency signals, and is used for reducing the transmission loss of the radio-frequency signals. For example, the high-frequency adhesive may be an epoxy adhesive or the like with improved high-frequency performance, and the embodiment of the invention is not limited herein.
In some embodiments of the present invention, first metallic shield layer 101 and second metallic shield layer 102 are copper foils. The circuit of the circuit layer is formed by etching copper foil.
In some embodiments of the present invention, the thickness of the flexible rf circuit board is in the range of 50 μm to 200 μm, and preferably, the thickness of the flexible rf circuit board is in the range of 50 μm to 100 μm. Illustratively, in a specific embodiment of the present invention, the flexible RF circuit board has a thickness of 80 μm.
An embodiment of the present invention further provides a method for manufacturing a flexible radio frequency circuit board, and fig. 3 is a flowchart of the method for manufacturing a flexible radio frequency circuit board according to the embodiment of the present invention, as shown in fig. 3, the method includes the following steps:
s101, providing a single-sided copper-clad plate, wherein the single-sided copper-clad plate comprises a first insulating layer and a copper foil layer arranged on the first insulating layer.
In the embodiment of the invention, a single-sided copper-clad plate is provided, and the single-sided copper-clad plate comprises a first insulating layer and a copper foil layer arranged on the first insulating layer.
S102, etching the copper foil layer to form a circuit layer.
Illustratively, the copper foil on the single-sided copper-clad plate is subjected to exposure, development, etching and other treatment to obtain a desired metal circuit, and a circuit layer is formed. The specific processes of exposure, development and etching in the embodiment of the invention are not described in detail herein.
And S103, forming a second insulating layer on one side of the circuit layer, which is far away from the first insulating layer.
Fig. 4 is a schematic diagram of forming a second insulating layer on the circuit layer, as shown in fig. 4, the second insulating layer 104 is adhered to the side of the circuit layer 103 away from the first insulating layer 102 by an adhesive layer 112, and the first insulating layer 102, the circuit layer 103 and the second insulating layer 104 form a circuit board. The second insulating layer 104 mainly functions to protect the wiring layer 103. Illustratively, to meet the flexibility requirement of the flexible rf circuit board, the first insulating layer 102 and the second insulating layer 104 are flexible materials, such as Polyimide (PI).
And S104, forming a first metal shielding layer on one side of the first insulating layer, which is far away from the circuit layer.
Fig. 5 is a schematic diagram of forming a first metal shielding layer on a first insulating layer, and as shown in fig. 5, in the embodiment of the present invention, a first metal shielding layer 101 is formed on a first protection layer 106 in advance to form a first shielding film. Then, one side of the first metal shielding layer 101 of the first shielding film is bonded to one side of the first insulating layer 102 away from the circuit layer 103 through the first adhesive layer 108.
And S105, forming a second metal shielding layer on one side of the second insulating layer far away from the circuit layer.
Fig. 6 is a schematic diagram of forming a second metal shielding layer on the second insulating layer, and as shown in fig. 6, in the embodiment of the present invention, the second metal shielding layer 105 is formed on the second protection layer 107 in advance to form a second shielding film. Then, one side of the second metal shielding layer 105 of the second shielding film is bonded to the side of the second insulating layer 104 away from the circuit layer 103 through the second adhesive layer 109.
S106, pressing the edges of the first metal shielding layer and the second metal shielding layer to form a Faraday cage, so that the first insulating layer, the circuit layer and the second insulating layer are enclosed in the Faraday cage.
The first metal shielding layer and the second metal shielding layer are provided with extension areas which exceed the peripheral edges of the first insulating layer, the circuit layer and the second insulating layer, and the edges of the first metal shielding layer and the second metal shielding layer are pressed. Fig. 7 is a schematic view of the press-fitting provided by the present invention, as shown in fig. 6 and 7, the circuit board composed of the first insulating layer 102, the circuit layer 103 and the second insulating layer 104 has flush peripheral edges, and illustratively, the flush peripheral edges of the first insulating layer 102, the circuit layer 103 and the second insulating layer 104 may be achieved by laser cutting or mechanical blanking. The first and second shielding films have an extended region beyond the peripheral edge of the wiring board composed of the first insulating layer 102, the wiring layer 103, and the second insulating layer 104. At the time of pressing, the extended regions of the first shielding film and the second shielding film are pressed.
In some embodiments of the present invention, considering the effect of the adhesive existing between the first metal shielding layer 101 and the second metal shielding layer 105 on the electrical connection, the surface of the first metal shielding layer 101 near the side of the first insulating layer 102 and the surface of the second metal shielding layer 105 near the side of the second insulating layer 104 are provided with a plurality of protruding structures, and the protruding structures penetrate through the first adhesive layer 108 and the second adhesive layer 109, so as to electrically connect the first metal shielding layer 101 and the second metal shielding layer 105. Illustratively, the bump structure is an integral structure with the first metal shielding layer 101 and the second metal shielding layer 105. During the pressing process, the bump structure pierces through the first adhesive layer 108 and the second adhesive layer 109, so that the first metal shielding layer 101 and the second metal shielding layer 105 are electrically connected. Protruding structure has improved the electric connection stability between first metal shielding layer 101 and the second metal shielding layer 105 on the one hand, and on the other hand, protruding structure has increased with the area of contact of viscose layer, has improved the fastness and the seal of interbedding bonding. Specifically, the embodiment shown in fig. 2 may be referred to as the protrusion structure, and the embodiment of the present invention is not described herein again.
Fig. 8 is a schematic diagram of a slot according to an embodiment of the present invention, and in another embodiment of the present invention, as shown in fig. 8, after the first shielding film, the circuit board, and the second shielding film are bonded together, the first shielding film, the circuit board, and the second shielding film are laser cut or mechanically punched to make the first shielding film, the circuit board, and the second shielding film have flush edges. Then, by mechanically cutting a groove, a part of the wiring board composed of the first insulating layer 102, the wiring layer 103 and the second insulating layer 104 is removed from the peripheral side surface of the three-part assembly, and a groove 111 is formed in the peripheral side surface of the three-part assembly. So that the first shielding film and the first shielding film have an extended region beyond the peripheral edges of the first insulating layer 102, the wiring layer 103, and the second insulating layer 104. At the time of pressing, the extended regions of the first shielding film and the second shielding film are pressed.
Specifically, the structures and materials of the layers in the above embodiments have been described in detail in the above embodiments, and the embodiments of the present invention are not described herein again.
In other embodiments of the present invention, a double-sided copper-clad plate may also be provided, in which a circuit layer is formed on one copper foil, and the other copper foil is used as the first metal shielding layer or the second metal shielding layer.
The embodiment of the invention also provides electronic equipment, which comprises the flexible radio frequency circuit board provided by any embodiment of the invention, and has the same functions and effects as the embodiment. The electronic device may include an electronic device such as a smart phone and a smart tablet, which is not limited herein.
In the description herein, it is to be understood that the terms "upper", "lower", "left", "right", and the like are used in a descriptive sense or positional relationship based on the orientation or positional relationship shown in the drawings for convenience in description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present invention.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A flexible radio frequency circuit board, comprising:
a first metal shielding layer;
a first insulating layer disposed on the first metal shielding layer;
the circuit layer is arranged on one side, away from the first metal shielding layer, of the first insulating layer;
the second insulating layer is arranged on one side, far away from the first insulating layer, of the circuit layer;
the second metal shielding layer is arranged on one side, far away from the circuit layer, of the second insulating layer;
and the edges of the first metal shielding layer and the second metal shielding layer are pressed to form a Faraday cage, so that the first insulating layer, the circuit layer and the second insulating layer are enclosed in the Faraday cage.
2. The flexible radio frequency circuit board of claim 1, wherein the first metal shielding layer and the second metal shielding layer after lamination form a reference loop of the circuit layer.
3. The flexible radio frequency circuit board of claim 1, wherein the first metal shielding layer and the second metal shielding layer are in a corrugated structure.
4. The flexible radio frequency circuit board according to claim 1, wherein a side of the first metal shielding layer away from the first insulating layer is provided with a first protective layer, and a side of the second metal shielding layer away from the second insulating layer is provided with a second protective layer.
5. The flexible radio frequency circuit board according to claim 1, wherein a first adhesive layer is disposed on a side of the first metal shielding layer close to the first insulating layer, and a second adhesive layer is disposed on a side of the second metal shielding layer close to the second insulating layer.
6. The flexible radio frequency circuit board according to claim 5, wherein a plurality of protruding structures are disposed on a surface of the first metal shielding layer close to one side of the first insulating layer and/or a surface of the second metal shielding layer close to one side of the second insulating layer, and the protruding structures penetrate through the first adhesive layer and the second adhesive layer to electrically connect the first metal shielding layer and the second metal shielding layer.
7. A preparation method of a flexible radio frequency circuit board is characterized by comprising the following steps:
providing a single-sided copper-clad plate, wherein the single-sided copper-clad plate comprises a first insulating layer and a copper foil layer arranged on the first insulating layer;
etching the copper foil layer to form a circuit layer;
forming a second insulating layer on one side of the circuit layer far away from the first insulating layer;
forming a first metal shielding layer on one side of the first insulating layer far away from the circuit layer;
forming a second metal shielding layer on one side of the second insulating layer far away from the circuit layer;
and pressing the edges of the first metal shielding layer and the second metal shielding layer to form a Faraday cage, so that the first insulating layer, the circuit layer and the second insulating layer are enclosed in the Faraday cage.
8. The method for manufacturing a flexible radio frequency circuit board according to claim 7, wherein the first metal shielding layer and the second metal shielding layer have an extension region beyond peripheral edges of the first insulating layer, the circuit layer and the second insulating layer, and the edge of the first metal shielding layer and the edge of the second metal shielding layer are pressed, including:
and pressing the extension areas of the first metal shielding layer and the second metal shielding layer.
9. The method for manufacturing a flexible radio frequency circuit board according to claim 7, wherein the step of pressing the edges of the first metal shielding layer and the second metal shielding layer comprises:
removing a part of the first insulating layer, the circuit layer and the second insulating layer from the side surface of a combination formed by the first metal shielding layer, the first insulating layer, the circuit layer, the second insulating layer and the second metal shielding layer to form a groove, so that the first metal shielding layer and the second metal shielding layer have an extension area exceeding the peripheral edges of the first insulating layer, the circuit layer and the second insulating layer;
and pressing the extension areas of the first metal shielding layer and the second metal shielding layer.
10. An electronic device comprising the flexible radio frequency circuit board according to any one of claims 1 to 6.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111539215.7A CN114173473A (en) | 2021-12-15 | 2021-12-15 | Flexible radio frequency circuit board, preparation method and electronic equipment |
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| CN202111539215.7A CN114173473A (en) | 2021-12-15 | 2021-12-15 | Flexible radio frequency circuit board, preparation method and electronic equipment |
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Application publication date: 20220311 |