CN109041404A - A kind of FPC plate and mobile terminal for mobile terminal - Google Patents
A kind of FPC plate and mobile terminal for mobile terminal Download PDFInfo
- Publication number
- CN109041404A CN109041404A CN201810832679.9A CN201810832679A CN109041404A CN 109041404 A CN109041404 A CN 109041404A CN 201810832679 A CN201810832679 A CN 201810832679A CN 109041404 A CN109041404 A CN 109041404A
- Authority
- CN
- China
- Prior art keywords
- layer
- copper foil
- shielding layer
- foil shielding
- fpc plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of FPC plates and mobile terminal for mobile terminal, the FPC plate includes substrate, the substrate includes that at least one layer is provided with the routing layer of signal wire and the insulating layer for avoiding the routing layer short circuit, it is separately provided for the first copper foil shielding layer made of copper foil and the second copper foil shielding layer of radiation-screening in the both side surface of described matrix, multiple ground holes being arranged successively through described matrix and first copper foil shielding layer and second copper foil shielding layer are stamped and formed out along the edge on described matrix periphery.FPC plate for mobile terminal of the invention presses copper foil shielding layer in upper and lower surface, and copper foil is complete, without etching cabling, the edge the FPC hole Da Di is connected, signal wire is completely enclosed with upper layer and lower layer copper foil, plays the effect of shielding interference signal completely, not only save coating EMI shielded layer, leakage copper is also eliminated, production and material cost are saved, improves EMC performance.
Description
Technical field
The present invention relates to technical field of electronic products, whole more particularly, to a kind of FPC plate for mobile terminal and movement
End.
Background technique
It is high, bent, lightening that FPC flexible circuit board has the characteristics that Distribution density, and is widely used on mobile phone
To realize integration that component arrangement is connected with cabling.But FPC plate, which is different from pcb board, can place the screen such as mask frame, shielding case
Device is covered to improve radiation interference.The common screen method of FPC is the reserved leakage copper of FPC tow sides, coats EMI shielded layer, EMI
Shielded layer realizes shield effectiveness by leakage copper ground connection.All there is LCD interference in mobile phone in the prior art, need the FPC of LCD
Cabling applies EMI shielded layer to shield interference.
The method that FPC coats EMI shielded layer, there are the problem of have: FPC needs reserved leakage copper section, and certain in cabling
In the case where, increase leakage copper section and be intended to increase FPC width, increases FPC ground connection cost；EMI shielded layer is coated, is increased
EMI cost and coating process are added, production cost also correspondinglys increase.
Summary of the invention
The object of the present invention is to provide a kind of FPC plates and mobile terminal for mobile terminal, solve in the prior art
The problem of FPC plate higher cost in mobile phone.
The technical proposal for solving the technical problem of the invention is: a kind of FPC plate for mobile terminal, including base
Plate, the substrate include that at least one layer is provided with the routing layer of signal wire and the insulation for avoiding the routing layer short circuit
Layer is separately provided for the first copper foil shielding layer made of copper foil and the of radiation-screening in the both side surface of described matrix
Two copper foil shielding layers have been stamped and formed out along the edge on described matrix periphery through described matrix and the first copper foil screen
Cover multiple ground holes being arranged successively of layer and second copper foil shielding layer.
Optionally, the thickness of first copper foil shielding layer and second copper foil shielding layer is respectively 0.1mm-2mm.
Optionally, the quantity of first copper foil shielding layer is one or more layers；The quantity of second copper foil shielding layer
For one or more layers.
Optionally, the periphery of first copper foil shielding layer and the periphery of second copper foil shielding layer connect, and institute
The periphery edge for stating the first copper foil shielding layer is covered on the periphery edge of second copper foil shielding layer；Or second bronze medal
The periphery edge of foil shielded layer is covered on the periphery edge of first copper foil shielding layer.
Optionally, the shape of the cross section in each described ground hole is round, polygon or ellipse.
Optionally, the shape of the cross section in each described ground hole is circle, and the aperture in each described ground hole is 2mm-10mm.
Optionally, the spacing between two neighboring described ground hole is equal and is 3mm-20mm.
Optionally, the aperture in each described ground hole is 4mm-6mm, and the spacing between two neighboring described ground hole is 5mm-
10mm。
Optionally, the routing layer is the routing layer made of the copper foil for being etched with signal wire；Wherein, the routing layer
Quantity is one layer, and the insulating layer is respectively set in the both side surface of the routing layer；Or the quantity of the routing layer is more
Layer, the insulating layer is set between two adjacent routing layers and the outer surface of the routing layer positioned at two sides is respectively set
The insulating layer.
The present invention also provides a kind of mobile terminals, including above-mentioned FPC plate.
Implement the FPC plate and mobile terminal for mobile terminal of the invention, has the advantages that use of the invention
Copper foil shielding layer is pressed in upper and lower surface in the FPC plate of mobile terminal, and copper foil is complete, without etching cabling, by the edge FPC
It beats ground hole to connect, signal wire is completely enclosed with upper layer and lower layer copper foil, play the effect of shielding interference signal completely,
Coating EMI shielded layer is not only saved, leakage copper is also eliminated, saves production and material cost, improve EMC performance.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the FPC plate for mobile terminal of the invention；
Fig. 2 is the A-A of the FPC plate for mobile terminal of Fig. 1 to schematic cross-sectional view.
Specific embodiment
With reference to the accompanying drawings and examples, the FPC plate and mobile terminal for mobile terminal of the invention is made further
Illustrate:
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
As shown in Figs. 1-2, the present invention relates to a kind of mobile terminals, and the FPC plate of mobile terminal is used for including at least one,
FPC plate is connected by signal wire 100 with connector 200.Here mobile terminal refers to mobile phone, IPAD, electronic reader etc.
Deng.
It as shown in Figs. 1-2, include substrate 1 for the FPC plate of mobile terminal, substrate 1 includes that at least one layer is provided with signal
The routing layer 11 of line 100 and insulating layer 12 for avoiding the short circuit of routing layer 11.Routing layer 11 is by being etched with signal wire 100
Copper foil made of routing layer.Insulating layer 12 is made of insulating material, and insulating materials is commonly used in the prior art exhausted
Edge material.
The quantity of routing layer 11 can be one layer, and insulating layer 12 is respectively set in the both side surface of routing layer 11.Or it walks
The quantity of line layer 11 is multilayer, and insulating layer 12 and the routing layer 11 positioned at two sides are arranged between two adjacent routing layers 11
Insulating layer 12 is respectively set in outer surface.
The first copper foil shielding layer 10 made of copper foil of radiation-screening is separately provided in the both side surface of matrix 1
With the second copper foil shielding layer 20, it has been stamped and formed out along the edge on 1 periphery of matrix through matrix 1 and the first copper foil shielding layer
10 and second copper foil shielding layer 20 multiple ground holes 2 being arranged successively.
Wherein, the thickness of the first copper foil shielding layer 10 and the second copper foil shielding layer 20 is respectively 0.1mm-2mm.Preferably,
The thickness of first copper foil shielding layer 10 and the second copper foil shielding layer 20 is respectively 0.3mm-0.5mm.First copper foil shielding layer, 10 He
Second copper foil shielding layer 20 can achieve preferable shield effectiveness in situation thin as far as possible.The quantity of first copper foil shielding layer 10 can
Think one or more layers；The quantity of second copper foil shielding layer 20 can be one or more layers, depending on as needed.
The periphery of first copper foil shielding layer 10 and the periphery of the second copper foil shielding layer 20 connect, and the first copper foil shielding layer
10 periphery edge is covered on the periphery edge of the second copper foil shielding layer 20 or the periphery edge of the second copper foil shielding layer 20
It is covered on the periphery edge of the first copper foil shielding layer 10, the edge of FPC plate is avoided to be led to the presence of radiation by radiation effect
Dead angle.
The shape of the cross section in each ground hole 2 is round, polygon or ellipse.Preferably, the cross in each ground hole 2
The shape in section is circle, and the aperture in each ground hole 2 is 2mm-10mm, and the spacing between adjacent two ground hole 2 is equal
It and is 3mm-20mm.Spacing between adjacent two ground hole 2 refers to the shortest distance between the hole edge in two ground hole 2.It is preferred that
Ground, the aperture in each ground hole 2 are 4mm-6mm, and the spacing between two neighboring ground hole 2 is 5mm-10mm.
FPC plate for mobile terminal of the invention presses copper foil shielding layer in upper and lower surface, and copper foil is complete, without
Cabling is etched, the edge the FPC hole Da Di is connected, signal wire is completely enclosed with upper layer and lower layer copper foil, is played completely
The effect for shielding interference signal not only saves coating EMI shielded layer, also eliminates leakage copper, save production and material cost, change
It has been apt to EMC performance.
The serial number of the above embodiments of the invention is only for description, does not represent the advantages or disadvantages of the embodiments.
The above is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of FPC plate for mobile terminal, including substrate (1), the substrate (1) includes that at least one layer is provided with signal wire
(100) routing layer (11) and the insulating layer (12) for avoiding the routing layer (11) short circuit, which is characterized in that described
The both side surface of matrix (1) is separately provided for the first copper foil shielding layer made of copper foil (10) and second of radiation-screening
Copper foil shielding layer (20) has been stamped and formed out along the edge on described matrix (1) periphery through described matrix (1) and described
Multiple ground holes (2) being arranged successively of one copper foil shielding layer (10) and second copper foil shielding layer (20).
2. FPC plate according to claim 1, which is characterized in that first copper foil shielding layer (10) and second bronze medal
The thickness of foil shielded layer (20) is respectively 0.1mm-2mm.
3. FPC plate according to claim 1, which is characterized in that the quantity of first copper foil shielding layer (10) is one layer
Or multilayer；The quantity of second copper foil shielding layer (20) is one or more layers.
4. FPC plate according to claim 1, which is characterized in that the periphery of first copper foil shielding layer (10) with it is described
The periphery of second copper foil shielding layer (20) connects, and the periphery edge of first copper foil shielding layer (10) is covered on described
On the periphery edge of two copper foil shielding layers (20)；Or the periphery edge of second copper foil shielding layer (20) is covered on described
On the periphery edge of one copper foil shielding layer (10).
5. FPC plate according to claim 1, which is characterized in that the shape of the cross section of each described ground hole (2) is circle
Shape, polygon or ellipse.
6. FPC plate according to claim 1, which is characterized in that the shape of the cross section of each described ground hole (2) is circle
Shape, the aperture of each described ground hole (2) are 2mm-10mm.
7. FPC plate according to claim 6, which is characterized in that the spacing between two neighboring described ground hole (2) it is equal and
For 3mm-20mm.
8. FPC plate according to claim 7, which is characterized in that the aperture of each described ground hole (2) is 4mm-6mm, adjacent
Spacing between two described ground hole (2) is 5mm-10mm.
9. FPC plate according to claim 1, which is characterized in that the routing layer (11) is by being etched with signal wire (100)
Copper foil made of routing layer；
Wherein, the quantity of the routing layer (11) is one layer, is respectively set in the both side surface of the routing layer (11) described exhausted
Edge layer (12)；Or the quantity of the routing layer (11) is multilayer, between the routing layer (11) of adjacent two described in setting
Insulating layer (12) and the insulating layer (12) are respectively set positioned at the outer surface of the routing layer (11) of two sides.
10. a kind of mobile terminal, which is characterized in that including FPC described at least any one of claim 1-9 claim
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810832679.9A CN109041404A (en) | 2018-07-26 | 2018-07-26 | A kind of FPC plate and mobile terminal for mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810832679.9A CN109041404A (en) | 2018-07-26 | 2018-07-26 | A kind of FPC plate and mobile terminal for mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109041404A true CN109041404A (en) | 2018-12-18 |
Family
ID=64646550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810832679.9A Pending CN109041404A (en) | 2018-07-26 | 2018-07-26 | A kind of FPC plate and mobile terminal for mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109041404A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114173473A (en) * | 2021-12-15 | 2022-03-11 | 安捷利电子科技（苏州）有限公司 | Flexible radio frequency circuit board, preparation method and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201491368U (en) * | 2009-08-21 | 2010-05-26 | 成都明天高新产业有限责任公司 | Electromagnetic interference resistant flexible circuit board |
| JP5550179B2 (en) * | 2010-05-06 | 2014-07-16 | フジコピアン株式会社 | Copper layer transfer sheet |
| CN105263255A (en) * | 2015-09-25 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Electrostatic discharge resistant circuit board with electromagnetic compatibility |
| CN105636336A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
-
2018
- 2018-07-26 CN CN201810832679.9A patent/CN109041404A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201491368U (en) * | 2009-08-21 | 2010-05-26 | 成都明天高新产业有限责任公司 | Electromagnetic interference resistant flexible circuit board |
| JP5550179B2 (en) * | 2010-05-06 | 2014-07-16 | フジコピアン株式会社 | Copper layer transfer sheet |
| CN105263255A (en) * | 2015-09-25 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Electrostatic discharge resistant circuit board with electromagnetic compatibility |
| CN105636336A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114173473A (en) * | 2021-12-15 | 2022-03-11 | 安捷利电子科技（苏州）有限公司 | Flexible radio frequency circuit board, preparation method and electronic equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181218 |
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| RJ01 | Rejection of invention patent application after publication |