CN114173027A - Photosensitive assembly with heat dissipation element and preparation method thereof - Google Patents
Photosensitive assembly with heat dissipation element and preparation method thereof Download PDFInfo
- Publication number
- CN114173027A CN114173027A CN202011477844.7A CN202011477844A CN114173027A CN 114173027 A CN114173027 A CN 114173027A CN 202011477844 A CN202011477844 A CN 202011477844A CN 114173027 A CN114173027 A CN 114173027A
- Authority
- CN
- China
- Prior art keywords
- photosensitive
- heat dissipation
- circuit board
- chip
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 167
- 238000002360 preparation method Methods 0.000 title description 5
- 238000004806 packaging method and process Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 22
- 238000003466 welding Methods 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 230000008054 signal transmission Effects 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 5
- 238000000429 assembly Methods 0.000 claims description 5
- 206010070834 Sensitisation Diseases 0.000 abstract description 14
- 230000008313 sensitization Effects 0.000 abstract description 14
- 238000003384 imaging method Methods 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 13
- 229920000106 Liquid crystal polymer Polymers 0.000 description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 3
- -1 Polypropylene Polymers 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
Abstract
The application provides a photosensitive assembly with heat dissipation piece, includes: the circuit board, sensitization chip, packaging body and at least one heat dissipation piece. The circuit board has opposite first and second surfaces. The photosensitive chip is attached to the first surface. The package body is arranged around the photosensitive chip on the first surface and is provided with an outer side wall. At least one radiating piece is arranged inside the packaging body, one end of the radiating piece is contacted with the first surface of the circuit board, and the other end of the radiating piece extends to the outer side wall or is exposed outside the outer side wall. The application provides a photosensitive assembly accessible and the radiating piece that generates heat source direct contact to heat conduction and thermal radiation's mode derive the heat that photosensitive assembly produced in the work effectively, and then improve the imaging quality of the module of making a video recording.
Description
Divisional application statement
The application is a divisional application of a Chinese patent application with an application number of 202010948331.3, entitled "photosensitive assembly with heat dissipation element and manufacturing method thereof" filed 9, 10, 2020.
Technical Field
The present disclosure relates to the field of optical devices, and more particularly, to a photosensitive assembly with a heat dissipation element, a method for manufacturing the photosensitive assembly with the heat dissipation element, and a camera module including the photosensitive assembly.
Background
Nowadays, the photosensitive pixels of the camera module reach 4000 ten thousand or more, and the area of the photosensitive chip is increased. Therefore, when the high-pixel camera module works, the power of the photosensitive assembly is increased quickly, and the heat generated by the photosensitive assembly is increased.
In the module of making a video recording of current high pixel, the inside temperature rise of its sensitization subassembly is very fast, but can not obtain effective heat dissipation again, consequently, the inside circuit board of sensitization subassembly, sensitization chip and other electronic component can produce deformation, and sensitization chip and electronic components's working property also receives this influence and reduces, causes the imaging quality of high pixel module of making a video recording to descend.
Disclosure of Invention
The application provides a photosensitive assembly, a preparation method and a camera module comprising the photosensitive assembly, wherein at least one of the defects in the prior art can be at least solved or partially solved.
This application provides a photosensitive assembly in one aspect, wherein, photosensitive assembly includes: a circuit board having first and second opposing surfaces; the photosensitive chip is arranged on the first surface and comprises a substrate connected with the first surface, and a photosensitive area and a non-photosensitive area which are opposite to the substrate; a package disposed around the light sensing chip on the first surface, the package having an outer sidewall; and at least one heat dissipation piece, which is arranged inside the packaging body, wherein one end of the heat dissipation piece is contacted with the non-photosensitive area, and the other end of the heat dissipation piece extends to the outer side wall or is exposed outside the outer side wall.
According to the embodiment of the application, the non-photosensitive area is provided with a plurality of first welding points, and at least one part of the first welding points is connected with one end of the heat dissipation member.
According to the embodiment of the application, the first welding point connected with one end of the heat dissipation element in the plurality of first welding points is a welding point with a grounding connection or a welding point which does not participate in signal transmission.
According to the embodiment of the application, one end of the heat dissipation member is bonded to the non-photosensitive region.
According to the embodiment of the application, the non-photosensitive area is connected with the circuit board through the electric connecting piece, and the electric connecting piece and the heat dissipation piece are arranged in the packaging body at intervals.
According to an embodiment of the present application, the heat sink is made of a heat conductive material.
According to the embodiment of the application, the heat conductivity lambda of the heat dissipation piece satisfies: λ is not less than 50W/(m.k).
According to an embodiment of the present application, the heat sink is a metal wire.
According to the embodiment of the application, the non-photosensitive area surrounds the photosensitive area sets up, the sensitization chip has connect the basement with a plurality of sides of non-photosensitive area, it is a plurality of the side have with the inside of packaging body is relative, the radiating piece set up in with at least one side is relative the inside of packaging body.
According to an embodiment of the present application, the photosensitive assembly further includes: at least one second heat dissipation piece is arranged inside the packaging body, one end of the second heat dissipation piece is contacted with the circuit board, and the other end of the second heat dissipation piece extends to the outer side wall or is exposed outside the outer side wall.
According to the embodiment of the application, the circuit board is provided with a plurality of second welding spots, and at least one part of the second welding spots is connected with one end of the second heat dissipation piece.
According to an embodiment of the present application, a second solder joint connected to one end of the second heat dissipation element among the plurality of second solder joints is a solder joint having a ground connection, or a solder joint not participating in signal transmission.
According to an embodiment of the application, the electrical connector is spaced apart from the second heat spreader within the package body.
According to an embodiment of the present application, the photosensitive assembly further includes: the heating panel, set up in the second surface of circuit board, wherein, the first surface is provided with holds the groove of sensitization chip, so that sensitization chip attached in the heating panel.
This application on the other hand still provides a module of making a video recording, includes: the photosensitive assembly; and the lens assembly is arranged above the photosensitive assembly.
In yet another aspect, the present application provides a method for manufacturing a photosensitive component, including preparing a circuit panel including a plurality of circuit boards, wherein the method includes: respectively arranging a photosensitive chip corresponding to each circuit board on the first surface of each circuit board, and connecting the photosensitive chip with each circuit board through an electric connector; arranging a plurality of radiating pieces in the circuit jointed board, wherein one end of each radiating piece is arranged on the photosensitive chip, and the other end of each radiating piece is arranged on the photosensitive chip adjacent to the photosensitive chip; placing the circuit jointed board provided with the heat dissipation piece in a packaging mold; filling a material for preparing a packaging body into the packaging mold so as to be cured to form a packaging body corresponding to each circuit board; and cutting the solidified circuit jointed board to obtain a plurality of photosensitive assemblies.
According to the embodiment of the application, the sensitization chip includes photosensitive area and the non-photosensitive area of keeping away from the first surface, will the sensitization chip with every the circuit board passes through electric connector to be connected and includes: arranging a plurality of welding spots in the non-photosensitive area; and connecting the welding points of the photosensitive chip with each circuit board through an electric connector.
According to an embodiment of the present application, providing one end of each of the heat dissipation members to the photosensitive chip includes: connecting one end of each heat dissipation piece with the welding point of the non-photosensitive area; and disposing the electrical connector spaced from the heat sink.
According to an embodiment of the present application, providing one end of each of the heat dissipation members to the photosensitive chip includes: bonding one end of each heat dissipation member to the non-photosensitive region; and disposing the electrical connector spaced from the heat sink.
According to the embodiment of the present application, the other end of each of the heat dissipating members is provided to the photosensitive chip adjacent to the photosensitive chip, and the heat dissipating members include: connecting the other end of each heat dissipation piece with a welding spot of the adjacent photosensitive chip; and arranging the electric connecting piece connected with the adjacent photosensitive chips and the heat radiating piece at intervals.
According to the embodiment of the present application, the other end of each of the heat dissipating members is provided to the photosensitive chip adjacent to the photosensitive chip, and the heat dissipating members include: bonding the other end of each heat dissipation piece to the non-photosensitive area of the adjacent photosensitive chip; and arranging the electric connecting piece connected with the adjacent photosensitive chips and the heat radiating piece at intervals.
Yet another aspect of the present application also provides a method for manufacturing a photosensitive assembly, the method including: respectively arranging a photosensitive chip corresponding to each circuit board on the first surface of each circuit board, and connecting the photosensitive chip with each circuit board through an electric connector; arranging a plurality of radiating pieces in the circuit jointed board, wherein one end of each radiating piece is arranged on the photosensitive chip, and the other end of each radiating piece is arranged on the photosensitive chip adjacent to the photosensitive chip; arranging a plurality of radiating pieces in the photosensitive chip on the outermost side of the circuit jointed board, wherein one end of each radiating piece is arranged on the photosensitive chip on the outermost side, and the other end of each radiating piece is arranged on the circuit board corresponding to the photosensitive chip on the outermost side; placing the circuit jointed board provided with the heat dissipation piece in a packaging mold; filling a material for preparing a packaging body into the packaging mold so as to be cured to form a packaging body corresponding to each circuit board; and cutting the solidified circuit jointed board to obtain a plurality of photosensitive assemblies.
According to the embodiment of the application, wherein, sensitization chip includes keeping away from sensitization district and the non-sensitization district of first surface, will sensitization chip and every circuit board pass through electric connector and connect and include: arranging a plurality of welding spots in the non-photosensitive area; and connecting the welding points of the photosensitive chip with each circuit board through an electric connector.
According to the embodiment of the present application, the photosensitive chip, in which one end of each of the heat dissipation members is disposed at the outermost side, includes: connecting one end of each heat dissipation piece with a welding spot of the photosensitive chip on the outermost side; and arranging the electric connector connected with the photosensitive chip on the outermost side and the heat dissipation piece at intervals.
According to the embodiment of the present application, the photosensitive chip, in which one end of each of the heat dissipation members is disposed at the outermost side, includes: bonding one end of each heat dissipation piece to the non-photosensitive area of the photosensitive chip on the outermost side; and arranging the electric connector connected with the photosensitive chip on the outermost side and the heat dissipation piece at intervals.
According to the embodiment of the application, the other end of each heat dissipation piece is arranged on the circuit board corresponding to the photosensitive chip on the outermost side, and the circuit board comprises: connecting the other end of each heat dissipation piece with the welding spot of the corresponding circuit board; and arranging the electric connector connected with the photosensitive chip on the outermost side and the heat dissipation piece at intervals.
The present application further provides a photosensitive assembly, including: a circuit board having first and second opposing surfaces; the photosensitive chip is attached to the first surface; a package disposed around the light sensing chip on the first surface, the package having an outer sidewall; and at least one heat dissipation piece arranged inside the packaging body, wherein one end of the heat dissipation piece is contacted with the first surface, and the other end of the heat dissipation piece extends to the outer side wall or is exposed outside the outer side wall.
According to the photosensitive assembly, the preparation method and the at least one scheme of the camera module, at least one of the following beneficial effects can be achieved:
1. the application provides a photosensitive assembly with heat dissipation piece through set up in photosensitive assembly and generate heat source direct contact's heat dissipation piece to the heat that produces is derived effectively with photosensitive assembly work to heat-conduction and thermal radiation's mode, and then improves the imaging quality of the module of making a video recording.
2. The application provides a module of making a video recording including the photosensitive assembly who has the radiating piece, through the heat-sinking capability who improves the heat-sinking capability of the sensing chip in its photosensitive assembly, packaging body and the heat-sinking capability of circuit board, can solve high pixel module radiating problem in the work effectively.
3. Methods of efficiently preparing a photosensitive assembly having a heat sink are provided.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic cross-sectional view of a photosensitive assembly having a heat sink according to one embodiment of the present application;
FIG. 2 is a top view of a photosensitive assembly having a heat sink according to one embodiment of the present application;
FIG. 3 is a schematic diagram of a conventional photosensitive assembly with a heat dissipation structure;
FIG. 4 is a schematic cross-sectional view of a photosensitive assembly having a second heat dissipation element according to another embodiment of the present application;
FIG. 5 is a schematic cross-sectional view of a photosensitive assembly having a heat dissipation element and a second heat dissipation element according to another embodiment of the present application;
FIG. 6 is a schematic cross-sectional view of a photosensitive assembly having a heat sink according to another embodiment of the present application;
fig. 7 is a schematic cross-sectional view of a camera module with a heat dissipation function according to an embodiment of the present application;
FIG. 8 is a flow chart of a process for preparing a photosensitive assembly having a heat sink according to one embodiment of the present application;
FIGS. 9A-9E are schematic diagrams illustrating a process for preparing a photosensitive assembly having a heat sink according to one embodiment of the present application;
FIG. 10 is a flow chart of a process for preparing a photosensitive assembly having a heat sink according to another embodiment of the present application; and
fig. 11A to 11E are schematic views illustrating a process of manufacturing a photosensitive assembly having a heat sink according to another embodiment of the present application, respectively.
Detailed Description
For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that in this specification, the expressions first, second, third, etc. are used only to distinguish one feature from another, and do not represent any limitation on the features. Thus, the first surface discussed below may also be referred to as the second surface without departing from the teachings of the present application. And vice versa.
In the drawings, the thickness, size and shape of the components have been slightly adjusted for convenience of explanation. The figures are purely diagrammatic and not drawn to scale. As used herein, the terms "approximately", "about" and the like are used as table-approximating terms and not as table-degree terms, and are intended to account for inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.
It will be further understood that terms such as "comprising," "including," "having," "including," and/or "containing," when used in this specification, are open-ended and not closed-ended, and specify the presence of stated features, elements, and/or components, but do not preclude the presence or addition of one or more other features, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of" appears after a list of listed features, it modifies that entire list of features rather than just individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.
Unless otherwise defined, all terms (including engineering and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. Unless explicitly defined or contradicted by context, the specific steps included in the imaging module described in the present application are not necessarily limited to the described order, and may be executed in any order or in parallel. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 is a schematic cross-sectional view of a photosensitive assembly 1000 having a heat sink 400 according to an embodiment of the present application. Fig. 2 is a top view of a photosensitive assembly 1000 having a heat sink 400 according to one embodiment of the present application.
As shown in fig. 1, the photosensitive assembly 1000 provided by the present application includes: the circuit board 100, the photosensitive chip 200, the package 300 and the heat sink 400.
In this embodiment, the wiring board 100 includes opposing first and second surfaces 110 and 120. The wiring board 100 may be made of any one of a variety of materials, such as a flexible printed Circuit board rg (printed Circuit), a flexible printed Circuit board fpc (flexible printed Circuit), a rigid printed Circuit board pcb (printed Circuit board), and a ceramic substrate (without a flexible board).
The photosensitive chip 200 may be disposed on the first surface 110 of the circuit board 100 by, for example, bonding or soldering, and the photosensitive chip 200 includes a substrate 210, a photosensitive region 220, a non-photosensitive region 230, and a side 240. The substrate 210 is usually made of a semiconductor material such as silicon, and can be connected to the first surface 110 of the circuit board 100. The photosensitive region 220 and the non-photosensitive region 230 are located on a surface opposite to the substrate 210, in other words, the photosensitive region 220 and the non-photosensitive region 230 may be disposed away from the first surface 110 of the circuit board 100, wherein the non-photosensitive region 230 may be disposed around a periphery of the photosensitive region 220. Connecting the substrate 210 and the non-photosensitive region 230 may form a plurality of sides 240 of the photosensitive chip 200.
The non-photosensitive area 230 is a logic circuit area for transmitting the electrical signal after the photoelectric conversion of the photosensitive area 220 to the circuit board 100. The non-photosensitive area 230 and the circuit board 100 generate a large amount of heat during operation.
The package 300 may be formed by, for example, mold curing, and other thermoplastic or thermosetting materials, such as nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy, and the like. The package 300 may be disposed around the photosensitive chip 200 on the first surface 110 of the circuit board 100. The package 300 may form a hollow structure with two open ends, and the hollow structure may form a light-passing hole of the photosensitive chip 200, that is, the hollow structure may be disposed opposite to the photosensitive area 220 of the photosensitive chip 200, so that light may reach the photosensitive chip 200 through the hollow structure.
The package body 300 has opposite inner and outer sidewalls 310 and 320, the inner sidewall 310 is connected to the non-photosensitive region 230 of the photosensitive chip 200, and defines a hollow structure in the photosensitive region 220 and the non-photosensitive region 230, which extends outward to the inner sidewall 310 around an optical axis (not shown) of the photosensitive element 1000.
Further, the photosensitive assembly 1000 further includes electronic components (not shown). The electronic components are usually disposed on the circuit board 100 for completing the transmission of the electrical signals. The electronic components may be, for example, resistors, capacitors, driving elements, signal processing elements, memory elements, etc. In the embodiment of the present application, the package 300 may cover the electronic component.
The package 300 integrally encapsulates the sidewall 240 of the photosensitive chip 200, a portion of the non-photosensitive region 230, the electronic component and the first surface 110 of the circuit board 100, so as to prevent the above components from being exposed to external dust and affecting the imaging quality of the camera module; in addition, the integrally packaged structure can provide supporting and fixing functions for the photosensitive chip 200 and the circuit board 100, enhance the structural strength of the circuit board 100 and the photosensitive chip 200, and further reduce the size of the camera module.
The heat sink 400 is made of a heat conductive material, such as various metal materials having high thermal conductivity. In the embodiment of the present application, the thermal conductivity λ of the heat sink 400 satisfies λ ≧ 50W/(m · k). Further, considering that the higher the thermal conductivity of the heat sink 400, the better, the material having a thermal conductivity λ ≧ 100W/(m · k) may be selected for the preparation of the heat sink 400. The heat sink 400 may be a metal wire, one end of which contacts the non-photosensitive region 230 of the heat generating source of the photosensitive assembly 1000, and the other end of which may extend to the outer sidewall 320 or be exposed outside the outer sidewall 320.
The length L of the heat dissipation member 400 is larger than or equal to 1mm, and the heat dissipation capability of the heat dissipation member 400 can be improved due to the longer heat dissipation length.
Other configurations of the heat dissipation member 400, such as metal strips, metal blocks, etc., may be selected, and the present application is not limited thereto, and it will be understood by those skilled in the art that the material and shape configuration of the heat dissipation member may be changed to obtain the various results and advantages described in the present specification without departing from the technical solution claimed in the present application.
The heat sink 400 is encapsulated by the package 300, in other words, the heat sink 400 is disposed inside the package 300. The package 300 can support the heat dissipation member 400, and the heat dissipation member 400 is inserted into the package 300, which is beneficial to increase the heat dissipation capability of the package 300, and the effective heat dissipation area of the light sensing assembly 1000 can be increased by the larger surface area of the package 300.
Fig. 3 is a schematic diagram of a conventional photosensitive assembly 2000 with a heat dissipation structure.
As shown in fig. 3, in the conventional heat dissipation method of the photosensitive assembly 2000, heat is generally conducted indirectly by heat radiation, for example, by mounting a heat dissipation plate 2200 on the second surface 2120 of the wiring board 2100. Since the substrate 2310 of the photosensitive chip 2300 is made of a semiconductor material such as silicon, the thermal conductivity is usually 10W/(m.k) or less, and the thickness of the substrate 2310 is usually in the range of 80 μm to 150 μm, the substrate 2310 of the photosensitive chip 2300 has poor thermal conductivity, which blocks partial heat transfer. In the prior art, the heat generated by the photosensitive chip 2300 during the operation of the camera module is relatively large, only a part of the generated heat can be led out from the lower heat dissipation plate, and the other part of the generated heat is still retained in the camera module, and the retained excessive temperature can cause adverse effects on other components of the camera module, for example, the components deform, and the deformed components can affect the performance of the photosensitive chip 2300 and the shooting effect of the camera module.
Referring again to fig. 1, in the embodiment of the present application, the heat sink 400 is in direct contact with the main heat-generating source non-photosensitive region 230 of the photosensitive chip 200, and the heat sink 400 is disposed in the package 300, so that the heat dissipation area of the package 300 is effectively increased by a larger surface area, and heat can be effectively conducted away by means of heat conduction and heat radiation. Further, a plurality of heat dissipation members 400 may be further disposed in the light sensing chip 200, and the plurality of heat dissipation members 400 may be further uniformly disposed in the package 300 opposite to the plurality of sidewalls 240 of the light sensing chip 200, that is, the plurality of heat dissipation members 400 may effectively directly contact the non-photosensitive areas 230 on different sides of the light sensing chip 200, and effectively conduct heat away by means of heat conduction and heat radiation.
Further, the photosensitive assembly 1000 further includes an electrical connector 500. In one embodiment of the present application, the non-photosensitive region 230 can be electrically connected to the circuit board 100 by, for example, a wire bonding process, so as to achieve electrical connection therebetween. The wire bonding process can be selected from gold wire, silver wire, copper wire, etc. The electrical connector 500 is used to electrically connect the circuit board 100 and the non-photosensitive area 230.
Referring again to fig. 2, in one embodiment of the present application, the non-photosensitive region 230 may include a plurality of first pads, such as a pad 231 and a pad 232. The wiring board 100 may also include a plurality of second pads, such as pad 111. Electrical connection 500 may be connected to, for example, pad 231 at one end of non-photosensitive region 230 and electrical connection 500 may be connected to, for example, pad 111 of circuit board 100 at the other end. The package body 300 encapsulates the electrical connector 500, and the electrical connector 500 may be a power lead, a power ball, or the like.
Among the first pads of the non-photosensitive region 230, the pad 232 is a pad having a ground connection or a pad not participating in the transmission of an electrical signal. In one embodiment of the present application, to prevent leakage problem of photosensitive assembly 1000, the end of heat dissipation member 400 contacting non-photosensitive region 230 may be selected to have a solder pad connected to ground in non-photosensitive region 230 or a solder pad directly connected to a solder pad not involved in electrical signal transmission, such as solder pad 232; the other end of the heat sink 400 may extend to the outer sidewall 320 of the package body 300 or be exposed outside of the outer sidewall 320. Therefore, the heat generated by the non-photosensitive region 230 can be conducted to the heat sink 400 through the solder joints, so as to conduct the heat out of the camera module.
Further, in one embodiment of the present application, the solder joint having the ground connection or the solder joint not participating in the transmission of the electrical signal in the non-photosensitive region 230 may have a large surface area, for example, the surface area of the solder joint 232 may be larger than that of the solder joint 231, and a plurality of heat dissipation members 400 may be connected at the same time.
Alternatively, in one embodiment of the present application, heat spreader 400 may be selectively coupled to non-photosensitive region 230 by other means, such as bonding, to facilitate and efficiently conduct heat generated by non-photosensitive region 230. Further, the heat dissipation member 400 in the embodiment of the present application may also directly contact the side of the photo-sensing chip 200, so that heat dissipation may be achieved with a small size of the non-photosensitive region 230. That is, when the size of the non-photosensitive region 230 is small, for example, no more first solder points for contacting the heat dissipation member 400 can be provided, the heat dissipation member 400 can be directly contacted to the side of the photo chip 200.
Further, in an embodiment of the present application, a first pad, such as pad 231, of the photo sensor chip 200 for connecting to the circuit board 100 may be disposed on a side of the substrate 210 without the photo sensor area 220, and directly electrically connected to the circuit board 100 by a process, such as gold ball implantation; a first solder point, such as solder point 232, of the photo-sensing chip 200, which is in contact with or fixed to the heat spreader 400, is disposed in the non-photo-sensing area 230. Alternatively, the heat dissipation member 400 may also be directly contacted or fixed to the sidewall 240 of the photosensitive chip 200, so that only the photosensitive region 220 needs to be disposed on the substrate 210 of the photosensitive chip 200 to effectively control the size of the photosensitive chip 200.
In one embodiment of the present application, the heat sink 400 and the electrical connector 500 are simultaneously encapsulated by the package body 300, i.e., the heat sink 400 and the electrical connector 500 are spaced apart from each other inside the package body 300. The heat dissipation member 400 and the electrical connector 500 can be isolated by the interval arrangement mode, so that the situations of crosstalk, electric leakage, short circuit and the like of electrical signals are avoided; on the other hand, the heat sink 400 is inserted into the package body, which is beneficial to increasing the heat dissipation capability of the package body 300, and the effective heat dissipation area of the photosensitive assembly 1000 is increased by the larger surface area of the package body 300.
Fig. 4 is a schematic cross-sectional view of a photosensitive assembly 1000 having a second heat dissipation member 600 according to another embodiment of the present application. Fig. 5 is a schematic cross-sectional view of a photosensitive assembly 1000 having a heat dissipation member 400 and a second heat dissipation member 600 according to another embodiment of the present application.
As shown in fig. 4, in one embodiment of the present application, the photosensitive assembly 1000 may further include a second heat dissipation member 600. Likewise, the second heat dissipation member 600 is made of a heat conductive material, such as various metal materials having high thermal conductivity. In the embodiment of the present application, the thermal conductivity λ of the second heat sink 600 satisfies λ ≧ 50W/(m · k). Further, the second heat sink 600 may be prepared by selecting a material having a thermal conductivity λ ≧ 100W/(m · k) in consideration that the higher the thermal conductivity of the second heat sink 600 is, the better. The heat dissipation member 600 may be a metal wire, or alternatively, other structures such as a metal strip, a metal block, etc., and the present application is not limited thereto, and it will be understood by those skilled in the art that the material and shape of the heat dissipation member may be changed to obtain the various results and advantages described in the present specification without departing from the technical solution claimed in the present application.
The length L of the second heat dissipation member 600 satisfies that L is larger than or equal to 1mm, and the longer heat dissipation length can improve the heat dissipation capacity of the second heat dissipation member 600.
In one embodiment of the present application, one end of the metal wire may contact one of the circuit boards 100 of the heat generating sources of the photosensitive assembly 1000, and the other end of the metal wire may extend to the outer sidewall 320 or be exposed outside the outer sidewall 320.
Among the plurality of second pads of the wiring board 100, a pad that is connected to ground or a pad that does not participate in transmission of an electrical signal is also included. In one embodiment of the present application, in order to prevent the problems of electrical leakage and the like of the photosensitive assembly 1000, one end of the second heat dissipation element 600 may be selectively connected to a solder pad having a ground connection in the circuit board 100 or a solder pad not participating in electrical signal transmission; the other end of the second heat dissipation member 600 may extend to the outer sidewall 320 of the package body 300 or be exposed outside of the outer sidewall 320.
Further, in an embodiment of the present application, a pad having a ground connection or a pad not participating in electrical signal transmission in the circuit board 100 may have a large surface area, and a plurality of second heat dissipation members 600 may be connected at the same time.
Likewise, the second heat dissipation member 600 is encapsulated by the package body 300, in other words, the second heat dissipation member 600 is disposed inside the package body 300. The second heat sink 600 is spaced apart from the electrical connector 500 inside the package body 300. The second heat dissipation member 600 can be isolated from the electrical connector 500 by the interval arrangement, so that the occurrence of crosstalk, electric leakage, short circuit and the like of electrical signals can be avoided. The package 300 may support the second heat dissipation member 600, and the second heat dissipation member 600 is inserted into the package 300, so as to increase the heat dissipation capability of the package 300, increase the effective heat dissipation area of the light sensing module 1000 through the larger surface area of the package 300, and enhance the strength of the package 300 due to the second heat dissipation member 600.
As shown in fig. 5, in an embodiment of the present application, the above two heat dissipation methods may be combined, that is, photosensitive assembly 1000 includes both heat dissipation member 400 and second heat dissipation member 600. In this embodiment, the photosensitive assembly increases the number of the heat dissipation members, and also increases the heat dissipation capability of the photosensitive chip and the circuit board, thereby improving the heat dissipation capability of the photosensitive assembly.
Fig. 6 is a schematic cross-sectional view of a photosensitive assembly 1000 having a heat sink 400 according to another embodiment of the present application.
As shown in fig. 6, in an embodiment of the present application, a heat dissipation plate 700 may be further provided in the photosensitive assembly 1000 in combination with the related art. The heat dissipation plate 700 may be disposed on the second surface 120 of the circuit board 100, and the photo sensor chip 200 may be disposed on the first surface 110 of the circuit board 100. The slot position may correspond to the mounting position of the heat dissipation plate, so that the substrate 210 of the photo sensor chip 200 is attached to the heat dissipation plate 700. The package 300 encapsulates the photosensitive assembly 1000 by encapsulating the first surface 110 of the circuit board 100, encapsulating a portion of the non-photosensitive region 230 of the photosensitive chip 200, encapsulating the side 240 of the photosensitive chip 200, encapsulating electronic components such as a capacitor and a resistor, and encapsulating the heat sink 400, and has a hollow structure exposing the photosensitive region 220 of the photosensitive chip 200. In this embodiment, the photosensitive assembly 1000 includes both the heat sink 400 and the heat sink 700, so that the photosensitive assembly 1000 can dissipate heat in multiple directions in multiple ways, thereby improving heat dissipation capability.
Fig. 7 is a schematic cross-sectional view of a camera module with a heat dissipation function according to an embodiment of the present application.
As shown in fig. 7, in an embodiment of the present application, a camera module with functions is further provided, and the camera module may include a photosensitive assembly 1000 having a heat dissipation member 400, a lens assembly 3000, and a filter assembly 4000.
The filter assembly 4000 is used to filter infrared light. The filter assembly 4000 may be mounted on a surface of the package 300 (as shown in fig. 7), a surface of the lens carrier or the motor 3200, or other suitable positions, which is not limited in this application.
Fig. 8 is a flowchart of a method 5000 of manufacturing a photosensitive assembly having a heat sink 5400 according to an embodiment of the present application. As shown in fig. 8, in one embodiment of the present application, there is also provided a method 5000 of manufacturing a photosensitive assembly having a heat sink. The method 5000 mainly comprises the following steps:
s5001, respectively arranging the photosensitive chips corresponding to the circuit boards on the first surfaces of the circuit boards, and connecting the photosensitive chips with the circuit boards through electric connectors.
In step S5001, as shown in fig. 9A, a plurality of, for example, 3 circuit boards 5100 are provided on the circuit board assembly. A photosensitive chip 5200 corresponding to each wiring board 5100 may be provided on a first surface of each wiring board 5100, and each wiring board 5100 and the photosensitive chip 5200 corresponding thereto may be connected through an electrical connector 5500.
Further, a plurality of first pads, e.g., 5231 and 5232, are included in the non-photosensitive area of the photo-sensing chip 5200, wherein, as shown in fig. 9A, electrical connection 5500 is connected to pad 5231 at one end of the photo-sensing chip 5200 and electrical connection 5500 is connected to the circuit board 5100 at the other end.
S5002, arranging a plurality of heat dissipation pieces in the circuit jointed board, arranging one end of each heat dissipation piece in the photosensitive chip, and arranging the other end of each heat dissipation piece in the photosensitive chip adjacent to the photosensitive chip.
In the S5002 step, the heat sink may be made of a heat conductive material such as a metal wire, and satisfies a thermal conductivity λ ≧ 50W/(m · k) of the heat sink. The length L of the heat dissipation piece meets the condition that L is larger than or equal to 1mm, and the heat dissipation capacity of the heat dissipation piece can be improved by means of the longer heat dissipation length.
As shown in fig. 9B, a plurality of heat dissipation members 5400 may be disposed in the circuit board assembly, wherein one end of the heat dissipation member 5400 may be disposed in the photosensitive chip 5200, and the other end of the heat dissipation member 5400 may be disposed in the photosensitive chip 5200a adjacent to the photosensitive chip.
Further, the pad 5232 can be a pad with a ground connection or a pad that does not participate in signal transmission. In order to prevent the occurrence of electric leakage or the like, as shown in fig. 9B, one end of the heat sink 5400 is connected to a pad 5232, and the other end of the heat sink 5400 is connected in the same manner to a pad connected to ground in the adjacent photosensitive chip 5200a or a pad 5232a not participating in signal transmission.
Alternatively, the heat sink 5400 and the photosensitive chip 5200 may be connected by a sample bonding method, and the connection method of the heat sink and the photosensitive chip is not limited in this application.
And repeating the steps to arrange a plurality of heat dissipation pieces in the circuit splicing plate. And the plurality of heat dissipation members and the electric connection members are arranged at intervals to prevent the problems of electric leakage, short circuit, crosstalk and the like caused by contact between the heat dissipation members and the electric connection members in the finally molded photosensitive assembly.
S5003, putting the circuit board provided with the heat dissipation piece in a packaging mold in a splicing mode.
In the S5003 step, as shown in fig. 9C, the package mold includes an upper mold 5010 and a lower mold 5020, and the circuit board where the heat sink is disposed is placed in the package mold composed of the upper mold 5010 and the lower mold 5020.
S5004, filling the material for preparing the packaging body into the packaging mold, so as to solidify and form the packaging body corresponding to each circuit board.
In S5004, a material such as nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, or other thermoplastic or thermosetting material is selected to pass through a package mold as shown in fig. 9D, and the package is integrally molded by means of, for example, curing.
In step S5004, filling the package mold with the packaging material may generate a large impact force on the circuit board mounted in the package mold, which may cause deformation of at least one of the electrical connector 5500 and the heat sink 5400 on the circuit board. Under the existing process conditions, the electrical connector 5500 may realize less or no deformation under the impact of the packaging material, and the heat sink 5400 needs to further improve the impact resistance and deformation resistance thereof, so as to prevent at least one of the electrical connector 5500 and the heat sink 5400 from deforming to affect the imaging quality of the camera module due to the deformation of the heat sink 5400 in this step.
Based on above-mentioned problem, this application has studied to the intensity of radiating piece to ensure that the intensity of radiating piece meets the demands. The research finds that: when the strength of the material for manufacturing the heat sink is close to or similar to the strength of the material for manufacturing the electric connector, if the sectional area of the heat sink is larger than that of the electric connector, the strength of the heat sink is larger than that of the electric connector.
Furthermore, the heat dissipation part is prepared by selecting a material with higher strength, and the strength of the packaging body can be improved. The strength of the heat sink and the electrical connector or the strength of the material from which both are made is understood in this application to be its ability to resist the impact of the encapsulating material.
S5005, cutting the solidified circuit jointed board to obtain a plurality of photosensitive assemblies.
In step S5005, as shown in fig. 9E, the circuit panels can be cut along the dotted lines to obtain a plurality of, for example, 3, photosensitive elements with heat dissipation elements.
Fig. 10 is a flowchart of a method 6000 for manufacturing a photosensitive assembly having heat dissipation members 6400 and 6600 according to another embodiment of the present application. As shown in fig. 10, in one embodiment of the present application, there is also provided a method 6000 of manufacturing a photosensitive assembly having a heat sink. The method 6000 mainly comprises the following steps:
and S6001, respectively arranging the photosensitive chip corresponding to each circuit board on the first surface of each circuit board, and connecting the photosensitive chip and each circuit board through an electric connector.
In step S6001, as shown in fig. 11A, a plurality of circuit boards 6100 are disposed on the circuit board assembly, for example, 3 circuit boards. A photosensitive chip 6200 corresponding to each wiring board 6100 may be disposed on the first surface of each wiring board 6100, and each wiring board 6100 and the photosensitive chip 6200 corresponding thereto may be connected by an electrical connection 6500.
Further, a plurality of first pads, e.g., 6231 and 6232, are included in the non-photosensitive area of the photosensitive chip 6200, wherein, as shown in fig. 11A, one end of the electrical connector 6500 in the photosensitive chip 6200 is connected to the pad 6231, and the other end of the electrical connector 6500 is connected to the circuit board 6100.
S6002, arranging a plurality of radiating pieces in the circuit splicing plate, arranging one end of each radiating piece in the photosensitive chip, and arranging the other end of each radiating piece in the photosensitive chip adjacent to the photosensitive chip.
In the S6002 step, the heat sink may be made of a heat conductive material such as a metal wire and satisfies a thermal conductivity λ ≧ 50W/(m · k) of the heat sink. The length L of the heat dissipation piece meets the condition that L is larger than or equal to 1mm, and the heat dissipation capacity of the heat dissipation piece can be improved by means of the longer heat dissipation length.
As shown in fig. 11B, a plurality of heat dissipation members 6400 may be disposed in the circuit board assembly, wherein one end of the heat dissipation member 6400 may be disposed in the photo sensor chip 6200, and the other end of the heat dissipation member 6400 may be disposed in the photo sensor chip 6200a adjacent to the photo sensor chip.
Further, bond pad 6232 can be a bond pad with a ground connection or a bond pad that does not participate in signal transmission. In order to prevent the occurrence of electric leakage or the like, as shown in fig. 11B, one end of heat sink 6400 is connected to pad 6232, and the other end of heat sink 6400 is connected in the same manner to a pad connected to ground in adjacent photosensitive chip 6200a or pad 6232a not participating in signal transmission.
As an option, the heat dissipation member 6400 and the photosensitive chip 6200 may also be connected in a sample bonding manner, and the connection manner of the heat dissipation member and the photosensitive chip is not limited in this application.
And repeating the steps to arrange a plurality of heat dissipation pieces in the circuit splicing plate. And the plurality of heat dissipation members and the electric connection members are arranged at intervals to prevent the problems of electric leakage, short circuit, crosstalk and the like caused by contact between the heat dissipation members and the electric connection members in the finally molded photosensitive assembly.
And S6003, arranging a plurality of radiating pieces in the photosensitive chips on the outermost sides of the circuit splicing plates, wherein one end of each radiating piece is arranged on the photosensitive chip on the outermost side, and the other end of each radiating piece is arranged on the circuit board corresponding to the photosensitive chip on the outermost side.
In step S6003, as shown in fig. 11B, a photosensitive chip 6200B is disposed on the outermost side of the circuit board, and in order to obtain a photosensitive assembly located on the outermost side of the circuit board and having more heat dissipation members, a second heat dissipation member 6600 is disposed on the photosensitive chip 6200B. The second heat sink may be made of a heat conductive material such as a metal wire, and satisfies a thermal conductivity lambda ≧ 50W/(m · k) of the second heat sink. The length L of the second radiating piece meets the condition that L is larger than or equal to 1mm, and the longer radiating length can improve the radiating capacity of the second radiating piece.
As shown in fig. 11B, a plurality of second heat dissipation members 6600 may be disposed in the photosensitive chip 6200B, wherein one end of the second heat dissipation member 6600 may be disposed in the photosensitive chip 6200B, and the other end of the second heat dissipation member 6600 may be disposed in the circuit board 6100B opposite to the photosensitive chip.
Further, pad 6232b can be a pad with a ground connection or a pad that does not participate in signal transmission. In order to prevent the occurrence of electric leakage or the like, as shown in fig. 11B, one end of the second heat dissipation element 6600 is connected to a solder point 6232B, and the other end of the second heat dissipation element 6600 is connected to a solder point connected to ground or a solder point not participating in signal transmission in the circuit board 6100B in the same manner.
As an option, the second heat dissipation member 6600 and the photosensitive chip 6200 may also be connected in a sampling bonding manner, and the connection manner of the heat dissipation member and the photosensitive chip is not limited in this application.
And repeating the steps to arrange a plurality of second heat dissipation parts in the photosensitive chip at the outermost side of the circuit spliced board. And the plurality of second heat dissipation parts and the electric connection parts are arranged at intervals so as to prevent the problems of electric leakage, short circuit, crosstalk and the like caused by contact between the second heat dissipation parts and the electric connection parts in the finally molded photosensitive assembly.
And S6004, placing the circuit jointed board provided with the heat dissipation piece in a packaging mold.
In step S6004, as shown in fig. 11C, the package mold includes an upper mold 6010 and a lower mold 6020, and the circuit board assembly provided with the heat sink is placed in the package mold composed of the upper mold 6010 and the lower mold 6020.
And S6005, filling the material for preparing the packaging body into a packaging mold, so as to solidify and form the packaging body corresponding to each circuit board.
In step S6005, a material such as nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, or other thermoplastic or thermosetting material is selected to pass through a package mold as shown in fig. 9D, and the package is integrally molded by means of curing or the like.
And S6006, cutting the solidified circuit jointed board to obtain a plurality of photosensitive assemblies.
In step S6006, as shown in fig. 11E, a plurality of, for example, 3, light sensing modules with heat dissipation elements can be obtained by cutting the circuit boards along the dotted lines.
The above description is only an embodiment of the present application and an illustration of the technical principles applied. It will be appreciated by a person skilled in the art that the scope of protection covered by the present application is not limited to the embodiments with a specific combination of the features described above, but also covers other embodiments with any combination of the features described above or their equivalents without departing from the technical idea. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (15)
1. A photosensitive assembly, comprising:
a circuit board having first and second opposing surfaces;
the photosensitive chip is attached to the first surface;
a package disposed around the light sensing chip on the first surface, the package having an outer sidewall; and
at least one heat dissipation piece, set up in the inside of packaging body, the one end contact of heat dissipation piece the first surface of circuit board, the other end of heat dissipation piece extends to the lateral wall or expose outside the lateral wall.
2. A photosensitive assembly according to claim 1, wherein said circuit board has a plurality of second solder bumps, at least some of said second solder bumps being connected to one end of said heat spreader.
3. A photosensitive assembly according to claim 2, wherein a second solder joint of the plurality of second solder joints connecting an end of the heat sink is a solder joint having a ground connection or a solder joint not participating in signal transmission.
4. A photosensitive assembly according to claim 3, wherein said bond pad of said second bond pads having a ground connection or said bond pad not participating in signal transmission has a larger surface area than the remaining of said second bond pads.
5. A photosensitive assembly according to claim 2, wherein said photosensitive chip is connected to said circuit board by electrical connections, said electrical connections being spaced from said heat sink within said package.
6. A photosensitive assembly according to claim 1, wherein said heat sink is made of a thermally conductive material.
7. A photosensitive assembly according to claim 6, wherein said heat sink has a thermal conductivity λ satisfying: λ is not less than 50W/(m.k).
8. A photosensitive assembly according to claim 6 or 7 wherein the heat sink is a metal wire.
9. A photosensitive assembly according to claim 1, further comprising:
at least one second heat dissipation piece is arranged inside the packaging body, one end of the second heat dissipation piece is contacted with the photosensitive chip, and the other end of the second heat dissipation piece extends to the outer side wall or is exposed outside the outer side wall.
10. The utility model provides a module of making a video recording which characterized in that includes:
the photosensitive assembly of at least one of claims 1-9; and
the lens assembly is arranged above the photosensitive assembly.
11. A method for making a photosensitive assembly comprising preparing a wiring panel comprising a plurality of circuit boards, the method comprising:
respectively arranging a photosensitive chip corresponding to each circuit board on the first surface of each circuit board, and connecting the photosensitive chip with each circuit board through an electric connector;
arranging a plurality of radiating pieces in the circuit jointed board, wherein one end of each radiating piece is arranged on the photosensitive chip, and the other end of each radiating piece is arranged on the photosensitive chip adjacent to the photosensitive chip;
arranging a plurality of radiating pieces in the photosensitive chip on the outermost side of the circuit jointed board, wherein one end of each radiating piece is arranged on the photosensitive chip on the outermost side, and the other end of each radiating piece is arranged on the circuit board corresponding to the photosensitive chip on the outermost side;
placing the circuit jointed board provided with the heat dissipation piece in a packaging mold;
filling a material for preparing a packaging body into the packaging mold so as to be cured to form a packaging body corresponding to each circuit board; and
and cutting the solidified circuit jointed board to obtain a plurality of photosensitive assemblies.
12. The method of claim 11, wherein the photo-sensing die includes a photo-sensing region and a non-photo-sensing region remote from the first surface, and wherein electrically connecting the photo-sensing die to each of the circuit boards comprises:
arranging a plurality of welding spots in the non-photosensitive area; and
and connecting the welding points of the photosensitive chip with each circuit board through an electric connector.
13. The method of claim 12, wherein disposing one end of each heat dissipation member on the outermost photo-sensing chip comprises:
connecting one end of each heat dissipation piece with a welding spot of the photosensitive chip on the outermost side; and
and arranging the electric connecting piece connected with the photosensitive chip on the outermost side and the heat radiating piece at intervals.
14. The method of claim 12, wherein disposing one end of each heat dissipation member on the outermost photo-sensing chip comprises:
bonding one end of each heat dissipation piece to the non-photosensitive area of the photosensitive chip on the outermost side; and
and arranging the electric connecting piece connected with the photosensitive chip on the outermost side and the heat radiating piece at intervals.
15. The method of claim 12, wherein disposing the other end of each of the heat dissipation members on a circuit board corresponding to the outermost photo-sensing chip comprises:
connecting the other end of each heat dissipation piece with the welding spot of the corresponding circuit board; and
and arranging the electric connecting piece connected with the photosensitive chip on the outermost side and the heat radiating piece at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011477844.7A CN114173027A (en) | 2020-09-10 | 2020-09-10 | Photosensitive assembly with heat dissipation element and preparation method thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010948331.3A CN114173022A (en) | 2020-09-10 | 2020-09-10 | Photosensitive assembly with heat dissipation element and preparation method thereof |
| CN202011477844.7A CN114173027A (en) | 2020-09-10 | 2020-09-10 | Photosensitive assembly with heat dissipation element and preparation method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010948331.3A Division CN114173022A (en) | 2020-09-10 | 2020-09-10 | Photosensitive assembly with heat dissipation element and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114173027A true CN114173027A (en) | 2022-03-11 |
Family
ID=80475648
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011477844.7A Pending CN114173027A (en) | 2020-09-10 | 2020-09-10 | Photosensitive assembly with heat dissipation element and preparation method thereof |
| CN202010948331.3A Pending CN114173022A (en) | 2020-09-10 | 2020-09-10 | Photosensitive assembly with heat dissipation element and preparation method thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010948331.3A Pending CN114173022A (en) | 2020-09-10 | 2020-09-10 | Photosensitive assembly with heat dissipation element and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN114173027A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060124912A (en) * | 2005-06-01 | 2006-12-06 | 삼성전자주식회사 | Integrated circuit chip package and a display device provided with the same |
| WO2017177631A1 (en) * | 2016-04-12 | 2017-10-19 | 华天科技（昆山）电子有限公司 | Image sensing chip packaging structure and manufacturing method therefor |
| CN109510922A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN110602360A (en) * | 2019-09-03 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera module, camera device and electronic equipment |
| CN210016539U (en) * | 2019-07-30 | 2020-02-04 | 宁波舜宇光电信息有限公司 | Camera module, composite substrate and photosensitive assembly |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105681640B (en) * | 2016-03-28 | 2019-12-27 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
| CN206743368U (en) * | 2017-04-28 | 2017-12-12 | 南昌欧菲光电技术有限公司 | Camera module and its easy heat radiation photosensory assembly |
| CN110536062B (en) * | 2019-10-15 | 2021-03-02 | Oppo广东移动通信有限公司 | Camera module, camera module assembling process and electronic equipment |
| CN210725022U (en) * | 2019-11-27 | 2020-06-09 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, camera module and electronic equipment |
| CN210725025U (en) * | 2019-11-29 | 2020-06-09 | 南昌欧菲光电技术有限公司 | Camera module and intelligent terminal |
-
2020
- 2020-09-10 CN CN202011477844.7A patent/CN114173027A/en active Pending
- 2020-09-10 CN CN202010948331.3A patent/CN114173022A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060124912A (en) * | 2005-06-01 | 2006-12-06 | 삼성전자주식회사 | Integrated circuit chip package and a display device provided with the same |
| WO2017177631A1 (en) * | 2016-04-12 | 2017-10-19 | 华天科技（昆山）电子有限公司 | Image sensing chip packaging structure and manufacturing method therefor |
| CN109510922A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN210016539U (en) * | 2019-07-30 | 2020-02-04 | 宁波舜宇光电信息有限公司 | Camera module, composite substrate and photosensitive assembly |
| CN110602360A (en) * | 2019-09-03 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera module, camera device and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114173022A (en) | 2022-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11303789B2 (en) | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | |
| KR102467001B1 (en) | Substrate structure for image sensor module and image sneor module including the same | |
| JP7025345B2 (en) | Camera modules and molded photosensitive assemblies and their manufacturing methods, and electronic devices | |
| US7645635B2 (en) | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages | |
| US7576401B1 (en) | Direct glass attached on die optical module | |
| US5973337A (en) | Ball grid device with optically transmissive coating | |
| US7196403B2 (en) | Semiconductor package with heat spreader | |
| US7593636B2 (en) | Pin referenced image sensor to reduce tilt in a camera module | |
| US20070210246A1 (en) | Stacked image sensor optical module and fabrication method | |
| KR100541654B1 (en) | Wiring substrate and solid-state imaging apparatus using thereof | |
| KR100568223B1 (en) | Solid-State Imaging Apparatus | |
| CN103119510B (en) | There is the device of optical module and gripper shoe | |
| CN1711639B (en) | Folded-flex bondwire-less multichip power package | |
| CN108391451B (en) | Image pickup element package, method of manufacturing the same, and image pickup apparatus | |
| KR20150007248A (en) | Photonic semiconductor devices in llc assembly with controlled molding boundary and method for forming same | |
| JP3251323B2 (en) | Electronic circuit device | |
| CN109729241B (en) | Camera module, extended wiring packaging photosensitive assembly thereof and manufacturing method thereof | |
| CN210325795U (en) | Optical scanning module | |
| CN114173027A (en) | Photosensitive assembly with heat dissipation element and preparation method thereof | |
| US6441453B1 (en) | Clear coating for digital and analog imagers | |
| CN112770019A (en) | Photosensitive assembly, preparation method thereof and camera module | |
| KR100541650B1 (en) | Solid-state Imaging Apparatus and Method For Manufacturing The Same | |
| EP0690515A1 (en) | Optoelectronic assembly and methods for producing and using the same | |
| US20080283982A1 (en) | Multi-chip semiconductor device having leads and method for fabricating the same | |
| JP2810130B2 (en) | Semiconductor package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |