CN114172116B - Board manufacturing control method and electronic equipment - Google Patents
Board manufacturing control method and electronic equipment Download PDFInfo
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- CN114172116B CN114172116B CN202111449491.4A CN202111449491A CN114172116B CN 114172116 B CN114172116 B CN 114172116B CN 202111449491 A CN202111449491 A CN 202111449491A CN 114172116 B CN114172116 B CN 114172116B
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
- H02H3/08—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess current
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H7/00—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
- H02H7/20—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for electronic equipment
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Abstract
The application discloses a board control method and electronic equipment, the electronic equipment includes: a printed circuit board; the printed circuit board is provided with the following structure: a power supply for outputting electric energy; a plurality of device groups, wherein the device groups comprise one or more load devices; the power management chips are connected between the power supply and the equipment group, and are used for converting the electric energy output by the power supply and outputting the converted electric energy to the equipment group, wherein load equipment in the equipment group is associated with an overcurrent protection threshold value on the power management chips.
Description
Technical Field
The application relates to the technical field of power supply control, in particular to a board manufacturing control method and electronic equipment.
Background
At present, a group of hot-pluggable power management chips are generally used in a power supply to provide services such as through-flow function, overcurrent protection and the like for load equipment.
Because the load equipment is complex and changeable, a higher overcurrent protection threshold value needs to be set for the power management chip, and the overload protection threshold value can not protect the load equipment in time when the load equipment is lightly loaded.
Disclosure of Invention
In view of this, the present application provides a board control method and an electronic device, as follows:
an electronic device, comprising:
a printed circuit board; the printed circuit board is provided with the following structure:
a power supply for outputting electric energy;
a plurality of device groups, wherein the device groups comprise one or more load devices;
the power management chips are connected between the power supply and the equipment group, and are used for converting the electric energy output by the power supply and outputting the converted electric energy to the equipment group, wherein load equipment in the equipment group is associated with an overcurrent protection threshold value on the power management chips.
The above electronic device, preferably, the load devices in the device group satisfy a grouping condition; the grouping condition includes at least:
the distance between load devices in the same device group is less than or equal to a distance threshold.
In the above electronic device, preferably, an electric energy transmission medium is disposed between the power management chip and the device group; the grouping condition further includes:
the sum of the maximum rated currents of the load devices in the device group is less than or equal to the maximum load current of the power transmission medium.
In the above electronic device, preferably, the grouping condition further includes:
the load devices in the same device group are identical in device type.
In the above electronic device, preferably, an electric energy transmission medium is disposed between the power management chip and the device group;
the overcurrent protection threshold value on the power management chip is the maximum bearing current of the electric energy transmission medium.
Preferably, the power management chip has a chip identifier that uniquely characterizes the power management chip, and the chip identifier is used for pointing to a load device in a device group connected to the power management chip.
A board control method comprising:
grouping a plurality of load devices to be set to obtain a plurality of device groups, wherein the device groups comprise one or more load devices;
configuring a corresponding power management chip for the equipment group, wherein load equipment in the equipment group is matched with an overcurrent protection threshold of the power management chip, and the power management chip can convert electric energy output by a power supply arranged on a printed circuit board and output the converted electric energy to the equipment group;
and obtaining board control data at least according to the equipment group and the corresponding power management chip, wherein the board control data is used for indicating that load equipment in the equipment group and the corresponding power management chip are arranged on the printed circuit board so that one power management chip is connected between the power supply and one equipment group.
In the above method, preferably, grouping a plurality of load devices to be set to obtain a plurality of device groups includes:
grouping a plurality of load devices to be set according to grouping conditions, so that the load devices in the device group obtained by grouping meet the grouping conditions;
the grouping condition includes at least: the distance between load devices in the same device group is less than or equal to a distance threshold.
In the above method, preferably, an electric energy transmission medium is disposed between the power management chip and the device group; the grouping condition further includes:
the sum of the maximum rated currents of the load devices in the device group is less than or equal to the maximum load current of the power transmission medium;
and/or the number of the groups of groups,
the load devices in the same device group are identical in device type.
The above method, preferably, further comprises:
and configuring a chip identifier which uniquely characterizes the power management chip for the power management chip, wherein the chip identifier is used for pointing to load equipment in a device group connected with the power management chip.
According to the technical scheme, in the board-making control method and the electronic equipment disclosed by the application, the power management chips are split on the printed circuit board, each split power management chip is respectively connected with a power supply and a corresponding equipment group, so that the power management chips convert electric energy output by the power supply and output the converted electric energy to load equipment in the connected equipment groups, no matter the equipment groups are light-load or heavy-load equipment, the load equipment in the equipment groups is matched with an overcurrent protection threshold value on the power management chip, and the situation that the load equipment cannot be protected in time due to the fact that the overcurrent protection threshold value is too high can be avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device according to a first embodiment of the present application;
fig. 2 is an exemplary diagram of grouping load devices in an embodiment of the present application;
fig. 3 is another schematic structural diagram of an electronic device according to a first embodiment of the present disclosure;
FIG. 4 is another exemplary diagram of grouping load devices in an embodiment of the present application;
fig. 5 is a flowchart of a board control method according to a second embodiment of the present application;
fig. 6 and fig. 7 are exemplary diagrams of the present application when the printed circuit board is manufactured for a mobile phone.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1, a schematic structural diagram of an electronic device according to an embodiment of the present application may be a device including a printed circuit board, such as a mobile phone, a pad, a computer, or a server. The technical scheme in the embodiment is mainly used for improving the use safety of the electronic equipment.
Specifically, the electronic device in this embodiment may include the following structure:
a printed circuit board 1; the printed circuit board 1 is provided with the following structure:
a power supply 2 for outputting electric power. For example, a power supply unit PSU (Power supply unit) having an output of 12V supplies power to the load devices provided on the printed circuit board 1.
A plurality of device groups 3, said device groups 3 comprising one or more load devices 31. The load device 31 may include a cpu CPU (central processing unit), a Memory storage, a high-speed serial computer expansion bus PCIe (peripheral component interconnect express), a hard disk storage HDD (Hard Disk Drive), and the like. Only one load device 31 may be included in one device group 3, or a plurality of load devices 31 may be included in one device group 3. For example, one device group 3 includes a CPU and a Memory, the other device group 3 includes an HDD, and the other device group 3 includes PCIe.
A plurality of power management chips 4, one power management chip 4 is connected between the power source 2 and one device group 3, and the power management chip 4 is configured to convert the power output from the power source 2 and output the converted power to the device group 3.
It should be noted that the number of the power management chips 4 on the printed circuit board is consistent with the number of the device groups 3, and a one-to-one mapping relationship is formed between the device groups 3 and the power management chips 4, each device group 3 corresponds to one power management chip 4, and each power management chip 4 is connected with the power supply 2, so that each power management chip 4 converts the electric energy output by the power supply 2 into the voltage or current required by the device group 3 corresponding to the power management chip 4, so as to provide the electric energy according to the requirements of the load devices 31 in the device group 3.
Wherein the load devices 31 in the device group 3 are associated with an over-current protection threshold on the power management chip 4.
In particular, the association of the load devices 31 in the device group 3 with the overcurrent protection threshold on the power management chip 4 can be understood as: the total load of the load devices 31 in the device group 3 matches the over-current protection threshold on the power management chip 4, whereby no over-current protection threshold on the power management chip 4 is present as to whether the total load of the load devices 31 in the device group 3 is too high or too low.
It can be seen from the above technical solution that, in the electronic device provided in the first embodiment of the present application, the power management chips that are set are split on the printed circuit board, and each split power management chip is connected with a power supply and a corresponding device group, so that the power management chips convert the electric energy output by the power supply and output the converted electric energy to the load device in the connected device group, no matter the device group is a light load device or a heavy load device, because the load device in the device group is matched with the overcurrent protection threshold on the power management chip, the situation that the load device cannot be protected in time due to the excessively high overcurrent protection threshold can be avoided.
In one implementation, the load devices 31 in the device group 3 satisfy a grouping condition, where the grouping condition includes at least: the distance between the load devices 31 in the same device group 3 is less than or equal to the distance threshold. The distance threshold is a preset value, such as 5 mm.
That is, in the present embodiment, when grouping the load devices 31 on the printed circuit board 1, the grouping is preferentially performed in accordance with the grouping condition of the proximity rule, that is, the load devices 31 whose distance is less than or equal to the distance threshold are divided into the same device group 3, and the load devices 31 exceeding the distance threshold are divided into different device groups 3. Therefore, when the power transmission media are configured for each device group 3, the load devices are grouped, so that the width of each group of power transmission media can be shortened, the occupied area of the power transmission media can be reduced, and the structural complexity of the printed circuit board can be reduced. For example, as shown in FIG. 2, CPUs, memory and HDDs that are closer are partitioned into one device group a, and PCIe devices that are farther are partitioned into a different device group b. Therefore, the width and occupied area of the copper foil for connecting each load device and the power management chip on the printed circuit board can be saved, and the design complexity of the copper foil of the printed circuit board is reduced.
Based on the above implementation, a power transmission medium 5, such as a copper foil, as shown in fig. 3, is disposed between the power management chip 4 and the device group 3, and based on this, the following may be included in the grouping conditions in the present embodiment:
the sum of the maximum rated currents of the load devices 31 in the device group 3 is less than or equal to the maximum load current of the power transmission medium.
That is, for the device group 3 divided under the grouping condition of the nearby principle, if the sum of the maximum rated currents of the load devices 31 included in the device group 3 is too large, the load devices 31 in the device group 3 need to be divided again, and the principle of division is that the sum of the maximum rated currents of the load devices 31 in the device group 3 cannot be made to exceed the maximum load current of the corresponding power transmission medium, so that the situation that the power transmission medium is damaged due to the excessive current transmitted to the device group 3 by the power management chip 4 is avoided.
Specifically, in the present embodiment, when the device groups are subdivided according to the maximum load currents of the power transmission media, the device groups may be divided according to the magnitudes of the maximum rated currents of the respective load devices 31 in the device group 3 and the magnitudes of the maximum load currents of the corresponding power transmission media, so that the sum of the maximum rated currents of the load devices 31 in the device group 3 that is retrieved does not exceed the maximum load currents of the corresponding power transmission media.
For example, as shown in fig. 4, for a CPU, memory and HDD which are closely divided into the device group a, the sum of the maximum rated currents of the three loads exceeds the maximum load currents of the copper foils of the respective widths, and therefore, it is necessary to divide the three loads in the device group a again, the CPU and Memory are divided into the device group a, whereas since the maximum rated currents of the HDD are large, the HDD is individually divided into one device group c, the respective power management chips are allocated to the device groups a, b, c, respectively, whereby the sum of the maximum rated currents of the loads included in each device group a, b, c does not exceed the maximum load currents of the copper foils y1, y2, y3 between the respective power management chips x1, x2, and x3, and further, the case that the copper foils are fire-damaged due to the excessive currents transmitted to the CPU, memory and HDD by the power management chips is avoided.
Further, the grouping condition may further include: the load devices 31 in the same device group 3 are identical in device type.
That is, in the present embodiment, when dividing the device group 3, it is implemented according to the principle of the same or similar device types, in addition to the principle of the nearby devices. For example, the CPU1 and the CPU2 of the processor type are divided into the same device group, and a plurality of memory banks of the storage type are divided into the same device group. Of course, the CPU1 and CPU2 of the processor type and the memory banks of the storage type that are close to each other may be divided into the same device group at the same time according to the grouping condition of the nearby principle.
Based on the above implementation, the overcurrent protection threshold on the power management chip 4 in this embodiment may be set to the maximum load current of the power transmission medium 5 to which it is connected, so that the load device 31 in the device group 3 does not exceed the maximum load current of the power transmission medium 5 even if it operates at the maximum rated current, but if the actual operating current of the load device 31 exceeds the maximum rated current, the current on the power transmission medium 5 may exceed its overcurrent protection threshold, and the power management chip 4 performs overcurrent protection, thereby achieving the purpose of protecting the load device and the electronic device.
For example, the overcurrent protection threshold of the power management chip x1 corresponding to the device group a is the maximum load current of the copper foil y1 between the power management chip x1 and the device group a, and the maximum load current of y1 is greater than or equal to the maximum rated current of the CPU and the maximum rated current of the Memory, so that if the sum of the actual working currents of the CPU and the Memory exceeds the maximum rated currents of the two, the power management chip x1 can execute the overcurrent protection before the copper foil y1 fires, so as to avoid the condition that the copper foil y1 fires and the mobile phone fires.
In one implementation, each power management chip 4 on the printed circuit board 1 has a chip identification, such as a chip id or the like, that uniquely characterizes the power management chip 4, for pointing to the load devices 31 in the device group 3 to which the power management chip 4 is connected.
Based on this, when an overcurrent alarm message exists on the printed circuit board 1, the device group in which the overcurrent condition exists can be determined according to the chip identifier in the overcurrent alarm message, and the range of the load device 31 in which the abnormality such as a short circuit exists can be further determined. For example, as shown in fig. 4, when the chip id included in the overcurrent alarm message is the power management chip x2, it may be determined that the load device having the abnormality is most likely PCIe in the device group b.
Referring to fig. 5, a flowchart of a board control method according to a second embodiment of the present application is implemented, and the method may be applied to an electronic device, such as a board control server, that can obtain board control data and control a board flow of a printed circuit board. The technical scheme in the embodiment is mainly used for improving the use safety of the electronic equipment to which the manufactured printed circuit board belongs.
Specifically, the method in this embodiment may include the following procedures:
step 501: and grouping a plurality of load devices to be set to obtain a plurality of device groups.
Wherein the device group comprises one or more load devices.
Specifically, in this embodiment, a plurality of load devices to be set may be grouped according to a grouping condition, so that the load devices in the device group obtained by the grouping may satisfy the grouping condition.
And the grouping conditions here include at least: the distance between load devices in the same device group is less than or equal to a distance threshold.
Further, because the power management chip and the equipment group are provided with an electric energy transmission medium; therefore, the grouping conditions in the present embodiment may further include: the sum of the maximum rated currents of the load devices in the device group is less than or equal to the maximum load current of the power transmission medium; and/or the load devices in the same device group are the same device type.
That is, in this embodiment, the load devices that need to be set on the printed circuit board are grouped based on the grouping condition of the proximity rule preferentially, and further, when grouping, the sum of the maximum rated currents of the load devices in the device group needs to be smaller than or equal to the maximum load current of the power transmission medium, so that the situation that the power transmission medium is damaged due to overcurrent can be avoided. In addition, the load devices of the unified device type may be divided into the same device group at the time of grouping. Specific examples may be referred to in the foregoing.
Step 502: and configuring a corresponding power management chip for the equipment group.
The load equipment in the equipment group is matched with an overcurrent protection threshold of the power management chip, and the power management chip can convert electric energy output by a power supply arranged on the printed circuit board and output the converted electric energy to the equipment group.
Specifically, the overcurrent protection threshold of the power management chip may be set to be the maximum load current of the power transmission medium between the corresponding device groups, so that even if the load devices in the device groups all operate at the maximum rated current, the maximum load current of the power transmission medium will not be exceeded, but if the actual working current of each load device exceeds the maximum rated current, the current on the power transmission medium may exceed the overcurrent protection threshold thereof, the power management chip will perform overcurrent protection, so as to achieve the purpose of protecting the load devices and the electronic devices.
Step 503: and obtaining the board control data at least according to the equipment group and the corresponding power management chip.
Wherein the board control data is used to instruct the placement of load devices and corresponding power management chips in a device group on the printed circuit board such that one power management chip is connected between the power source and one of the device groups.
Specifically, in this embodiment, grouping information of the device groups and corresponding power management chips and overcurrent protection thresholds of the power management chips may be integrated to obtain board manufacturing control data, so that the board manufacturing control data includes grouping information of the device groups in which load devices to be set are divided, power management chips configured for each device group, overcurrent protection thresholds of each power management chip, and information such as length, width, layout positions, and the like of the load devices, power sources, and power management chips in the device groups, and electric energy transmission media between the device groups and the power management chips, and therefore, after the board manufacturing control data is sent to a board manufacturing machine, the board manufacturing machine may perform printing operations on a circuit board according to various information in the board manufacturing control data, such as operations of laying (layout) of various load devices.
Furthermore, in this embodiment, a chip identifier that uniquely characterizes the power management chip may be configured for the power management chip, where the configured chip identifier is used to point to a load device in a device group connected to the power management chip, based on this, after board-making control data including the chip identifier is sent to a board-making machine, the board-making machine has a respective chip identifier for each power management chip on a printed circuit board made according to the board-making control data, and in a use process of the printed circuit board, if overcurrent alarm information occurs, the load device in the device group that may have an abnormality may be accurately located according to the chip identifier in the overcurrent alarm information.
As can be seen from the above technical solution, in the method for controlling board manufacturing provided in the second embodiment of the present application, during the process of obtaining board manufacturing control data, load devices to be set are grouped, and a power management chip is configured for a device group obtained by grouping, and an overcurrent protection threshold on the power management chip is matched with load devices in a corresponding device group, so that, on a printed circuit board manufactured according to the obtained board manufacturing control data, no matter whether the device group is a light load device or a heavy load device, the load devices in the device group are matched with the overcurrent protection threshold on the power management chip, and therefore, the situation that the load devices cannot be protected in time due to the excessively high overcurrent protection threshold can be avoided.
Taking the manufacture of the printed circuit board of the mobile phone as an example, the following describes the technical solution in this embodiment in detail, as shown in fig. 6:
in this embodiment, by decomposing the requirement of the power supply device, the 12V power supply is split, and the power management chip and the load device corresponding to the 12V power supply are both grouped reasonably, for example, the CPU and the Memory are grouped into the same device group and correspond to one power management chip, as shown in fig. 7, and then the overcurrent protection thresholds of the power management chips are defined respectively, where the overcurrent protection thresholds can be the maximum bearing current of the copper foil between the device group and the corresponding power management chip, so that the overcurrent protection thresholds are effectively reduced, and the system risk is reduced.
Based on the grouping information and the configuration information, layout independent layout is performed on the printed circuit board, and further, management id of the power management chip is independently defined on the system so as to facilitate abnormality positioning.
Specifically, in this embodiment, the grouping principle when grouping the load device and the power management chip is mainly as follows:
based on the principle of system layout, the adjacent devices are distributed in a group as much as possible, which is beneficial to the integrity of the copper foil.
Furthermore, the maximum current which can be born by the copper foil temperature rise is calculated based on the actual copper foil width, and the current is set to be the maximum overcurrent protection point, so that when the system works abnormally but cannot trigger overcurrent protection, the PCB is prevented from being ignited due to the fact that the copper foil temperature rise is too high.
In summary, the present embodiment provides a new power management scheme with the following advantages:
firstly, by splitting power supply management, an overcurrent protection threshold can be reasonably designed, the system risk is effectively reduced, and a plurality of power management chips are not required to be bundled for layout in a scattered power management mode, so that the difficulty of layout is greatly reduced; in addition, the scattered power management mode can accurately position equipment with problems, improves the problem solving efficiency and shortens the analysis time.
It should be noted that, the number of components (load devices) of each group of power management chips after the splitting is reduced compared with the original number of components, so that the occupied area of each group of power management chips on the printed circuit board is reduced, and the difficulty of layout of each group of power management chips is reduced.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software modules may be disposed in Random Access Memory (RAM), memory, read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. An electronic device, comprising:
a printed circuit board; the printed circuit board is provided with the following structure:
a power supply for outputting electric energy;
a plurality of device groups, wherein the device groups comprise one or more load devices;
the power management chips are connected between the power supply and the equipment group, and are used for converting the electric energy output by the power supply and outputting the converted electric energy to the equipment group, wherein load equipment in the equipment group is associated with an overcurrent protection threshold value on the power supply management chip;
the load devices in the device group meet grouping conditions; the grouping condition includes at least:
the distance between load devices in the same device group is less than or equal to a distance threshold.
2. The electronic device of claim 1, wherein a power transmission medium is disposed between the power management chip and the device group; the grouping condition further includes:
the sum of the maximum rated currents of the load devices in the device group is less than or equal to the maximum load current of the power transmission medium.
3. The electronic device of claim 1 or 2, the grouping condition further comprising:
the load devices in the same device group are identical in device type.
4. The electronic device of claim 1, wherein a power transmission medium is disposed between the power management chip and the device group;
the overcurrent protection threshold value on the power management chip is the maximum bearing current of the electric energy transmission medium.
5. The electronic device of claim 1, the power management chip having a chip identification uniquely characterizing the power management chip, the chip identification for pointing to a load device in a device group to which the power management chip is connected.
6. A board control method comprising:
grouping a plurality of load devices to be set to obtain a plurality of device groups, wherein the device groups comprise one or more load devices;
configuring a corresponding power management chip for the equipment group, wherein load equipment in the equipment group is matched with an overcurrent protection threshold of the power management chip, and the power management chip can convert electric energy output by a power supply arranged on a printed circuit board and output the converted electric energy to the equipment group;
obtaining board control data at least according to the equipment group and the corresponding power management chip, wherein the board control data is used for indicating that load equipment in the equipment group and the corresponding power management chip are arranged on the printed circuit board so that one power management chip is connected between the power supply and one equipment group;
grouping a plurality of load devices to be set to obtain a plurality of device groups, including:
grouping a plurality of load devices to be set according to grouping conditions, so that the load devices in the device group obtained by grouping meet the grouping conditions;
the grouping condition includes at least: the distance between load devices in the same device group is less than or equal to a distance threshold.
7. The method of claim 6, wherein a power transfer medium is disposed between the power management chip and the device group; the grouping condition further includes:
the sum of the maximum rated currents of the load devices in the device group is less than or equal to the maximum load current of the power transmission medium;
and/or the number of the groups of groups,
the load devices in the same device group are identical in device type.
8. The method of claim 6, further comprising:
and configuring a chip identifier which uniquely characterizes the power management chip for the power management chip, wherein the chip identifier is used for pointing to load equipment in a device group connected with the power management chip.
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| CN202111449491.4A CN114172116B (en) | 2021-11-30 | 2021-11-30 | Board manufacturing control method and electronic equipment |
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| CN202111449491.4A CN114172116B (en) | 2021-11-30 | 2021-11-30 | Board manufacturing control method and electronic equipment |
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| CN114172116B true CN114172116B (en) | 2023-06-23 |
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| EP1764947A3 (en) * | 1999-01-12 | 2007-03-28 | Powerdsine, Ltd. | System and method for providing electrical power over communication cabling |
| CN106371540B (en) * | 2016-08-25 | 2020-02-21 | 联想(北京)有限公司 | System power management method, chip and electronic equipment |
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