CN114171662A - Display panel, preparation method thereof and display device - Google Patents
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- 238000000034 method Methods 0.000 claims abstract description 34
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- 230000008569 process Effects 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 17
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- 239000002344 surface layer Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 31
- 238000009792 diffusion process Methods 0.000 abstract description 18
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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Abstract
The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a display back plate and a light-emitting element, wherein the display back plate comprises a substrate and a first electrode, and the first electrode is arranged on the surface of the substrate; the light-emitting element comprises a light-emitting body and a second electrode, wherein the second electrode is arranged on the surface of the light-emitting body and is electrically connected with the light-emitting body; the first electrode is in contact with and electrically connected with the second electrode, and comprises a convex structure which is arranged on the contact surface of the first electrode and the second electrode; and/or the second electrode comprises a convex structure, and the convex structure is arranged on the contact surface of the second electrode and the first electrode. The display panel can absorb and limit the molten soldering tin, reduce the diffusion area of the display panel, avoid the large diffusion range of the melted soldering tin and avoid short circuit of a light-emitting element; and the gas release produced in the welding process is facilitated, the air holes produced in the soldering tin during welding are reduced, and the light-emitting element is prevented from being broken.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to a display panel, a preparation method thereof and a display device.
Background
An LED display (LED display) is a flat panel display, which is composed of a plurality of small LED module panels and is used to display various information such as text, images, video, and the like. The LED display screen has the advantages of bright color, wide dynamic range, high brightness, long service life, stable and reliable operation and the like. Micro LEDs are a new generation of LED display technology, and have higher brightness, better luminous efficiency and lower power consumption compared with the existing OLED display technology.
Micro LEDs are significantly smaller in size than conventional LEDs, such as: the size of the Micro LED is changed from millimeter level of the traditional LED to the size smaller than 50 μm; the size of a Micro LED pad (namely a Micro LED electrode) is changed from the size of hundreds of micrometers to millimeters of a traditional LED to the size of several micrometers to dozens of micrometers; the welding difficulty of the Micro LED welding pad is obviously increased, and the current welding method cannot be used for welding the Micro LED.
Disclosure of Invention
The invention provides a display panel, a preparation method thereof and a display device, aiming at the problem that the existing welding method cannot deal with the welding of a Micro LED. The display panel can absorb and limit the molten soldering tin, reduce the diffusion area of the display panel and avoid the large diffusion range of the melted soldering tin, thereby avoiding the short circuit between the positive electrode and the negative electrode of the light-emitting element; on the other hand, the gas release generated in the welding process is facilitated, and the gas holes generated in the soldering tin during welding are reduced, so that the poor contact virtual connection between the first electrode and the second electrode after welding is reduced.
The invention provides a display panel, which comprises a display back plate and a light-emitting element, wherein the display back plate comprises a substrate and a first electrode, and the first electrode is arranged on the surface of the substrate; the light-emitting element comprises a light-emitting body and a second electrode, wherein the second electrode is arranged on the surface of the light-emitting body and is electrically connected with the light-emitting body; the first electrode and the second electrode are in contact and electrically connected,
the first electrode comprises a convex structure, and the convex structure is arranged on the contact surface of the first electrode and the second electrode; and/or the second electrode comprises the protruding structure, and the protruding structure is arranged on the contact surface of the second electrode and the first electrode.
Optionally, the protruding structure comprises a plurality of protruding portions, and the protruding portions are arranged around the center of the contact surface at equal intervals.
Optionally, the heights of the plurality of protrusions are equal, and the heights of the protrusions are 1/2-4/5 of the total thickness of the first electrode or the second electrode.
Optionally, the protrusion is made of a conductive material.
Optionally, the cross-sectional shape of the protrusion portion perpendicular to the contact surface includes any one of a rectangle, a triangle, a trapezoid, and a semicircle.
Optionally, the raised structures comprise first raised structures and second raised structures;
the first protruding structures are arranged on the contact surface of the first electrode, the second protruding structures are arranged on the contact surface of the second electrode, and the first protruding structures and the second protruding structures are arranged in a staggered mode.
The invention also provides a display device comprising the display panel.
The invention also provides a preparation method of the display panel, which comprises the following steps:
preparing a display back plate; preparing a display back plate comprises preparing a substrate, and preparing a first electrode on the surface of the substrate;
preparing a light-emitting element; preparing a light-emitting element comprises preparing a light-emitting body and preparing a second electrode on the surface of the light-emitting body;
correspondingly and electrically connecting the first electrode with the second electrode; preparing a first electrode comprises preparing a convex structure on a contact surface of the first electrode and the second electrode; and/or, preparing the second electrode comprises preparing a convex structure on the contact surface of the second electrode and the first electrode.
Optionally, preparing the bump structure comprises: and carrying out an exposure process on the surface layer of the first electrode and/or the second electrode to form a pattern of the protruding structure.
Optionally, the electrically connecting the first electrode and the second electrode correspondingly comprises:
printing solder paste on the contact surface of the first electrode;
and correspondingly contacting the first electrode with the second electrode, and welding the first electrode and the second electrode together through a reflow soldering process.
The invention has the beneficial effects that: according to the display panel provided by the invention, the convex structure is arranged on the contact surface of the first electrode and the second electrode; and/or, set up the protruding structure on the contact surface with the first electrode of the second electrode, on one hand, when adopting the soldering tin to weld the first electrode with the second electrode to connect, will climb along the surface of protruding structure after the solder ball melts, namely the protruding structure can play the effects of absorbing and limiting to the molten solder, reduce its diffusion area, thus avoid the diffusion range is greater after the solder melts, and then avoid the short circuit to take place between positive and negative pole of the light-emitting component; on the other hand, protruding structure is favorable to the release of production gas in the welding process, reduces the gas pocket that produces in the soldering tin during the welding to reduce the contact virtual connection between first electrode and the second electrode after the welding bad, promote welded fastness and reliability between first electrode and the second electrode, improve the dependability that first electrode and second electrode electricity are connected.
According to the display device provided by the invention, the quality of the display device is improved and the display quality of the display device is improved by adopting the display panel.
Drawings
FIG. 1 is a schematic cross-sectional view illustrating a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic top view of the arrangement of the protrusions of the display panel of FIG. 1;
FIG. 3 is a schematic cross-sectional view illustrating the structure of the display panel after step S1 of the display panel manufacturing method according to the embodiment of the present invention is completed;
FIG. 4 is a structural diagram illustrating a process of forming a bump structure from an upper layer of a first electrode according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view illustrating the structure of the display panel after step S31 of the display panel manufacturing method according to the embodiment of the present invention is completed;
FIG. 6 is a schematic cross-sectional view illustrating the structure of the display panel after step S32 of the display panel manufacturing method according to the embodiment of the present invention is completed;
fig. 7 is a schematic cross-sectional view illustrating a display panel according to another embodiment of the invention.
Wherein the reference numerals are:
1. a display backplane; 11. a substrate; 12. a first electrode; 121. a first sub-electrode; 122. a second sub-electrode; 2. a light emitting element; 21. a light emitting body; 22. a second electrode; 221. a third sub-electrode; 222. a fourth sub-electrode; 3. a raised structure; 31. a boss portion; 32. a first bump structure; 33. a second bump structure; 4. solder paste.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, a display panel, a method for manufacturing the same, and a display device according to the present invention will be described in further detail with reference to the accompanying drawings and the detailed description.
In the traditional LED display panel, the LEDs are connected with the back plate by using traditional solder ball welding, the size of the solder ball is usually several microns and dozens of microns, and micron-sized micro LEDs are difficult to weld. Even if the size of the solder ball is reduced, other problems are faced, such as: the soldering tin ball can be diffused within a certain range after being melted, the diffusion range is related to the amount of soldering paste, the diffusion range can also reach the width of dozens of micrometers after the size of the soldering tin ball is reduced, two electrode pads (namely the positive electrode and the negative electrode of the micro LED) of the micro LED are easily short-circuited, although the diffusion range after the soldering tin ball is melted can be reduced by reducing the amount of the soldering tin paste, the short circuit of the two electrode pads of the micro LED can still be inevitably caused. In addition, when the soldering paste and the soldering flux react, the soldering paste generates heat and generates air holes, and when the LED electrode pad is large, because the amount of the soldering paste is sufficient, a small amount of air holes can not cause poor welding contact; but along with the reduction of micro LED size, micro LED electrode pad has also more and more littleer, and is two orders of magnitude less than traditional LED electrode pad's size, and the volume of soldering paste also reduces thereupon, and a little bubble all probably causes the contact failure of micro LED electrode pad to the micro LED takes place to open circuit, can't light.
For this reason, it is necessary to develop a new soldering technique to cope with soldering of micro LEDs, especially when the micro LEDs are applied to displays, because the application of the micro LEDs to displays is millions; a reliable welding method is further needed to deal with.
Aiming at the problem that the existing welding method cannot deal with Micro LED welding, the embodiment of the invention provides a display panel, as shown in fig. 1, including a display back plate 1 and a light emitting element 2, where the display back plate 1 includes a substrate 11 and a first electrode 12, and the first electrode 12 is disposed on the surface of the substrate 11; the light emitting element 2 comprises a light emitting body 21 and a second electrode 22, the second electrode 22 is disposed on the surface of the light emitting body 21, and the second electrode 22 is electrically connected with the light emitting body 21; the first electrode 12 is in contact with and electrically connected to the second electrode 22, the first electrode includes a protruding structure 3, and the protruding structure 3 is disposed on a contact surface of the first electrode 12 and the second electrode 22.
The first electrode 12 and the second electrode 22 are electrically connected by solder. The light emitting element 2 is a micro LED, an LED, or a mini LED. A light emitting element 2 driving circuit for driving the light emitting element 2 to emit light is provided in the substrate 11. The first electrode 12 includes a first sub-electrode 121 and a second sub-electrode 122, and the first sub-electrode 121 and the second sub-electrode 122 are a positive electrode and a negative electrode of the light emitting element 2, respectively. The second electrode 22 includes a third sub-electrode 221 and a fourth sub-electrode 222, the third sub-electrode 221 is electrically connected to the first sub-electrode 121 correspondingly, the fourth sub-electrode 222 is electrically connected to the second sub-electrode 122 correspondingly, and the driving circuit in the substrate 11 drives the light emitting element 2 to emit light through the third sub-electrode 221 and the fourth sub-electrode 222.
By arranging the convex structure 3 on the contact surface of the first electrode 12 and the second electrode 22, on one hand, when the first electrode 12 and the second electrode 22 are welded and connected by adopting soldering tin, a soldering tin ball can climb along the surface of the convex structure 3 after being melted, namely, the convex structure 3 can play a role in adsorbing and limiting the melted soldering tin, so that the diffusion area is reduced, the diffusion range is prevented from being larger after the soldering tin is melted, and further, the short circuit between the positive electrode and the negative electrode of the light-emitting element 2 is prevented; on the other hand, the protruding structure 3 is beneficial to releasing gas generated in the welding process, and reduces air holes generated in soldering tin during welding, so that poor contact virtual connection between the first electrode 12 and the second electrode 22 after welding is reduced.
Alternatively, the protruding structure 3 comprises a plurality of protruding portions 31, and the protruding portions 31 are arranged around the center of the contact surface at equal intervals, as shown in fig. 2. With the arrangement, on one hand, the adsorption and limitation effects of the projection structures 3 on the molten soldering tin can be enhanced, so that the molten soldering tin is gathered in the distribution range of the projection parts 31, the diffusion area of the projection parts is reduced, the diffusion range is prevented from being large after the soldering tin is molten, and the short circuit between the anode and the cathode of the light-emitting element 2 is further prevented; on the other hand, the protrusions 31 arranged at intervals are beneficial to gas generated in the welding process to overflow from the intervals, and air holes generated in soldering tin during welding are reduced, so that poor contact virtual connection between the first electrode 12 and the second electrode 22 after welding is reduced, and the reliability of welding connection is improved.
Alternatively, the protrusions 31 may be arranged in an array, or the intervals between the protrusions 31 may be different.
Optionally, the heights of the plurality of protrusions 31 are equal, and the heights of the protrusions 31 are 1/2-4/5 of the total thickness of the first electrode 12. Further alternatively, the projection 31 is made of a conductive material. The protruding portion 31 is a part of the first electrode 12, for example, the first electrode 12 may be formed by using a double-layer conductive material, and an upper conductive layer of the first electrode 12 is prepared to form the protruding portion 31. Therefore, good contact conduction of the first electrode 12 and the second electrode 22 can be ensured, the adsorption and limiting effects of the projection 31 on the molten soldering tin can be better enhanced, the molten soldering tin is further gathered in the distribution range of the projection 31, the diffusion area of the molten soldering tin is reduced, and the diffusion range of the molten soldering tin is prevented from being large.
Alternatively, the protruding portion 31 may also be made of a non-conductive material, and the protruding portion 31 made of the non-conductive material can also perform the functions of adsorbing and limiting the molten solder during the welding process, so as to avoid a large diffusion area; meanwhile, since the solder covers the entire protrusion 31 of the non-conductive material during soldering, the connection conduction between the first electrode 12 and the second electrode 22 is not substantially affected.
Alternatively, the convex portion 31 includes any one of a rectangle, a triangle, a trapezoid, and a semicircle along a sectional shape perpendicular to the contact surface. The cross-sectional shape of the projection 31 perpendicular to the contact surface may be any shape in which the top portion thereof is constricted with respect to the bottom portion thereof, and it is ensured that the projection 31 is convex with respect to the contact surface.
Based on the above structure of the display panel, this embodiment further provides a method for manufacturing the display panel, including: step S1: preparing a display back plate; preparing the display back plate comprises preparing a substrate and preparing a first electrode on the surface of the substrate.
In this step, preparing the first electrode 12 includes preparing the projection structure 3 on the contact surface of the first electrode 12 with the second electrode 22, as shown in fig. 3. The manufacturing of the projection structure 3 includes: and carrying out an exposure process on the surface layer of the first electrode 12 to form a pattern of the convex structure 3. For example: as shown in fig. 4, the first electrode 12 is composed of an upper layer and a lower layer of metal, the lower layer is an ITO or Mo material layer, and the upper layer is any one of Cu, Mo, and Al; the upper and lower layers of metal forming the first electrode 12 are prepared by a deposition process, and then etched by an exposure process (including steps of photoresist coating, exposure, development, and etching) to form a pattern of the projection structure 3. Because the upper layer metal and the lower layer metal have different etching selection ratios, the process of only etching the upper layer metal can be realized by selecting different etching liquids.
In addition, if the convex structure 3 is made of a non-conductive material, such as a resin material, the convex structure 3 may be formed on the contact surface of the first electrode 12 directly by a patterning process.
Step S2: preparing a light-emitting element; the manufacturing of the light emitting element includes manufacturing a light emitting body, and manufacturing a second electrode on a surface of the light emitting body.
Step S3: and correspondingly and electrically connecting the first electrode with the second electrode.
The method specifically comprises the following steps: step S31: printing solder paste 4 on the contact surface of the first electrode 12; as shown in fig. 5. The solder paste 4 may be printed by screen printing or ink jet printing.
Step S32: the first electrode 12 and the second electrode 22 are brought into corresponding contact, and the first electrode 12 and the second electrode 22 are soldered together by a reflow soldering process, as shown in fig. 6.
The reflow soldering process is to melt the solder balls in an environment with a high temperature of about 200 ℃, the melted solder is spread along the protruding structure 3, the first electrode 12 and the second electrode 22 are connected together, then the temperature is reduced to solidify the solder, and finally the first electrode 12 and the second electrode 22 are electrically connected. In addition, in the reflow soldering process, the solvent in the soldering paste printed on the contact surface of the first electrode 12 can be quickly volatilized due to high temperature, and then the solder ball can be melted, so that the soldering tin is prevented from being oxidized after the solvent is volatilized, and the deterioration of the conductive connection performance of the soldering tin is avoided.
The embodiment of the present invention further provides a display panel, which is different from the above embodiment, as shown in fig. 7, on the basis of the above embodiment, in this embodiment, the second electrode 22 includes a protruding structure, and the protruding structure is disposed on a contact surface of the second electrode 22 and the first electrode 12.
In the present embodiment, the bump structures include a first bump structure 32 and a second bump structure 33; the first protruding structures 32 are disposed on the contact surface of the first electrode 12, the second protruding structures 33 are disposed on the contact surface of the second electrode 22, and the first protruding structures 32 and the second protruding structures 33 are staggered. Wherein the first and second convex structures 32 and 33 are the same as those of the above-described embodiment. The first protruding structures 32 and the second protruding structures 33 are arranged in a staggered mode, so that the adsorption and limiting effects on molten soldering tin are guaranteed, gas generated in the welding process is enabled to overflow from the protruding structures, and the firmness and reliability of welding between the first electrode 12 and the second electrode 22 can be further improved under the condition that air holes in the soldering tin are reduced, and the reliability of electric connection between the first electrode 12 and the second electrode 22 is further improved.
In this embodiment, other structures of the display panel are the same as those in the above embodiments, and are not described herein again.
The method for manufacturing the display panel in this embodiment only needs to add a step of manufacturing the second protrusion structure on the contact surface of the second electrode and the first electrode on the basis of the method for manufacturing the display panel in the above embodiment, and other steps are the same as those in the above embodiment and are not described here again.
The embodiment of the present invention further provides a display panel, which is different from the foregoing embodiments in that only the second electrode includes a protrusion structure, and the protrusion structure is disposed on a contact surface of the second electrode and the first electrode.
That is, in this embodiment, the projection structure is provided only on the electrode of the light emitting element. When the light-emitting element is used for plate making, a plurality of light-emitting elements can be typeset and prepared by one motherboard, and the convex structures are formed on the contact surfaces of the second electrodes of all the light-emitting elements by one exposure process before the motherboard is cut to form the independent light-emitting elements.
In this embodiment, other structures of the display panel and the manufacturing method of the display panel are the same as those in the first embodiment, and are not described herein again.
In the display panel provided in the above embodiment of the present invention, the convex structure is disposed on the contact surface of the first electrode and the second electrode; and/or, set up the protruding structure on the contact surface with the first electrode of the second electrode, on one hand, when adopting the soldering tin to weld the first electrode with the second electrode to connect, will climb along the surface of protruding structure after the solder ball melts, namely the protruding structure can play the effects of absorbing and limiting to the molten solder, reduce its diffusion area, thus avoid the diffusion range is greater after the solder melts, and then avoid the short circuit to take place between positive and negative pole of the light-emitting component; on the other hand, protruding structure is favorable to the release of production gas in the welding process, reduces the gas pocket that produces in the soldering tin during the welding to reduce the contact virtual connection between first electrode and the second electrode after the welding bad, promote welded fastness and reliability between first electrode and the second electrode, improve the dependability that first electrode and second electrode electricity are connected.
An embodiment of the present invention further provides a display device, including the display panel in any of the above embodiments.
By adopting the display panel in any one of the embodiments, the quality of the display device is improved, and the display quality of the display device is improved.
The display device provided by the invention can be any product or part with a display function, such as an LED panel, a micro LED panel, a mini LED panel, an LED television, a micro LED television, a mini LED television, a display, a mobile phone, a navigator and the like.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A display panel comprises a display back panel and a light-emitting element, wherein the display back panel comprises a substrate and a first electrode, and the first electrode is arranged on the surface of the substrate; the light-emitting element comprises a light-emitting body and a second electrode, wherein the second electrode is arranged on the surface of the light-emitting body and is electrically connected with the light-emitting body; the first electrode and the second electrode are in contact and electrically connected,
the first electrode comprises a convex structure, and the convex structure is arranged on the contact surface of the first electrode and the second electrode; and/or the second electrode comprises the protruding structure, and the protruding structure is arranged on the contact surface of the second electrode and the first electrode.
2. The display panel of claim 1, wherein the protrusion structure comprises a plurality of protrusions arranged at equal intervals around the center of the contact surface.
3. The display panel according to claim 2, wherein the plurality of protrusions have equal heights, and the height of the protrusion is 1/2-4/5 of the total thickness of the first electrode or the second electrode.
4. The display panel according to claim 3, wherein the protrusion is made of a conductive material.
5. The display panel according to claim 4, wherein the protrusion includes any one of a rectangle, a triangle, a trapezoid, and a semicircle in a cross-sectional shape perpendicular to the contact surface.
6. The display panel according to any one of claims 1 to 5, wherein the convex structure comprises a first convex structure and a second convex structure;
the first protruding structures are arranged on the contact surface of the first electrode, the second protruding structures are arranged on the contact surface of the second electrode, and the first protruding structures and the second protruding structures are arranged in a staggered mode.
7. A display device characterized by comprising the display panel according to any one of claims 1 to 6.
8. A method for manufacturing a display panel according to any one of claims 1 to 6, comprising:
preparing a display back plate; preparing a display back plate comprises preparing a substrate, and preparing a first electrode on the surface of the substrate;
preparing a light-emitting element; preparing a light-emitting element comprises preparing a light-emitting body and preparing a second electrode on the surface of the light-emitting body;
correspondingly and electrically connecting the first electrode with the second electrode; it is characterized in that the preparation method is characterized in that,
preparing a first electrode comprises preparing a convex structure on a contact surface of the first electrode and the second electrode; and/or, preparing the second electrode comprises preparing a convex structure on the contact surface of the second electrode and the first electrode.
9. The method of claim 8, wherein the step of preparing the protrusion structure comprises: and carrying out an exposure process on the surface layer of the first electrode and/or the second electrode to form a pattern of the protruding structure.
10. The method for manufacturing a display panel according to claim 9, wherein the electrically connecting the first electrode and the second electrode correspondingly comprises:
printing solder paste on the contact surface of the first electrode;
and correspondingly contacting the first electrode with the second electrode, and welding the first electrode and the second electrode together through a reflow soldering process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010955634.8A CN114171662A (en) | 2020-09-11 | 2020-09-11 | Display panel, preparation method thereof and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010955634.8A CN114171662A (en) | 2020-09-11 | 2020-09-11 | Display panel, preparation method thereof and display device |
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| CN114171662A true CN114171662A (en) | 2022-03-11 |
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| CN202010955634.8A Pending CN114171662A (en) | 2020-09-11 | 2020-09-11 | Display panel, preparation method thereof and display device |
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| CN104881185A (en) * | 2014-02-27 | 2015-09-02 | 宸鸿科技(厦门)有限公司 | Touch panel and touch electrode structure thereof |
| WO2019169770A1 (en) * | 2018-03-07 | 2019-09-12 | 昆山工研院新型平板显示技术中心有限公司 | Led chip and manufacturing method therefor, display panel and electronic device |
| US20190393285A1 (en) * | 2017-01-26 | 2019-12-26 | Sony Corporation | Display device, electronic device, and manufacturing method of display device |
| CN110739380A (en) * | 2018-07-20 | 2020-01-31 | 錼创显示科技股份有限公司 | Micro light-emitting element and display device |
| CN110867462A (en) * | 2019-10-30 | 2020-03-06 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
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- 2020-09-11 CN CN202010955634.8A patent/CN114171662A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104881185A (en) * | 2014-02-27 | 2015-09-02 | 宸鸿科技(厦门)有限公司 | Touch panel and touch electrode structure thereof |
| US20190393285A1 (en) * | 2017-01-26 | 2019-12-26 | Sony Corporation | Display device, electronic device, and manufacturing method of display device |
| WO2019169770A1 (en) * | 2018-03-07 | 2019-09-12 | 昆山工研院新型平板显示技术中心有限公司 | Led chip and manufacturing method therefor, display panel and electronic device |
| CN110739380A (en) * | 2018-07-20 | 2020-01-31 | 錼创显示科技股份有限公司 | Micro light-emitting element and display device |
| CN110867462A (en) * | 2019-10-30 | 2020-03-06 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
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