CN114164408A - Heterojunction solar cell production system and target cleaning mechanism - Google Patents

Heterojunction solar cell production system and target cleaning mechanism Download PDF

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Publication number
CN114164408A
CN114164408A CN202111487569.1A CN202111487569A CN114164408A CN 114164408 A CN114164408 A CN 114164408A CN 202111487569 A CN202111487569 A CN 202111487569A CN 114164408 A CN114164408 A CN 114164408A
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CN
China
Prior art keywords
target
cleaning
ring
driving assembly
cleaning mechanism
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Pending
Application number
CN202111487569.1A
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Chinese (zh)
Inventor
魏科胜
薛建锋
余义
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Tongwei Solar Anhui Co Ltd
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Tongwei Solar Anhui Co Ltd
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Priority to CN202111487569.1A priority Critical patent/CN114164408A/en
Publication of CN114164408A publication Critical patent/CN114164408A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention relates to a heterojunction solar cell production system and a target cleaning mechanism, when a target is required to be cleaned, a driving assembly drives a cleaning ring to move along the extending direction of the target, so that the target is inserted into a cleaning cavity, the surface of the target can be cleaned by utilizing at least two cleaning pieces, fragments of damaged silicon wafers lapped between the target and a baffle can be cleaned, and the target is prevented from being short-circuited; meanwhile, dust on the surface of the target can be cleaned, prokaryotic points in the sputtering process can be reduced, target nodulation can be reduced, the coating quality can be improved, and the produced film has excellent performance; in addition, cooling and cavity opening cleaning are not needed, so that vacuumizing and heating are not needed after cleaning, the production efficiency is high, and the productivity is improved.

Description

Heterojunction solar cell production system and target cleaning mechanism
Technical Field
The invention relates to the technical field of photovoltaics, in particular to a heterojunction solar cell production system and a target cleaning mechanism.
Background
In the production process of the heterojunction solar cell, a magnetron sputtering method is usually adopted to plate an ITO (Indium tin oxide) film layer on a silicon wafer. In order to reduce the cost, the thickness of the silicon wafer needs to be reduced, and after the thickness of the silicon wafer is reduced, the silicon wafer is easy to break when coating is carried out, and the broken silicon wafer can be lapped between the cavity and the target to cause short circuit of the target. In order to avoid the short circuit of the target material, the traditional mode is to clean the cavity, and the production efficiency is reduced.
Disclosure of Invention
In view of the above, it is necessary to provide a heterojunction solar cell production system and a target cleaning mechanism for solving the problem of low production efficiency.
The technical scheme is as follows:
in one aspect, a target cleaning mechanism is provided, comprising:
the cleaning ring is provided with a mounting cavity;
the at least two cleaning pieces are arranged in the mounting cavity and connected with the cleaning ring, and are arranged around the circumferential direction of the cleaning ring and enclosed into a cleaning cavity matched with the outer contour of the target; and
and the driving assembly is in transmission connection with the cleaning ring so as to drive the cleaning ring to reciprocate along the extending direction of the target.
The technical solution is further explained below:
in one embodiment, the target cleaning mechanism further includes a trigger element electrically connected to the driving assembly, and the trigger element is configured to detect an operating state of the target.
In one embodiment, the trigger element comprises an image collector for collecting an image of the target.
In one embodiment, the trigger element comprises an electrical signal detector for detecting an electrical condition of the target.
In one embodiment, the driving assembly includes a telescopic member, the telescopic member is provided with a telescopic end which moves back and forth along the extending direction of the target material, and the telescopic end is connected with the cleaning ring.
In one embodiment, the driving assembly further comprises a rotating member, the rotating member is provided with a mounting end and a rotating end, the mounting end is connected with the telescopic end, and the rotating end is in transmission connection with the cleaning ring so that the cleaning ring rotates around the central axis of the cleaning ring.
In one embodiment, at least some of the at least two cleaning members are rotatably coupled to the cleaning ring.
In one embodiment, the target cleaning mechanism further comprises at least two elastic resetting pieces, and the at least two elastic resetting pieces and the at least two cleaning pieces are arranged in a one-to-one correspondence manner; one end of the elastic reset piece is connected with the cleaning ring, and the other end of the elastic reset piece is connected with the corresponding cleaning piece.
In one embodiment, the cleaning member includes at least one of a cleaning brush or a cleaning spray head.
In another aspect, a heterojunction solar cell production system is provided, which comprises a target material and the target material cleaning mechanism for cleaning the target material.
According to the heterojunction solar cell production system and the target cleaning mechanism in the embodiment, when the target needs to be cleaned, the driving assembly drives the cleaning ring to move along the extending direction of the target, so that the target is inserted into the cleaning cavity, the surface of the target can be cleaned by utilizing at least two cleaning pieces, fragments of damaged silicon wafers lapped between the target and the baffle can be cleaned, and the target is prevented from being short-circuited; meanwhile, dust on the surface of the target can be cleaned, prokaryotic points in the sputtering process can be reduced, target nodulation can be reduced, the coating quality can be improved, and the produced film has excellent performance; in addition, cooling and cavity opening cleaning are not needed, so that vacuumizing and heating are not needed after cleaning, the production efficiency is high, and the productivity is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heterojunction solar cell production system of an embodiment;
fig. 2 is a top view of a target cleaning mechanism of the heterojunction solar cell production system of fig. 1;
fig. 3 is a schematic structural diagram of a driving assembly of a target cleaning mechanism of the heterojunction solar cell production system of fig. 1.
Description of reference numerals:
100. cleaning a ring; 110. a mounting cavity; 200. cleaning the workpiece; 210. cleaning the cavity; 300. a drive assembly; 310. a telescoping member; 311. a telescopic end; 320. a rotating member; 321. an installation end; 322. a rotating end; 400. a target material; 500. and (4) fragmenting.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In one embodiment, as shown in fig. 1, a heterojunction solar cell production system is provided, comprising a target 400 and a target cleaning mechanism. The target material cleaning mechanism can be used for timely and effectively cleaning the target material 400, and the problem of coating quality caused by the influence on the target material 400 is avoided.
The target 400 may be an existing element that can be applied to a magnetron sputtering process to plate an ITO film layer on a silicon wafer.
As shown in fig. 2 and 3, the target cleaning mechanism optionally includes a cleaning ring 100, at least two cleaning members 200, and a driving assembly 300.
The cleaning ring 100 is a closed ring structure, and the middle portion of the cleaning ring 100 is hollow to form an installation cavity 110. The cleaning ring 100 may be made of metal such as iron, or may be made of non-metal such as plastic, and only needs to have sufficient strength and rigidity.
In addition, the projection profile of the cleaning ring 100 may be a circular ring shape or a square frame shape, and may be flexibly designed or adjusted according to actual use requirements. Preferably, the mounting chamber 110 has a contour similar to the contour of the target 400.
Wherein, at least two clearance pieces 200 all set up in installation cavity 110 to, at least two clearance pieces 200 all are connected with clearance ring 100.
Specifically, one end of each cleaning piece 200 is connected with the inner side wall of the mounting cavity 110, that is, one end of each cleaning piece 200 is connected with the cleaning ring 100, and each cleaning piece 200 extends towards the central axis direction of the mounting cavity 110.
Also, at least two cleaning members 200 are disposed around the circumference of the cleaning ring 100. Furthermore, at least two cleaning members 200 enclose a cleaning chamber 210 that matches the outer contour of the target 400. In this way, one end of each cleaning member 200, which is far away from the cleaning ring 100, is surrounded to form a cleaning cavity 210 into which the target 400 can be inserted, so that the surface of the target 400 can be cleaned by the cleaning members 200.
In addition, the outline of the cleaning cavity 210 may be circular or rectangular, and may be flexibly designed or adjusted according to the actual use requirement. Preferably, the cleaning chamber 210 has a contour similar to the contour of the target 400.
The specific number of the cleaning elements 200 can be flexibly adjusted or designed according to actual use requirements, and only the cleaning requirements of the target 400 need to be met.
Alternatively, the cleaning member 200 may clean the target 400 by contacting the surface of the target 400, for example, the cleaning member 200 may be a cleaning brush, and the surface of the target 400 is cleaned by a brush head of the cleaning brush; it may also be realized without directly contacting the surface of the target 400, for example, the cleaning member 200 may be a cleaning nozzle disposed at a distance from the surface of the target 400, and cleaning is performed by jetting a gas flow to the surface of the target 400. Of course, in other embodiments, one part of the at least two cleaning members 200 may be a cleaning brush and the other part may be a cleaning nozzle.
When the cleaning piece 200 is a cleaning brush, high-temperature resistant materials can be selected for manufacturing, and the cleaning brush also has the functions of oxidation resistance and friction resistance and can continuously and reliably work.
The driving assembly 300 is in transmission connection with the cleaning ring 100, so that the cleaning ring 100 can be driven to reciprocate along the extending direction of the target 400, and the target 400 can be cleaned by the cleaning member 200.
In the case where the target 400 has a rod-like or strip-like structure, the extending direction of the target 400 refers to the longitudinal direction thereof, and in the case where the target 400 has a columnar structure, the extending direction of the target 400 refers to the central axis direction.
In addition, the cleaning cavity 210 matches the outer contour of the target 400, which means that the target 400 can be inserted into the cleaning cavity 210, and the cleaning member 200 can clean the target 400. When the cleaning member 200 is a cleaning brush, the inner diameter of the cleaning cavity 210 may be smaller than the outer diameter of the target 400, so that the cleaning brush can contact with the surface of the target 400 for cleaning after the target 400 is inserted into the cleaning cavity 210; when the cleaning member 200 is a cleaning nozzle, the inner diameter of the cleaning cavity 210 may be larger than the outer diameter of the target 400, so that the target 400 can be smoothly inserted into the cleaning cavity 210 without interference, and the surface of the target 400 can be cleaned by the airflow ejected from the cleaning nozzle.
In the target cleaning mechanism of the above embodiment, when the target 400 needs to be cleaned, the driving assembly 300 drives the cleaning ring 100 to move along the extending direction of the target 400, so that the target 400 is inserted into the cleaning cavity 210, the surface of the target 400 can be cleaned by using at least two cleaning pieces 200, fragments 500 of damaged silicon wafers caught between the target 400 and the baffle can be cleaned, and the target 400 is prevented from being short-circuited; meanwhile, dust on the surface of the target 400 can be cleaned, prokaryotic points in the sputtering process can be reduced, nodules of the target 400 can be reduced, the coating quality is improved, and the produced film has excellent performance; in addition, cooling and cavity opening cleaning are not needed, so that vacuumizing and heating are not needed after cleaning, the production efficiency is high, and the productivity is improved.
Of course, when the target material cleaning mechanism is used for cleaning the target material 400, the target material can be cleaned when the whole machine is in a material waiting state, and the utilization rate of the machine is ensured.
In addition, in order to ensure that the target 400 can be cleaned timely and without errors, so as to avoid the occurrence of mistaken cleaning or influence on the normal operation of magnetron sputtering.
Optionally, the target cleaning mechanism further comprises a trigger element (not shown). Specifically, the trigger device is electrically connected to the driving assembly 300, and the trigger device is used for detecting the working state of the target 400. Therefore, after the working state of the target 400 is detected by the trigger element, whether the working state of the target 400 is normal or not is judged according to the detection result, and when the working state of the target 400 is abnormal, the driving assembly 300 can be started to drive the cleaning ring 100 and the cleaning piece 200 to clean the target 400, so that the timeliness and effectiveness of cleaning are guaranteed. Of course, when the working state of the target 400 is detected to be normal, the driving assembly 300 is in a standby state.
The trigger element may detect the operating state of the target 400 by detecting an external state thereof.
In one embodiment, the trigger element includes an image collector, so, the image collector can collect the image of the target 400, and then compare the collected image with a standard image, so as to obtain whether foreign matters such as fragments 500 of a damaged silicon wafer are attached to the target 400, and then reuse the image collector and the electric connection of the driving assembly 300, so as to start the driving assembly 300 in time when the foreign matters are detected to be attached to the target 400, and further drive the cleaning ring 100 and the cleaning member 200 to clean the foreign matters attached to the target 400 through the driving assembly 300.
The image collector may be a camera or other existing elements capable of collecting image information of the target 400. The image collectors may be disposed at the side of the target 400, and at least two image collectors may be used to collect image information of the target 400 at each angle.
It should be noted that, in the actual use process, the acquired image information may be compared by using a control device such as a console, that is, an intermediate control element may also be present between the image acquirer and the driving assembly 300. Of course, the comparison of the image information can also be directly completed by the image collector. It is only necessary to satisfy the requirement that the start or standby of the driving assembly 300 can be realized through the collected image information.
The detection of the trigger element on the working state of the target 400 can also be realized by detecting the internal electrical condition thereof.
In one embodiment, the trigger element includes an electrical signal detector for detecting an electrical signal of the target 400, so that the electrical signal detector is used to detect the electrical signal of the target 400, and then the detected electrical signal is compared with a standard signal, so as to determine whether the electrical performance of the target 400 is normal, and then the electrical signal detector is electrically connected to the driving assembly 300, so that the driving assembly 300 can be started in time when the electrical signal of the target 400 is detected to have a deviation from the standard signal, and the driving assembly 300 drives the cleaning ring 100 and the cleaning member 200 to clean the foreign matter attached to the target 400.
The electrical signal may be one or a combination of several of a resistance signal, a current signal, or a voltage signal.
The electric signal detector may be a voltmeter, an ammeter, or the like, which can detect an electric signal of the target 400. The electrical signal detector may be electrically connected to the circuitry of the target 400.
It should be noted that, in the actual use process, the collected electrical signal may be compared with the standard signal by using a control device such as a console, that is, an intermediate control element may also be present between the electrical signal detector and the driving assembly 300, and it is only necessary to realize the start or standby of the driving assembly 300 by the collected electrical signal.
Wherein, drive assembly 300 drive clearance ring 100 along the extending direction reciprocating motion of target 400, can realize through flexible mode, for example utilize the flexible realization of pneumatic cylinder or pneumatic cylinder, also can convert into linear motion through rotary motion and realize, for example utilize the screw-nut structure to drive clearance ring 100 along the reciprocating linear motion of the length direction of screw rod, only need satisfy can drive clearance ring 100 motion so that target 400 inserts in clearance chamber 210 and clear up can.
As shown in fig. 3, optionally, the driving assembly 300 includes a telescopic member 310 arranged along the extending direction of the target 400. The telescopic member 310 is provided with a telescopic end 311 reciprocating along the extending direction of the target 400, and the telescopic end 311 is connected with the cleaning ring 100 by means of screw connection, clamping connection and the like. So, when the flexible end 311 of extensible member 310 is flexible, thereby drive clearance ring 100 along the extending direction reciprocating motion of target 400, and then can make target 400 insert clearance chamber 210 or follow clearance chamber 210 and remove, and then can realize clearing up target 400, can not influence the normal work of target 400 yet.
The telescopic member 310 may be a hydraulic cylinder, an air cylinder, or the like. The telescopic end 311 may be a telescopic rod or a telescopic head of a hydraulic cylinder or an air cylinder.
Of course, to ensure that the cleaning member 200 can effectively clean the surfaces of the target 400.
As shown in fig. 3, further, the driving assembly 300 further includes a rotating member 320. The rotating member 320 has a mounting end 321 and a rotating end 322 spaced from each other. Specifically, the mounting end 321 is connected to the telescopic end 311 by screwing, clipping, or the like. The rotating end 322 is connected with the cleaning ring 100 in a screwing mode, a clamping mode and the like, so that the cleaning ring 100 can rotate around the central axis of the cleaning ring 100 by the aid of the rotating end 322, and each cleaning piece 200 can rotate around the central axis of the cleaning ring 100. So, after target 400 inserted clearance chamber 210, combine the rotation of clearance piece 200 to can more thoroughly clear up with effectual surface to target 400, the clearance effect is better.
The rotating member 320 may be a rotating motor or other existing components capable of driving the cleaning ring 100 to rotate. The mounting end 321 may be a housing of the rotating electrical machine, and the rotating end 322 may be a rotating output shaft of the rotating electrical machine.
In addition, the connection between the cleaning member 200 and the cleaning ring 100 may be a fixed connection manner such as a screw connection, a clamping connection, or a movable connection manner such as a hinge connection.
Optionally, at least a portion of the at least two cleaning members 200 is pivotally connected to the cleaning ring 100, such as by a hinge. So, after target 400 inserts in clearance chamber 210, through effort and the reaction force between clearance piece 200 and the target 400 for the clearance piece 200 of being connected with clearance ring 100 rotation can rotate around corresponding axis of rotation, and then can clear up the surface of target 400 more effectually, and the clearance effect is better.
In addition, intermediate elements may also be present in the connection between the cleaning member 200 and the cleaning ring 100.
Optionally, the target cleaning mechanism further comprises at least two elastic restoring members (not shown).
Specifically, at least two elastic restoring members are disposed in one-to-one correspondence with the at least two cleaning members 200. Wherein, the one end that the elasticity resets is connected with modes such as clearance ring 100 adoption spiro union, joint, and the other end that the elasticity resets is connected with modes such as the clearance piece 200 adoption spiro union, joint that correspond. Thus, when the target 400 is inserted into the cleaning cavity 210, the elastic reset piece deforms under the action of the extrusion force, so that the impact force between the cleaning piece 200 and the target 400 can be buffered and absorbed, and the cleaning piece 200 is prevented from scratching or damaging the surface of the target 400 in the cleaning process.
The elastic restoring member may be a spring, a spring leaf or other elements with elastic expansion and contraction functions.
Of course, when the elastic restoring member is used to connect the cleaning member 200 and the cleaning ring 100, the elastic restoring member may be combined with the rotating member 320, so that the whole cleaning ring 100 can rotate around its central axis.
The "certain body" and the "certain portion" may be a part corresponding to the "member", that is, the "certain body" and the "certain portion" may be integrally formed with the other part of the "member"; the "part" can be made separately from the "other part" and then combined with the "other part" into a whole. The expressions "a certain body" and "a certain part" in the present application are only one example, and are not intended to limit the scope of the present application for reading convenience, and the technical solutions equivalent to the present application should be understood as being included in the above features and having the same functions.
It should be noted that, the components included in the "unit", "assembly", "mechanism" and "device" of the present application can also be flexibly combined, i.e., can be produced in a modularized manner according to actual needs, so as to facilitate the modularized assembly. The division of the above-mentioned components in the present application is only one example, which is convenient for reading and is not a limitation to the protection scope of the present application, and the same functions as the above-mentioned components should be understood as equivalent technical solutions in the present application.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to," "disposed on," "secured to," or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Further, when one element is considered as "fixed transmission connection" with another element, the two elements may be fixed in a detachable connection manner or in an undetachable connection manner, and power transmission can be achieved, such as sleeving, clamping, integrally-formed fixing, welding and the like, which can be achieved in the prior art, and is not cumbersome. When an element is perpendicular or nearly perpendicular to another element, it is desirable that the two elements are perpendicular, but some vertical error may exist due to manufacturing and assembly effects. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It should also be understood that in explaining the connection relationship or the positional relationship of the elements, although not explicitly described, the connection relationship and the positional relationship are interpreted to include an error range which should be within an acceptable deviation range of a specific value determined by those skilled in the art. For example, "about," "approximately," or "substantially" may mean within one or more standard deviations, without limitation.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A target cleaning mechanism, comprising:
the cleaning ring is provided with a mounting cavity;
the at least two cleaning pieces are arranged in the mounting cavity and connected with the cleaning ring, and are arranged around the circumferential direction of the cleaning ring and enclosed into a cleaning cavity matched with the outer contour of the target; and
and the driving assembly is in transmission connection with the cleaning ring so as to drive the cleaning ring to reciprocate along the extending direction of the target.
2. The target cleaning mechanism of claim 1, further comprising a trigger element electrically connected to the driving assembly, wherein the trigger element is configured to detect an operating state of the target.
3. The target cleaning mechanism of claim 2, wherein the trigger element comprises an image collector for collecting an image of the target, and the image collector is electrically connected to the driving assembly.
4. The target cleaning mechanism of claim 2, wherein the triggering element comprises an electrical signal detector for detecting an electrical signal of the target, the electrical signal detector being electrically connected to the driving assembly.
5. The target cleaning mechanism according to any one of claims 1 to 4, wherein the driving assembly comprises a telescopic member provided with a telescopic end that reciprocates along the extending direction of the target, the telescopic end being connected to the cleaning ring.
6. The target cleaning mechanism of claim 5, wherein the driving assembly further comprises a rotating member having a mounting end and a rotating end spaced apart from each other, the mounting end being connected to the telescopic end, and the rotating end being connected to the cleaning ring such that the cleaning ring rotates around a central axis of the cleaning ring.
7. The target cleaning mechanism of any of claims 1 to 4, wherein at least some of the at least two cleaning members are rotatably connected to the cleaning ring.
8. The target cleaning mechanism according to any one of claims 1 to 4, further comprising at least two elastic restoring members, wherein the at least two elastic restoring members are arranged in one-to-one correspondence with the at least two cleaning members; one end of the elastic reset piece is connected with the cleaning ring, and the other end of the elastic reset piece is connected with the corresponding cleaning piece.
9. The target cleaning mechanism of any one of claims 1 to 4, wherein the cleaning member comprises at least one of a cleaning brush or a cleaning spray head.
10. A heterojunction solar cell production system comprising a target and a target cleaning mechanism according to any one of claims 1 to 9 for cleaning the target.
CN202111487569.1A 2021-12-07 2021-12-07 Heterojunction solar cell production system and target cleaning mechanism Pending CN114164408A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111487569.1A CN114164408A (en) 2021-12-07 2021-12-07 Heterojunction solar cell production system and target cleaning mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111487569.1A CN114164408A (en) 2021-12-07 2021-12-07 Heterojunction solar cell production system and target cleaning mechanism

Publications (1)

Publication Number Publication Date
CN114164408A true CN114164408A (en) 2022-03-11

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Family Applications (1)

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CN202111487569.1A Pending CN114164408A (en) 2021-12-07 2021-12-07 Heterojunction solar cell production system and target cleaning mechanism

Country Status (1)

Country Link
CN (1) CN114164408A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012255199A (en) * 2011-06-10 2012-12-27 Sumitomo Heavy Ind Ltd Rotary sputtering cathode, and film deposition apparatus having rotary sputtering cathode
CN107164724A (en) * 2017-05-11 2017-09-15 合肥京东方显示技术有限公司 The quantity of coating machine and target particulate determines method
CN207343298U (en) * 2017-03-23 2018-05-11 无锡市明骥智能机械有限公司 Possesses the piston rod cleaner that high pressure water washes away reciprocal cleaning function
CN213053964U (en) * 2020-06-16 2021-04-27 洛阳晶联光电材料有限责任公司 Rotary target surface polishing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012255199A (en) * 2011-06-10 2012-12-27 Sumitomo Heavy Ind Ltd Rotary sputtering cathode, and film deposition apparatus having rotary sputtering cathode
CN207343298U (en) * 2017-03-23 2018-05-11 无锡市明骥智能机械有限公司 Possesses the piston rod cleaner that high pressure water washes away reciprocal cleaning function
CN107164724A (en) * 2017-05-11 2017-09-15 合肥京东方显示技术有限公司 The quantity of coating machine and target particulate determines method
CN213053964U (en) * 2020-06-16 2021-04-27 洛阳晶联光电材料有限责任公司 Rotary target surface polishing device

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