CN114156259A - Light source module and method for manufacturing the same - Google Patents
Light source module and method for manufacturing the same Download PDFInfo
- Publication number
- CN114156259A CN114156259A CN202010934054.0A CN202010934054A CN114156259A CN 114156259 A CN114156259 A CN 114156259A CN 202010934054 A CN202010934054 A CN 202010934054A CN 114156259 A CN114156259 A CN 114156259A
- Authority
- CN
- China
- Prior art keywords
- substrate
- transparent conductive
- light
- source module
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims abstract description 86
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 9
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 8
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 5
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- -1 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 28
- 238000010586 diagram Methods 0.000 description 10
- 238000002161 passivation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a light source module and a manufacturing method thereof, wherein the light source module comprises a transparent conductive substrate and a light-emitting element, the light-emitting element is arranged on the transparent conductive film of the transparent conductive substrate and is electrically connected with the transparent conductive film, and the light-emitting element is a flip light-emitting diode chip and/or does not comprise a lead support.
Description
Technical Field
The present invention relates to the field of optics, and in particular, to a light source module and a method for manufacturing the light source module.
Background
With the evolution of electronic industry and the vigorous development of industrial technology, various electronic devices are developed and designed in a direction of being portable and easy to carry, so as to be convenient for users to apply to mobile commerce, entertainment, leisure and the like at any time and any place. In addition, in recent years, as the degree of integration and application of light, light and electricity is increasing, various light source modules are being widely extended to various electronic products, for example, the light source modules are applied to the housings of computers for electronic competitions, so that the housings of the computers have a cool and shining light effect.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an appearance of a conventional light source module when the light source module does not emit light, and fig. 2 is a schematic structural cross-sectional diagram of the light source module shown in fig. 1. The light source module 1 includes a transparent conductive substrate 11, a plurality of led units 12, a protective glass 13, and a sealant 14 filled between the transparent conductive substrate 11 and the protective glass 13, and each led unit 12 is electrically connected to the conductive layer 111 on the transparent conductive substrate 11, so that the transparent conductive substrate 11 can obtain power to output light beams, and the protective glass 13 and the sealant 14 provide functions of protecting the conductive layer 111 and the led units 12, thereby preventing the occurrence of damp and scratch.
Each of the led units 12 in the light source module 1 is formed by packaging an led bare chip 121, and in detail, each of the led units 12 includes an led bare chip 121 and a wire frame (lead frame)122, the led bare chip 121 is disposed on the wire frame 122 and electrically connected by wire bonding 123, and the wire frame 122 is disposed on the transparent conductive substrate 11 and electrically connected to the conductive layer 111 of the transparent conductive substrate 11 through an electrical connection portion 124 thereof.
The known light source module 1 has the following disadvantages: (1) according to the package of the led bare chip 121, the volume occupied by the wire support 122 and the height required for reserving the bonding wire 123 all result in that the overall thickness of the led unit 12 cannot be reduced, generally, the thickness H1 above the transparent conductive substrate 11 is mostly more than 3 mm, which is not favorable for the thinning of the light source module 1 and is also not favorable for the development of the electronic device applying the light source module 1 toward the light, thin and short directions; (2) the wire holder 12 is not a light-transmitting structure, which affects the penetrability of the light source module 1 and the light source module 1 cannot provide a double-sided light-emitting effect; (3) when the light source module 1 does not emit light, the light emitting diode units 12 arranged therein are still clearly visible, and a clean and simple visual effect cannot be provided; (4) in order to avoid the wires 123 in the led units 12 from breaking or breaking away due to the bending of the light source module 1, the transparent conductive substrate 11 can only be a rigid substrate, which will affect the flexibility of the light source module 1.
As can be seen from the above description, the known light source module has room for improvement.
Disclosure of Invention
A first objective of the present invention is to provide a light source module, and more particularly, to a light source module combining a low-impedance transparent conductive substrate and a flip-chip light emitting diode chip.
A second objective of the present invention is to provide a light source module, and more particularly, to a light source module combining a low-impedance transparent conductive substrate and a light emitting device without a wire support.
A third objective of the present invention is to provide a method for manufacturing the light source module.
In a preferred embodiment, the present invention provides a light source module, including: the transparent conductive base material comprises a transparent substrate and a transparent conductive film, and the transparent conductive film is arranged on the transparent substrate; and at least one flip-chip light emitting diode chip arranged on the transparent conductive film and electrically connected to the transparent conductive film for receiving an electric power through the transparent conductive film and outputting a light beam.
In a preferred embodiment, the present invention also provides a light source module, including: the transparent conductive base material comprises a transparent substrate and a transparent conductive film, and the transparent conductive film is arranged on the transparent substrate; and at least one light-emitting element, each light-emitting element includes an electrical connection part and does not include the wire support; each light-emitting element is arranged on the transparent conductive film, so that the electrical connection part is electrically connected with the transparent conductive film, and each light-emitting element is used for receiving electric power through the transparent conductive film and outputting a light beam.
In a preferred embodiment, any one of the at least one flip-chip led chips is a sub-millimeter led chip.
In a preferred embodiment, the transparent substrate is a glass substrate, a polyethylene terephthalate substrate or a polymethyl methacrylate substrate.
In a preferred embodiment, the transparent conductive film is a conductive film formed by an indium tin oxide, a conductive film formed by a liquid crystal polymer mixture material or a composite conductive film formed by stacking an indium tin oxide, a metal and an indium tin oxide.
In a preferred embodiment, the transparent conductive substrate is a rigid substrate or a flexible substrate.
In a preferred embodiment, the thickness of the transparent conductive substrate is not more than 0.25 mm.
In a preferred embodiment, the light source module further includes a substrate protection layer disposed on the transparent conductive substrate.
In a preferred embodiment, the light source module further includes a light emitting device protection layer disposed on the at least one flip chip led chip.
In a preferred embodiment, the present invention also provides a method for manufacturing a light source module, comprising the following steps:
(a) forming a transparent conductive film on a transparent substrate; and
(b) and arranging the at least one flip-chip light emitting diode chip on the transparent conductive film so that the at least one flip-chip light emitting diode chip is electrically connected with the transparent conductive film.
The invention has the advantages that (1) the light-emitting element does not comprise a lead support, thereby being beneficial to the thinning of the light source module and the development of an electronic device applying the light source module towards the light, thin and short directions, and (2) the light source module 2 can provide the double-sided light-emitting effect.
Drawings
Fig. 1 is a schematic view of an appearance structure of a conventional light source module when the light source module does not emit light.
Fig. 2 is a schematic cross-sectional view of the light source module shown in fig. 1.
Fig. 3 is a schematic structural diagram of an external appearance of the light source module according to a preferred embodiment of the invention when the light source module is not emitting light.
Fig. 4 is a schematic cross-sectional view of the light source module shown in fig. 3.
FIG. 5 is a schematic block flow chart illustrating a method for manufacturing a light source module according to the present invention.
Fig. 6A is a conceptual diagram of step S1 shown in fig. 5.
Fig. 6B is a conceptual diagram of step S2 shown in fig. 5.
Fig. 6C is a conceptual diagram of step S3 shown in fig. 5.
Fig. 6D is a conceptual diagram of step S4 shown in fig. 5.
Fig. 6E is a conceptual diagram of step S5 shown in fig. 5.
Fig. 6F is a conceptual diagram of step S6 shown in fig. 5.
The reference numbers are as follows:
1 light source module
2 light source module
11 transparent conductive substrate
12 light emitting diode unit
13 protective glass
14 colloid
21 transparent conductive substrate
22 light emitting element
23 protective layer of substrate
24 light emitting element protective layer
111 conductive layer
121 light emitting diode bare chip
122 wire holder
123 wire
124 electrical connection
211 transparent substrate
212 transparent conductive film
221 electric connection part
2121 Circuit pattern
2122 transparent conducting layer
H1 thickness
H2 thickness
Step S1
Step S2
Step S3
Step S4
Step S5
Step S6
Detailed Description
Embodiments of the invention will be further explained by the following in conjunction with the associated drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts. In the drawings, the shape and size may be exaggerated for simplicity and convenience. It is to be understood that elements not specifically shown in the drawings or described in the specification are in a form known to those skilled in the art. Various changes and modifications may be suggested to one skilled in the art in light of this disclosure.
Referring to fig. 3 and 4, fig. 3 is an external structural view of a light source module according to a preferred embodiment of the invention when the light source module is not emitting light, and fig. 4 is a structural cross-sectional view of the light source module shown in fig. 3. The light source module 2 includes a transparent conductive substrate 21 and a plurality of light emitting devices 22, wherein the transparent conductive substrate 21 includes a transparent substrate 211 and a transparent conductive film 212 disposed on the transparent substrate 211, and the transparent conductive film 212 has a circuit pattern 2121 for the plurality of light emitting devices 22 to be disposed thereon and electrically connected to the circuit pattern 2121. In the present invention, the transparent conductive substrate 21 can be a rigid substrate, and can also be a flexible substrate.
Furthermore, in the present invention, each light emitting element 22 is a light emitting element including the electrical connection portion 221 but not including the lead frame (lead frame), for example, the light emitting element 22 may be a Flip-Chip light emitting diode (Flip-Chip LED), and more preferably, the Flip-Chip light emitting diode (Flip-Chip LED) is a submillimeter light emitting diode (Mini LED) Chip, but not limited thereto. The light emitting device 22 is electrically connected to the circuit pattern 2121 on the transparent conductive film 212 through the electrical connection portion 221, and thus receives power through the transparent conductive film 212 to output a light beam.
Preferably, the light source module 2 further includes a substrate passivation layer 23 and a light-emitting device passivation layer 24, wherein the substrate passivation layer 23 is disposed on the transparent conductive substrate 21, and the light-emitting device passivation layer 24 is disposed on the light-emitting devices 22, so that the light-emitting devices 22 and the circuit patterns 2121 on the transparent conductive film 212 can be protected, thereby preventing scratching or oxidation. The substrate protection layer 23 and the light-emitting device protection layer 24 are transparent protection layers.
Referring to fig. 5 and fig. 6A to 6F, fig. 5 is a schematic flow chart of a preferred block of a manufacturing method of a light source module according to the present invention, and fig. 6A to 6F are schematic flow conceptual diagrams of the manufacturing method shown in fig. 5. The following describes a method for manufacturing a light source module. First, step S1 is executed to provide a transparent substrate 211, as shown in fig. 6A, and the transparent substrate 211 may be a glass substrate, a polyethylene terephthalate (PET) substrate, or a polymethyl methacrylate (PMMA) substrate, but not limited thereto.
Next, step S2 is executed to form a transparent conductive layer 2122 on the transparent substrate 211, as shown in fig. 6B, wherein the transparent conductive layer 2122 may be a conductive layer formed by Indium Tin Oxide (ITO), a conductive layer formed by liquid crystal polymer blend (PEDOT), or a composite conductive layer formed by stacking Indium Tin Oxide, metal, and Indium Tin Oxide. In addition, since the transparent conductive layer 2122 can be directly grown on the transparent substrate 211 and the transparent conductive layer 2122 can be formed by stacking different materials, the resistance of the transparent conductive substrate 21 can be reduced and the good light transmittance can be maintained.
In addition, step S3 is performed to form a circuit pattern 2121 on the transparent conductive layer 2122, which is shown in fig. 6C, so that the transparent conductive film 212 is manufactured. The circuit pattern 2121 may be formed by a semiconductor process such as a photomask, an exposure process and/or an etching process, which are well known in the art and thus will not be described herein again. Next, step S4 is executed to form a substrate protection layer 23 on the transparent conductive film 212, as shown in fig. 6D, and the substrate protection layer 23 may be made of Epoxy resin (Epoxy), polymethyl methacrylate (arcalic), Silicone (Silicone), Hybrid material (Hybrid material), etc., and is attached to the transparent conductive film 212 by coating, printing, or dispensing, which is advantageous in that the substrate protection layer 23 can protect the circuit pattern 2121 of the transparent conductive film 212 and can also increase the adhesion between the substrate protection layer 23 and the transparent conductive film 212.
In addition, step S5 is executed to dispose the light emitting element 22 on the transparent conductive film 212 so that the light emitting element 22 is electrically connected to the transparent conductive film 212, as shown in fig. 6E, and as mentioned above, the light emitting element 22 may be a Flip-Chip light emitting diode (Flip-Chip LED), and more preferably, the Flip-Chip light emitting diode is a submillimeter light emitting diode (Mini LED) Chip. Finally, step S6 is executed to form a light-emitting device protection layer 24 on the light-emitting device 22, as shown in fig. 6F, and the light-emitting device protection layer 24 may be made of Epoxy resin (Epoxy), polymethyl methacrylate (arcalic), Silicone rubber (Silicone), Hybrid material (Hybrid material), or the like, and is attached to the light-emitting device 22 by coating, printing, or dispensing.
Based on the above description, the light source module 2 of the present invention has the following advantages: (1) the light emitting element 22 does not include a lead frame (lead frame), which is advantageous for the light source module 2 to be thin, and is also advantageous for the electronic device using the light source module 2 to be light, thin, short, and small, but not limited thereto, in the light source module 2 of the present invention, the thickness H2 above the transparent conductive substrate 21 is not more than 0.25 mm; (2) the light source module 2 can provide double-sided light-emitting effect; (3) the process of cutting and routing (wire bonding) is not needed, which is beneficial to the manufacture of the light source module 2, and the flexible transparent conductive base material 21 is adopted to improve the flexibility and changeability of the light source module 2; (4) the method is suitable for large modules, such as machine members with the size of 500 mm x200 mm or more; (5) the light source is stable and uniform; (6) the light source module 2 can provide a clean and simple visual effect when not emitting light (the light emitting element 22 is not easily seen by naked eyes).
The above-mentioned embodiments are merely preferred embodiments of the present invention, which are not intended to limit the scope of the present invention, and therefore, all equivalent changes and modifications that do not depart from the spirit of the present invention are intended to be included within the scope of the present invention.
Claims (20)
1. A light source module, comprising:
the transparent conductive base material comprises a transparent substrate and a transparent conductive film, and the transparent conductive film is arranged on the transparent substrate; and
the flip-chip light-emitting diode chip is arranged on the transparent conductive film and electrically connected with the transparent conductive film, and is used for receiving electric power and outputting a light beam through the transparent conductive film.
2. The light source module of claim 1, wherein any of the at least one flip-chip LED chip is a sub-millimeter LED chip.
3. The light source module of claim 1, wherein the transparent substrate is a glass substrate, a polyethylene terephthalate substrate, or a polymethyl methacrylate substrate.
4. The light source module of claim 1, wherein the transparent conductive film is a conductive film formed by an indium tin oxide, a conductive film formed by a liquid crystal polymer mixture material, or a composite conductive film formed by stacking an indium tin oxide, a metal, and an indium tin oxide.
5. The light source module of claim 1, wherein the transparent conductive substrate is a rigid substrate or a flexible substrate.
6. The light source module of claim 1, wherein the thickness over the transparent conductive substrate is no more than 0.25 mm.
7. The light source module of claim 1, further comprising a substrate protection layer disposed on the transparent conductive substrate; and/or
The light source module further comprises a light-emitting element protection layer, and the light-emitting element protection layer is arranged on the at least one flip-chip light-emitting diode chip.
8. A light source module, comprising:
the transparent conductive base material comprises a transparent substrate and a transparent conductive film, and the transparent conductive film is arranged on the transparent substrate; and
at least one light-emitting element, each light-emitting element comprises an electrical connection part and does not comprise a lead support; each light-emitting element is arranged on the transparent conductive film, so that the electrical connection part is electrically connected with the transparent conductive film, and each light-emitting element is used for receiving electric power through the transparent conductive film and outputting a light beam.
9. The light source module of claim 8, wherein any one of the at least one light emitting device is a flip-chip light emitting diode chip.
10. The light source module of claim 8, wherein any one of the at least one light emitting element is a one-millimeter light emitting diode chip.
11. The light source module of claim 8, wherein the transparent substrate is a glass substrate, a polyethylene terephthalate substrate, or a polymethyl methacrylate substrate.
12. The light source module of claim 8, wherein the transparent conductive film is a conductive film formed by an indium tin oxide, a conductive film formed by a liquid crystal polymer mixture, or a composite conductive film formed by stacking an indium tin oxide, a metal, and an indium tin oxide.
13. The light source module of claim 8, wherein the transparent conductive substrate is a rigid substrate or a flexible substrate.
14. The light source module of claim 8, wherein the thickness over the transparent conductive substrate is no more than 0.25 mm.
15. The light source module of claim 8, further comprising a substrate protection layer disposed on the transparent conductive substrate; and/or
The light source module further comprises a light-emitting element protection layer, and the light-emitting element protection layer is arranged on the at least one flip-chip light-emitting diode chip.
16. A method of manufacturing a light source module, comprising the steps of:
(a) forming a transparent conductive film on a transparent substrate; and
(b) and arranging at least one flip-chip light emitting diode chip on the transparent conductive film so that the at least one flip-chip light emitting diode chip is electrically connected with the transparent conductive film.
17. The method of manufacturing a light source module of claim 16, wherein the step (a) comprises:
(a1) forming a transparent conductive layer on the transparent substrate; and
(a2) forming a circuit pattern on the transparent conductive layer for electrically connecting the at least one flip-chip light emitting diode chip.
18. The method of claim 17, wherein the transparent conductive layer is a conductive layer formed of an indium tin oxide, a conductive layer formed of a liquid crystal polymer mixture, or a composite conductive layer formed by stacking an indium tin oxide, a metal, and an indium tin oxide.
19. The method of claim 16, wherein any of the at least one flip-chip LED chips is a sub-millimeter LED chip.
20. The method of claim 16, wherein the transparent substrate is a glass substrate, a polyethylene terephthalate substrate, or a polymethyl methacrylate substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010934054.0A CN114156259A (en) | 2020-09-08 | 2020-09-08 | Light source module and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010934054.0A CN114156259A (en) | 2020-09-08 | 2020-09-08 | Light source module and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114156259A true CN114156259A (en) | 2022-03-08 |
Family
ID=80460585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010934054.0A Pending CN114156259A (en) | 2020-09-08 | 2020-09-08 | Light source module and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114156259A (en) |
-
2020
- 2020-09-08 CN CN202010934054.0A patent/CN114156259A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109461382B (en) | Bendable panel and manufacturing method thereof | |
| US20070018191A1 (en) | Side view LED with improved arrangement of protection device | |
| US10061965B2 (en) | Fingerprint sensing unit and fingerprint sensing module | |
| TW508843B (en) | Chip type light emitting diode and method of manufacture thereof | |
| KR20190137976A (en) | Display apparatus and electronic divice including the same | |
| US10126462B2 (en) | Proximity sensor, electronic apparatus and method for manufacturing proximity sensor | |
| KR20200032780A (en) | Electronic apparatus | |
| JP2009027166A (en) | Package sealing construction and its manufacturing method of compound semiconductor device | |
| KR20230009352A (en) | Light-emitting substrate, method for manufacturing the same, and display device | |
| JP2020003788A (en) | Flexible substrate and display device including the same | |
| KR100646569B1 (en) | Light emitting device package and method for fabricating the same | |
| CN112698528A (en) | Backlight module and display device | |
| KR20190140129A (en) | Display device | |
| TW202211726A (en) | Light source module and manufacturing method therefor | |
| JP6742000B2 (en) | Solar cell module | |
| TWI248653B (en) | Method of fabricating wafer level package | |
| US20060081833A1 (en) | Package structure of light-emitting device | |
| CN114156259A (en) | Light source module and method for manufacturing the same | |
| KR20100127623A (en) | Led package and back light unit | |
| KR20110110957A (en) | Led package | |
| US20070295970A1 (en) | Base apparatus of a light emitting diode and method for manufacturing the light emitting diode | |
| TWI540931B (en) | Organic electro-luminescent device package and fabricating method thereof | |
| CN101777542A (en) | Chip packaging structure and packaging method | |
| KR101161408B1 (en) | Light emitting diode package and manufacturing method for the same | |
| US20210327934A1 (en) | Chip packaging structure and chip packaging method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |