CN114143623A - Commercial Ethernet switch of no fan heat dissipation - Google Patents
Commercial Ethernet switch of no fan heat dissipation Download PDFInfo
- Publication number
- CN114143623A CN114143623A CN202111431323.2A CN202111431323A CN114143623A CN 114143623 A CN114143623 A CN 114143623A CN 202111431323 A CN202111431323 A CN 202111431323A CN 114143623 A CN114143623 A CN 114143623A
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- switch
- heat dissipation
- heat
- radiator
- ethernet switch
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 58
- 238000012545 processing Methods 0.000 claims description 16
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 206010040007 Sense of oppression Diseases 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/10—Exchange station construction
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/035—Cooling of active equipments, e.g. air ducts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Networks & Wireless Communication (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a commercial Ethernet switch without a fan for heat dissipation, which comprises a switch body; the switch body comprises an upper shell and a lower shell detachably connected with the upper shell, wherein the switch body also comprises a switch main board arranged on the lower shell and a radiator fixedly arranged on the switch main board; the inner surface of the upper shell is fixedly provided with a heat dissipation plate corresponding to the radiator; a first heat conduction gasket is attached to the upper surface of the radiator; the first heat conduction gasket is tightly connected with the heat dissipation plate; the inner surface of the lower shell is fixedly provided with a second heat conduction gasket corresponding to the radiator; the second heat conduction gasket is positioned at the bottom of the mainboard of the switch; the radiator, the first heat conduction gasket, the second heat conduction gasket and the radiating plate form a radiating system; the Ethernet switch conducts the heat inside the switch to the air through the fanless heat dissipation system, so that the heat of the mainboard of the switch is reduced, and the unstable system connection of the switch caused by the temperature rise is avoided; the noise is small; the service life is long.
Description
Technical Field
The invention relates to the technical field of Ethernet communication, in particular to a commercial Ethernet switch without a fan for heat dissipation.
Background
The Ethernet switch is a switch for transmitting data based on Ethernet, and the Ethernet adopts a local area network of a shared bus type transmission medium mode. The ethernet switch is configured such that each port is directly connected to the host and typically operates in full duplex mode. The switch can simultaneously connect a plurality of pairs of ports, so that each pair of mutually communicated hosts can transmit data without conflict like exclusive communication media.
With the rapid development of electronic technology, the trend of ethernet switches is as follows: 1. the functions are increased, and the power is increasingly increased; 2. the overall dimension is smaller and smaller; 3. the integration degree of various components is continuously improved, and the packaging density is high; 4. the application environment is various. The power generated by unit volume is continuously increased, and the two effective heat dissipation areas are correspondingly reduced. The most important factor affecting the lifetime of an ethernet switch is heat dissipation. In order to ensure the normal operation of the electronic equipment, a heat dissipation system must be arranged. The temperature of the components, the single plate and the whole machine is controlled through reasonable heat dissipation, and heat can be smoothly dissipated to the external environment from a heat source through the geothermal resistance channel.
The commercial Ethernet switch in life is generally applied to the general fields of enterprises, education, medical treatment and the like, and is generally used for road traffic control automation, building automatic control systems, electric power system control automation, machine room monitoring systems and the like, the existing commercial Ethernet switch adopts a fan for heat dissipation, the fan is easy to cause dust blockage, the service life of the fan is greatly influenced, and the commercial Ethernet switch is directly caused to work abnormally; fans also create noise, particularly in hospital settings, which affects hospital comfort.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a commercial ethernet switch without fan for heat dissipation, which addresses the above-mentioned drawbacks of the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows: a commercial Ethernet switch without fan for heat dissipation comprises a switch body; the switch body include the upper casing and with the lower casing of connection can be dismantled to the upper casing, wherein: the switch body also comprises a switch main board arranged on the lower shell and a radiator fixedly arranged on the switch main board; the inner surface of the upper shell is fixedly provided with a heat dissipation plate corresponding to the radiator; a first heat conduction gasket is attached to the upper surface of the radiator; the first heat conduction gasket is tightly connected with the heat dissipation plate; a second heat conduction gasket corresponding to the radiator is fixedly arranged on the inner surface of the lower shell; the second heat conduction gasket is positioned at the bottom of the switch mainboard; the radiator, the first heat conduction gasket, the second heat conduction gasket and the radiating plate form a radiating system;
the commercial Ethernet switch without the fan for heat dissipation is characterized in that the heat sink comprises a bottom plate fixedly connected with a mainboard of the switch, a cover plate parallel to the bottom plate and a heat dissipation assembly connecting the bottom plate and the cover plate; the heat dissipation assembly comprises a plurality of groups of fins which are arranged in parallel; the multiple groups of fins are arranged at equal intervals;
according to the commercial Ethernet switch without the fan for heat dissipation, an X air channel is formed between every two adjacent groups of fins; at least one heat dissipation groove is correspondingly arranged on all the fins; a Y air channel is formed in each row of heat dissipation grooves; a plurality of rows of Y air channels are arranged in the radiator;
the commercial Ethernet switch without the fan for heat dissipation is characterized in that the switch mainboard comprises a main circuit board, a central processing unit fixedly arranged on the main circuit board and a switching module arranged on one side of the main circuit board; the central processor and the switching module are electrically connected with the main circuit board;
the commercial Ethernet switch without the fan for heat dissipation is characterized in that a plurality of first through holes are dug in a bottom plate of the heat sink; a second through hole corresponding to the first through hole is dug in the switch main board; the first through hole and the second through hole are connected in a penetrating mode through a pin; the upper surface of the central processing unit is also coated with heat-conducting silica gel; when the pin is screwed down, the heat-conducting silicone grease is extruded into a gap between the central processing unit and the bottom plate of the radiator;
the commercial Ethernet switch without the fan for heat dissipation is characterized in that a power supply access port for power supply access is formed in the surface of one side of the lower shell; the power supply access port is electrically connected with the main circuit board;
the commercial Ethernet switch without the fan for heat dissipation is characterized in that a plurality of groups of horizontally arranged network port connectors are further arranged on the surface of one side of the lower shell;
according to the commercial Ethernet switch without the fan for heat dissipation, the lower shell is further provided with an indicator lamp for displaying the state of the network port connector;
the commercial Ethernet switch without the fan for heat dissipation is characterized in that a plurality of heat-dissipating third through holes are formed in the two side edges of the upper shell in an excavating mode; heat dissipation channels corresponding to the third through holes are dug in the two sides of the lower shell;
the commercial Ethernet switch without the fan for heat dissipation is characterized in that the inner surface of the lower shell is also provided with a plurality of supporting columns for supporting the upper shell; the height of the supporting column is not less than that of the radiator.
The invention has the following beneficial effects: 1. the Ethernet switch conducts the heat inside the switch to the air through the fanless heat dissipation system, so that the heat of the mainboard of the switch is reduced, and the unstable system connection of the switch caused by the temperature rise is avoided; the noise is small; the service life is long.
2. The radiator in the radiating system is arranged to be flat up and down, and the middle of the radiator is hollowed to form an X air channel and a Y air channel; not only the air circulation is smoother, but also the contact area of the heat exchange is increased; the radiating effect is good, and has reduced holistic weight, has avoided the radiator too heavy to cause the oppression to the switch mainboard, lets the system of switch more stable.
3. The switch is internally provided with a central processing unit, a switching module, a main circuit board and a power interface; the power interface is electrically connected with an external power supply, so that the signal connection, signal conversion and management functions of the Ethernet are realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
fig. 1 is a schematic structural diagram of a commercial ethernet switch without heat dissipation fan according to a preferred embodiment of the present invention;
fig. 2 is a schematic diagram of an internal structure of a commercial ethernet switch without fan for heat dissipation according to a preferred embodiment of the present invention;
fig. 3 is a schematic structural diagram of an upper housing of a commercial ethernet switch without fan for heat dissipation according to a preferred embodiment of the present invention;
FIG. 4 is a schematic diagram of a heat sink of a commercial Ethernet switch without fan for heat dissipation according to a preferred embodiment of the invention;
the reference numbers are as follows:
100-upper machine shell; 101-a heat sink; 102-a third via; 200-a lower housing;
201-power supply access port; 202-a network port connector; 203-indicator light; 204-heat dissipation channel;
205-support column; 300-a switch motherboard; 301-main circuit board; 302-a switching module;
303-a second via; 400-a heat sink; 401 — a first via; 402-a backplane; 403-cover plate;
404-fins; 405-a heat sink; 406-X wind tunnel; 407-Y duct.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
A commercial ethernet switch without fan in accordance with a preferred embodiment of the present invention, as shown in fig. 1-4, includes a switch body; the switch body includes an upper case 100 and a lower case 200 detachably connected to the upper case 100, wherein: the switch body further includes a switch main board 300 disposed on the lower case 200 and a heat sink 400 fixedly mounted on the switch main board 300; a heat dissipation plate 101 corresponding to the heat sink 400 is fixedly arranged on the inner surface of the upper case 100; a first heat conducting pad (not shown) is attached to the upper surface of the heat sink 400; the first heat-conducting pad (not shown) is tightly connected to the heat sink 101; a second heat conduction pad (not shown) corresponding to the heat sink 400 is fixedly disposed on the inner surface of the lower housing 200; a second thermal pad (not shown) is located on the bottom of the switch board 300; the heat sink 400, the first heat conductive pad (not shown), the second heat conductive pad (not shown), and the heat dissipation plate 101 constitute a heat dissipation system.
The heat dissipation plate is fixed inside the upper shell through a plurality of screws, the first heat conduction gasket is in full contact with the radiator and the upper shell, partial heat generated on the switch mainboard is discharged outwards from the upper shell, and the second heat conduction gasket is arranged on the back of the switch mainboard and conducts partial heat generated on the switch mainboard to the lower shell, so that the heat is dissipated to the air; the heat dissipation is accelerated.
The Ethernet switch conducts the heat inside the switch to the air through the fanless heat dissipation system, so that the heat of the mainboard of the switch is reduced, and the unstable system connection of the switch caused by the temperature rise is avoided; the noise is small; the service life is long.
Preferably, the heat sink 400 includes a bottom plate 402 fixedly connected to the switch motherboard 300, a cover plate 403 parallel to the bottom plate 402, and a heat dissipation assembly connecting the bottom plate 402 and the cover plate 403; the heat dissipation assembly includes a plurality of sets of fins 404 arranged in parallel; the sets of fins 404 are equidistantly spaced. An X air channel 406 is formed between two adjacent groups of fins 404; all the fins 404 are correspondingly provided with at least one heat dissipation groove 405; a Y air channel 407 is formed in each row of heat dissipation grooves 405; multiple rows of Y-ducts 407 are provided in the heat sink 400.
The radiator in the radiating system is arranged to be flat up and down, and the middle of the radiator is hollowed to form an X air channel and a Y air channel; not only the air circulation is smoother, but also the contact area of the heat exchange is increased; the radiating effect is good, and has reduced holistic weight, has avoided the radiator too heavy to cause the oppression to the switch mainboard, lets the system of switch more stable.
Preferably, the switch board 300 includes a main circuit board 301, a central processing unit (not shown) fixedly mounted on the main circuit board 301, and a switch module 302 disposed on one side of the main circuit board 301; the central processing unit (not shown) and the switch module 302 are electrically connected to the main circuit board 301.
It is worth mentioning that: the model of the central processing unit is FM3322, which is the prior art.
The switch is internally provided with a central processing unit, a switching module, a main circuit board and a power interface; the power interface is electrically connected with an external power supply, so that the signal connection, signal conversion and management functions of the Ethernet are realized.
Preferably, a plurality of first through holes 401 are dug in the bottom plate 402 of the heat sink 400; a second through hole 303 corresponding to the first through hole 401 is dug in the switch main board 300; the first through hole 401 and the second through hole 303 are connected through a pin (not shown); the upper surface of the central processing unit (not shown) is coated with heat-conducting silica gel; when the pins (not shown) are tightened, the heat conductive silicone grease is squeezed into the gap between the cpu (not shown) and the bottom plate 402 of the heat sink 400; the radiator is fully contacted with the central processing unit through the heat-conducting silicone grease, and the heat on the central processing unit is conducted to the radiator, so that the junction temperature of the central processing unit is reduced.
Preferably, a power supply inlet 201 for a power supply to be connected is formed on one side surface of the lower housing 200; the power inlet 201 is electrically connected to the main circuit board 301.
Preferably, a plurality of sets of horizontally arranged network connectors 202 are further provided on a side surface of the lower housing 200; the port connector 202 is an RJ45 port interface, and the RJ45 port interface is conventional and will not be described herein.
Preferably, an indicator lamp 203 for displaying the state of the network port connector 202 is further installed on the lower housing 200.
Preferably, a plurality of heat-dissipating third through holes 102 are dug in both side edges of the upper housing 100; heat dissipation channels 204 corresponding to the third through holes 102 are dug at two sides of the lower shell 200;
preferably, the inner surface of the lower case 200 is further provided with a plurality of support columns 205 supporting the upper case 100; the height of the support posts 205 is not less than the height of the heat spreader 400; the structure is stable; the heat can be dissipated quickly.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. A commercial Ethernet switch without fan for heat dissipation comprises a switch body; the switch body include the upper casing and with the lower casing of connection can be dismantled to the upper casing, its characterized in that: the switch body also comprises a switch main board arranged on the lower shell and a radiator fixedly arranged on the switch main board; the inner surface of the upper shell is fixedly provided with a heat dissipation plate corresponding to the radiator; a first heat conduction gasket is attached to the upper surface of the radiator; the first heat conduction gasket is tightly connected with the heat dissipation plate; a second heat conduction gasket corresponding to the radiator is fixedly arranged on the inner surface of the lower shell; the second heat conduction gasket is positioned at the bottom of the switch mainboard; the radiator, the first heat conduction gasket, the second heat conduction gasket and the radiating plate form a radiating system.
2. The fanless commercial ethernet switch according to claim 1, wherein said heat sink comprises a bottom plate fixedly connected to said switch motherboard, a cover plate parallel to said bottom plate, and a heat sink assembly connecting said bottom plate and said cover plate; the heat dissipation assembly comprises a plurality of groups of fins which are arranged in parallel; the multiple groups of fins are arranged at equal intervals.
3. The commercial ethernet switch without fan for heat dissipation according to claim 2, wherein an X-shaped air channel is formed between two adjacent sets of the fins; at least one heat dissipation groove is correspondingly arranged on all the fins; a Y air channel is formed in each row of heat dissipation grooves; and a plurality of rows of Y air channels are arranged in the radiator.
4. The commercial ethernet switch without fan heat dissipation according to any of claims 1 to 3, wherein the switch motherboard comprises a main circuit board, a central processing unit fixedly mounted on the main circuit board, and a switching module disposed on one side of the main circuit board; the central processing unit and the switching module are electrically connected with the main circuit board.
5. The fanless heat-dissipating commercial ethernet switch according to claim 4, wherein a plurality of first through holes are dug in a bottom plate of the heat sink; a second through hole corresponding to the first through hole is dug in the switch main board; the first through hole and the second through hole are connected in a penetrating mode through a pin; the upper surface of the central processing unit is also coated with heat-conducting silica gel; and when the pin is screwed down, the heat-conducting silicone grease is extruded into a gap between the central processing unit and the bottom plate of the radiator.
6. The commercial ethernet switch without fan heat dissipation according to claim 5, wherein a power inlet for receiving a power is formed on a surface of one side of the lower housing; the power supply access port is electrically connected with the main circuit board.
7. The fanless commercial ethernet switch according to claim 6, wherein said lower housing is further provided at one side surface thereof with a plurality of sets of horizontally arranged network connectors.
8. The fanless commercial ethernet switch according to claim 7, wherein said lower housing further comprises an indicator light for indicating the status of the network port connector.
9. The fanless heat dissipation commercial ethernet switch according to any of claims 1-3 and 5-8, wherein a plurality of third through holes for heat dissipation are dug on two side edges of said upper housing; and heat dissipation channels corresponding to the third through holes are dug in the two sides of the lower shell.
10. The fanless commercial ethernet switch according to claim 9, wherein the inner surface of said lower housing further comprises a plurality of support posts for supporting said upper housing; the height of the supporting column is not less than that of the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111431323.2A CN114143623A (en) | 2021-11-29 | 2021-11-29 | Commercial Ethernet switch of no fan heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111431323.2A CN114143623A (en) | 2021-11-29 | 2021-11-29 | Commercial Ethernet switch of no fan heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114143623A true CN114143623A (en) | 2022-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111431323.2A Pending CN114143623A (en) | 2021-11-29 | 2021-11-29 | Commercial Ethernet switch of no fan heat dissipation |
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| Country | Link |
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| CN (1) | CN114143623A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114640899A (en) * | 2022-05-12 | 2022-06-17 | 四川三思德科技有限公司 | Edge box based on Internet of things |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201340586Y (en) * | 2009-01-08 | 2009-11-04 | 方正科技集团苏州制造有限公司 | Heat radiating device of low-noise small-sized computer |
| CN204906427U (en) * | 2015-09-08 | 2015-12-23 | 安徽欧迈特数字技术有限责任公司 | High -efficient heat dissipation switch |
| CN207678176U (en) * | 2017-12-25 | 2018-07-31 | 大族激光科技产业集团股份有限公司 | A kind of radiator structure part and built-in industrial control machine |
| CN211349211U (en) * | 2019-12-31 | 2020-08-25 | 深圳市迈拓诚悦科技有限公司 | Fan-free industrial computer |
| CN212749757U (en) * | 2020-09-01 | 2021-03-19 | 北京乐研科技有限公司 | Network equipment |
-
2021
- 2021-11-29 CN CN202111431323.2A patent/CN114143623A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201340586Y (en) * | 2009-01-08 | 2009-11-04 | 方正科技集团苏州制造有限公司 | Heat radiating device of low-noise small-sized computer |
| CN204906427U (en) * | 2015-09-08 | 2015-12-23 | 安徽欧迈特数字技术有限责任公司 | High -efficient heat dissipation switch |
| CN207678176U (en) * | 2017-12-25 | 2018-07-31 | 大族激光科技产业集团股份有限公司 | A kind of radiator structure part and built-in industrial control machine |
| CN211349211U (en) * | 2019-12-31 | 2020-08-25 | 深圳市迈拓诚悦科技有限公司 | Fan-free industrial computer |
| CN212749757U (en) * | 2020-09-01 | 2021-03-19 | 北京乐研科技有限公司 | Network equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114640899A (en) * | 2022-05-12 | 2022-06-17 | 四川三思德科技有限公司 | Edge box based on Internet of things |
| CN114640899B (en) * | 2022-05-12 | 2022-07-22 | 四川三思德科技有限公司 | Edge box based on Internet of things |
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Application publication date: 20220304 |
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