CN114131799A - A cardboard device for epoxy plastic mold makes - Google Patents
A cardboard device for epoxy plastic mold makes Download PDFInfo
- Publication number
- CN114131799A CN114131799A CN202111427521.1A CN202111427521A CN114131799A CN 114131799 A CN114131799 A CN 114131799A CN 202111427521 A CN202111427521 A CN 202111427521A CN 114131799 A CN114131799 A CN 114131799A
- Authority
- CN
- China
- Prior art keywords
- clamping plate
- shape
- die body
- cardboard
- clip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004593 Epoxy Substances 0.000 title claims abstract description 19
- 239000004033 plastic Substances 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000006260 foam Substances 0.000 description 7
- 239000002131 composite material Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/08—Blades for rotors, stators, fans, turbines or the like, e.g. screw propellers
- B29L2031/082—Blades, e.g. for helicopters
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The invention provides a clamping plate device for manufacturing an epoxy plastic mold, which comprises: the first clamping plate is used for controlling the section shape of the die body in the length direction; the second clamping plate is used for controlling the cross section shape of the die body in the width direction; wherein the first card is different from the second card; under the same height datum line, processing the longitudinal shape of the die body by using the first clamping plate, and processing the transverse shape of the die body by using the second clamping plate based on the position datum lines on the first clamping plate and the second clamping plate; the invention can realize the accurate processing of the helicopter blade epoxy plastic mold, and has the advantages of low production cost, high efficiency and simple operation.
Description
Technical Field
The application belongs to the technical field of epoxy plastic mold processing, especially, relates to a cardboard device for epoxy plastic mold makes.
Background
The composite material blade of the helicopter is composed of high-strength foam, a complete pair of composite material blade foam is formed by splicing a plurality of small foams with different shapes, the size of the blade splicing foam reaches 8-9 m at most, the splicing precision is +/-0.3 mm, and if a blade foam splicing mould is directly processed in a numerical control mode.
For the processing of the small-size foam splicing epoxy plastic mold, on one hand, the processing cost is high, and the time consumption is long; on the other hand, a large amount of dust is generated when the epoxy plastic mold is processed in a numerical control mode, the dust contains a large amount of aluminum powder and other metals, great loss is caused to numerical control equipment for a long time, production cost is increased, and the existing numerical control equipment cannot meet processing requirements for manufacturing large-size foam splicing epoxy resin molds.
Disclosure of Invention
In view of the above technical problems, the present invention provides a clamping device for manufacturing an epoxy plastic mold, the clamping device comprising:
the first clamping plate is used for controlling the section shape of the die body in the length direction;
the second clamping plate is used for controlling the cross section shape of the die body in the width direction; wherein the first card is different from the second card;
and under the same height datum line, processing the longitudinal shape of the die body by using the first clamping plate, and processing the transverse shape of the die body by using the second clamping plate based on the position datum lines on the first clamping plate and the second clamping plate.
Preferably, the first card includes:
the first working edge has the same shape as the cross section of the theoretical shape of the die body in the length direction;
the first height reference line is used for ensuring that the clamping plate devices are at the same height;
and the first position reference line is used for determining the processing position of the second clamping plate.
Preferably, the distance between the first position reference lines is 200-300 mm.
Preferably, the first clamping plate is arranged at an abrupt change of the shape of the die body.
Preferably, the second card includes:
the second working edge has the same shape as the cross section of the theoretical shape of the die body in the width direction;
the second height reference line is used for ensuring that the clamping plate devices are at the same height;
and the second position datum line is used for determining the machining position of the first clamping plate.
Preferably, the distance between the second position reference lines is 200-300 mm.
Preferably, the second clamping plate is arranged at the position of the abrupt change of the shape of the die body.
Preferably, the first catch plate and the second catch plate are made of stainless steel.
The invention has the technical effects that:
the invention can realize the accurate processing of the helicopter blade epoxy plastic mold, and has the advantages of low production cost, high efficiency and simple operation.
Drawings
FIG. 1 is a diagram illustrating an operating state of a card device according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view of a card device provided in an embodiment of the present application;
the device comprises a die body 1, a first clamping plate 2, a first working edge 2-1, a first height datum line 2-2, a first position datum line 2-3, a second clamping plate 3, a second height datum line 3-1, a second working edge 3-2 and a second position datum line 3-3.
Detailed Description
Referring to fig. 1-2, the present invention provides a clamping apparatus for manufacturing an epoxy plastic mold, the clamping apparatus comprising: the first clamping plate 2 is used for controlling the section shape of the die body in the length direction; the second clamping plate 3 is used for controlling the cross section shape of the die body in the width direction; the first clamping plate is different from the second clamping plate;
and under the same height datum line, the longitudinal shape of the die body 1 is processed by using the first clamping plate, and the transverse shape of the die body is processed by using the second clamping plate based on the position datum lines on the first clamping plate and the second clamping plate.
In an embodiment of the present application, the first card includes: the first working edge 2-1 has the same shape as the cross section of the theoretical shape of the die body in the length direction; a first height reference line 2-2 for ensuring that the card means are at the same height; and the first position reference line 2-3 is used for determining the processing position of the second clamping plate.
In the embodiment of the present application, the distance between the first position reference lines is 200-300 mm. The first clamping plate is arranged at the position of the abrupt change of the appearance of the die body.
In an embodiment of the present application, the second card includes: the second working edge 3-2 has the same shape as the cross section of the theoretical shape of the die body in the width direction; a second height reference line 3-1 for ensuring that the card devices are at the same height; and the second position reference line 3-3 is used for determining the machining position of the first clamping plate.
Wherein, the distance between the second position datum lines is 200-300 mm. The second cardboard sets up in die body appearance abrupt change department.
The invention belongs to the field of processing of epoxy plastic molds, and is suitable for processing and manufacturing the epoxy plastic molds in the non-numerical control field. Wherein, the first cardboard and the second cardboard are made of stainless steel.
In other embodiments of the present application. The invention provides a clamping plate device for manufacturing an epoxy plastic mold, which comprises a mold body 1, a first clamping plate and a second clamping plate.
The shape of the working edge of the clamping plate on the first clamping plate is consistent with the shape of the cross section of the die body at the position of the second clamping plate, and the shape of the working edge of the clamping plate on the second clamping plate is consistent with the shape of the cross section of the die body at the position of the second clamping plate. The cardboard datum line on the first cardboard and the cardboard datum line on the second cardboard are used for controlling the use height of first cardboard and second cardboard, and in the same set of mould manufacturing, the use height of cardboard datum line and cardboard datum line is unanimous.
Wherein, cardboard datum line on the cardboard on the first cardboard and the cardboard datum line on the second cardboard mutually support and confirm the vertical and horizontal position of first cardboard and second cardboard, and the position of cardboard datum line on the first cardboard is exactly the service position of second cardboard promptly, and the position of cardboard datum line on the second cardboard is exactly the service position of first cardboard.
In the mould manufacturing, first cardboard and second cardboard all have the polylith to constitute. In the smooth change region of mould profile, the interval of the first cardboard of polylith can be taken 200 ~ 300mm, preferred 200mm, and the interval of polylith second cardboard can be taken 200 ~ 300mm, preferred 200 mm.
At the position where the mold surface has sudden change, a first clamping plate or a second clamping plate is required to control the mold surface.
In other embodiments of the present application, the material of the first card and the second card is 20# - δ 1.5 or 0Cr18Ni9- δ 1.2, preferably 0Cr18Ni9- δ 1.2 stainless steel plate.
The first clamping plate and the second clamping plate are machined by a laser cutting method, and the tolerance of the working edge of the clamping plate on the first clamping plate and the working edge of the clamping plate on the second clamping plate is +/-0.05 mm.
Referring to the attached fig. 1-2, the present invention is further illustrated in connection with an example of a clamping plate device for manufacturing epoxy plastic mold.
In a possible implementation manner, the clamping plate device comprises a mold body, a first clamping plate and a second clamping plate. The cardboard work limit shape on the first cardboard 2 is unanimous with 1 cross sectional shape of die body of first cardboard 2 position, and cardboard work limit shape on the second cardboard 3 is unanimous with 1 cross sectional shape of die body of second cardboard 3 position. The cardboard datum line on the first cardboard 2 and the cardboard datum line on the second cardboard 3 are used for controlling the use height of first cardboard 2 and second cardboard 3, and in same set of mould manufacturing, the use height of cardboard datum line 2-2 and cardboard datum line 3-1 is unanimous.
Wherein, cardboard datum line 2-3 on the first cardboard 2 and the cardboard datum line 3-3 on the second cardboard 3 mutually support and confirm the vertical and horizontal position of first cardboard 2 and second cardboard 3, and cardboard datum line 2-3's on the first cardboard 2 position is exactly the position of use of second cardboard 3 promptly, and cardboard datum line 3-3's on the second cardboard 3 position is exactly the position of use of first cardboard 2.
The invention can realize the accurate processing of the helicopter blade epoxy plastic mold, and has the advantages of low production cost, high efficiency and simple operation.
Claims (8)
1. A card device for manufacturing an epoxy plastic mold, the card device comprising:
the first clamping plate is used for controlling the section shape of the die body in the length direction;
the second clamping plate is used for controlling the cross section shape of the die body in the width direction; wherein the first card is different from the second card;
and under the same height datum line, processing the longitudinal shape of the die body by using the first clamping plate, and processing the transverse shape of the die body by using the second clamping plate based on the position datum lines on the first clamping plate and the second clamping plate.
2. The clip assembly of claim 1, wherein the first clip comprises:
the first working edge has the same shape as the cross section of the theoretical shape of the die body in the length direction;
the first height reference line is used for ensuring that the clamping plate devices are at the same height;
and the first position reference line is used for determining the processing position of the second clamping plate.
3. The clip apparatus for epoxy mold manufacturing as claimed in claim 2, wherein the distance between the first position reference lines is 200mm and 300 mm.
4. The clip apparatus of claim 3, wherein the first clip is disposed at an abrupt change in the shape of the mold body.
5. The clip assembly of claim 1, wherein the second clip comprises:
the second working edge has the same shape as the cross section of the theoretical shape of the die body in the width direction;
the second height reference line is used for ensuring that the clamping plate devices are at the same height;
and the second position datum line is used for determining the machining position of the first clamping plate.
6. The clip apparatus for epoxy mold manufacturing of claim 5, wherein the distance between the reference lines of the second position is 200mm and 300 mm.
7. The clip apparatus of claim 6, wherein the second clip is disposed at an abrupt change in the shape of the mold body.
8. The clip assembly of claim 1, wherein the first clip and the second clip are made of a stainless steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111427521.1A CN114131799A (en) | 2021-11-26 | 2021-11-26 | A cardboard device for epoxy plastic mold makes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111427521.1A CN114131799A (en) | 2021-11-26 | 2021-11-26 | A cardboard device for epoxy plastic mold makes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114131799A true CN114131799A (en) | 2022-03-04 |
Family
ID=80388382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111427521.1A Pending CN114131799A (en) | 2021-11-26 | 2021-11-26 | A cardboard device for epoxy plastic mold makes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114131799A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108215248A (en) * | 2017-12-14 | 2018-06-29 | 中航复合材料有限责任公司 | A kind of positioning of Varying-thickness precast body and the device and method of Thickness sensitivity |
| CN111805815A (en) * | 2020-08-03 | 2020-10-23 | 广东工业大学 | University student's equation motorcycle race seat mould |
-
2021
- 2021-11-26 CN CN202111427521.1A patent/CN114131799A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108215248A (en) * | 2017-12-14 | 2018-06-29 | 中航复合材料有限责任公司 | A kind of positioning of Varying-thickness precast body and the device and method of Thickness sensitivity |
| CN111805815A (en) * | 2020-08-03 | 2020-10-23 | 广东工业大学 | University student's equation motorcycle race seat mould |
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