CN114126230B - Compatible wiring method and related device of PCB - Google Patents

Compatible wiring method and related device of PCB Download PDF

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Publication number
CN114126230B
CN114126230B CN202111424690.XA CN202111424690A CN114126230B CN 114126230 B CN114126230 B CN 114126230B CN 202111424690 A CN202111424690 A CN 202111424690A CN 114126230 B CN114126230 B CN 114126230B
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resistance
bonding pad
functional module
capacitance devices
interface
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CN114126230A (en
Inventor
荣世立
李岩
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Inspur Electronic Information Industry Co Ltd
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Inspur Electronic Information Industry Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The application discloses a compatible wiring method of a PCB board, comprising the following steps: setting four bonding pads; connecting an input end and an output end of the functional module with a bonding pad respectively; connecting an interface of the target controller with the connector with a bonding pad respectively; when the functional module is used, M resistance-capacitance devices are connected with the bonding pads, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel; when the functional module is not used, the N resistance-capacitance devices are connected with the bonding pads, so that the interface, the N resistance-capacitance devices and the connector form a signal transmission channel; wherein each anti-capacitor piece is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M. The method can save the space of the board card and reduce the impedance discontinuity effect brought by the impedance container. The application also discloses a compatible wiring device, equipment and computer readable storage medium of the PCB, which have the technical effects.

Description

Compatible wiring method and related device of PCB
Technical Field
The application relates to the technical field of PCB (Printed Circuit Board ) boards, in particular to a compatible wiring method of a PCB board; also relates to a compatible wiring device, equipment and computer readable storage medium of the PCB board.
Background
As system configurations become more and more diverse, various functional modules are often reserved on the motherboard to meet various demands of the system. For example, for SATA links, some clients need to encrypt signals, and some clients do not. Therefore, two functional modules, namely encryption and non-encryption, are reserved on the main board at the same time. As shown in fig. 1, configuration a is not an encryption module, and configuration B is an encryption module (signals will pass through the encryption chip). However, the above design increases the design cost of the motherboard and occupies more board space and chip resources. Thereby limiting the motherboard design.
In order to reduce the design cost of the motherboard and save the space of the motherboard and the chip resources, a Compatible-Layout scheme as shown in fig. 2 exists at present. When the customer needs to configure A, placing the resistor components R0 and R1 according to the left diagram in FIG. 2; when the customer needs configuration B, the resistive elements R1 and R1 are placed according to the right diagram in fig. 2. The signal flow in the different configurations is shown in dashed lines in fig. 2. Although the scheme shown in fig. 2 can reduce the occupation of the interface, only one connector is used, so that the space of the board card and the chip resources are saved to a certain extent, the required resistance-capacitance devices and the number of the bonding pads are more, and the larger space of the board card can be occupied. At the same time, for some high speed signals, adding a resistive device introduces additional impedance discontinuities that affect signal quality.
Therefore, how to save the space of the board and reduce the impedance discontinuity effect caused by the resistive device has become a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The purpose of the application is to provide a compatible wiring method of a PCB, which can save the space of a board card and reduce the impedance discontinuous effect brought by a resistor-capacitor part. Another object of the present application is to provide a compatible wiring device, apparatus and computer readable storage medium of a PCB board, which have the above technical effects.
In order to solve the technical problem, the application provides a compatible wiring method of a PCB board, including:
setting four bonding pads;
connecting the input end and the output end of the functional module with one bonding pad respectively; the input end of the functional module is different from the bonding pad connected with the output end;
connecting an interface of the target controller with the connector with one bonding pad respectively; the interface is different from the bonding pad connected with the connector;
when the functional module is used, M resistance-capacitance devices are connected with the bonding pads, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel;
when the functional module is not used, connecting N resistance-capacitance devices with the bonding pads, so that the interface, the N resistance-capacitance devices and the connector form a signal transmission channel;
wherein each resistor-capacitor part is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M.
Optionally, the connecting M number of the resistance-capacitance devices to the pad includes:
connecting the two resistance-capacitance devices with the bonding pads;
correspondingly, the connecting the N resistance-capacitance devices with the bonding pad includes:
and connecting one of the resistance-capacitance devices with the bonding pad.
Optionally, the connecting M number of the resistance-capacitance devices to the pad includes:
connecting one of the resistance-capacitance devices with the bonding pad;
correspondingly, the connecting the N resistance-capacitance devices with the bonding pad includes:
and connecting the two resistance-capacitance devices with the bonding pads.
Optionally, the resistance-capacitance device is a resistor.
Optionally, the functional module includes a single functional chip.
For solving above-mentioned technical problem, this application still provides a compatible wiring arrangement of PCB board, includes:
a setting unit for setting four pads;
the first connecting unit is used for connecting the input end and the output end of the functional module with one bonding pad respectively; the input end of the functional module is different from the bonding pad connected with the output end;
the second connection unit is used for respectively connecting one interface of the target controller with one bonding pad of the connector; the interface is different from the bonding pad connected with the connector;
the third connection unit is used for connecting M resistance-capacitance devices with the bonding pads when the functional module is used, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel;
a fourth connection unit, configured to connect the N resistance-capacitance devices with the pads when the functional module is not used, so that the interface, the N resistance-capacitance devices, and the connector form a signal transmission channel;
wherein each resistor-capacitor part is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M.
Optionally, the third connection unit is specifically configured to: connecting the two resistance-capacitance devices with the bonding pads;
correspondingly, the fourth connection unit is specifically configured to: and connecting one of the resistance-capacitance devices with the bonding pad.
Optionally, the third connection unit is specifically configured to: connecting one of the resistance-capacitance devices with the bonding pad;
correspondingly, the fourth connection unit is specifically configured to: and connecting the two resistance-capacitance devices with the bonding pads.
For solving the technical problem, the application also provides a compatible wiring device of a PCB board, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the compatible routing method of a PCB board as described in any one of the above when executing the computer program.
To solve the above technical problem, the present application further provides a computer readable storage medium, on which a computer program is stored, which when executed by a processor, implements the steps of the method for wiring a PCB board compatible with any one of the above.
The compatible wiring method of the PCB provided by the application comprises the following steps: setting four bonding pads; connecting the input end and the output end of the functional module with one bonding pad respectively; the input end of the functional module is different from the bonding pad connected with the output end; connecting an interface of the target controller with the connector with one bonding pad respectively; the interface is different from the bonding pad connected with the connector; when the functional module is used, M resistance-capacitance devices are connected with the bonding pads, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel; when the functional module is not used, connecting N resistance-capacitance devices with the bonding pads, so that the interface, the N resistance-capacitance devices and the connector form a signal transmission channel; wherein each resistor-capacitor part is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M.
Therefore, the compatible wiring method of the PCB provided by the application is provided with four bonding pads, compared with six bonding pads in the prior art, the number of the bonding pads is reduced, and the space of a board is saved. In addition, under different functional demands, the number of required resistance-capacitance components is at most two, and is at least one, and compared with the prior art scheme which needs at least two resistance-capacitance components, the number of the resistance-capacitance components is reduced, and signals can only pass through one resistance-capacitance component at least, so that the impedance discontinuous effect brought by the resistance-capacitance components can be reduced, and the reliability of the system is improved.
The compatible wiring device, the equipment and the computer readable storage medium of the PCB have the technical effects.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly explain the drawings needed in the prior art and embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a conventional motherboard design;
FIG. 2 is a schematic diagram of a compatible wiring of a conventional PCB;
fig. 3 is a schematic flow chart of a method for wiring compatible with a PCB board according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a higher order colay according to an embodiment of the present application;
fig. 5 is a schematic diagram of compatible wiring of a first PCB board according to an embodiment of the present disclosure;
fig. 6 is a schematic diagram of compatible wiring of a second PCB board according to an embodiment of the present disclosure;
FIG. 7 is a schematic diagram of a third PCB compatible routing provided in an embodiment of the present application;
fig. 8 is a schematic diagram of a compatible wiring device of a PCB according to an embodiment of the present disclosure;
fig. 9 is a schematic diagram of a compatible wiring device of a PCB board according to an embodiment of the present application.
Detailed Description
The core of the application is to provide a compatible wiring method of a PCB, which can save the space of a board card and reduce the impedance discontinuous effect brought by a resistor-capacitor part. Another core of the present application is to provide a compatible wiring device, device and computer readable storage medium of a PCB board, which all have the above technical effects.
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 3, fig. 3 is a flow chart of a method for compatible wiring of a PCB board according to an embodiment of the present application, and referring to fig. 1, the method mainly includes:
s101: setting four bonding pads;
s102: connecting an input end and an output end of the functional module with a bonding pad respectively; the input end of the functional module is different from the bonding pad connected with the output end;
s103: connecting an interface of the target controller with the connector with a bonding pad respectively; the interface is different from the bonding pad connected with the connector;
s104: when the functional module is used, M resistance-capacitance devices are connected with the bonding pads, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel;
s105: when the functional module is not used, the N resistance-capacitance devices are connected with the bonding pads, so that the interface, the N resistance-capacitance devices and the connector form a signal transmission channel;
wherein each anti-capacitor piece is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M.
Specifically, referring to fig. 4, the compatible wiring method provided in the present application adopts a scheme of high-order compatible wiring, four PADs (PAD in fig. 4 represents a PAD) are provided, and any two adjacent PADs can be connected to a resistive-capacitive device. Four pads can implement the colay design of three resistance-capacitance devices. The upper two bonding pads can be selected to be connected with one resistance-capacitance device R0, and the lower two bonding pads can be selected to be connected with one resistance-capacitance device R2; or selecting the middle two bonding pads to be connected with one resistance-capacitance device R1.
Based on the high-order compatible wiring scheme, on the basis of setting four bonding pads, the input end and the output end of the functional module are respectively connected with one bonding pad. When the four bonding pads are sequentially arranged from top to bottom, the input end of the functional module can be connected with the uppermost bonding pad, and the output end of the functional module is connected with the lowermost bonding pad. Connecting an interface of the target controller with the connector with a bonding pad respectively; wherein the interface is different from the pad to which the connector is connected. When the interface and the bonding pad connected with the connector are in accordance with different functional requirements, the number of the resistance-capacitance devices is determined adaptively, and the requirements can be met:
when the functional module is needed, M resistance-capacitance devices are connected with the bonding pads, each resistance-capacitance device is connected with two adjacent bonding pads, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel, and at the moment, signals flowing in the interface can pass through the functional module.
When the function module is not needed, N resistance-capacitance devices are connected with the bonding pads, each resistance-capacitance device is connected with two adjacent bonding pads, so that the interface, the N resistance-capacitance devices and the connector form a signal transmission channel, and at the moment, signals flowing in the interface cannot pass through the function module.
M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M. Thus, no matter when the functional module is required to be used or when the functional module is not required to be used, the number of the resistance container parts is at most two, and at least one.
Wherein the resistive-capacitive device may be a resistor and the functional module may comprise a single functional chip, e.g. a single cryptographic chip.
On the basis of the above embodiment, as a specific implementation manner, connecting M resistance-capacitance devices to the pad includes: connecting the two resistance-capacitance devices with the bonding pad; correspondingly, connecting the N resistance-capacitance devices with the bonding pad comprises: a resistive-capacitive device is connected to the pad.
Specifically, referring to fig. 5, four pads are sequentially denoted as a first pad, a second pad, a third pad, and a fourth pad from top to bottom. Taking the target controller as a SATA controller, taking the function module as an encryption chip as an example, port1 of the SATA controller is connected with the second bonding pad, and the connector is connected with the third bonding pad. The input end of the encryption chip is connected with the first bonding pad, and the output end of the encryption chip is connected with the fourth bonding pad.
When the encryption chip is needed, the resistor-capacitor element R0 is connected with the first pad and the second pad, and the resistor-capacitor element R1 is connected with the third pad and the fourth pad, and at this time, as shown in the left diagram in fig. 5, the signal flow direction is port1, the resistor-capacitor element R0, the encryption chip, the resistor-capacitor element R1 and the connector, namely port1, the resistor-capacitor element R0, the encryption chip, the resistor-capacitor element R1 and the connector, in sequence, form a signal transmission channel.
When the encryption chip is not needed, the resistor-capacitor element R2 is connected with the second bonding pad and the third bonding pad, and at the moment, the signal flow direction is as shown in the right diagram of fig. 5, and a signal transmission channel is formed by the port1, the resistor-capacitor element R2 and the connector, namely the port1, the resistor-capacitor element R2 and the connector in sequence.
Therefore, in this embodiment, only one interface of the SATA controller is occupied, only one connector is used, and only one resistor-capacitor element is needed when the encryption chip is not needed, and at this time, the signal only passes through one resistor-capacitor element, thereby not only saving the space occupied by the board card, but also reducing the impedance discontinuity effect caused by the resistor-capacitor element.
On the basis of the above embodiment, as a specific implementation manner, on the basis of the above embodiment, in a specific implementation manner, connecting M resistance-capacitance devices with the pads includes: connecting a resistance-capacitance device with the bonding pad; correspondingly, connecting the N resistance-capacitance devices with the bonding pad comprises: two resistive-capacitive devices are connected to the pads.
Specifically, referring to fig. 6, four pads are sequentially denoted as a first pad, a second pad, a third pad, and a fourth pad from top to bottom. Taking the target controller as a SATA controller and the functional module as an encryption chip as an example, port1 of the SATA controller is connected with the second bonding pad, and the connector is connected with the fourth bonding pad. The input end of the encryption chip is connected with the first bonding pad, and the output end of the encryption chip is connected with the fourth bonding pad.
When the encryption chip is needed, the resistor-capacitor element R0 is connected with the first bonding pad and the second bonding pad, and at this time, as shown in the left diagram in fig. 6, the signal flow direction is port1, the resistor-capacitor element R0, the encryption chip and the connector in sequence, that is, the port1, the resistor-capacitor element R0, the encryption chip and the connector form a signal transmission channel.
When the encryption chip is not needed, the resistor-capacitor element R1 is connected with the second pad and the third pad, and the resistor-capacitor element R2 is connected with the third pad and the fourth pad, and at this time, the signal flow direction is as shown in the right diagram of fig. 6, and a signal transmission channel is formed by the port1, the resistor-capacitor element R2 and the connector, namely the port1, the resistor-capacitor element R2 and the connector in sequence.
Therefore, in this embodiment, only one interface of the SATA controller is occupied, only one connector is used, and only one resistor-capacitor element is needed when the encryption chip is needed, and at this time, the signal passes through only one resistor-capacitor element, so that not only is the space occupied by the board card saved, but also the impedance discontinuity effect caused by the resistor-capacitor element is reduced.
Alternatively, referring to fig. 7, four pads are sequentially designated as a first pad, a second pad, a third pad, and a fourth pad from top to bottom. Taking the target controller as a SATA controller, the functional module as an encryption chip as an example, port1 of the SATA controller is connected with the first bonding pad, and the connector is connected with the third bonding pad. The input end of the encryption chip is connected with the first bonding pad, and the output end of the encryption chip is connected with the fourth bonding pad.
When the encryption chip is needed, the resistor-capacitor element R0 is connected with the third pad and the fourth pad, and at this time, as shown in the left diagram in fig. 7, the signal flow direction is port1, the resistor-capacitor element R0, the encryption chip and the connector in sequence, that is, the port1, the resistor-capacitor element R0, the encryption chip and the connector form a signal transmission channel.
When the encryption chip is not needed, the resistor-capacitor element R1 is connected with the first pad and the second pad, the resistor-capacitor element R2 is connected with the second pad and the third pad, and at this time, as shown in the right diagram of fig. 6, the signal flow direction is port1, the resistor-capacitor element R2 and the connector, namely, the port1, the resistor-capacitor element R2 and the connector form a signal transmission channel.
Also, in the embodiment shown in FIG. 7, only one interface of the SATA controller is occupied, only one connector is used, and only one container blocking member is needed when the encryption chip is needed.
In summary, according to the compatible wiring method for the PCB provided by the application, four bonding pads are arranged, compared with six bonding pads in the prior art, the number of the bonding pads is reduced, and the space of a board is saved. In addition, under different functional demands, the number of required resistance-capacitance components is at most two, and is at least one, and compared with the prior art scheme which needs at least two resistance-capacitance components, the number of the resistance-capacitance components is reduced, and signals can only pass through one resistance-capacitance component at least, so that the impedance discontinuous effect brought by the resistance-capacitance components can be reduced, and the reliability of the system is improved.
The application also provides a compatible wiring device of the PCB, and the device can be referred to correspondingly with the method. Referring to fig. 8, fig. 8 is a schematic diagram of a compatible wiring device for a PCB according to an embodiment of the present application, and in combination with fig. 8, the device includes:
a setting unit 10 for setting four pads;
a first connection unit 20 for connecting the input terminal and the output terminal of the functional module to one of the pads, respectively; the input end of the functional module is different from the bonding pad connected with the output end;
a second connection unit 30 for connecting one interface of the target controller and the connector to one of the pads, respectively; the interface is different from the bonding pad connected with the connector;
a third connection unit 40 for connecting M resistance-capacitance devices with the pads when the functional module is used, so that the interface, M resistance-capacitance devices, the functional module, and the connector form a signal transmission channel;
a fourth connection unit 50 for connecting the N number of the resistive-capacitive devices with the pads when the functional module is not used, so that the interface, the N number of the resistive-capacitive devices, and the connector form a signal transmission channel;
wherein each resistor-capacitor part is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M.
On the basis of the above embodiment, optionally, the third connection unit 40 is specifically configured to: connecting the two resistance-capacitance devices with the bonding pads;
correspondingly, the fourth connection unit 50 is specifically configured to: and connecting one of the resistance-capacitance devices with the bonding pad.
On the basis of the above embodiment, optionally, the third connection unit 40 is specifically configured to: connecting one of the resistance-capacitance devices with the bonding pad;
correspondingly, the fourth connection unit 50 is specifically configured to: and connecting the two resistance-capacitance devices with the bonding pads.
On the basis of the above embodiment, optionally, the resistive-capacitive device is a resistor.
Alternatively, the functional module may comprise a single functional chip.
The application also provides a compatible wiring device of the PCB, and referring to FIG. 9, the device comprises a memory 1 and a processor 2.
A memory 1 for storing a computer program;
a processor 2 for executing a computer program to perform the steps of:
setting four bonding pads; connecting the input end and the output end of the functional module with one bonding pad respectively; the input end of the functional module is different from the bonding pad connected with the output end; connecting an interface of the target controller with the connector with one bonding pad respectively; the interface is different from the bonding pad connected with the connector; when the functional module is used, M resistance-capacitance devices are connected with the bonding pads, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel; when the functional module is not used, connecting N resistance-capacitance devices with the bonding pads, so that the interface, the N resistance-capacitance devices and the connector form a signal transmission channel; wherein each resistor-capacitor part is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M.
For the description of the apparatus provided in the present application, reference is made to the above method embodiments, and the description is omitted herein.
The present application also provides a computer readable storage medium having a computer program stored thereon, which when executed by a processor, performs the steps of:
setting four bonding pads; connecting the input end and the output end of the functional module with one bonding pad respectively; the input end of the functional module is different from the bonding pad connected with the output end; connecting an interface of the target controller with the connector with one bonding pad respectively; the interface is different from the bonding pad connected with the connector; when the functional module is used, M resistance-capacitance devices are connected with the bonding pads, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel; when the functional module is not used, connecting N resistance-capacitance devices with the bonding pads, so that the interface, the N resistance-capacitance devices and the connector form a signal transmission channel; wherein each resistor-capacitor part is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M.
The computer readable storage medium may include: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
For the description of the computer-readable storage medium provided in the present application, reference is made to the above method embodiments, and the description is omitted herein.
In the description, each embodiment is described in a progressive manner, and each embodiment is mainly described by the differences from other embodiments, so that the same similar parts among the embodiments are mutually referred. For the apparatus, device and computer readable storage medium of the embodiment disclosure, since it corresponds to the method of the embodiment disclosure, the description is relatively simple, and the relevant points refer to the description of the method section.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software modules may be disposed in Random Access Memory (RAM), memory, read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The technical scheme provided by the application is described in detail. Specific examples are set forth herein to illustrate the principles and embodiments of the present application, and the description of the examples above is only intended to assist in understanding the methods of the present application and their core ideas. It should be noted that it would be obvious to those skilled in the art that various improvements and modifications can be made to the present application without departing from the principles of the present application, and such improvements and modifications fall within the scope of the claims of the present application.

Claims (10)

1. A compatible wiring method of a PCB board is characterized by comprising the following steps:
setting four bonding pads;
connecting the input end and the output end of the functional module with one bonding pad respectively; the input end of the functional module is different from the bonding pad connected with the output end;
connecting an interface of the target controller with the connector with one bonding pad respectively; the interface is different from the bonding pad connected with the connector;
the bonding pad connected with the input end of the functional module, the bonding pad connected with the output end of the functional module, the bonding pad connected with the connector and the bonding pad connected with one interface of the target controller are different; or the bonding pad connected with the input end of the functional module is the same as the bonding pad connected with one interface of the target controller, and the bonding pad connected with the output end of the functional module is different from the bonding pad connected with the connector; or, the pad connected with the input end of the functional module is different from the pad connected with one interface of the target controller, and the pad connected with the output end of the functional module is the same as the pad connected with the connector;
when the functional module is used, M resistance-capacitance devices are connected with the bonding pads, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel;
when the functional module is not used, connecting N resistance-capacitance devices with the bonding pads, so that the interface, the N resistance-capacitance devices and the connector form a signal transmission channel;
wherein each resistor-capacitor part is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M.
2. The compatible wiring method of claim 1, wherein said connecting M of said resistance-capacitance devices with said pads comprises:
connecting the two resistance-capacitance devices with the bonding pads;
correspondingly, the connecting the N resistance-capacitance devices with the bonding pad includes:
and connecting one of the resistance-capacitance devices with the bonding pad.
3. The compatible wiring method of claim 1, wherein said connecting M of said resistance-capacitance devices with said pads comprises:
connecting one of the resistance-capacitance devices with the bonding pad;
correspondingly, the connecting the N resistance-capacitance devices with the bonding pad includes:
and connecting the two resistance-capacitance devices with the bonding pads.
4. The compatible wiring method of claim 1 wherein the resistive-capacitive device is a resistor.
5. The compatible wiring method of claim 1, wherein the functional module comprises a single functional chip.
6. A compatible wiring device for a PCB board, comprising:
a setting unit for setting four pads;
the first connecting unit is used for connecting the input end and the output end of the functional module with one bonding pad respectively; the input end of the functional module is different from the bonding pad connected with the output end;
the second connection unit is used for respectively connecting one interface of the target controller with one bonding pad of the connector; the interface is different from the bonding pad connected with the connector;
the bonding pad connected with the input end of the functional module, the bonding pad connected with the output end of the functional module, the bonding pad connected with the connector and the bonding pad connected with one interface of the target controller are different; or the bonding pad connected with the input end of the functional module is the same as the bonding pad connected with one interface of the target controller, and the bonding pad connected with the output end of the functional module is different from the bonding pad connected with the connector; or, the pad connected with the input end of the functional module is different from the pad connected with one interface of the target controller, and the pad connected with the output end of the functional module is the same as the pad connected with the connector;
the third connection unit is used for connecting M resistance-capacitance devices with the bonding pads when the functional module is used, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel;
a fourth connection unit, configured to connect the N resistance-capacitance devices with the pads when the functional module is not used, so that the interface, the N resistance-capacitance devices, and the connector form a signal transmission channel;
wherein each resistor-capacitor part is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M.
7. The compatible wiring device of claim 6, wherein the third connection unit is specifically configured to: connecting the two resistance-capacitance devices with the bonding pads;
correspondingly, the fourth connection unit is specifically configured to: and connecting one of the resistance-capacitance devices with the bonding pad.
8. The compatible wiring device of claim 6, wherein the third connection unit is specifically configured to: connecting one of the resistance-capacitance devices with the bonding pad;
correspondingly, the fourth connection unit is specifically configured to: and connecting the two resistance-capacitance devices with the bonding pads.
9. A compatible wiring device for a PCB board, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the compatible routing method of a PCB board according to any one of claims 1 to 5 when executing said computer program.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a computer program which, when executed by a processor, implements the steps of the compatible routing method of a PCB board according to any one of claims 1 to 5.
CN202111424690.XA 2021-11-26 2021-11-26 Compatible wiring method and related device of PCB Active CN114126230B (en)

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