CN114125413A - Pixel assembly, image sensor assembly and electronic device - Google Patents
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
- H04N9/3173—Constructional details thereof wherein the projection device is specially adapted for enhanced portability
- H04N9/3176—Constructional details thereof wherein the projection device is specially adapted for enhanced portability wherein the projection device is incorporated in a camera
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Abstract
The application discloses pixel component, image sensor subassembly and electronic equipment belongs to image acquisition and projection technical field, and the pixel component includes: the acquisition module comprises a light acquisition unit, and the light acquisition unit is used for generating an ambient light signal; the projection module comprises a light-emitting unit, and the light-emitting unit is used for projecting light; and the lens assembly covers the light collection unit and the light emitting unit.
Description
Technical Field
The application belongs to the technical field of image acquisition and projection, and particularly relates to a pixel assembly, an image sensor assembly and electronic equipment.
Background
In the related art, the image pickup assembly of the electronic device includes an image sensor to implement a photographing function, while the pixel assembly of the image sensor can only be used to acquire image data, and if a projection function is to be implemented, an additional projection assembly needs to be provided, resulting in an increase in size and cost of the electronic device.
Disclosure of Invention
An object of the embodiments of the present application is to provide a pixel component, an image sensor component and an electronic device, which can solve the technical problem of single function of the pixel component in the prior art.
In a first aspect, an embodiment of the present application provides a pixel assembly, including:
the acquisition module comprises a light acquisition unit, and the light acquisition unit is used for generating an ambient light signal;
the projection module comprises a light-emitting unit, and the light-emitting unit is used for projecting light;
and the lens assembly covers the light collection unit and the light emitting unit.
In a second aspect, an embodiment of the present application provides an image sensor assembly, including:
an input bus for receiving a drive signal;
the output bus is used for outputting the acquisition signal;
the pixel assembly according to the first aspect, the number of the pixel assemblies is N, the N pixel assemblies are connected to the input bus and the output bus, and N is a positive integer.
In a third aspect, an embodiment of the present application provides an electronic device, including: a housing; the main board is arranged in the shell; the image sensor assembly as provided in the second aspect, the image sensor assembly is electrically connected to the main board.
In this application embodiment, the pixel component includes collection module and projection module, and wherein, collection module can gather ambient light data, and generate corresponding ambient light signal, and N collection module of N pixel component can form N ambient light signal altogether, and these ambient light signals are received by the treater back, can form into a complete digital image to the function of shooing is realized. Wherein the ambient light signal of each pixel element corresponds to a pixel point in the digital image.
The projection module can receive a driving signal from the processor through the input bus, and under the driving of the driving signal, the projection module can project light rays to the outside, the light rays can form a light spot on the projection surface, the N projection modules of the N pixel assemblies can project N light spots on the projection surface, the N light spots can form a projection image on the projection surface, and each light spot is a pixel point on the projection image.
The embodiment of the application integrates the functions of image acquisition and image projection in the pixel assembly, so that the image sensor applying the pixel assembly can shoot images on the one hand, and can also project images on the other hand, the function of the image sensor is richer, the dual functions of image shooting and image projection can be realized under the condition that the electronic equipment is not provided with an independent projection assembly, the size of the electronic equipment is favorably reduced, and the cost of the electronic equipment is reduced.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 shows one of the schematic structural diagrams of a pixel assembly according to an embodiment of the present application;
FIG. 2 illustrates a second schematic structural diagram of a pixel assembly according to an embodiment of the present application;
fig. 3 shows a circuit diagram of a driver circuit according to an embodiment of the application;
FIG. 4 shows a circuit diagram of an acquisition circuit according to an embodiment of the present application;
FIG. 5 shows a circuit diagram of an image sensor assembly according to an embodiment of the application;
FIG. 6 is a schematic diagram of an image sensor assembly according to an embodiment of the present application;
fig. 7 shows a block diagram of an electronic device according to an embodiment of the present application.
Reference numerals:
100 image sensor components, 102 input bus, 104 output bus, 106 pixel components, 108 projection module, 1082 light emitting diode, 1084 driving circuit, 10842 first switch tube, 10844 second switch tube, 10846 capacitive element, 110 acquisition module, 1102 photodiode, 1104 acquisition circuit, 11042 third switch tube, 11044 fourth switch tube, 11046 fifth switch tube, 11048 sixth switch tube, 112 lens component, 114 analog-to-digital conversion circuit, 116 digital-to-analog conversion circuit;
200 electronic equipment, 202 shell and 204 mainboard.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
A pixel assembly, an image sensor assembly, and an electronic device according to embodiments of the present application are described below with reference to fig. 1 to 7.
In some embodiments of the present application, fig. 1 illustrates one of the schematic structural diagrams of a pixel assembly according to an embodiment of the present application, and as shown in fig. 1, an image sensor assembly 100 includes:
the acquisition module 110 comprises a light acquisition unit, and the light acquisition unit is used for generating an ambient light signal;
a projection module 108 including a light emitting unit for projecting light;
and a lens assembly 112 covering the light collection unit and the light emitting unit.
In an embodiment of the present application, the pixel assembly 106 includes an acquisition module 110 and a projection module 108, wherein the acquisition module 110 and the projection module 108 are capable of operating independently.
Specifically, when the collection module 110 works, the projection module 108 does not work, at this time, the collection module 110 can collect the ambient light data and generate the corresponding ambient light signals, N collection modules 110 of N pixel assemblies 106 can form N ambient light signals in total, and after the ambient light signals are received by the processor, the ambient light signals can form a complete digital image, so that the photographing function is realized. Wherein the ambient light signal of each pixel element 106 corresponds to one pixel element 106 in the digital image.
Because one pixel assembly 106 simultaneously includes the acquisition module 110 and the projection module 108, there is one projection module 108 at an interval between two acquisition modules 110 of two adjacent pixel assemblies 106, that is, the N acquisition modules 110 of the image sensor are arranged at intervals, which can effectively avoid interference between the adjacent image acquisition modules 110, and simultaneously effectively utilize the interval space to set the projection module 108, thereby improving the integration level of the image sensor assembly 100.
When the projection module 108 is in operation, the collection module 110 does not operate, at this time, the projection module 108 can receive a driving signal from the processor through the input bus 102, and under the driving of the driving signal, the projection module 108 can project light rays to the outside, the light rays can form a "light spot" on the projection surface, N projection modules 108 of N pixel assemblies 106 can project N "light spots" on the projection surface, the N "light spots" can form a projection image on the projection surface, wherein each "light spot" is a pixel point on the projection image.
The collection module 110 includes a light collection unit, and when the ambient light irradiates the light collection unit, the light collection unit generates a corresponding electrical signal according to the intensity, color and other information of the ambient light, thereby generating an ambient light signal. The projection module 108 includes a light emitting unit, and under the action of the driving signal, the light emitting unit can emit visible light according to different brightness and light emitting colors, so as to project a projection image.
Fig. 2 shows a second schematic structural diagram of a pixel unit according to an embodiment of the present application, and as shown in fig. 2, the image sensor assembly 100 further includes a lens assembly 112, where the lens assembly 112 can refract ambient light and visible light emitted by the light emitting assembly, so as to improve a detection angle of the light collecting unit, and enable a small-area image sensor to project a larger-area projection image on a projection surface.
The lens assembly 112 includes N microlenses, the N microlenses are in one-to-one correspondence with the N pixel assemblies 106, the projection module 108 and the collection module 110 in one pixel assembly 106 share the same microlens, specifically, the lens assembly 112 covers the light collection unit of the collection module 110 in the light receiving direction, when the ambient light irradiates the microlens, the ambient light reaches the light collection unit after being refracted by the microlens, so that the light collection unit generates a corresponding electrical signal.
Meanwhile, the lens assembly 112 covers the light emitting direction of the light emitting unit, so that the visible light generated by the light emitting unit is emitted after passing through the lens assembly 112, and the emission path of the visible light is changed by refraction of the lens assembly 112, so that a projection image with a proper size is projected on the projection surface.
The embodiment of the application integrates the functions of image acquisition and image projection in the pixel assembly 106, so that the image sensor applying the pixel assembly 106 can shoot images on the one hand, and can also project images on the other hand, thereby the functions of the image sensor are richer, the electronic equipment can realize the dual functions of image shooting and image projection under the condition of not setting an independent projection assembly, the size of the electronic equipment is favorably reduced, and the cost of the electronic equipment is reduced.
According to the embodiment of the application, the acquisition module 110 and the projection module 108 share the lens assembly 112, so that the utilization rate of the lens assembly 112 is improved, the integration level of the image sensor assembly 100 is improved, and the reduction of the volume of the image sensor assembly 100 is facilitated.
In some embodiments of the present application, as shown in fig. 1 and 2, the light emitting unit includes a light emitting diode 1082; the projection module 108 further includes: the driving circuit 1084, the driving circuit 1084 and the light emitting diode 1082 are electrically connected, for driving the light emitting diode 1082 to emit light.
In the embodiment of the present application, the light emitting unit includes a light emitting diode 1082, wherein the light emitting diode 1082 generates visible light when being excited by an external driving signal, and emits the visible light after being emitted by the lens assembly 112, and forms a projection image on a projection plane.
The projection module 108 further includes a driving circuit 1084, an input terminal of the driving circuit 1084 is connected to the input bus 102 of the image sensor assembly 100, and an output terminal of the driving circuit 1084 is connected to the light emitting diode 1082. Specifically, the processor sends down a driving signal through the input bus 102, and the driving signal is received by the driving circuit 1084 and then transmitted to the light emitting diode 1082 in the form of a driving voltage, so as to activate the light emitting diode 1082 to start emitting visible light.
It can be understood that the driving circuit 1084 can adjust the brightness of the led 1082 according to the driving signal, wherein the higher the driving voltage, the higher the brightness of the visible light emitted by the led 1082, and the lower the driving voltage, the lower the brightness of the visible light emitted by the led 1082.
In some embodiments of the present application, fig. 3 shows a circuit diagram of a driving circuit according to an embodiment of the present application, and as shown in fig. 3, the driving circuit 1084 includes: a first switch tube 10842; a second switch tube 10844, a first end of the second switch tube 10844 is connected to the anode of the light emitting diode 1082, a second end of the second switch tube 10844 is connected to a second end of the first switch tube 10842, and a third segment of the second switch tube 10844 is configured to receive a power supply signal; the cathode of the led 1082 is grounded.
In the embodiment of the present application, the driving circuit 1084 includes a first switch 10842 and a second switch 10844, wherein the first switch 10842 receives the driving signal of the input bus 102, and the second switch 10844 receives the power supply signal. When the projection module 108 is in operation, the first switch tube 10842 is turned on, and the second switch tube 10844 is turned on, at this time, the driving signal from the input bus 102 is transmitted to the light emitting diode 1082 through the first switch tube 10842 and the second switch tube 10844, and the light emitting diode 1082 emits visible light under the excitation of the driving signal.
When the projection module 108 is not in operation, the first switch tube 10842 and the second switch tube 10844 are turned off, and the light emitting diode 1082 does not emit visible light, and the adjacent acquisition modules 110 are isolated by the inactive projection module 108, so as to prevent signal-to-noise interference between the adjacent acquisition modules 110.
In some embodiments of the present application, as shown in fig. 4, the driver circuit 1084 further comprises: a capacitive element 10846, a first end of the capacitive element 10846 being coupled to a common end of the first and second switch tubes 10842, 10844, and a second end of the capacitive element 10846 being coupled to ground.
In this technical solution, the driving circuit 1084 is further provided with a capacitive element 10846, the capacitive element 10846 is connected to a common end of the first switch tube 10842 and the second switch tube 10844, that is, an output end of the first switch tube 10842, and a second end of the capacitive element 10846 is grounded, so that the capacitive element 10846 is formed as a filter element for the driving signal, and ac noise in the driving signal is absorbed and eliminated by the capacitive element 10846, so that the brightness of the visible light emitted by the light emitting unit of the projection module 108 is more stable, stroboflash is reduced, and the projection effect is improved.
In some embodiments of the present application, as shown in fig. 1 and 2, the light collection unit includes a photodiode 1102; the acquisition module 110 further includes: and the acquisition circuit 1104 is electrically connected with the photodiode 1102 and used for receiving the electric signal of the light emitting diode 1082 and outputting an acquisition signal to the output bus 104.
In this technical solution, the light collection unit includes a photodiode 1102, where the photodiode 1102 can generate a corresponding electrical signal under the excitation of visible light, and specifically, when the ambient light reaches the photodiode 1102 after being refracted by the lens assembly 112, the photodiode 1102 generates a corresponding electrical signal according to the intensity, color, and the like of the visible light, and the electrical signal is output to the collection circuit 1104, and the collection circuit 1104 transmits the electrical signal to the output bus 104 and outputs the electrical signal to the processor of the electronic device as an ambient light signal.
After the processor receives the ambient light signal, a corresponding digital image can be generated according to the ambient light signal, wherein the ambient light signals of the N photodiodes 1102 corresponding to the N pixel assemblies 106 respectively form N pixel points of the digital image, so that the shooting scene is digitally restored, and a digital shooting function is realized.
In some embodiments of the present application, fig. 4 shows a circuit diagram of an acquisition circuit according to embodiments of the present application, as shown in fig. 4, the acquisition circuit 1104 includes: a third switching tube 11042, wherein a first end of the third switching tube 11042 is used for receiving a power supply signal; a fourth switching tube 11044, a first end of the fourth switching tube 11044 is connected to a second end of the third switching tube 11042, and a second end of the fourth switching tube 11044 is connected to a cathode of the photodiode 1102; a fifth switching tube 11046, a first end of the fifth switching tube 11046 is used for receiving a power supply signal, and a second end of the fifth switching tube 11046 is connected with a common end of the third switching tube 11042 and the fourth switching tube 11044; a sixth switching tube 11048, a first end of the sixth switching tube 11048 is connected to a third end of the fifth switching tube 11046, and a second end of the sixth switching tube 11048 is connected to the output bus 104; the anode of the photodiode 1102 is grounded.
In this embodiment of the application, the acquisition circuit 1104 includes a third switching tube 11042, a fourth switching tube 11044, a fifth switching tube 11046, and a sixth switching tube 11048, where the third switching tube 11042 receives a power supply signal, the fourth switching tube 11044 receives an ambient light signal generated by the photodiode 1102 under excitation of ambient light, and the fifth switching tube 11046 and the sixth switching tube 11048 can output the ambient light signal to the output bus 104, so as to send the ambient light signal to the processor of the electronic device through the output bus 104.
Specifically, when the acquisition module 110 works, the third switching tube 11042, the fourth switching tube 11044, the fifth switching tube 11046 and the sixth switching tube 11048 are all turned on, and at this time, the ambient light signal generated by the photodiode 1102 is transmitted to the output bus 104 through the third switching tube 11042, the fourth switching tube 11044, the fifth switching tube 11046 and the sixth switching tube 11048, and is output to the processor of the electronic device through the output bus 104.
When the acquisition module 110 does not work, the third switching tube 11042, the fourth switching tube 11044, the fifth switching tube 11046 and the sixth switching tube 11048 are all turned off. At this time, even if the ambient light irradiates the photodiode 1102 of the acquisition module 110, the electrical signal generated by the photodiode 1102 is not received by the processor, which can avoid consuming unnecessary processor resources and save the device performance and power consumption of the electronic device.
Optionally, the first switch tube 10842, the second switch tube 10844, the third switch tube 11042, the fourth switch tube 11044, the fifth switch tube 11046 and the sixth switch tube 11048 are Complementary Metal Oxide Semiconductor (CMOS) switch tubes.
In some embodiments of the present application, there is provided an image sensor assembly, and fig. 5 shows a circuit diagram of an image sensor assembly according to an embodiment of the present application, and as shown in fig. 5, a sensor assembly 100, comprising: an input bus 102 for receiving a drive signal;
an output bus 104 for outputting the acquisition signal;
as in the pixel assembly 106 provided in any of the above embodiments, the number of the pixel assemblies 106 is N, where N pixel assemblies 106 are connected to the input bus 102 and the output bus 104, and N is a positive integer.
In the embodiment of the present application, the image sensor assembly 100 includes N pixel assemblies 106, wherein each pixel assembly 106 is integrally provided with an acquisition module 110 and a projection module 108, wherein the acquisition module 110 and the projection module 108 can independently operate.
Specifically, when the collection module 110 works, the projection module 108 does not work, at this time, the collection module 110 can collect the ambient light data and generate corresponding collection signals, N collection modules 110 of N pixel assemblies 106 can form N collection signals in total, and after the collection signals are received by the processor, the collection signals can form a complete digital image, so that the photographing function is realized. Wherein the captured signal of each pixel assembly 106 corresponds to one pixel assembly 106 in the digital image.
Because one pixel assembly 106 simultaneously includes the acquisition module 110 and the projection module 108, there is one projection module 108 at an interval between two acquisition modules 110 of two adjacent pixel assemblies 106, that is, the N acquisition modules 110 of the image sensor are arranged at intervals, which can effectively avoid interference between the adjacent image acquisition modules 110, and simultaneously effectively utilize the interval space to set the projection module 108, thereby improving the integration level of the image sensor assembly 100.
When the projection module 108 is in operation, the collection module 110 does not operate, at this time, the projection module 108 can receive a driving signal from the processor through the input bus 102, and under the driving of the driving signal, the projection module 108 can project light rays to the outside, the light rays can form a "light spot" on the projection surface, N projection modules 108 of N pixel assemblies 106 can project N "light spots" on the projection surface, the N "light spots" can form a projection image on the projection surface, wherein each "light spot" is a pixel point on the projection image.
The embodiment of the application integrates the functions of image acquisition and image projection in the image sensor assembly 100, so that the image sensor can shoot images on the one hand, and can also project images on the other hand, thereby the functions of the image sensor are richer, and the electronic equipment applying the image sensor assembly 100 can realize the dual functions of image shooting and image projection under the condition of not setting an independent projection assembly, thereby being beneficial to reducing the volume of the electronic equipment and reducing the cost of the electronic equipment.
In some embodiments of the present application, the N pixel components 106 include: a red pixel component, a green pixel component, and a blue pixel component.
In the embodiment of the present application, the image sensor assembly 100 includes N pixel assemblies 106, including a red pixel assembly, a green pixel assembly, and a blue pixel assembly. Wherein, including red collection module and red projection module in the red pixel subassembly, including green collection module and green projection module in the green pixel subassembly, including blue collection module and blue projection module in the blue pixel subassembly.
As shown in fig. 6, in the red pixel assembly, the red projection module is an R1 square block, and the red collection module is an R square block. In the green pixel component, the green projection module is a G1 square, and the green collection module is a G square. In the blue pixel assembly, the blue projection module is a block B1, and the blue collection module is a block B.
Specifically, the red collection module includes a red photodiode 1102, the green collection module includes a green photodiode 1102, and the blue collection module includes a blue photodiode 1102. At the time of image acquisition, incident ambient light is irradiated onto the photodiode 1102 through the lens assembly 112, so that a corresponding line signal is generated and formed as a detection signal.
It can be appreciated that the red photodiode 1102 can generate a red detection signal from the red portion of the visible light, the green photodiode 1102 can generate a green detection signal from the green portion of the visible light, and the blue photodiode 1102 can generate a blue detection signal from the blue portion of the visible light.
The red projection module includes red leds 1082, the green projection module includes green leds 1082, and the blue projection module includes blue leds 1082. In projecting an image, a drive signal is applied to the light emitting diode 1082 through the drive circuit 1084, so that the light emitting diode 1082 is energized to generate visible light of a corresponding color.
It can be appreciated that the red light emitting diode 1082 can emit red visible light upon activation of a drive signal, the green light emitting diode 1082 can emit green visible light upon activation of the drive signal, and the blue light emitting diode 1082 can emit blue visible light upon activation of the drive signal.
In some embodiments of the present application, as shown in fig. 5, the image sensor further includes: the analog-to-digital conversion circuit 114 is connected in series between the acquisition module 110 and the output bus 104, and is used for converting the ambient light signal from an analog signal to a digital signal; and a digital-to-analog conversion circuit 116 connected in series between the projection module 108 and the input bus 102 for converting the driving signal from a digital signal to an analog signal.
In this embodiment, the image sensor includes a digital-to-analog conversion circuit 116 and an analog-to-digital conversion circuit 114, where the analog-to-digital conversion circuit 114 is connected in series between the acquisition module 110 and the output bus 104, when the acquisition module 110 is in operation, the photodiode 1102 of the acquisition module 110 generates an electrical signal under the irradiation of ambient light, the electrical signal is an analog signal, the electrical signal of the analog signal is converted into a digital ambient light signal by the analog-to-digital conversion circuit 114, and the digital ambient light signal can be received and recognized by a processor of the electronic device, so that the electronic device draws a corresponding digital image.
The digital-to-analog conversion circuit 116 is connected in series between the input bus 102 and the projection module 108, when the projection module 108 is in operation, the processor of the electronic device outputs a driving signal of a digital signal, the driving signal of the digital signal is converted into an analog signal by the digital-to-analog conversion circuit 116, and is applied to the light emitting diode 1082 of the projection module 108, and the light emitting diode 1082 emits light under the excitation of the analog signal, so that a projection image is projected on the projection plane.
In some embodiments of the present application, an electronic device is provided, and fig. 7 shows a block diagram of a structure of the electronic device according to an embodiment of the present application, and as shown in fig. 7, the electronic device 200 includes: a housing 202; a main board 204 disposed in the housing 202; the image sensor assembly 100 provided in any of the above embodiments is disposed on the housing 202, and the image sensor assembly 100 is connected to the main board 204.
In the embodiment of the present application, the electronic device includes electronic devices such as a mobile phone, a tablet computer, a personal computer, a smart watch, a smart bracelet, and smart glasses. A casing 202 of the electronic apparatus 200 is a main frame structure of the electronic apparatus 200, and functional components such as a main board 204 of the electronic apparatus, a battery, a vibration motor, and a sensor are provided in the casing 202.
A processor of the electronic device is integrated on the main board 204, and the processor realizes data interaction through data connection between the main board 204 and the image sensor assembly 100. Specifically, when the image sensor assembly 100 works in a working state of collecting images, the collecting modules of the image sensor assembly 100 work, N collecting modules can form N ambient light signals, and the ambient light signals can form a complete digital image after being received by the processor, so that the photographing function is realized. Wherein the ambient light signal of each pixel element corresponds to a pixel element in the digital image.
When the image sensor assembly 100 works in an operating state of a projected image, the projection modules of the image sensor assembly 100 work, the N projection modules can receive a driving signal from the processor, and under the driving of the driving signal, the projection modules can project light rays to the outside, the light rays can form a "light spot" on the projection surface, the N projection modules of the N pixel assemblies can project N "light spots" on the projection surface, the N "light spots" can form a projected image on the projection surface, and each "light spot" is a pixel point on the projected image.
The image sensor component comprises an image sensor, an image sensor and an image projection module, wherein the image sensor is used for acquiring images, and the image projection module is used for projecting images.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A pixel assembly, comprising:
the acquisition module comprises a light acquisition unit, and the light acquisition unit is used for generating an ambient light signal;
the projection module comprises a light-emitting unit, and the light-emitting unit is used for projecting light;
and the lens assembly covers the light collection unit and the light emitting unit.
2. A pixel assembly according to claim 1, wherein the light emitting unit comprises a light emitting diode;
the projection module further includes:
and the driving circuit is electrically connected with the light emitting diode and used for driving the light emitting diode to emit light.
3. The pixel assembly of claim 2, wherein the drive circuit comprises:
a first switch tube;
a first end of the second switch tube is connected with the anode of the light emitting diode, and a second end of the second switch tube is connected with a second end of the first switch tube;
and the cathode of the light emitting diode is grounded.
4. The pixel assembly of claim 3, wherein the drive circuit further comprises:
and a first end of the capacitive element is connected with a common end of the first switch tube and the second switch tube, and a second end of the capacitive element is grounded.
5. The pixel assembly of claim 1, wherein the light collection unit comprises a photodiode;
the acquisition module further comprises:
and the acquisition circuit is electrically connected with the photodiode.
6. The pixel assembly of claim 5, wherein the acquisition circuit comprises:
a third switching tube;
a first end of the fourth switching tube is connected with a second end of the third switching tube, and a second end of the fourth switching tube is connected with a cathode of the photodiode;
a second end of the fifth switching tube is connected with a common end of the third switching tube and the fourth switching tube;
a first end of the sixth switching tube is connected with a third end of the fifth switching tube, and a second end of the sixth switching tube is connected with an output bus;
the anode of the photodiode is grounded.
7. An image sensor assembly, comprising:
an input bus for receiving a drive signal;
the output bus is used for outputting the acquisition signal;
the pixel assembly of any one of claims 1 to 6, said number of pixel assemblies being N, said N pixel assemblies each being connected to said input bus and said output bus, N being a positive integer.
8. The image sensor assembly of claim 7, wherein the N pixel assemblies comprise:
a red pixel component, a green pixel component, and a blue pixel component.
9. The image sensor assembly of claim 7 or 8, wherein the pixel assembly comprises an acquisition module and a projection module;
the image sensor assembly further comprises:
the analog-to-digital conversion circuit is connected between the acquisition module and the output bus in series;
and the digital-to-analog conversion circuit is connected between the projection module and the input bus in series.
10. An electronic device, comprising:
a housing;
the main board is arranged in the shell;
the image sensor assembly of any one of claims 7 to 9, electrically connected with the motherboard.
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| CN202111499708.2A CN114125413A (en) | 2021-12-09 | 2021-12-09 | Pixel assembly, image sensor assembly and electronic device |
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| CN202111499708.2A CN114125413A (en) | 2021-12-09 | 2021-12-09 | Pixel assembly, image sensor assembly and electronic device |
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