CN108650358A - Imaging sensor, camera and electronic equipment with projecting function - Google Patents
Imaging sensor, camera and electronic equipment with projecting function Download PDFInfo
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- CN108650358A CN108650358A CN201810564958.1A CN201810564958A CN108650358A CN 108650358 A CN108650358 A CN 108650358A CN 201810564958 A CN201810564958 A CN 201810564958A CN 108650358 A CN108650358 A CN 108650358A
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- 238000003384 imaging method Methods 0.000 title claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000004020 luminiscence type Methods 0.000 claims abstract description 19
- 238000002834 transmittance Methods 0.000 claims description 25
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000004568 cement Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 230000037431 insertion Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
- 230000006870 function Effects 0.000 description 25
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 235000013399 edible fruits Nutrition 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 210000003128 head Anatomy 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 210000003733 optic disk Anatomy 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0272—Details of the structure or mounting of specific components for a projector or beamer module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application proposes a kind of imaging sensor, camera and electronic equipment with projecting function, wherein imaging sensor includes：Multiple sensor units and multiple luminescence units, multiple sensor units are interspersed with multiple luminescence units on substrate；Luminescence unit, including driving element, the first metal routing layer and light-emitting component；Wherein, driving element is set to the one side of substrate, for driving light-emitting component；First metal routing layer, is set to driving element surface, is electrically connected with driving element and light-emitting component；Light-emitting component is set to the first metal routing layer surface, for shining under driving element driving；Sensor unit, including photosensitive element and the second metal routing layer；Wherein, photosensitive element insertion is in a substrate, photosensitive for being carried out to injection light；Second metal routing layer, is set to the another side of substrate, is electrically connected with photosensitive element.
Description
Technical field
This application involves technical field of mobile terminals more particularly to a kind of imaging sensor, with the camera shooting of projecting function
Head and electronic equipment.
Background technology
Currently, more and more mobile phones have provided the screen of the effective area of bigger to the user all using the design shielded comprehensively
Curtain.But current techniques are limited to, comprehensive screen mobile phone is temporarily the mobile phone of superelevation screen accounting, as possible obtains the frame design of mobile phone
It is narrower to shield accounting to improve, it is not the mobile phone that real front screen accounting is 100%.In design, the front of mobile phone needs
A panel region is reserved, to put the devices such as receiver, front camera, this results in front screen to be designed to special-shaped screen, or
It compromises and shields accounting, affect the aesthetic measure of mobile phone.Therefore, how to realize and really shield comprehensively, it has also become urgent need to resolve is asked
Topic.
Apply for content
The application is intended to solve at least some of the technical problems in related technologies.
For this purpose, the application proposes a kind of imaging sensor.
The application proposes a kind of camera with projecting function.
The application proposes a kind of electronic equipment.
The application one side embodiment proposes a kind of imaging sensor, including：
Multiple sensor units and multiple luminescence units, multiple sensor units interlock with multiple luminescence units
It is distributed on substrate；
The luminescence unit, including driving element, the first metal routing layer and light-emitting component；
Wherein, the driving element is set to the one side of the substrate, for driving the light-emitting component；
The first metal routing layer is set to the driving element surface, with the driving element and light-emitting component electricity
Property connection；
The light-emitting component is set to the first metal routing layer surface, for being issued in driving element driving
Light；
The sensor unit, including photosensitive element and the second metal routing layer；
Wherein, the photosensitive element is embedded in the substrate, for photosensitive to injecting light progress；
The second metal routing layer, is set to the another side of the substrate, is electrically connected with the photosensitive element.
Optionally, the light-emitting component includes：
Metal anode is set to the first metal routing layer surface；
Luminescent layer is set to the metal anode surface；
Transparent cathode is set to the luminous layer surface.
The imaging sensor of the embodiment of the present application, by by photosensitive unit and luminescence unit Integrated design, may be implemented into
When as state by the photosensitive shooting of photosensitive unit and dispaly state when luminescence unit emission optical projections, and it is the two is corresponding
Metal routing layer is separately positioned on the both sides of substrate, can increase the area of photosensitive unit, improves photosensitive precision, promotes imaging effect
Fruit.
The another aspect embodiment of the application proposes a kind of camera with projecting function, including lens assembly and first
Imaging sensor described in aspect embodiment.
The camera with projecting function of the embodiment of the present application, by by the photosensitive unit of imaging sensor with shine it is single
First Integrated design, when may be implemented image formation state by the photosensitive shooting of photosensitive unit and dispaly state when luminescence unit shine
It projects, and the corresponding metal routing layer of the two is separately positioned on to the both sides of substrate, the area of photosensitive unit can be increased, carried
High photosensitive precision, promotes imaging effect.
The another aspect embodiment of the application proposes a kind of electronic equipment, including：
Cover board；
There is transmittance section, the display screen to be stacked with the cover board for display screen, the display screen, and the cover board is located at
The side of the display screen；
Camera as claimed in claim 3, the camera are located at the other side of the display screen, the camera with
The transmittance section is opposite；
The lens assembly of the camera is located at the camera lens close to the display screen, the imaging sensor of the camera
The side far from the display screen of component；
Colour film, the colour film is between the camera and the cover board, and the colour film and the light transmission
Portion is opposite.
Optionally, the electronic equipment further includes：
Controller, the controller are connected with the camera, for controlling the camera under dispaly state in institute
It states transmittance section and carries out Projection Display, image is acquired through the transmittance section under image formation state.
Optionally, the colour film is attached at the display screen towards the surface of the camera.
Optionally, the colour film is attached at the surface of the direction display screen of the cover board.
Optionally, at least partly structure of the transmittance section is configured to cavernous structure.
Optionally, there is transparent filler layer in the cavernous structure.
Optionally, the transparent filler layer is optical cement.
Optionally, the display screen is OLED screen.
Optionally, the cross-sectional area of the transmittance section is more than or equal to the cross-sectional area of the camera.
Optionally, the contour line of the cross section of the transmittance section is in polygon, round or ellipse.
The electronic equipment of the embodiment of the present application, it is opposite with transmittance section by that will have the camera of projecting function to be arranged, it can
Projection display funciton to realize shooting function when image formation state, and when may be implemented dispaly state, while sense can be increased
The area of light unit improves photosensitive precision, promotes imaging effect, more effectively realizes screen comprehensively.
The additional aspect of the application and advantage will be set forth in part in the description, and will partly become from the following description
It obtains obviously, or recognized by the practice of the application.
Description of the drawings
The application is above-mentioned and/or additional aspect and advantage will become from the following description of the accompanying drawings of embodiments
Obviously and it is readily appreciated that, wherein：
A kind of sectional view for imaging sensor that Fig. 1 is provided by the embodiment of the present application；
The sectional view for a kind of electronic equipment that Fig. 2 is provided by the embodiment of the present application；
The sectional view for another electronic equipment that Fig. 3 is provided by the embodiment of the present application；
The sectional view for another electronic equipment that Fig. 4 is provided by the embodiment of the present application；
The schematic diagram for the electronic equipment imaging that Fig. 5 is provided by the embodiment of the present application；
The schematic diagram for the electronic equipment projection that Fig. 6 is provided by the embodiment of the present application.
Specific implementation mode
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the application, and should not be understood as the limitation to the application.
Below with reference to the accompanying drawings the imaging sensor, the camera with projecting function and electronics for describing the embodiment of the present application are set
It is standby.
A kind of sectional view for imaging sensor that Fig. 1 is provided by the embodiment of the present application.
As shown in Figure 1, imaging sensor 1000 includes multiple luminescence units 1100 and multiple sensor units 1200.
Multiple luminescence units 1100 are interspersed with multiple sensor units 1200 on substrate 1300.
Wherein, luminescence unit 1100, including driving element 1110, the first metal routing layer 1120 and light-emitting component
1130.Driving element 1110 is set to the one side of substrate 1300, for driving light-emitting component 1130.First metal routing layer
1120, it is set to 1110 surface of driving element, is electrically connected with driving element 1110 and light-emitting component 1130.Light-emitting component
1130, it is set to 1120 surface of the first metal routing layer, for shining under the driving of driving element 1110.
Further, light-emitting component 1130 may include metal anode 1131, luminescent layer 1132 and transparent cathode 1133.Gold
Belong to anode 1131, is set to 1120 surface of the first metal routing layer.Luminescent layer 1132 is set to 1131 surface of metal anode.Thoroughly
Bright cathode 1133 is set to 1132 surface of luminescent layer.
Sensor unit 1200, including photosensitive element 1210 and the second metal routing layer 1220.
Wherein, photosensitive element 1210 is embedded in substrate 1300, for photosensitive to injecting light progress.Second metal routing
Layer 1220, is set to the another side of substrate 1300, is electrically connected with photosensitive element 1210.
It should be understood that luminescence unit 1100 can be silicon substrate OLED cell, sensor unit 1200 can be CMOS
Photosensitive unit.
The imaging sensor of the embodiment of the present application, by by photosensitive unit and luminescence unit Integrated design, may be implemented into
When as state by the photosensitive shooting of photosensitive unit and dispaly state when luminescence unit emission optical projections, and it is the two is corresponding
Metal routing layer is separately positioned on the both sides of substrate, can increase the area of photosensitive unit, improves photosensitive precision, promotes imaging effect
Fruit.
To achieve the above object, the application also proposes a kind of camera with projecting function.
Wherein, the camera with projecting function includes the imaging sensor of lens assembly and an embodiment as above.
The camera with projecting function of the embodiment of the present application, by by the photosensitive unit of imaging sensor with shine it is single
First Integrated design, when may be implemented image formation state by the photosensitive shooting of photosensitive unit and dispaly state when luminescence unit shine
It projects, and the corresponding metal routing layer of the two is separately positioned on to the both sides of substrate, the area of photosensitive unit can be increased, carried
High photosensitive precision, promotes imaging effect.
To achieve the above object, the application proposes a kind of electronic equipment again.
As shown in Fig. 2, electronic equipment includes cover board 100, display screen 200, camera 300 and coloured silk with projecting function
Color film 400.
Wherein, display screen 200 has transmittance section 210.Display screen 200 is stacked with cover board 100, and cover board 100 is located at aobvious
The side of display screen 200.
In order to promote the display effect of display screen 200, in the example of the application, display screen 200 can be OLED
Screen.
Camera 300 with projecting function is located at the other side of display screen 200.Camera 300 and 210 phase of transmittance section
It is right.
Colour film 400 is between camera 300 and cover board 100, and colour film 400 is opposite with transmittance section 210.Wherein,
Colour film 400 can be as shown in Fig. 2, be attached at display screen 200 towards the surface of camera 300；It can also be as shown in figure 3, being sticked
In the surface towards display screen 200 of cover board 100.
Camera 300 may include the imaging sensor 320 of lens assembly 310 and the description of first aspect embodiment.Wherein, mirror
Head assembly 310 is located at the side of the separate display screen 200 of lens assembly 310 close to display screen 200, imaging sensor 320.
In another embodiment of the application, as shown in figure 4, electronic equipment may also include controller 500.
Controller 500 is connected with camera 300.Controller 500 can control camera 300 under dispaly state in light transmission
Portion 210 carries out Projection Display, and image is acquired through transmittance section 210 under image formation state.That is, having projecting function
Camera 300 there is two states, i.e. image formation state and dispaly state.When user opens shooting, controller 500 is controllable to be taken the photograph
Picture head 300 enters image formation state, and (pixel is as example) as shown in Figure 5, incident light is injected into image by colour film 400
Sensor 320, it is photosensitive by imaging sensor 320, photo-generated carrier is generated, to be imaged；When normal display, such as Fig. 6 institutes
Show (pixel is as example), controller 500 can control the unlatching projecting function of camera 300 to pass through hair into dispaly state
Light unit shines, and is projected by colour film 400, projects frame out towards transmittance section 210 so that the content that transmittance section 210 is shown
Keep unified with the display content at 200 other positions of display screen, enhancing integration.In the present embodiment, the image of camera is passed
Sensor is designed as CMOS photosensitive units and is integrated with silicon substrate OLED cell, not only may be implemented to be imaged, but also may be implemented to project.
Wherein, at least partly structure of transmittance section 210 is configured to cavernous structure.There is transparent filler in the cavernous structure
Layer, and transparent filler layer can be optical cement.
The cross-sectional area of transmittance section 210 is more than or equal to the cross-sectional area of camera 300.The wheel of the cross section of transmittance section 210
Profile can be in polygon, can also be rounded, naturally it is also possible to oval.
The electronic equipment of the embodiment of the present application, it is opposite with transmittance section by that will have the camera of projecting function to be arranged, it can
Projection display funciton to realize shooting function when image formation state, and when may be implemented dispaly state, while sense can be increased
The area of light unit improves photosensitive precision, promotes imaging effect, more effectively realizes screen comprehensively.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the application.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present application, the meaning of " plurality " is at least two, such as two, three
It is a etc., unless otherwise specifically defined.
Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes
It is one or more for realizing custom logic function or process the step of executable instruction code module, segment or portion
Point, and the range of the preferred embodiment of the application includes other realization, wherein can not press shown or discuss suitable
Sequence, include according to involved function by it is basic simultaneously in the way of or in the opposite order, to execute function, this should be by the application
Embodiment person of ordinary skill in the field understood.
Expression or logic and/or step described otherwise above herein in flow charts, for example, being considered use
In the order list for the executable instruction for realizing logic function, may be embodied in any computer-readable medium, for
Instruction execution system, device or equipment (system of such as computer based system including processor or other can be held from instruction
The instruction fetch of row system, device or equipment and the system executed instruction) it uses, or combine these instruction execution systems, device or set
It is standby and use.For the purpose of this specification, " computer-readable medium " can any can be included, store, communicating, propagating or passing
Defeated program is for instruction execution system, device or equipment or the dress used in conjunction with these instruction execution systems, device or equipment
It sets.The more specific example (non-exhaustive list) of computer-readable medium includes following：Electricity with one or more wiring
Interconnecting piece (electronic device), portable computer diskette box (magnetic device), random access memory (RAM), read-only memory
(ROM), erasable edit read-only storage (EPROM or flash memory), fiber device and portable optic disk is read-only deposits
Reservoir (CDROM).In addition, computer-readable medium can even is that the paper that can print described program on it or other are suitable
Medium, because can be for example by carrying out optical scanner to paper or other media, then into edlin, interpretation or when necessary with it
His suitable method is handled electronically to obtain described program, is then stored in computer storage.
It should be appreciated that each section of the application can be realized with hardware, software, firmware or combination thereof.Above-mentioned
In embodiment, software that multiple steps or method can in memory and by suitable instruction execution system be executed with storage
Or firmware is realized.Such as, if realized in another embodiment with hardware, following skill well known in the art can be used
Any one of art or their combination are realized：With for data-signal realize logic function logic gates from
Logic circuit is dissipated, the application-specific integrated circuit with suitable combinational logic gate circuit, programmable gate array (PGA), scene can compile
Journey gate array (FPGA) etc..
Those skilled in the art are appreciated that realize all or part of step that above-described embodiment method carries
Suddenly it is that relevant hardware can be instructed to complete by program, the program can be stored in a kind of computer-readable storage medium
In matter, which includes the steps that one or a combination set of embodiment of the method when being executed.
In addition, each functional unit in each embodiment of the application can be integrated in a processing module, it can also
That each unit physically exists alone, can also two or more units be integrated in a module.Above-mentioned integrated mould
The form that hardware had both may be used in block is realized, can also be realized in the form of software function module.The integrated module is such as
Fruit is realized in the form of software function module and when sold or used as an independent product, can also be stored in a computer
In read/write memory medium.
Storage medium mentioned above can be read-only memory, disk or CD etc..Although having been shown and retouching above
Embodiments herein is stated, it is to be understood that above-described embodiment is exemplary, and should not be understood as the limit to the application
System, those skilled in the art can be changed above-described embodiment, change, replace and become within the scope of application
Type.
Claims (13)
1. a kind of imaging sensor, which is characterized in that including：
Multiple sensor units and multiple luminescence units, multiple sensor units are interspersed with multiple luminescence units
On substrate；
The luminescence unit, including driving element, the first metal routing layer and light-emitting component；
Wherein, the driving element is set to the one side of the substrate, for driving the light-emitting component；
The first metal routing layer is set to the driving element surface, electrically connects with the driving element and light-emitting component
It connects；
The light-emitting component is set to the first metal routing layer surface, for shining under driving element driving；
The sensor unit, including photosensitive element and the second metal routing layer；
Wherein, the photosensitive element is embedded in the substrate, for photosensitive to injecting light progress；
The second metal routing layer, is set to the another side of the substrate, is electrically connected with the photosensitive element.
2. imaging sensor according to claim 1, which is characterized in that the light-emitting component includes：
Metal anode is set to the first metal routing layer surface；
Luminescent layer is set to the metal anode surface；
Transparent cathode is set to the luminous layer surface.
3. a kind of camera with projecting function, which is characterized in that including lens assembly and such as any one of claim 1-2 institutes
The imaging sensor stated.
4. a kind of electronic equipment, which is characterized in that including：
Cover board；
There is transmittance section, the display screen to be stacked with the cover board for display screen, the display screen, and the cover board is located at described
The side of display screen；
Camera as claimed in claim 3, the camera are located at the other side of the display screen, the camera with it is described
Transmittance section is opposite；
The lens assembly of the camera is located at the lens assembly close to the display screen, the imaging sensor of the camera
Far from the display screen side；
Colour film, the colour film is between the camera and the cover board, and the colour film and the transmittance section phase
It is right.
5. electronic equipment according to claim 4, which is characterized in that further include：
Controller, the controller are connected with the camera, for controlling the camera under dispaly state described
Light portion carries out Projection Display, and image is acquired through the transmittance section under image formation state.
6. electronic equipment according to claim 4, which is characterized in that the colour film is attached at the display screen towards institute
State the surface of camera.
7. electronic equipment according to claim 4, which is characterized in that the colour film be attached at the cover board towards institute
State the surface of display screen.
8. electronic equipment according to claim 4, which is characterized in that at least partly structure of the transmittance section is configured to
Cavernous structure.
9. electronic equipment according to claim 8, which is characterized in that have transparent filler layer in the cavernous structure.
10. electronic equipment according to claim 9, which is characterized in that the transparent filler layer is optical cement.
11. electronic equipment according to claim 4, which is characterized in that the display screen is OLED screen.
12. electronic equipment according to claim 4, which is characterized in that the cross-sectional area of the transmittance section is more than or equal to institute
State the cross-sectional area of camera.
13. electronic equipment according to claim 4, which is characterized in that the contour line of the cross section of the transmittance section is in more
Side shape, round or ellipse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810564958.1A CN108650358B (en) | 2018-06-04 | 2018-06-04 | Image sensor, camera with projection function and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810564958.1A CN108650358B (en) | 2018-06-04 | 2018-06-04 | Image sensor, camera with projection function and electronic equipment |
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| Publication Number | Publication Date |
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| CN108650358A true CN108650358A (en) | 2018-10-12 |
| CN108650358B CN108650358B (en) | 2024-03-19 |
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| CN201810564958.1A Active CN108650358B (en) | 2018-06-04 | 2018-06-04 | Image sensor, camera with projection function and electronic equipment |
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|---|---|---|---|---|
| CN109309740A (en) * | 2018-11-16 | 2019-02-05 | Oppo广东移动通信有限公司 | The control method of electronic device and electronic device |
| CN109413239A (en) * | 2018-11-16 | 2019-03-01 | Oppo广东移动通信有限公司 | The control device of electronic equipment, the control method of electronic equipment and electronic equipment |
| CN109561207A (en) * | 2018-11-16 | 2019-04-02 | Oppo广东移动通信有限公司 | The control method of electronic device and electronic device |
| CN109309740B (en) * | 2018-11-16 | 2021-03-16 | Oppo广东移动通信有限公司 | Electronic device and control method thereof |
| CN110010061A (en) * | 2019-03-27 | 2019-07-12 | 武汉华星光电半导体显示技术有限公司 | Display device and its manufacturing method |
| CN114125413A (en) * | 2021-12-09 | 2022-03-01 | 维沃移动通信有限公司 | Pixel assembly, image sensor assembly and electronic device |
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