CN114124821B - Method, device, equipment and storage medium for transmitting data between modules in chip - Google Patents
Method, device, equipment and storage medium for transmitting data between modules in chip Download PDFInfo
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L47/00—Traffic control in data switching networks
- H04L47/10—Flow control; Congestion control
- H04L47/16—Flow control; Congestion control in connection oriented networks, e.g. frame relay
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L47/00—Traffic control in data switching networks
- H04L47/10—Flow control; Congestion control
- H04L47/26—Flow control; Congestion control using explicit feedback to the source, e.g. choke packets
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L47/00—Traffic control in data switching networks
- H04L47/10—Flow control; Congestion control
- H04L47/27—Evaluation or update of window size, e.g. using information derived from acknowledged [ACK] packets
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L47/00—Traffic control in data switching networks
- H04L47/10—Flow control; Congestion control
- H04L47/36—Flow control; Congestion control by determining packet size, e.g. maximum transfer unit [MTU]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The application discloses a method, a device, equipment and a storage medium for data transmission between modules in a chip. The method comprises the following steps: receiving a data transmission request sent by a second target module in the chip through a request interface of the second target module through the request interface of the second target module; according to the data transmission request, a request response is sent to a response interface of the second target module through a response interface of the data transmission request, so that communication connection between the first target module and the second target module is established; and according to the communication connection, sending target data corresponding to the data transmission request to the data transmission interface of the second target module through the data transmission interface of the second target module. The data transmission can be initiated at any time without occupying a bus, and the data transmission efficiency among the modules in the chip is improved.
Description
Technical Field
The present invention relates to the field of computer technologies, and in particular, to a method, an apparatus, a device, and a storage medium for data transmission between modules in a chip.
Background
Along with the development of science and technology, the requirements on the functionality, the stability and the like of the chip are more and more stringent, the scale of the chip is larger and more powerful, and accordingly, the modules in the chip are more and more, and the data transmission among the chip modules is more and more important. The data transmission between the modules is used for mutually transmitting information between the modules, and the efficiency and the quality of the data transmission between the modules directly determine whether the whole chip is designed successfully or not, so that the data transmission between the modules is very important.
In the prior art, the data transmission method between modules is mainly two methods, namely a bus and a FIFO (First Input First Output, first-in first-out). Through data transmission among modules of the bus, the modules requesting to transmit data send requests to the bus for data needing to access a certain module, the bus transmits request signals to requested signals, the modules requesting to access send the data to the bus, and the bus sends the data to the modules requesting to transmit the data, so that data transmission among the modules is completed. The transmission mode is high in reliability, but needs to occupy a bus, when the bus is busy, data transmission needs to wait, timeliness is low, and when a large amount of data needs to be transmitted between two modules, bus time is occupied all the time, so that the bus is busy for a long time, and other modules cannot be used. Through the data transmission between the modules in the FIFO mode, when two modules need to carry out data transmission, a sending module can write data into the FIFO, a receiving module can take out the data from the FIFO, and the data transmission between the modules is completed.
Disclosure of Invention
Accordingly, the present invention is directed to a method, apparatus, device and medium for data transmission between modules in a chip, which can initiate data transmission at any time without occupying a bus, and improve the data transmission efficiency between modules in the chip. The specific scheme is as follows:
in a first aspect, the present application discloses a method for transmitting data between modules in a chip, including:
receiving a data transmission request sent by a second target module in the chip through a request interface of the second target module through the request interface of the second target module;
according to the data transmission request, a request response is sent to a response interface of the second target module through a response interface of the data transmission request, so that communication connection between the first target module and the second target module is established;
and according to the communication connection, sending target data corresponding to the data transmission request to the data transmission interface of the second target module through the data transmission interface of the second target module.
Optionally, the sending, by the own data transmission interface, the target data corresponding to the data transmission request to the data transmission interface of the second target module includes:
acquiring a data volume acquisition request sent by the second target module through a response interface of the second target module; the data volume acquisition request is a request generated by the second target module according to the data processing state of the second target module;
determining the size of target data according to the data volume acquisition request, and determining corresponding target data according to the data transmission request;
generating a data packet to be sent according to the size of the target data based on the target data, and sending the data packet to be sent to a data transmission interface of the second target module through a data transmission interface of the second target module.
Optionally, before the obtaining the data volume obtaining request sent by the second target module through the response interface of the second target module, the method further includes:
determining the first data transmission size according to the data transmission configuration information;
and according to the first data transmission size, sending target data corresponding to the data transmission request to a data transmission interface of the second target module through a data transmission interface of the first data transmission size.
Optionally, after the obtaining the data volume obtaining request sent by the second target module through the response interface of the second target module, the method further includes:
judging whether the size of the target data in the data volume acquisition request is zero or not;
and if the target data size is zero, stopping sending the target data to the second target module.
Optionally, the sending, through the own reply interface, a request reply response to the reply interface of the second target module to establish a communication connection between the first target module and the second target module includes:
sending a request response to a response interface of the second target module through a response interface of the second target module;
and receiving a data response corresponding to the request response fed back by the second target module through the response interface of the second target module so as to establish communication connection between the first target module and the second target module.
Optionally, before receiving the data transmission request sent by the second target module in the chip through the request interface, the method further includes:
configuring respective input and output type interfaces for target modules in the chip according to preset interface configuration information, so that the first target module and the second target module both comprise the request interface, the response interface and the data transmission interface; the interface configuration information includes an interface format and the number of interfaces.
Optionally, the configuring respective input/output type interfaces for the target modules in the chip according to preset interface configuration information includes:
according to the request interface configuration parameters in the preset interface configuration information, configuring a request interface for a target module in the chip to obtain the request interface;
configuring an ACK response interface for a target module in the chip according to response interface configuration parameters in the preset interface configuration information to obtain the response interface; the response interface configuration parameters comprise a request format corresponding to the request response, a request format corresponding to the data response and a request format corresponding to the data volume acquisition request;
and configuring a data interface for a target module in the chip according to the data interface configuration parameters in the preset interface configuration information to obtain the data transmission interface.
In a second aspect, the present application discloses an inter-chip module data transmission device, including:
the data transmission request acquisition module is used for receiving a data transmission request sent by the second target module in the chip through the request interface of the second target module;
the communication connection establishment module is used for sending a request response to a response interface of the second target module through a response interface of the communication connection establishment module according to the data transmission request so as to establish communication connection between the first target module and the second target module;
and the data transmission module is used for transmitting the target data corresponding to the data transmission request to the data transmission interface of the second target module through the data transmission interface of the data transmission module according to the communication connection.
In a third aspect, the present application discloses an electronic device comprising:
a memory for storing a computer program;
and the processor is used for executing the computer program to realize the inter-chip module data transmission method.
In a fourth aspect, the present application discloses a computer-readable storage medium for storing a computer program; the computer program, when executed by the processor, implements the method for inter-chip module data transmission.
In the application, a first target module in a chip receives a data transmission request sent by a second target module in the chip through a request interface of the first target module in the chip through the request interface of the first target module; according to the data transmission request, a request response is sent to a response interface of the second target module through a response interface of the data transmission request, so that communication connection between the first target module and the second target module is established; and according to the communication connection, sending target data corresponding to the data transmission request to the data transmission interface of the second target module through the data transmission interface of the second target module. As can be seen from the above, in this embodiment, the intra-chip module is provided with a request interface, a response interface and a data transmission interface, and different modules in the chip send or receive data transmission requests through their own request interfaces, and simultaneously, different modules in the chip send response responses through their own response interfaces, and data transmission is performed through their own data transmission interfaces between different modules in the chip, so that data transmission can be initiated at any time without occupying a bus, and data transmission efficiency between the intra-chip modules is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for transmitting data between modules in a chip;
FIG. 2 is a schematic diagram of a specific inter-chip module data transmission interface structure provided in the present application;
FIG. 3 is a timing diagram of inter-chip module data transmission according to one embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of an inter-chip module data transmission device provided in the present application;
fig. 5 is a block diagram of an electronic device provided in the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the prior art, data transmission among modules through a bus is high in reliability, but needs to occupy the bus, when the bus is busy, data transmission needs to wait, the timeliness is low, and when a large amount of data needs to be transmitted between two modules, the bus time is occupied all the time, so that the bus is busy for a long time, and other modules cannot be used. The data transmission between the modules in the FIFO mode is simple, the two modules are connected only through the FIFO, and no other information interaction exists, but the data transmission device is simple in structure and only suitable for the simple data transmission between the two modules, such as the two modules which always need to transmit data. In order to overcome the technical problems, the application provides a data transmission method between the modules in the chip, which can initiate data transmission at any time without occupying a bus and improves the data transmission efficiency between the modules in the chip.
The embodiment of the application discloses a method for transmitting data between modules in a chip, which is applied to a first target module in the chip, and is shown in fig. 1, and the method can comprise the following steps:
step S11: and receiving a data transmission request sent by the second target module in the chip through the self request interface.
In this embodiment, the first target module in the chip is a data transmitting end, which may also be referred to as a requested end, and the first target module obtains, through a request interface configured in advance, a data transmission request sent by the second target module in the chip through the request interface, and the second target module is a data receiving end, which may also be referred to as a request end. That is, the on-chip modules are each configured with a respective request interface for sending data transmission requests to other modules or receiving data transmission requests sent by other modules.
Step S12: and sending a request response to the response interface of the second target module through the response interface of the second target module according to the data transmission request so as to establish communication connection between the first target module and the second target module.
In this embodiment, after receiving the data transmission request, the first target module sends a request response to a response interface of the second target module through its own response interface, where the request response is used to characterize and accept the data transmission request of the second target module, so as to establish a communication connection between the first target module and the second target module. That is, the on-chip modules are each configured with a respective reply interface for sending reply responses to the other modules.
In this embodiment, the sending, by the own reply interface, a request reply response to the reply interface of the second target module to establish a communication connection between the first target module and the second target module may include: sending a request response to a response interface of the second target module through a response interface of the second target module; and receiving a data response corresponding to the request response fed back by the second target module through the response interface of the second target module so as to establish communication connection between the first target module and the second target module.
It can be understood that in the process of establishing the communication connection between the first target module and the second target module, in the first step, the second target module sends a data transmission request to the first target module through its own request interface; the second step, after the first target module receives the data transmission request, the first target module sends a request response to the second target module through a response interface of the first target module; and thirdly, after receiving the request response, the second target module sends a data response interface to the first target module through the response interface of the second target module so as to represent that the data is ready to be received, and the first target module can start transmitting the data to the second target module until the communication connection between the first target module and the second target module is successfully established.
Step S13: and according to the communication connection, sending target data corresponding to the data transmission request to the data transmission interface of the second target module through the data transmission interface of the second target module.
In this embodiment, after the communication connection is established successfully, the first target module transmits the data and the target data corresponding to the data transmission request to the second target module through the data transmission interface of the first target module and the data transmission interface of the second target module. That is, the on-chip modules are each configured with a respective data transmission interface for data transmission with other modules.
In this embodiment, the sending, by the own data transmission interface, the target data corresponding to the data transmission request to the data transmission interface of the second target module may include: acquiring a data volume acquisition request sent by the second target module through a response interface of the second target module; the data volume acquisition request is a request generated by the second target module according to the data processing state of the second target module; determining the size of target data according to the data volume acquisition request, and determining corresponding target data according to the data transmission request; generating a data packet to be sent according to the size of the target data based on the target data, and sending the data packet to be sent to a data transmission interface of the second target module through a data transmission interface of the second target module. It can be understood that in this embodiment, a feedback variable window mechanism is implemented by responding to a data volume acquisition request sent by an interface, where the size of a window is that several data are transmitted at a time, and the size of the feedback variable window is that several data may be transmitted at a time. Therefore, the size of single data transmission can be flexibly adjusted, in the prior art, the fixed window is set to be too small, if a transmitting end transmits one data, a receiving end confirms to receive one data, the cost is too large, and the transmission rate can be reduced; if the window is set too large, for example, 100 data are transmitted each time, and the receiving end can only receive and process 50 data, which causes data loss and blocking, the feedback variable window can effectively solve the problem in this embodiment.
In this embodiment, before receiving, through the self request interface, the data transmission request sent by the second target module in the chip through the self request interface, the method may further include: configuring respective input and output type interfaces for target modules in the chip according to preset interface configuration information, so that the first target module and the second target module both comprise the request interface, the response interface and the data transmission interface; the interface configuration information includes an interface format and the number of interfaces. Each module in the chip is configured with a request interface, a response interface and a data transmission interface, and the types of the three interfaces are input and output type interfaces, so that half-duplex communication can be supported. In this embodiment, the first target module and the second target module are only general terms, and any one module in the chip can be used as a request end and a requested end.
In this embodiment, configuring respective input/output type interfaces for the target modules in the chip according to the preset interface configuration information may include: according to the request interface configuration parameters in the preset interface configuration information, configuring a request interface for a target module in the chip to obtain the request interface; configuring an ACK response interface for a target module in the chip according to response interface configuration parameters in the preset interface configuration information to obtain the response interface; the response interface configuration parameters comprise a request format corresponding to the request response, a request format corresponding to the data response and a request format corresponding to the data volume acquisition request; and configuring a data interface for a target module in the chip according to the data interface configuration parameters in the preset interface configuration information to obtain the data transmission interface.
It should be understood that, for example, fig. 2 is a schematic diagram of a specific inter-chip module DATA transmission interface, where the request interface configured for each module may be specifically a request interface (REQ interface), the response interface may be specifically a ACK (Acknowledgement) response interface, and a DATA transmission interface (DATA interface). The REQ interface is configured to transmit a data transmission request signal, the bit width is 1bit, the high level is defined as REQ valid, the data transmission is requested, the low level is defined as REQ invalid, no data transmission request is generated, and the REQ needs to be kept in a high level valid state all the time in the data transmission process. The data transmission interface is used for transmitting data. The bit width is 1bit, and the serial transmission is performed.
The ACK interface is used for carrying out acknowledgement of data transmission, the ACK is divided into request acknowledgement response and data acknowledgement response, and specific interface format configuration can be as follows:
ACK [0] represents request response, the bit width is 1bit, the first target module sends the response to the second target module, namely the requested module sends the response to the request module for responding to the data transmission request, the high level indicates that the response is successful, otherwise, the response is not responded, namely the requested module does not receive REQ request signals or the requested module cannot transmit data;
the ACK [1] represents a data response, the bit width is 1bit, and the second target module sends the data response to the first target module, namely the request module sends the data response to the requested module, and the data response is used for responding to the ACK [0], so that the requested end can start sending data, the high level indicates that the response is successful, otherwise, the data response is not supposed, namely the request module does not receive a response signal of the ACK [0] or the request module does not prepare for receiving the data;
ACK [ N:2] represents a data quantity acquisition request, and the bit width is configurable and is used for feeding back a variable window to control transmission data.
It can be seen that ACK [0] and ACK [0] are request responses for connection establishment between two modules, ACK [ N:2] is a feedback variable window response signal (N is a set bit width value) for feedback variable window setting control data transmission. Therefore, the speed of data transmission can be controlled by feeding back the setting of the variable window, the data transmission is initiated by adopting a REQ request-based mode, the connection is established and the data transmission is adjusted by an ACK response signal, and the resource waste and the transmission blockage are avoided.
In this embodiment, before the obtaining the data volume obtaining request sent by the second target module through the response interface of the second target module, the method may further include: determining the first data transmission size according to the data transmission configuration information; and according to the first data transmission size, sending target data corresponding to the data transmission request to a data transmission interface of the second target module through a data transmission interface of the first data transmission size. In this embodiment, after the obtaining the data volume obtaining request sent by the second target module through the response interface of the second target module, the method may further include: judging whether the size of the target data in the data volume acquisition request is zero or not; and if the target data size is zero, stopping sending the target data to the second target module.
For example, as shown in FIG. 3, the workflow of the feedback variable window is as follows: when the first time of data transmission is performed, the default window size, namely the default first time of data transmission size, can be set to 8 bits, at this time, after the second target module receives the data, the second target module responds the data by ACK [ N:2] and returns the data to the first target module, the content of the response signal is the number of the data which is expected to be transmitted next time, namely when the first time of 8 bits of data is transmitted, if the second target module has the capability of processing more data at this time, the second target module can send response signals of 16, 24 or 32 and the like by ACK [ N:2], so as to tell the first target module that the next time of data with the more bits can be transmitted; if the second target module is not capable of processing so much data or has no need to transmit data, a response signal such as 4, 2 and the like is sent through ACK [ N:2], and the first target module is informed to reduce data transmission. If ACK [ N:2] sends a response signal with N being 0, the first target module stops sending data after receiving the signal. If the first target module does not receive the ACK signal, the second target module fails to receive, and the first target module resends. By setting the feedback variable window, half-duplex data transmission is realized, meanwhile, the data transmission speed can be controlled, resource waste and transmission blockage are avoided, and the data transmission efficiency is improved.
FIG. 3 is a timing diagram of the inter-chip module data transmission:
(1) Assuming that two modules need to perform data transmission, a first target module (requested module, i.e., data transmitting module, i.e., transmitting end) and a second target module (requested data transmitting module, i.e., data receiving module, i.e., receiving end);
(2) When the receiving end needs the transmitting end to transmit data, the receiving end transmits a REQ signal to the transmitting end;
(3) The sending end receives the REQ signal and sends an ACK [0] response signal to the receiving end according to the self condition;
(4) After receiving ACK [0], the receiving end sends an ACK [1] response signal to the sending end according to the self situation;
(5) After receiving ACK [1], the sending end starts to send data, and the first pen sends 8bit data;
(6) After receiving the data, the receiving end sends ACK [ N:2] to the sending module according to the self condition (if the receiving end still needs a large amount of data transmission and has the capability of processing, a larger value of ACK [ N:2] can be sent to the sending module, and if the receiving end has no capability of processing more data or does not need data transmission, the value of ACK [ N:2] can be smaller or 0);
(7) After receiving ACK (N: 2), the sending end sets the number of data to be sent next according to the value;
(8) Repeating the steps (6) and (7) until ACK [ N:2] is 0, namely, data transmission is not needed.
From the above, in this embodiment, the first target module in the chip receives, through its own request interface, a data transmission request sent by the second target module in the chip through its own request interface; according to the data transmission request, a request response is sent to a response interface of the second target module through a response interface of the data transmission request, so that communication connection between the first target module and the second target module is established; and according to the communication connection, sending target data corresponding to the data transmission request to the data transmission interface of the second target module through the data transmission interface of the second target module. As can be seen from the above, in this embodiment, the intra-chip module is provided with a request interface, a response interface and a data transmission interface, and different modules in the chip send or receive data transmission requests through their own request interfaces, and simultaneously, different modules in the chip send response responses through their own response interfaces, and data transmission is performed through their own data transmission interfaces between different modules in the chip, so that data transmission can be initiated at any time without occupying a bus, and data transmission efficiency between the intra-chip modules is improved.
Correspondingly, the embodiment of the application also discloses an inter-chip module data transmission device, as shown in fig. 4, which comprises:
a data transmission request acquisition module 11, configured to receive, through a request interface of the data transmission request sent by the second target module in the chip through the request interface of the data transmission request acquisition module;
a communication connection establishment module 12, configured to send a request response to the response interface of the second target module through the response interface of the communication connection establishment module according to the data transmission request, so as to establish a communication connection between the first target module and the second target module;
and the data transmission module 13 is configured to send, according to the communication connection, target data corresponding to the data transmission request to a data transmission interface of the second target module through a data transmission interface of the second target module.
From the above, in this embodiment, the first target module in the chip receives, through its own request interface, a data transmission request sent by the second target module in the chip through its own request interface; according to the data transmission request, a request response is sent to a response interface of the second target module through a response interface of the data transmission request, so that communication connection between the first target module and the second target module is established; and according to the communication connection, sending target data corresponding to the data transmission request to the data transmission interface of the second target module through the data transmission interface of the second target module. As can be seen from the above, in this embodiment, the intra-chip module is provided with a request interface, a response interface and a data transmission interface, and different modules in the chip send or receive data transmission requests through their own request interfaces, and simultaneously, different modules in the chip send response responses through their own response interfaces, and data transmission is performed through their own data transmission interfaces between different modules in the chip, so that data transmission can be initiated at any time without occupying a bus, and data transmission efficiency between the intra-chip modules is improved.
In some specific embodiments, the data transmission module 13 may specifically include:
a data volume acquisition request receiving unit, configured to acquire a data volume acquisition request sent by the second target module through its own response interface; the data volume acquisition request is a request generated by the second target module according to the data processing state of the second target module;
the data determining unit is used for determining the size of target data according to the data volume acquisition request and determining corresponding target data according to the data transmission request;
and the data packet to be sent generating unit is used for generating a data packet to be sent according to the target data size based on the target data, and sending the data packet to be sent to the data transmission interface of the second target module through the data transmission interface of the data packet to be sent.
In some specific embodiments, the data transmission module 13 may specifically include:
the first data transmission size determining unit is used for determining the first data transmission size according to the data transmission configuration information;
and the data transmission unit is used for transmitting the target data corresponding to the data transmission request to the data transmission interface of the second target module through the data transmission interface of the data transmission unit according to the first data transmission size.
In some specific embodiments, the data transmission module 13 may specifically include:
a data size judging unit, configured to judge whether the target data size in the data size obtaining request is zero;
and the transmission stopping unit is used for stopping sending the target data to the second target module if the size of the target data is zero.
In some specific embodiments, the communication connection establishment module 12 may specifically include:
a request response sending unit, configured to send a request response to the response interface of the second target module through the response interface of the request response sending unit;
and the data response receiving unit is used for receiving the data response corresponding to the request response fed back by the second target module through the response interface of the data response receiving unit so as to establish communication connection between the first target module and the second target module.
In some embodiments, the inter-chip module data transmission device may specifically include:
the interface configuration unit is used for configuring respective input and output type interfaces for the target modules in the chip according to preset interface configuration information, so that the first target module and the second target module both comprise the request interface, the response interface and the data transmission interface; the interface configuration information includes an interface format and the number of interfaces.
In some specific embodiments, the interface configuration unit may specifically include:
a request interface configuration unit, configured to configure a request interface for a target module in the chip according to a request interface configuration parameter in the preset interface configuration information, so as to obtain the request interface;
the response interface configuration unit is used for configuring an ACK response interface for the target module in the chip according to response interface configuration parameters in the preset interface configuration information so as to obtain the response interface; the response interface configuration parameters comprise a request format corresponding to the request response, a request format corresponding to the data response and a request format corresponding to the data volume acquisition request;
and the data transmission interface configuration unit is used for configuring a data interface for the target module in the chip according to the data interface configuration parameters in the preset interface configuration information so as to obtain the data transmission interface.
Further, the embodiment of the application further discloses an electronic device, and referring to fig. 5, the content in the drawing should not be considered as any limitation on the scope of use of the application.
Fig. 5 is a schematic structural diagram of an electronic device 20 according to an embodiment of the present application. The electronic device 20 may specifically include: at least one processor 21, at least one memory 22, a power supply 23, a communication interface 24, an input-output type interface 25, and a communication bus 26. The memory 22 is used for storing a computer program, and the computer program is loaded and executed by the processor 21 to implement relevant steps in the inter-chip module data transmission method disclosed in any of the foregoing embodiments.
In this embodiment, the power supply 23 is configured to provide an operating voltage for each hardware device on the electronic device 20; the communication interface 24 can create a data transmission channel between the electronic device 20 and an external device, and the communication protocol to be followed is any communication protocol applicable to the technical solution of the present application, which is not specifically limited herein; the input/output type interface 25 is used for acquiring external input data or outputting external output data, and the specific interface type thereof may be selected according to the specific application needs, which is not limited herein.
The memory 22 may be a carrier for storing resources, such as a read-only memory, a random access memory, a magnetic disk, or an optical disk, and the resources stored thereon include an operating system 221, a computer program 222, and data 223 including a training set, and the storage may be temporary storage or permanent storage.
The operating system 221 is used for managing and controlling various hardware devices on the electronic device 20 and the computer program 222, so as to implement the operation and processing of the processor 21 on the mass data 223 in the memory 22, which may be Windows Server, netware, unix, linux, etc. The computer program 222 may further include a computer program capable of performing other specific tasks in addition to the computer program capable of performing the method of inter-chip module data transmission performed by the electronic device 20 as disclosed in any of the foregoing embodiments.
Further, the embodiment of the application also discloses a computer storage medium, wherein the computer storage medium stores computer executable instructions, and when the computer executable instructions are loaded and executed by a processor, the steps of the inter-chip module data transmission method disclosed in any embodiment are realized.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, so that the same or similar parts between the embodiments are referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software modules may be disposed in Random Access Memory (RAM), memory, read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The method, the device, the equipment and the medium for transmitting the data between the modules in the chip are described in detail, and specific examples are applied to the explanation of the principle and the implementation mode of the invention, and the explanation of the above examples is only used for helping to understand the method and the core idea of the invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.
Claims (9)
1. An inter-chip module data transmission method, which is applied to a first target module in a chip, comprises the following steps:
receiving a data transmission request sent by a second target module in the chip through a request interface of the second target module through the request interface of the second target module;
according to the data transmission request, a request response is sent to a response interface of the second target module through a response interface of the data transmission request, so that communication connection between the first target module and the second target module is established; the response interface comprises an ACK response interface and is used for responding to data transmission; ACK [ N:2] represents a data quantity acquisition request, and the bit width is configurable and is used for feeding back a variable window and carrying out transmission data control; the N is a set bit width value;
according to the communication connection, sending target data corresponding to the data transmission request to a data transmission interface of the second target module through a data transmission interface of the second target module;
the sending, by the own data transmission interface, the target data corresponding to the data transmission request to the data transmission interface of the second target module includes:
acquiring a data volume acquisition request sent by the second target module through a response interface of the second target module; the data volume acquisition request is a request generated by the second target module according to the data processing state of the second target module;
determining the size of target data according to the data volume acquisition request, and determining corresponding target data according to the data transmission request;
generating a data packet to be sent according to the size of the target data based on the target data, and sending the data packet to be sent to a data transmission interface of the second target module through a data transmission interface of the second target module.
2. The method for inter-chip module data transmission according to claim 1, wherein before the obtaining the data volume obtaining request sent by the second target module through its own response interface, further comprises:
determining the first data transmission size according to the data transmission configuration information;
and according to the first data transmission size, sending target data corresponding to the data transmission request to a data transmission interface of the second target module through a data transmission interface of the first data transmission size.
3. The method for inter-chip module data transmission according to claim 1, wherein after the obtaining the data volume obtaining request sent by the second target module through its own response interface, further comprising:
judging whether the size of the target data in the data volume acquisition request is zero or not;
and if the target data size is zero, stopping sending the target data to the second target module.
4. The method for transmitting data between the on-chip modules according to claim 1, wherein the sending a request response to the response interface of the second target module through the response interface thereof to establish the communication connection between the first target module and the second target module comprises:
sending a request response to a response interface of the second target module through a response interface of the second target module;
and receiving a data response corresponding to the request response fed back by the second target module through the response interface of the second target module so as to establish communication connection between the first target module and the second target module.
5. The method for inter-chip module data transmission according to claim 4, wherein before receiving the data transmission request sent by the second on-chip target module through the own request interface, the method further comprises:
configuring respective input and output type interfaces for target modules in the chip according to preset interface configuration information, so that the first target module and the second target module both comprise the request interface, the response interface and the data transmission interface; the interface configuration information includes an interface format and the number of interfaces.
6. The method for inter-chip module data transmission according to claim 5, wherein configuring respective input/output type interfaces for the target modules in the chip according to preset interface configuration information comprises:
according to the request interface configuration parameters in the preset interface configuration information, configuring a request interface for a target module in the chip to obtain the request interface;
configuring an ACK response interface for a target module in the chip according to response interface configuration parameters in the preset interface configuration information to obtain the response interface; the response interface configuration parameters comprise a request format corresponding to the request response, a request format corresponding to the data response and a request format corresponding to the data volume acquisition request;
and configuring a data interface for a target module in the chip according to the data interface configuration parameters in the preset interface configuration information to obtain the data transmission interface.
7. An inter-chip module data transmission device, which is applied to a first target module in a chip, comprising:
the data transmission request acquisition module is used for receiving a data transmission request sent by the second target module in the chip through the request interface of the second target module;
the communication connection establishment module is used for sending a request response to a response interface of the second target module through a response interface of the communication connection establishment module according to the data transmission request so as to establish communication connection between the first target module and the second target module; the response interface comprises an ACK response interface and is used for responding to data transmission; ACK [ N:2] represents a data quantity acquisition request, and the bit width is configurable and is used for feeding back a variable window and carrying out transmission data control; the N is a set bit width value;
the data transmission module is used for transmitting target data corresponding to the data transmission request to the data transmission interface of the second target module through the data transmission interface of the data transmission module according to the communication connection;
the data transmission module specifically comprises:
a data volume acquisition request receiving unit, configured to acquire a data volume acquisition request sent by the second target module through its own response interface; the data volume acquisition request is a request generated by the second target module according to the data processing state of the second target module;
the data determining unit is used for determining the size of target data according to the data volume acquisition request and determining corresponding target data according to the data transmission request;
and the data packet to be sent generating unit is used for generating a data packet to be sent according to the target data size based on the target data, and sending the data packet to be sent to the data transmission interface of the second target module through the data transmission interface of the data packet to be sent.
8. An electronic device, comprising:
a memory for storing a computer program;
a processor for executing the computer program to implement the inter-chip module data transfer method as claimed in any one of claims 1 to 6.
9. A computer-readable storage medium storing a computer program; wherein the computer program when executed by a processor implements the method of inter-chip module data transfer as claimed in any one of claims 1 to 6.
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