CN114122064A

CN114122064A - Release film and display device comprising same

Info

Publication number: CN114122064A
Application number: CN202110913176.6A
Authority: CN
Inventors: 权在勋; 柳泰铉
Original assignee: Samsung Display Co Ltd
Current assignee: Samsung Display Co Ltd
Priority date: 2020-08-31
Filing date: 2021-08-10
Publication date: 2022-03-01
Also published as: KR20220030400A

Abstract

Provided are a release film and a display device including the same. A display device according to an embodiment includes: a panel; a circuit board arranged to overlap one end of the panel; and a release film disposed to overlap the panel and the circuit substrate, the release film including: a base film including a panel covering portion overlapping the panel and a circuit substrate covering portion protruding from the panel covering portion to a first direction side and overlapping the circuit substrate; and the adhesive layer comprises a panel adhesive part configured on the panel covering part.

Description

Release film and display device comprising same

Technical Field

The invention relates to a release film and a display device comprising the same.

Background

Display devices have increased in importance as multimedia has developed. In response to this, various Display devices such as an Organic Light Emitting Display (OLED), a Liquid Crystal Display (LCD), and the like are used. Such display devices are mainly applied to various mobile electronic devices, for example, portable electronic devices such as smart phones, smart watches, and tablet PCs, and application examples thereof are diversified.

The display device may include a driving part in the form of an Integrated Circuit (IC) that supplies a driving voltage and a scan control signal. The driving unit may be mounted on a flexible film type circuit board in a Chip On Film (COF) manner and connected to the Display Panel (DP). In addition, a driving control part may be included that generates a gate control signal, a data control signal, and image data using an image signal and a plurality of timing signals received from an external system, and supplies the generated gate control signal, data control signal, and image data to the driving part.

Disclosure of Invention

The invention provides a release film capable of preventing a circuit substrate from tilting and a display device comprising the release film.

Technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned can be clearly understood by those skilled in the art from the following description.

A display device according to an embodiment for solving the technical problem includes: a panel; a circuit board disposed to overlap one end of the panel; and a release film disposed to overlap the panel and the circuit board, the release film including: a base film including a panel covering portion overlapping the panel and a circuit substrate covering portion protruding from the panel covering portion to a first direction side and overlapping the circuit substrate; and an adhesive layer including a panel adhesive portion disposed on the panel covering portion.

A width of the panel covering portion in a second direction intersecting the first direction may be larger than a width of the circuit substrate covering portion in the second direction.

The second direction one side and the other side edges of the circuit substrate covering portion may be located more inward than the second direction one side and the other side edges of the panel covering portion.

The adhesive layer may further include a circuit board adhesive portion disposed on the circuit board covering portion.

The display device may further include a reinforcing member disposed on the circuit substrate adjacent to the panel, and the release film may include a release film opening portion overlapping the reinforcing member.

A width of the release film opening portion in a second direction intersecting the first direction may be smaller than a width of the circuit substrate covering portion in the second direction.

The display device may further include a weight member disposed on the circuit substrate covering portion.

The circuit substrate covering portion may include: a first region overlapping with the circuit substrate; and a second region not overlapping with the circuit substrate, the area of the first region being larger than the area of the second region.

A release film according to an embodiment for solving the another technical problem includes a release film opening portion, the release film including: a base film; and an adhesive layer disposed on the base film, the base film including: a panel covering portion having a first width in a first direction; and a circuit board covering portion extending from the panel covering portion in a second direction intersecting the first direction and having a second width smaller than the first width in the first direction, the adhesive layer including a panel adhesive portion disposed on the panel covering portion, the release film opening portion being surrounded by the circuit board covering portion and disposed adjacent to the panel covering portion and having a third width smaller than the second width in the first direction.

The release film may further include a weight member disposed on the circuit substrate covering portion.

(effect of the invention)

Based on the release film according to an embodiment and the display device including the same, the lift-up of the circuit substrate attached to the composite panel can be prevented.

Effects according to the embodiments are not limited to those exemplified above, and more various effects are included in the present specification.

Drawings

Fig. 1 is a front plan view of a display device according to an embodiment.

Fig. 2 is a rear plan view of a display device according to an embodiment.

Fig. 3 is a plan view of a release film according to an embodiment.

Fig. 4 is a sectional view taken along IV-IV' of fig. 3.

Fig. 5 is a sectional view taken along V-V' of fig. 1.

Fig. 6 is a partially enlarged view of a of fig. 5.

Fig. 7 is a sectional view taken along VII-VII' of fig. 1.

Fig. 8 is a flowchart illustrating a method of manufacturing a display device according to an embodiment.

Fig. 9 is a schematic diagram illustrating a state in which a display device according to an embodiment is loaded on a tray.

Fig. 10 is a sectional view of a display device according to another embodiment.

Fig. 11 is a front plan view of a display device according to yet another embodiment.

Fig. 12 is a rear plan view of a display device according to yet another embodiment.

Fig. 13 is a plan view of a release film according to yet another embodiment.

Fig. 14 is a rear plan view of a display device according to yet another embodiment.

Fig. 15 is a sectional view taken along XV-XV' of fig. 14.

Fig. 16 is a plan view of a release film according to yet another embodiment.

Fig. 17 is a front plan view of a display device according to yet another embodiment.

Fig. 18 is a rear plan view of a display device according to yet another embodiment.

Fig. 19 is a plan view of a release film according to yet another embodiment.

Fig. 20 is a rear plan view of a display device according to yet another embodiment.

Fig. 21 is a sectional view taken along XXI-XXI' of fig. 20.

(description of reference numerals)

1: display device

100: composite panel

200: first circuit board

300: second circuit board

400: first drive chip

500: third circuit board

600: second driving chip

700: covering pad

800: release film

900: reinforcing member

Detailed Description

The advantages and features of the present invention and the methods of accomplishing the same will become apparent from the following detailed description of the embodiments when taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be embodied in various forms different from each other, and the embodiments are provided only for the purpose of making the disclosure of the present invention complete and for the purpose of fully conveying the scope of the present invention to those having ordinary knowledge in the art to which the present invention pertains, and the present invention is limited only by the scope of the claims.

References to elements or layers being "on" other elements or layers are intended to include the entire instances being directly on the other elements or intervening layers or other elements. Like reference numerals refer to like elements throughout the specification.

Although the terms first, second, etc. are used for describing various constituent elements, it is apparent that these constituent elements are not limited to these terms. These terms are only used to distinguish one constituent element from another constituent element. Therefore, the first constituent element mentioned below may obviously be the second constituent element within the technical idea of the present invention.

Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

Fig. 1 is a front plan view of a display device according to an embodiment. Fig. 2 is a rear plan view of a display device according to an embodiment. Fig. 3 is a plan view of a release film according to an embodiment. Fig. 4 is a sectional view taken along IV-IV' of fig. 3. Fig. 5 is a sectional view taken along V-V' of fig. 1. Fig. 6 is a partially enlarged view of a of fig. 5. Fig. 7 is a sectional view taken along VII-VII' of fig. 1.

Referring to fig. 1 to 7, the display device 1 may be used as a device for displaying video or still images. For example, the display device 1 may be used not only as a portable electronic device such as a Mobile phone (Mobile phone), a smart phone (smart phone), a tablet PC (tablet personal computer), a smart watch (smart watch), a watch phone (watch phone), a Mobile communication terminal, an electronic manual, an electronic book, a Portable Multimedia Player (PMP), a navigator, an Ultra Mobile PC (UMPC), and the like, but also as a display screen of various products such as a television, a notebook computer, a display, an advertisement board, and an internet of things (IOT). However, without being limited thereto, the display device 1 may be an intermediate display module used in processes for manufacturing various products as described above. In this case, a part of the structure may be added to or removed from the display device 1 to manufacture a finished product of the display device 1.

The display device 1 may be any one of an organic light emitting display device, a liquid crystal display device, a plasma display device, a field emission display device, an electrophoretic display device, an electrowetting display device, a quantum dot light emitting display device, and a micro LED display device. Hereinafter, the display device 1 is described as an example of an organic light emitting display device, but is not limited thereto.

The display device 1 according to an embodiment may include: a composite panel 100; a first circuit board 200 arranged to overlap the other end portion in the second direction Y of the composite panel 100; a first driving chip 400 disposed on the first circuit substrate 200; a second circuit board 300 arranged to overlap the other end portion in the second direction Y of the first circuit board 200; a third circuit board 500 arranged to overlap the first circuit board 200 and the second circuit board 300; a second driving chip 600 disposed on the third circuit substrate 500; a cover pad 700 covering the first driving chip 400 and the second driving chip 600; a release film 800 covering the back surfaces of the composite panel 100, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500; and a reinforcing member 900 disposed adjacent to the composite panel 100 on the back surface of the first circuit substrate 200.

Composite panel 100 may include: a display panel DP displaying an image; and a touch screen panel TSP sensing a touch stimulus. As described above, the display device 1 according to an embodiment may be only the intermediate display module, but the composite panel 100 itself may be in a finished state after finishing.

The composite panel 100 may be formed as a plane of a rectangular form having a short side of the first direction X and a long side of the second direction Y crossing the first direction X. The corner (corner) where the short side of the first direction X and the long side of the second direction Y intersect may be formed roundly or as a right angle. The shape in plan view of the composite panel 100 is not limited to a quadrangle, but may have other polygonal, circular, or elliptical shapes. A detailed description of the composite panel 100 will be described later.

The first circuit substrate 200 may be disposed on the other side of the composite panel 100 in the second direction Y. The first circuit substrate 200 may be attached to the other side of the composite panel 100 in the second direction Y using an anisotropic conductive film (anisotropic conductive film). The first circuit substrate 200 may be a flexible film (flexible film) such as a chip on film (chip on film), but is not limited thereto, and may be a flexible printed circuit board (flexible printed circuit board) or a printed circuit board (printed circuit board).

The back surface of one end portion in the second direction Y of the first circuit substrate 200 may be in contact with the top surface of the other end portion in the second direction Y of the composite panel 100. The back surface of the other end portion of the first circuit board 200 in the second direction Y may be in contact with an upper surface of one end portion of the second circuit board 300 in the second direction Y, which will be described later. The upper surface of the other end of the first circuit board 200 in the first direction X may be in contact with the rear surface of a third circuit board 500, which will be described later. The width of the first circuit substrate 200 in the first direction X may be constant as gradually decreasing from one side to the other side in the second direction Y. The width of one end portion of the first circuit substrate 200 in the second direction Y may be greater than the width of the other end portion in the second direction Y.

The first driving chip 400 in the form of an Integrated Circuit (IC) may be mounted on the first circuit substrate 200. The first driving chip 400 may serve as a display driving part that outputs a signal and a voltage for driving the display panel DP. For example, the first driving chip 400 may supply a data voltage to a data wiring, or supply a driving voltage to a driving voltage wiring, or supply a scan control signal to a scan driving part.

The second circuit substrate 300 may be disposed on the other side of the first circuit substrate 200 in the second direction Y. The second circuit board 300 may be a driving control unit that generates a gate control signal, a data control signal, and image data using an image signal and a plurality of timing signals received from an external system, and supplies the generated gate control signal, data control signal, and image data to the first driving chip 400 and the second driving chip 600, which will be described later.

The upper surface of one end portion in the second direction Y of the second circuit board 300 may be in contact with the back surface of the other end portion in the second direction Y of the first circuit board 200. The upper surface of the other end of the second circuit board 300 in the first direction X may be in contact with the rear surface of a third circuit board 500, which will be described later.

The first direction X side edge of the second circuit substrate 300 may be disposed on the other side of the first direction X than the first direction X side edge of the composite panel 100. One side edge in the second direction Y of the second circuit board 300 may be parallel to one side edge in the second direction Y of the composite panel 100, and the other side edge in the second direction Y of the second circuit board 300 may substantially travel toward the second direction Y as it goes toward the first direction X side. Therefore, the width of the second circuit substrate 300 in the second direction Y may gradually decrease from the other end portion to the one end portion in the first direction X.

The second circuit substrate 300 may include a fingerprint sensing hole 320. The fingerprint sensing hole 320 may be formed to provide a path through which light can enter a fingerprint sensor (not shown) in the display device 1 in a finished state. Although the fingerprint sensing hole 320 is illustrated as being circular in a plan view in fig. 1, the shape of the fingerprint sensing hole 320 in a plan view is not limited thereto and may have an elliptical or polygonal shape. When the second circuit substrate 300 is bent toward the rear surface of the composite panel 100, the fingerprint sensing hole 320 may be configured to overlap with the other side area of the second direction Y compared to the central portion of the composite panel 100. The fingerprint sensing hole 320 may be disposed on the other side of the first driving chip 400 in the second direction Y.

The second circuit substrate 300 may include a first connector 330, and the first connector 330 may be connected to an external wiring. The first connector 330 may be disposed on the other side of the second circuit substrate 300 in the first direction X. The first connector 330 may protrude outward from the other side edge of the first direction X of the composite panel 100.

The third circuit substrate 500 may be disposed on the first circuit substrate 200 and the second circuit substrate 300. The third circuit substrate 500 may be a touch driving circuit substrate. The third circuit board 500 may be disposed to overlap the first circuit board 200 and the second circuit board 300. The third circuit substrate 500 may be disposed on the other side of the first driving chip 400 in the first direction X.

The third circuit substrate 500 may include: a first region 511 overlapping the first circuit substrate 200; and a second region 512 overlapping with the second circuit substrate 300. The first region 511 may become constant as the width decreases from one side to the other side in the second direction Y. The width of one end of the second region 512 in the second direction Y may be greater than the width of the other end in the second direction Y.

The first region 511 may be disposed on the other side of the first direction X of the first driving chip 400 in a plan view. The second region 512 may be disposed on the other side of the fingerprint sensing hole 320 in the first direction X in a plan view. A second driving chip 600, which will be described later, may be mounted on the second region 512.

The third circuit substrate 500 may further include a second connector 520, and the second connector 520 may be connected to an external wiring. The second connector 520 may be disposed on the other side of the second region 512 in the second direction Y. The second connector 520 may protrude outward from the other side edge in the second direction Y of the second circuit substrate 300.

The second driving chip 600 in the form of an Integrated Circuit (IC) may be mounted on the third circuit substrate 500. The second driving chip 600 may be connected to touch electrodes (not shown) included in the touch screen panel TSP. The second driving chip 600 may apply a touch driving signal to the touch electrode and determine a static capacitance value of the touch electrode. The touch driving signal may be a signal having a plurality of driving pulses. The second driving chip 600 may determine whether a touch is input according to the capacitance value, and calculate a touch coordinate of the input touch.

In the display device 1 according to an embodiment, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 may be arranged in an unfolded state. That is, one surface of the composite panel 100 and one surface of each of the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 may be substantially located on the same plane. The first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 may be bent in a subsequent process, and fixed by a bracket or a frame for encapsulation. In this case, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 may be disposed to overlap the composite panel 100.

The first driving chip 400 and the second driving chip 600 may be covered and protected by a cover pad 700. For example, the cover gasket 700 may be a step compensation tape. The cover pad 700 may include: a first cover pad 710 covering the first driving chip 400 disposed on the first circuit substrate 200; and a second cover pad 720 covering the second driver chip 600 disposed on the third circuit substrate 500.

The first cover pad 710 may be configured to completely cover the first driving chip 400. The first cover pad 710 may compensate for a step generated by the first driving chip 400 being configured. One side of the first cover pad 710 may be substantially flat. The first cover pad 710 may partially overlap the first circuit substrate 200 and the second circuit substrate 300, and may not overlap the third circuit substrate 500. The first cover pad 710 may be positioned at the first direction X side of the third circuit substrate 500. Although not shown, the first cover pad 710 may be attached to the first circuit substrate 200 and the first driving chip 400 by an adhesive member (not shown). For example, the adhesive means may be a Pressure Sensitive Adhesive (PSA). The first cover pad 710 may include a cover pad grip 712 disposed at one side of the first direction X so as to be easily removed as needed in a subsequent process.

The second cover pad 720 may be configured to completely cover the second driving chip 600. One side of the second cover pad 720 may be substantially flat. The second cover pad 720 may overlap the second circuit substrate 300 and the third circuit substrate 500, and may not overlap the first circuit substrate 200. The second cover pad 720 may be positioned at the other side of the first circuit substrate 200 in the second direction Y. Although not shown, the second cover pad 720 may be attached to the third circuit substrate 500 and the second driving chip 600 by an adhesive member (not shown). For example, the adhesive means may be a Pressure Sensitive Adhesive (PSA). The second cover pad 720 may also be removed as needed in a subsequent process as the first cover pad 710 described above.

The release film 800 may be disposed on the back surfaces of the composite panel 100, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500. The release film 800 may overlap the composite panel 100, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500. The release film 800 may be attached to the rear surface of the composite panel 100 to protect the rear surface of the composite panel 100 disposed upward when the display device 1 is mounted on a tray (see "TR" in fig. 9) or transported. The release film 800 may be removed in a subsequent process after loading or handling of the display device 1 is completed.

The release film 800 may include a base film 810 and an adhesive layer 820 disposed on one side of the base film 810.

The base film 810 may include: a panel covering portion 811 overlapping the composite panel 100; a circuit board covering portion 812 extending from the panel covering portion 811 to the other side in the second direction Y and at least partially overlapping the first circuit board 200, the second circuit board 300, and the third circuit board 500; and a base film grip 813 projecting from the panel covering portion 811 to one side. The base film 810 may not be bent. Accordingly, at least one side of the base film 810 may be located on the same plane.

Panel covering portion 811 may have a shape substantially similar to composite panel 100. For example, the panel covering portion 811 may have a rectangular shape in plan view. The panel covering portion 811 may have a corner of a right-angled shape, but is not limited thereto, and may have a rounded corner. The panel covering portion 811 may be integrally attached to the rear surface of the composite panel 100. Specifically, the panel covering portion 811 may be air-tightly attached to the rear surface of the lower covering panel BP described later as a whole. Even if there is a step at the rear surface of the lower cover panel BP, the panel cover 811 may be air-tightly attached to the rear surface of the lower cover panel BP due to the property of flexibility (flex).

The edge of panel covering portion 811 and the edge of composite panel 100 may be substantially parallel. For example, one side edge of the panel covering portion 811 in the second direction Y may be parallel to one side edge of the composite panel 100 in the second direction Y, the other side edge of the panel covering portion 811 in the first direction X may be parallel to the other side edge of the composite panel 100 in the first direction X, and one side edge of the panel covering portion 811 in the first direction X may be parallel to one side edge of the composite panel 100 in the first direction X, but is not limited thereto.

The edge of panel covering portion 811 may be located inside than the edge of composite panel 100. That is, the edge of the panel covering portion 811 may be disposed on the composite panel 100. The second direction Y side edge of the panel covering portion 811 may be disposed at a first interval d1 from the second direction Y side edge of the composite panel 100. The other side edge in the first direction X of the panel covering portion 811 may be disposed at a second interval d2 from the other side edge in the first direction X of the composite panel 100. The first direction X side edge of the panel covering portion 811 may be disposed at a third interval d3 from the first direction X side edge of the composite panel 100. The sum of the second interval d2 and the third interval d3 may be constant, but is not limited thereto.

The width of the panel covering portion 811 in the first direction X may be constant. For example, the panel covering portion 811 may have a first width W1 toward the first direction X. The width of the panel covering portion 811 in the second direction Y may be constant. For example, the panel covering portion 811 may have a fourth width W4 in the second direction Y.

The circuit substrate covering portion 812 may have a rectangular shape in plan view. For example, the circuit substrate covering part 812 may have a second width W2 smaller than the first width W1 toward the first direction X and a fifth width W5 smaller than the fourth width W4 toward the second direction Y. However, the circuit board covering portion 812 may have any of other polygonal, elliptical, and circular shapes. The circuit substrate covering part 812 and the circuit substrate adhesive part 822 may cover the fingerprint sensing hole 320. The circuit substrate covering portion 812 may be partially attached to one surface of the second circuit substrate 300 and the third circuit substrate 500. The specific description thereof will be described later.

The circuit substrate covering part 812 may include: a first circuit board covering portion 812a that overlaps the first circuit board 200, the second circuit board 300, and the third circuit board 500; and a second circuit board covering portion 812b not overlapping with the first circuit board 200, the second circuit board 300, and the third circuit board 500. In the front plan view of the display device 1 according to an embodiment shown in fig. 1, it may be that the front of the first circuit substrate cover portion 812a is not exposed, but the front of the second circuit substrate cover portion 812b is exposed. The area of the first circuit substrate covering part 812a may be larger than that of the second circuit substrate covering part 812b, but is not limited thereto.

The release film opening 830 may be disposed to be surrounded by the circuit substrate covering portion 812. The release film opening 830 may be disposed to overlap a reinforcing member 900 described later. The release film opening 830 may expose at least one surface of the reinforcing member 900 to enable visual confirmation of the reinforcing member 900 from the outside. That is, the form, position, adhesion state, and the like of the reinforcing member 900 can be visually confirmed through the release film opening 830 of the circuit board covering portion 812. The release film opening part 830 may have a rectangular shape in a plan view. For example, the release film opening part 830 may have a third width W3 smaller than the first width W1 and the second width W2 in the first direction X and a sixth width W6 smaller than the fourth width W4 and the fifth width W5 in the second direction Y. However, the release film opening 830 may have any of other polygonal, elliptical, and circular shapes.

One and other side edges of the first direction X of the circuit substrate covering portion 812 may be parallel to one and other side edges of the first direction X of the panel covering portion 811. Further, the first direction X side and the other side edges of the circuit board covering portion 812 may be located inside the first direction X side and the other side edges of the panel covering portion 811. Specifically, the first direction X one side edge of the circuit substrate covering portion 812 may be located on the other side of the first direction X than the first direction X one side edge of the panel covering portion 811. The other side edge in the first direction X of the circuit substrate covering portion 812 may be located on the first direction X side than the other side edge in the first direction X of the panel covering portion 811.

The first-direction X side edge of the circuit board covering portion 812 and the first-direction X side edge of the panel covering portion 811 may be disposed with a seventh width W7 therebetween. The other side edge of the circuit board covering portion 812 in the first direction X and the other side edge of the panel covering portion 811 in the first direction X may be disposed with a seventh width W7.

The adhesive layer 820 may be disposed on one surface of the base film 810 on the entire surface. The adhesive layer 820 may include: a panel bonding portion 821 arranged on the panel covering portion 811; and a circuit board bonding portion 822 disposed on the circuit board covering portion 812. The adhesive layer 820 may not be disposed on the base film grip 813, but is not limited thereto.

Panel bonding part 821 may be disposed between panel covering part 811 and composite panel 100. Specifically, the panel bonding part 821 may be disposed between the panel covering part 811 and a lower cover panel BP described later. A coupling force between the panel adhesive part 821 and the panel covering part 811 may be greater than a coupling force between the panel adhesive part 821 and the lower cover panel BP. If the release film 800 is removed in a subsequent process, the panel adhesive part 821 may be removed together with attaching to the panel covering part 811 without remaining on the lower covering panel BP side.

The circuit substrate adhesive part 822 may be disposed between the circuit substrate covering part 812 and the second circuit substrate 300. The coupling force between the circuit substrate adhesive part 822 and the circuit substrate covering part 812 may be greater than the coupling force between the circuit substrate adhesive part 822 and the second circuit substrate 300. When the release film 800 is removed in a subsequent process, the circuit substrate adhesive part 822 may be removed together with the circuit substrate covering part 812 without remaining on the second circuit substrate 300 side. The adhesive layer 820 may, for example, include a Pressure Sensitive Adhesive (PSA).

The reinforcing member 900 may be disposed on the back surface of the first circuit substrate 200. The reinforcing member 900 may be disposed in close proximity to the composite panel 100. As described above, the reinforcing member 900 may be disposed to overlap the release film opening 830. One surface of the reinforcing member 900 may be in contact with the back surface of the first circuit board 200, and a side surface of the reinforcing member 900 perpendicular to the one surface may be in contact with the composite panel 100. The reinforcing member 900 may function to prevent damage of the first circuit substrate 200 in a region where the first circuit substrate 200 and the composite panel 100 are joined to each other by supporting the first circuit substrate 200. The reinforcing member 900 may include, for example, a silicon member, but is not limited thereto. In the rear plan view of the display device 1 shown in fig. 2, the edge of the rear surface of the reinforcing member 900 may be located inward of the edge of the release film opening 830 described above.

The following describes a laminated structure of the composite panel 100. Although fig. 6 shows the lower cover panel BP positioned uppermost and the cover window CW positioned lowermost, for convenience, the following description will be made with reference to the cover panel BP positioned lowermost and the cover window CW positioned uppermost.

Composite panel 100 may include: a display panel DP; a touch screen panel TSP disposed on the display panel DP; a polarizing film PF disposed on the touch screen panel TSP; a cover window CW arranged on the polarizing film PF; and a lower cover panel BP disposed below the display panel DP.

The display panel DP may include: a first substrate SUB 1; a thin film transistor layer TFTL disposed on the first substrate SUB 1; a light emitting element layer EML configured on the thin film transistor layer TFTL; an encapsulation layer TFEL disposed on the light emitting element layer EML; the second substrate SUB2 is disposed on the encapsulation layer TFEL.

The first substrate SUB1 may be made of an insulating substance such as glass, quartz, or polymer resin. The first substrate SUB1 may be a rigid (rig) substrate or a flexible (flex) substrate that may be bent (bending), folded (folding), rolled (rolling), etc.

The thin-film transistor layer TFTL may be disposed on the first substrate SUB 1. The thin-film transistor layer TFTL may include a plurality of wirings and an insulating layer insulating the wirings from each other. The driving of the composite panel 100 may be controlled by signals applied from the respective wirings. The plurality of wirings may include a metal substance, and the insulating layer may include an organic film and/or an inorganic film.

The light emitting device layer EML may be disposed on the thin film transistor layer TFTL. The light emitting element layer EML may include an anode electrode, an organic light emitting layer, and a cathode electrode.

The organic light emitting layer may include an organic substance to emit light of a predetermined color. The organic light emitting layer may include a hole transporting layer (hole transporting layer), an organic material layer, and an electron transporting layer (electron transporting layer).

The encapsulation layer TFEL encapsulating the light emitting element layer EML may be disposed on the light emitting element layer EML. The encapsulation layer TFEL may include at least one inorganic film in order to prevent oxygen or moisture from penetrating into the light emitting element layer EML. In addition, the encapsulation layer TFEL may include at least one organic film in order to protect the light emitting element layer EML from foreign substances.

The second substrate SUB2 may be disposed on the encapsulation layer TFEL. The second substrate SUB2 may be a transparent substrate. The second substrate SUB2 may be made of the same material as the first substrate SUB1, and may be a rigid (stiff) substrate or a flexible (flexible) substrate that can be bent (bending), folded (folding), rolled (rolling), or the like. The second substrate SUB2 may function as a package substrate that packages the light emitting element layer EML.

The touch screen panel TSP may be disposed on the display panel DP. Specifically, the touch screen panel TSP may be disposed on the second substrate SUB 2. However, without being limited thereto, the touch screen panel TSP may be provided in a separate panel form to be attached to the composite panel 100.

For example, the touch screen panel TSP may operate in an electrostatic capacity manner. In this case, the touch screen panel TSP may include: a touch electrode for sensing a touch of a user; a touch electrode pad; and a touch signal line connecting the touch electrode pad and the touch electrode. The touch signal line may be connected to a second driving chip 600 disposed on a third circuit substrate 500, which will be described later. However, the touch screen panel TSP may be operated by any one of a resistive type, an infrared type, an acoustic wave type, and a pressure sensitive type.

The polarizing film PF may be disposed on the touch screen panel TSP. The polarizing film PF may include a linear polarizer and a phase retardation film. The phase retardation film may be disposed on the touch screen panel TSP, and the linear polarizer may be disposed on the phase retardation film. However, without being limited thereto, the polarizing film PF may be omitted.

The cover window CW may be disposed on the polarizing film PF. The cover window CW may be constructed of a transparent substance including glass or plastic. For example, the cover window CW may include an ultra thin film glass (UTG) or Polyimide (PI) film having a thickness of 0.1mm or less. The cover window CW may be attached to the polarizing film PF through a transparent adhesive member. The transparent adhesive member may be, for example, an Optically Clear Adhesive (OCA) film, but is not limited thereto.

The lower cover panel BP may be disposed below the display panel DP. The lower cover panel BP may include at least one of a light absorbing member for absorbing light incident from the outside, a buffering member for absorbing impact from the outside, and a heat radiating member for effectively radiating heat generated from the composite panel 100. The lower cover panel BP may be attached to the first substrate SUB1 by an adhesive member (not shown). For example, the adhesive means may be a Pressure Sensitive Adhesive (PSA).

In the case where the first circuit substrate 200 is a flexible film (flexible film), bending may occur due to flexibility of itself. When the first circuit board 200 is bent, the second circuit board 300 and the third circuit board 500, which are bonded to the first circuit board 200 and will be described later, may be bent together, and the first circuit board 200, the second circuit board 300, and the third circuit board 500 may be lifted.

Therefore, the second-direction Y-side end portion of the second circuit substrate 300 overlapping the first circuit substrate 200 may be spaced apart from the circuit substrate bonding portion 822. The other end portion of the second circuit substrate 300 in the second direction Y may contact the circuit substrate adhesive portion 822.

For example, the other end portion of the composite panel 100 overlapping the first circuit substrate 200 in the second direction Y may be in contact with the panel adhesive portion 821 and have the first thickness t 1. The second direction Y-side end portion of the second circuit substrate 300 may have a second thickness t2 smaller than the first thickness t 1. The second-direction Y-side end of the second circuit substrate 300 and the circuit substrate bonding part 822 may be spaced apart by a third thickness t 3. The third thickness t3 may be the same as the difference between the first thickness t1 and the second thickness t 2. However, as described above, the other end portion of the second circuit substrate 300 in the second direction Y may be in contact with the circuit substrate bonding portion 822.

The reinforcing member 900 may have a fourth thickness t 4. The fourth thickness t4 may be less than the first thickness t1 and the second thickness t 2. Therefore, the reinforcing member 900 may be disposed to be spaced apart from the release film 800 in the third direction Z. In addition, the reinforcing member 900 may not protrude to the outside of the release film opening 830.

As described above, the third circuit substrate 500 may overlap the first circuit substrate 200 and the second circuit substrate 300. There may be a step between the upper face of the first circuit substrate 200 and the upper face of the second circuit substrate 300. Therefore, a step may exist on the upper surface of the third circuit substrate 500. The step existing on the upper surface of the third circuit substrate 500 may be a fifth thickness t 5.

The display device 1 according to an embodiment includes the release film 800 overlapping the composite panel 100, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500, so that the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted. Specifically, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted by the elastic restoring force of the release film 800. In the case where the display device 1 is mounted on a tray (see "TR" in fig. 9) in a state where the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 included in the display device 1 are lifted, the display device 1 may be damaged if the alignment of the display device 1 is not correct. Therefore, the display device 1 is mounted on the tray in a state in which the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 are prevented from being lifted up, and thus damage to the display device can be minimized.

Fig. 8 is a flowchart illustrating a method of manufacturing a display device according to an embodiment. Fig. 9 is a schematic diagram illustrating a state in which a display device according to an embodiment is loaded on a tray.

Referring to fig. 8, a method of manufacturing a display device according to an embodiment may include: a step (S11) of providing a display device including a composite panel and first to third circuit substrates; a step (S21) of attaching a release film covering the composite panel and the first to third circuit substrates to one surface of the display device; a step (S31) of loading and conveying the display device with the release film attached on the tray; and a step (S41) of removing the release film from the display device and bending the first to third circuit substrates for packaging.

In the step of providing a display device including the composite panel and the first to third circuit substrates (S11) and the step of attaching the release film covering the composite panel and the first to third circuit substrates to one surface of the display device (S21), the display device 1 and the release film 800 are the display device 1 and the release film 800 described above with reference to fig. 1 to 7. Therefore, detailed description about the display device 1 and the release film 800 will be omitted.

Referring to fig. 9, the display device 1 according to an embodiment may be loaded on trays TR1 to TR (n). At this time, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 of the display device 1 may be in a state of being unfolded without being bent. The trays TR1 to TR (n) may be plural, including a first tray TR1 to an nth tray TR (n) stacked in sequence. The display devices 1 may be loaded on the first tray TR1 to the (n-1) th tray TR (n-1), and the display devices 1 may not be loaded on the nth tray TR (n) stacked at the uppermost end.

Description will be made of the case where display device 1 is mounted on trays TR1 to TR (n), taking, as an example, the case where display device 1 is mounted on first tray TR1 as a reference. The first tray TR1 may include a bottom surface portion BS, protrusions PT1, PT2, and a side wall WL.

The bottom surface portion BS may constitute a bottom surface of the first tray TR1 and be spaced apart from the loaded display apparatus 1. The protruding portions PT1 and PT2 may extend from the bottom surface BS, protrude toward the third direction Z side, and support the display device 1. For example, the protrusions PT1 and PT2 may support the display device 1 by contacting one surface of the composite panel 100. The protrusions PT1, PT2 may include: a first projection PT1 supporting the other side of the composite panel 100 in the second direction Y; and a second projection PT2 supporting the second direction Y side of the composite panel 100. Although the first tray TR1 including the two protrusions PT1, PT2 is shown in fig. 9, it is not limited thereto, and the protrusions PT1, PT2 may have a greater number. The side wall WL may be disposed around the first tray TR 1. The display device 1 mounted on the first tray TR1 may be disposed in a space surrounded by the side wall WL.

A first spaced space SP1 may be formed between the bottom surface BS of the first tray TR1 and the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500. In addition, a second partitioned space SP2 may be formed between the bottom surface BS of the first tray TR1 and the composite panel 100.

The release film 800 prevents the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 from being lifted up, and thus the display device 1 can be stably loaded in the space in the first tray TR1 surrounded by the side wall WL. Therefore, the respective spaced distances of the first spaced space SP1 and the second spaced space SP2 formed at each of the first tray TR1 to the nth tray TR (n) may be constant.

The display device 1 can be transported in a state of being mounted on the trays TR1 to TR (n). The display device 1 thus carried can be subjected to a subsequent process. For example, the subsequent process may include a step of removing the release film from the display device and bending the first to third circuit substrates for encapsulation (S41). The first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 of the display device 1 may be fixed and encapsulated by a bracket or a frame after being bent. In the packaged display device 1, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 may be arranged to overlap the composite panel 100.

According to the method of manufacturing the display device according to the embodiment, the release film 800 prevents the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 from being lifted up, so that the display device 1 can be stably mounted on the trays TR1 to TR (n). Therefore, damage to the display device 1 that may occur when the display device 1 is loaded on the trays TR1 to TR (n) can be minimized.

Hereinafter, another embodiment of the display device will be described. The description of the display device according to another embodiment to be described later will omit the description overlapping with the display device 1 according to one embodiment, and the description will be mainly made with the difference points.

Referring to fig. 10, the display device 1_1 according to the present embodiment may include a release film 800_1 different from the display device 1 according to an embodiment. The release film 800_1 according to the present embodiment is different from the release film 800 according to an embodiment in that the adhesive layer 820_1 is only disposed to overlap the panel covering portion 811_ 1. That is, the adhesive layer 820_1 may not be disposed on the circuit substrate covering portion 812_ 1.

The display device 1_1 according to the embodiment includes the release film 800_1 overlapping the composite panel 100, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500, so that the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted. Specifically, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted by the elastic restoring force of the release film 800_ 1. In the case where the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 included in the display device 1_1 are mounted on the trays TR1 to TR (n) in a state where the tilting occurs, if the alignment of the display device 1_1 is not correct, the display device 1_1 may be damaged. Therefore, the display device 1_1 is mounted on the trays TR1 to TR (n) in a state in which the first circuit board 200, the second circuit board 300, and the third circuit board 500 are prevented from being lifted up, and thus damage to the display device can be minimized.

In addition, the adhesive layer 820_1 is not disposed on the circuit substrate covering portion 812_1, so that the frictional force between the second circuit substrate 300 and the release film 800_1 can be minimized. Therefore, the effect of preventing the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 from being lifted due to the elastic force of the release film 800_1 can be improved.

Fig. 11 is a front plan view of a display device according to yet another embodiment. Fig. 12 is a rear plan view of a display device according to yet another embodiment. Fig. 13 is a plan view of a release film according to yet another embodiment.

Referring to fig. 11 to 13, a display device 1_2 according to the present embodiment is different from the display device 1 according to an embodiment in that another form of release film 800_2 is included. The release film 800_2 according to the present embodiment may have a uniform width in the first direction X and a uniform width in the second direction Y according to regions. For example, the release film 800_2 according to the present embodiment may have a first width W1_2 in the first direction X and a second width W2_2 in the second direction Y.

The release film 800_2 according to the present embodiment may include a circuit substrate covering portion 812_2 having a wider area in a plan view than the release film 800 according to an embodiment. The circuit substrate covering part 812_2 included in the release film 800_2 according to the present embodiment may entirely cover the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500. That is, the edges of the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 may be located inside the edges of the circuit substrate covering part 812_ 2.

The circuit substrate covering part 812_2 may include: a first circuit board covering portion 812a _2 that overlaps the first circuit board 200, the second circuit board 300, and the third circuit board 500; and a second circuit board covering portion 812b _2 that does not overlap with the first circuit board 200, the second circuit board 300, and the third circuit board 500. The second circuit substrate covering part 812b _2 of the release film 800_2 according to the present embodiment may have a wider area in a plan view than the second circuit substrate covering part 812b of the release film 800 according to an embodiment.

The display device 1_2 according to the embodiment includes the release film 800_2 overlapping the composite panel 100, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500, so that the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted. Specifically, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted by the elastic restoring force of the release film 800_ 2. In the case where the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 included in the display device 1_2 are mounted on the trays TR1 to TR (n) in a state where the tilting occurs, if the alignment of the display device 1_2 is not correct, the display device 1_2 may be damaged. Therefore, the display device 1_2 is mounted on the trays TR1 to TR (n) in a state where the first circuit board 200, the second circuit board 300, and the third circuit board 500 are prevented from being lifted up, and damage to the display device can be minimized.

In addition, the display device 1_2 according to the present embodiment includes the circuit board covering portion 812_2 that covers all of the first circuit board 200, the second circuit board 300, and the third circuit board 500, so that the first circuit board 200, the second circuit board 300, and the third circuit board 500 can be effectively prevented from being lifted in the display device 1_ 2.

Fig. 14 is a rear plan view of a display device according to yet another embodiment. Fig. 15 is a sectional view taken along XV-XV' of fig. 14. Fig. 16 is a plan view of a release film according to yet another embodiment.

Referring to fig. 14 to 16, a display device 1_3 according to the present embodiment is different from the display device 1 according to an embodiment in that a release film 800_3 further including a weight part 840_3 is included.

The release film 800_3 according to the present embodiment may further include a weight part 840_3 disposed on one surface of the circuit substrate covering part 812_ 3. The weight-applying member 840_3 can prevent the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 from being lifted up by its own weight and the release film 800_ 3. The weight of the weight-applying member 840_3 may be set within a range that does not cause damage to the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500. For example, the weight part 840_3 may be composed of a metal plate or the same film as the base film 810_3, but is not limited thereto.

The edge of the weight part 840_3 may be disposed on the circuit substrate covering part 812_ 3. Although the shape of the weight part 840_3 in a plan view is illustrated as a rectangle in fig. 14 and 16, the shape of the weight part 840_3 in a plan view may be any of other polygons, circles, and ellipses, without being limited thereto.

The display device 1_3 according to the embodiment includes the release film 800_3 overlapping the composite panel 100, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500, so that the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted. Specifically, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted by the elastic restoring force of the release film 800_ 3. In the case where the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 included in the display device 1_3 are mounted on the trays TR1 to TR (n) in a state where the tilting occurs, if the alignment of the display device 1_3 is not correct, the display device 1_3 may be damaged. Therefore, the display device 1_3 is mounted on the trays TR1 to TR (n) in a state where the first circuit board 200, the second circuit board 300, and the third circuit board 500 are prevented from being lifted up, and damage to the display device can be minimized.

Furthermore, the display device 1_3 according to the present embodiment includes the weight member 840_3 disposed on one surface of the circuit substrate covering portion 812_3, so that the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be effectively prevented from being lifted by the self-weight of the weight member 840_ 3.

Fig. 17 is a front plan view of a display device according to yet another embodiment. Fig. 18 is a rear plan view of a display device according to yet another embodiment. Fig. 19 is a plan view of a release film according to yet another embodiment.

Referring to fig. 17 to 19, a display device 1_4 according to the present embodiment is different from the display device 1 according to an embodiment in that a release film 800_4 of another shape is included.

The release film 800_4 according to the present embodiment may include a circuit substrate covering part 812_4 extending from the other side of the second direction Y of the panel covering part 811_ 4. The circuit substrate covering portion 812_4 may be plural. For example, the circuit substrate covering portion 812_4 may extend from the first direction X side and the other side of the other end portion in the second direction Y of the panel covering portion 811_ 4. In the present embodiment, the interval between the outer edges of the circuit substrate covering part 812_4 may be the second width W2_4, which is the same as the width in the first direction X of the circuit substrate covering part 812 included in the display device 1 according to an embodiment. The length of the outer edge of the circuit substrate covering part 812_4 in the second direction Y may be a fifth width W5_4, which is the same as the width of the circuit substrate covering part 812 of the release film 800 according to an embodiment in the second direction Y. In the present embodiment, the interval between the inner edges of the circuit substrate covering parts 812_4 may be the third width W3_4, which is the same as the width in the first direction X of the release film opening part 830 included in the display device 1 according to an embodiment. The length of the inner edge of the circuit substrate cover 812_4 in the second direction Y may be a sixth width W6_4 having a value less than the fifth width W5_ 4. The width in the first direction X of each circuit substrate covering portion 812_4 may have a constant value by area, but is not limited thereto. The width of each circuit substrate covering portion 812_4 in the first direction X may have a seventh width W7_ 4.

The weight member 840_4 may be disposed on each circuit board covering portion 812_ 4. The weight-applying member 840_4 can prevent the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 from being lifted up by its own weight and the release film 800_ 4. The weight of the weight-applying member 840_4 may be set within a range that does not cause damage to the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500. The weight part 840_4 may be formed of the same substance as the weight part 840_3 according to the embodiment described above with reference to fig. 14 to 16.

In the present embodiment, the edge of the weight part 840_4 may be located more inward than the edge of each circuit substrate covering part 812_ 4. That is, the edge of the weight part 840_4 may be located on each circuit substrate covering part 812_ 4. Although the weight part 840_4 may be rectangular in plan view, it is not limited thereto and may be any of other polygons, circles, and ellipses. The width of the weight part 840_4 in the second direction Y may be an eighth width W8_4, which is smaller than the length of the outer edge of the circuit substrate covering part 812_4 in the second direction Y, i.e., a fifth width W5_4, and the length of the inner edge of the circuit substrate covering part 812_4 in the second direction Y, i.e., a sixth width W6_ 4. The width of the weight-applying member 840_4 in the first direction X may be the ninth width W9_4, which is smaller than the seventh width W7_4, which is the width of each circuit board covering portion 812_4 in the first direction X.

The reinforcing member 900 may be disposed in a region between the circuit board covering portions 812_4 located on one side and the other side in the first direction X. Specifically, the reinforcing member 900 may be disposed on the second direction Y side in the region between the circuit board covering portions 812_ 4.

The display device 1_4 according to the embodiment includes the release film 800_4 overlapping the composite panel 100, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500, so that the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted. Specifically, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted by the elastic restoring force of the release film 800_ 4. In the case where the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 included in the display device 1_4 are mounted on the trays TR1 to TR (n) in a state where the tilting occurs, if the alignment of the display device 1_4 is not correct, the display device 1_4 may be damaged. Therefore, the display device 1_4 is mounted on the trays TR1 to TR (n) in a state where the first circuit board 200, the second circuit board 300, and the third circuit board 500 are prevented from being lifted up, and thus damage to the display device can be minimized.

Also, the display device 1_4 according to the present embodiment includes the circuit substrate covering portion 812_4 extending from the first direction X side and the other side of the second direction Y other end portion of the panel covering portion 811_4, so that the alignment with the reinforcing member 900 can be easily aligned. Specifically, the alignment of the second direction Y of the release film 800_4 and the reinforcing member 900 can be easily aligned. In addition, the release film 800_4 according to the present embodiment further includes the weight part 840_4 disposed on one surface of the circuit substrate covering portion 812_4, so that the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be effectively prevented from being lifted by the self-weight of the weight part 840_ 4.

Fig. 20 is a rear plan view of a display device according to yet another embodiment. Fig. 21 is a sectional view taken along XXI-XXI' of fig. 20.

Referring to fig. 20 and 21, a display device 1_5 according to the present embodiment is different from the display device 1 according to an embodiment in that a release film 800_5 of another shape is included.

The release film 800_5 according to the present embodiment may include a panel covering part 811_5 and a circuit substrate covering part 812_5 separated from each other. In the present embodiment, one end portion of the circuit substrate covering portion 812_5 in the second direction Y may partially overlap the other end portion of the panel covering portion 811_5 in the second direction Y. The end portion of the circuit substrate covering part 812_5 in the second direction Y and the end portion of the panel covering part 811_5 in the second direction Y may be attached to each other by the circuit substrate bonding part 822_ 5. The circuit substrate covering portion 812_5 is detachable from the panel covering portion 811_ 5. Even if the circuit board covering portion 812_5 is detached from the panel covering portion 811_5, the circuit board bonding portion 822_5 may be disposed on the circuit board covering portion 812_ 5. That is, the coupling force between the circuit substrate adhesive part 822_5 and the circuit substrate covering part 812_5 may be stronger than the coupling force between the circuit substrate adhesive part 822_5 and the panel covering part 811_ 5.

The display device 1_5 according to the embodiment includes the release film 800_5 overlapping the composite panel 100, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500, so that the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted. Specifically, the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 can be prevented from being lifted by the elastic restoring force of the release film 800_ 5. In the case where the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 included in the display device 1_5 are mounted on the trays TR1 to TR (n) in a state where the tilting occurs, if the alignment of the display device 1_5 is not correct, the display device 1_5 may be damaged. Therefore, the display device 1_5 is mounted on the trays TR1 to TR (n) in a state where the first circuit board 200, the second circuit board 300, and the third circuit board 500 are prevented from being lifted up, and damage to the display device can be minimized.

Even with the same shape and size of the composite panel 100, various deformations may occur in the shapes in plan view of the first circuit substrate 200, the second circuit substrate 300, and the third circuit substrate 500 according to the display device 1_ 5. Accordingly, the shape of the circuit board covering portion 812_5 of the release film 800_5 needs to be variously modified. The display device 1_5 according to the present embodiment includes the release film 800_5 including the circuit substrate covering part 812_5 separated from the panel covering part 811_5, so that the circuit substrate covering part 812_5 can be deformed and applied corresponding to various shapes of the first, second and

third circuit substrates

200, 300 and 500.

In the above, the embodiments of the present invention have been described with reference to the accompanying drawings, but it will be understood by those having ordinary knowledge in the art to which the present invention pertains that the present invention may be embodied in other specific forms without changing its technical idea or essential features. The embodiments described above are therefore to be considered in all respects as illustrative and not restrictive.

Claims

1. A display device, comprising:

a panel;

a circuit board disposed to overlap one end of the panel; and

a release film disposed to overlap the panel and the circuit board,

the release film includes:

a base film including a panel covering portion overlapping the panel and a circuit substrate covering portion protruding from the panel covering portion to a first direction side and overlapping the circuit substrate; and

an adhesive layer, a pressure-sensitive adhesive layer,

the adhesive layer includes a panel adhesive portion disposed on the panel covering portion.

2. The display device according to claim 1,

a width of the panel covering portion in a second direction intersecting the first direction is larger than a width of the circuit substrate covering portion in the second direction.

3. The display device according to claim 2,

the second direction one side and the other side edges of the circuit substrate covering portion are located more inward than the second direction one side and the other side edges of the panel covering portion.

4. The display device according to claim 1,

the adhesive layer further includes a circuit substrate adhesive portion disposed on the circuit substrate covering portion.

5. The display device according to claim 1,

the display device further includes a reinforcing member disposed adjacent to the panel on the circuit substrate,

the release film includes a release film opening portion overlapping with the reinforcing member.

6. The display device according to claim 5,

the width of the release film opening part in a second direction intersecting the first direction is smaller than the width of the circuit substrate covering part in the second direction.

7. The display device according to claim 1,

the display device also comprises a weighting component configured on the circuit substrate covering part.

8. The display device according to claim 1,

the circuit substrate covering section includes: a first region overlapping with the circuit substrate; and a second region not overlapping with the circuit substrate,

the area of the first region is larger than the area of the second region.

9. A release film comprising a release film opening portion, wherein the release film comprises:

a base film; and

an adhesive layer disposed on the base film,

the base film includes: a panel covering portion having a first width in a first direction; and a circuit substrate covering portion extending from the panel covering portion to a second direction intersecting the first direction and having a second width smaller than the first width in the first direction,

the adhesive layer includes a panel adhesive part disposed on the panel covering part,

the release film opening portion is surrounded by the circuit substrate covering portion, is disposed adjacent to the panel covering portion, and has a third width smaller than the second width in the first direction.

10. The release film according to claim 9,

the release film also comprises a weighted component configured on the circuit substrate covering part.