CN114113674A - Hot film type mars surface wind field measuring sensor - Google Patents

Hot film type mars surface wind field measuring sensor Download PDF

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Publication number
CN114113674A
CN114113674A CN202111318225.8A CN202111318225A CN114113674A CN 114113674 A CN114113674 A CN 114113674A CN 202111318225 A CN202111318225 A CN 202111318225A CN 114113674 A CN114113674 A CN 114113674A
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wind field
sensor
resistor
sensitive
sensitive chip
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CN202111318225.8A
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Inventor
张雷博
方静
彭泳卿
刘希宝
蔡治国
冯红亮
黄晓瑞
王丰
刘建华
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Beijing Research Institute of Telemetry
Aerospace Long March Launch Vehicle Technology Co Ltd
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Beijing Research Institute of Telemetry
Aerospace Long March Launch Vehicle Technology Co Ltd
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Priority to CN202111318225.8A priority Critical patent/CN114113674A/en
Publication of CN114113674A publication Critical patent/CN114113674A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P5/00—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
    • G01P5/10—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables
    • G01P5/12—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables using variation of resistance of a heated conductor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P13/00—Indicating or recording presence, absence, or direction, of movement
    • G01P13/02—Indicating direction only, e.g. by weather vane

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)

Abstract

The invention provides a hot film type mars surface wind field measuring sensor, comprising: the wind field sensor comprises a wind field sensor sensitive end, an aluminum alloy shell, a signal cable and a sensor cable connector; the sensitive end of the wind field sensor comprises a sensitive chip, a heat insulation base, a gold wire and a switching PCB; the sensitive chip takes monocrystalline silicon as a substrate, and the surface of the monocrystalline silicon substrate adopts MEMS (micro-electromechanical systems) process steps of sputtering, photoetching, corrosion and the like to prepare a film platinum resistor: temperature measuring resistor R1, heating resistor R2 and grounding resistor R3. And R1, R2 and R3 are electrically connected with the adapting PCB plate through gold wires. The sensor is combined with the closed-loop control of a signal conditioning circuit, a sensitive chip can form constant temperature difference with the surrounding environment, wherein the heating power is related to the wind speed and the wind direction, and therefore the measurement of wind field parameters is achieved. The sensor has high sensitivity, and can realize high-precision measurement of wind speed and wind direction parameters in a Mars low-pressure environment.

Description

Hot film type mars surface wind field measuring sensor
Technical Field
The invention relates to the technical field of measurement and testing, in particular to a hot film type mars surface wind field measurement sensor.
Background
As sisters of the earth, the Mars climate has a plurality of similarities with the Earth climate, and the research on the Mars climate is helpful for better understanding the history and future evolution of the Earth climate. Therefore, obtaining the meteorological parameters of the surface of the mars is always one of the important contents of the mars detection. In 7 months in 2020, China develops a first Mars detection task and successfully logs on the Mars surface, and a solid foundation is laid for further implementation of future Mars detection tasks and development of other deep space detection tasks.
The wind field sensor is taken as an important meteorological sensor and is carried in almost all the foreign Mars detection tasks, and wind field information of a plurality of different areas on the surface of the Mars is obtained. The writer participates in the first Mars detection meteorological measurement instrument development in China, and carries a congratulation Mars vehicle to successfully land on the Mars surface.
Relative to the earth surface environment, the main component of the atmosphere on the surface of the Mars is carbon dioxide, the atmospheric density is only about eight thousandth of the atmospheric density of the earth, the temperature range of the surface of the Mars is wide, and the lowest temperature is below-120 ℃. These environmental conditions present a significant challenge to the reliability and measurement accuracy of wind field sensors. At present, the existing wind field measurement technology in China mainly aims at the normal pressure environment and is difficult to be applied to the surface environment of the mars with low pressure, wide temperature range and special atmosphere conditions.
Disclosure of Invention
The invention provides a hot-film mars surface wind field measurement sensor for solving the defects of the existing wind field measurement technology, wherein a temperature measurement resistor, a heating resistor and a rear-end signal conditioning circuit form closed-loop temperature control, and wind field measurement is carried out by maintaining the heating power required by constant temperature difference delta T between a sensitive chip and the environment, so that the wind field parameter measurement under the conditions of low air pressure, different environmental temperatures and various atmospheric media can be realized.
The invention provides a hot film type mars surface wind field measuring sensor which comprises a shell, a wind field sensor sensitive end embedded in the top of the shell, a sensor cable connector arranged at the bottom of the shell and a signal cable fixed on the inner wall of the shell and connected with the wind field sensor sensitive end and the sensor cable connector;
the wind field sensor sensitive end comprises a switching PCB embedded at the top of the shell and connected with the signal cable, a heat insulation base fixed on the upper surface of the switching PCB, a sensitive chip fixed at the top of the heat insulation base and a gold wire connected with the switching PCB and the sensitive chip;
the sensitive chip comprises a substrate and a temperature measuring resistor, a heating resistor and a grounding resistor which are prepared on the upper surface of the substrate by using an MEMS (micro-electromechanical systems) process, wherein the temperature measuring resistor, the heating resistor and the grounding resistor are all electrically connected with the switching PCB through gold wires.
As an optimal mode, the temperature measuring resistor, the heating resistor and the rear end signal conditioning circuit form closed-loop temperature control, the grounding resistor is electrically connected with a machine, and the grounding resistor is used for reducing the noise level of the wind field measuring sensor;
the method for measuring the wind speed by the wind field measuring sensor comprises the following steps: heating power is applied to the heating resistor, closed-loop temperature control is carried out through the temperature measuring resistor, the sensing chip and the environment temperature have a constant temperature difference delta T, and wind speed information is obtained according to the heating power required by the sensing chip and the environment to maintain the constant temperature difference delta T.
As a preferred mode, the thermal insulation base and the sensitive chips are four groups to form a 2 x 2 array, and the distances between two adjacent sensitive chips are the same;
the method for measuring the wind direction by the wind field measuring sensor comprises the following steps: applying heating power to the heating resistor, and performing closed-loop temperature control through the temperature measuring resistor to ensure that the sensitive chip has constant temperature difference delta T with the ambient temperature;
wind of the wind field to be measured flows through the four sensitive chips, and wind direction information is obtained according to the difference relation of power required by each sensitive chip to maintain constant temperature difference delta T.
According to the hot film type mars surface wind field measuring sensor, as an optimal mode, the included angle between the sensitive chip and the ground is 0-20 degrees.
As an optimal mode, the sensing chip is made of monocrystalline silicon, the thickness of the sensing chip is 0.3-0.4 mu m, the surface size of the sensing chip is 1.5 multiplied by 1.5mm, and the temperature measuring resistor, the heating resistor and the grounding resistor are all thin film platinum resistors and are prepared on the upper surface of the sensing chip by sputtering, photoetching and corrosion.
The invention relates to a hot-film Mars surface wind field measuring sensor, which is used as a preferred mode for depositing Al on the surface of a sensitive chip2O3Or SiO2A film.
According to the hot-film mars surface wind field measurement sensor, as a preferred mode, the shell is of an aluminum alloy cylindrical structure, the top surface of the shell is provided with the groove, the switching PCB is arranged in the groove, the upper surface of the switching PCB is flush with the top surface of the shell, and the edge of the upper surface of the shell is chamfered.
According to the hot film type mars surface wind field measurement sensor, as a preferred mode, the heat insulation base comprises four support columns and is made of polyimide, the bottom of the heat insulation base is fixed with the through connection PCB through low-temperature glue, and the sensitive chip is fixed on the upper surface of the heat insulation base through the low-temperature glue.
As an optimal mode, a gold wire is connected with a transfer PCB and a sensitive chip through a ball bonding method, and each bonding pad adopts two-point double lines.
According to the hot film type mars surface wind field measuring sensor, as a preferable mode, the signal cable is fixed on the inner wall of the shell through low-temperature glue.
A hot film type Mars surface wind field measurement sensor comprises a wind field sensor sensitive end, an aluminum alloy shell, a signal cable and a sensor cable connector, wherein the signal cable is fixed on the inner wall of the aluminum alloy shell by adopting low-temperature glue and is connected with the wind field sensor sensitive end and the sensor cable connector; the sensitive end of the wind field sensor comprises a sensitive chip, a heat insulation base, a gold wire and a switching PCB; the sensitive chip takes monocrystalline silicon as a substrate, and the surface of the monocrystalline silicon substrate adopts MEMS (micro-electromechanical systems) process steps of sputtering, photoetching, corrosion and the like to prepare a film platinum resistor: temperature measuring resistor R1, heating resistor R2 and grounding resistor R3. And R1, R2 and R3 are electrically connected with the adapting PCB plate through gold wires.
Furthermore, the aluminum alloy shell is of a cylindrical structure, the sensitive end of the wind field sensor is located on the top surface of the shell, the top surface of the shell is provided with a groove, the switching PCB is placed in the groove of the top surface, the upper surface of the switching PCB is flush with the top surface of the shell, and the edge position of the upper surface of the shell is processed through a fillet.
Furthermore, the heat insulation base of the sensitive end of the wind field sensor is made of polyimide and is prepared by machining, the heat insulation base is in an inverted table shape, and the sensitive chip is located above the heat insulation base and fixed through low-temperature glue. The bottom of the heat insulation structure is fixed with the PCB adapter plate through low-temperature glue.
Furthermore, the sensitive chips and the heat insulation structure form four groups to form a 2 x 2 array, the thickness of each sensitive chip is 0.3-0.4 mu m, the surface size is 1.5 x 1.5mm, the distance between every two adjacent sensitive chips is 0.3-0.5 mm, and the distances between every two sensitive chips are the same.
Furthermore, a temperature measuring resistor R1 and a heating resistor R2 of the sensitive chip and a rear end signal conditioning circuit form closed-loop temperature control, and the sensitive chip and the surrounding environment form constant temperature difference. The ground resistor R3 is mechanically connected.
Further, Al is deposited on the surface of the sensitive chip2O3Or SiO2The thin film protects the platinum resistance sensitive layer.
Furthermore, the gold wire is connected with the sensitive chip and the switching PCB board through a ball bonding method, and each bonding pad adopts double-point double-wire.
Further, in use, the plane of the sensor sensitive chip is parallel to the ground as much as possible, and the maximum included angle is smaller than 20 degrees.
In practical use, heating power is applied to the heating resistor R2, closed-loop temperature control is performed through the temperature measuring resistor R1, so that the constant temperature difference delta T between the sensitive chip and the ambient temperature is achieved, R3 is a grounding resistor, and the noise level of the sensor can be reduced. According to the heat conservation, the heat dissipation rates of the sensitive chip to the outside are different, and the heating power required for maintaining the constant temperature difference delta T is also different, so that the wind speed information can be obtained. The sensor sensitive end is provided with four 2 multiplied by 2 sensitive chip arrays, when wind current is sensitive to the sensitive chips, the temperature rises due to heating, under the action of the heat, the heat dissipation rate of the sensitive chips flowing through after the wind is reduced, and the power required by maintaining the constant temperature difference delta T is reduced relative to the sensitive chips flowing through first. For different wind direction angles, different difference relations can appear in the power needed by maintaining the constant temperature difference delta T between each sensitive chip and the environment temperature, and therefore wind direction information is obtained. The sensor has high sensitivity, high precision and high response speed, and can be used in the temperature range of-70 to +40 ℃ under low pressure and various atmospheric media. The theoretical measurement value covers the currently known Mars wind speed range, and meanwhile, the two-dimensional wind direction of a plane of 0-360 degrees can be measured. Besides being used as a mars wind field sensor, the sensor can measure the wind speed and wind direction information of the high-altitude atmosphere by carrying a test device such as an air sounding balloon.
The invention has the following advantages:
the hot film type wind field sensor is provided on the basis of a wind field sensor of a fusion signal meteorological measuring instrument, can be used for acquiring the wind speed and wind direction information of the surface of a mars, and has good precision and sensitivity compared with the traditional wind field sensor. The device can be suitable for low-pressure environment, various atmospheric medium conditions and environment temperature conditions of-70-40 ℃ through ground calibration. The method has practical application value for future Mars wind field detection tasks and other wind field high-precision measurement tasks under low air pressure.
Drawings
FIG. 1 is a schematic structural diagram of a hot film Mars surface wind field measurement sensor;
FIG. 2 is a schematic diagram of a structure of a wind field sensor sensitive end of a hot film Mars surface wind field measurement sensor;
fig. 3 is a schematic structural diagram of a hot-film mars surface wind field measurement sensor sensitive chip.
Reference numerals:
1. a housing; 2. a wind field sensor sensitive end; 21. switching the PCB; 22. a thermally insulated base; 23. a sensitive chip; 231. a substrate; 232. a temperature measuring resistor; 233. a heating resistor; 234. a ground resistor; 24. gold wire; 3. a sensor cable connector; 4. a signal cable.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1
As shown in fig. 1, a hot-film mars surface wind field measurement sensor comprises a shell 1, a wind field sensor sensitive end 2 embedded at the top of the shell 1, a sensor cable connector 3 arranged at the bottom of the shell 1, and a signal cable 4 fixed on the inner wall of the shell 1 and connected with the wind field sensor sensitive end 2 and the sensor cable connector 3;
as shown in fig. 2, the wind field sensor sensing end 2 includes an adapter PCB 21 embedded on the top of the housing 1 and connected to the signal cable 4, a heat insulation base 22 fixed on the upper surface of the adapter PCB 21, a sensing chip 23 fixed on the top of the heat insulation base 22, and a gold wire 24 connected to the adapter PCB 21 and the sensing chip 23;
as shown in fig. 3, the sensitive chip 23 includes a substrate 231, and a temperature measuring resistor 232, a heating resistor 233 and a grounding resistor 234 which are prepared on the upper surface of the substrate 231 by using an MEMS process, wherein the temperature measuring resistor 232, the heating resistor 233 and the grounding resistor 234 are electrically connected with the adapting PCB 21 through gold wires 24;
the temperature measuring resistor 232, the heating resistor 233 and the rear end signal conditioning circuit form closed-loop temperature control, the grounding resistor 234 is electrically connected with a machine, and the grounding resistor 234 is used for reducing the noise level of the wind field measurement sensor;
the method for measuring the wind speed by the wind field measuring sensor comprises the following steps: applying heating power to the heating resistor 233, performing closed-loop temperature control through the temperature measuring resistor 232 to enable the sensitive chip 23 to have a constant temperature difference delta T with the ambient temperature, and obtaining wind speed information according to the heating power required by the sensitive chip 23 to maintain the constant temperature difference delta T with the ambient;
the heat insulation base 22 and the sensitive chips 23 are four groups to form a 2 x 2 array, and the distances between two adjacent sensitive chips 23 are the same;
the method for measuring the wind direction by the wind field measuring sensor comprises the following steps: heating power is applied to the heating resistor 233, and closed-loop temperature control is performed through the temperature measuring resistor 232, so that the sensing chip 23 has a constant temperature difference delta T with the ambient temperature;
wind of a wind field to be measured flows through the four sensitive chips 23, and wind direction information is obtained according to the difference relation of power required by each sensitive chip 23 to maintain constant temperature difference delta T;
the included angle between the sensitive chip 23 and the ground is 0-20 degrees;
the sensitive chip 23 is made of monocrystalline silicon, the thickness of the sensitive chip is 0.3-0.4 mu m, the surface size of the sensitive chip is 1.5 multiplied by 1.5mm, and the temperature measuring resistor 232, the heating resistor 233 and the grounding resistor 234 are all thin-film platinum resistors and are prepared on the upper surface of the sensitive chip 23 by sputtering, photoetching and corrosion;
al deposited on the surface of the sensitive chip 232O3Or SiO2A film;
the shell 1 is of an aluminum alloy cylindrical structure, the top surface of the shell is provided with a groove, the switching PCB 21 is arranged in the groove, the upper surface of the switching PCB is flush with the top surface of the shell 1, and the edge of the upper surface of the shell 1 is rounded;
the heat insulation base 22 comprises four support columns and is made of polyimide, the bottom of the heat insulation base 22 is fixed with the switching PCB 21 through low-temperature glue, and the sensitive chip 23 is fixed on the upper surface of the heat insulation base 22 through low-temperature glue;
the gold wire 24 is connected with the switching PCB 21 and the sensitive chip 23 by a ball bonding method, and each bonding pad adopts two-point double wires;
the signal cable 4 is fixed on the inner wall of the shell 1 through low-temperature glue.
Example 2
As shown in fig. 1-3, a hot-film mars surface wind field measurement sensor comprises a shell 1, a wind field sensor sensitive end 2, a sensor cable connector 3 and a signal cable 4, wherein the signal cable 4 is fixed on the inner wall of the aluminum alloy shell 1 by low-temperature glue DW-3; the wind field sensor sensitive end 2 comprises a switching PCB 21, a heat insulation base 22, a sensitive chip 23 and a gold wire 24; the sensitive chip 23 uses monocrystalline silicon as a substrate 231, and the surface of the monocrystalline silicon substrate 231 adopts MEMS processing steps of sputtering, photoetching, corrosion and the like to prepare a film platinum resistor: temperature measuring resistor 232, heating resistor 233 and grounding resistor 234. As a specific example, the temperature measuring resistor 232 is 1000 Ω, the heating resistor 233 is 100 Ω, and the grounding resistor 234 is less than 10 Ω. The temperature measuring resistor 232, the heating resistor 233 and the grounding resistor 234 are electrically connected to the adapting PCB 21 through the gold wires 24.
The aluminum alloy shell 1 is of a cylindrical structure, the sensitive end 2 of the wind field sensor is located on the top surface of the shell 1, the top surface of the shell 1 is grooved, the switching PCB 21 is placed in the groove of the top surface, the upper surface of the switching PCB is flush with the top surface of the shell 1, and the edge position of the upper surface of the shell 1 is processed through a fillet.
The heat insulation base 22 of the wind field sensor sensitive end 2 is made of polyimide and is prepared by machining, the heat insulation base is in an inverted table shape, and the sensitive chip 23 is located above the heat insulation base 22 and fixed through low-temperature glue DW-3. The bottom of the heat insulation base 22 is fixed with the PCB adapter PCB 21 through low-temperature glue DW-3.
The sensitive chips 23 and the heat insulation base 22 are four groups to form a 2 x 2 array, the thickness of the sensitive chips 23 is 0.3 μm, the surface size is 1.5 x 1.5mm, the distance between the adjacent sensitive chips 23 is 0.5mm, and the distances between the sensitive chips 23 are the same.
The temperature measuring resistor 232 and the heating resistor 233 of the sensitive chip 23 and the rear end signal conditioning circuit form closed loop temperature control, and the sensitive chip 23 and the surrounding environment form constant temperature difference. The ground resistor 234 is mechanically connected.
Al deposited on the surface of the sensitive chip 232O3Or SiO2Thin film protection of platinum sensitive layers。
The gold wire 24 is connected with the sensitive chip 23 and the adapting PCB 21 by a ball bonding method, each bonding pad adopts two-point double lines, and the diameter of the gold wire 24 is selected to be 25 mu m.
When in use, the plane of the sensitive chip 23 is parallel to the ground as much as possible, and the maximum included angle is less than 20 degrees.
The sensor can be used in the temperature range of-70 to +40 ℃ under low pressure and various atmospheric media. The theoretical measurement value covers the currently known Mars wind speed range, and meanwhile, the two-dimensional wind direction of a plane of 0-360 degrees can be measured. Besides being used as a mars wind field sensor, the sensor can measure the wind speed and wind direction information of the high-altitude atmosphere by carrying a test device such as an air sounding balloon.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (10)

1. A hot film type mars surface wind field measurement sensor is characterized in that: the wind field sensor comprises a shell (1), a wind field sensor sensitive end (2) embedded in the top of the shell (1), a sensor cable connector (3) arranged at the bottom of the shell (1), and a signal cable (4) fixed on the inner wall of the shell (1) and connected with the wind field sensor sensitive end (2) and the sensor cable connector (3);
the wind field sensor sensitive end (2) comprises a switching PCB (printed circuit board) (21) embedded at the top of the shell (1) and connected with the signal cable (4), a heat insulation base (22) fixed on the upper surface of the switching PCB (21), a sensitive chip (23) fixed at the top of the heat insulation base (22) and a gold wire (24) connected with the switching PCB (21) and the sensitive chip (23);
the sensitive chip (23) comprises a substrate (231) and a temperature measuring resistor (232), a heating resistor (233) and a grounding resistor (234) which are prepared on the upper surface of the substrate (231) by using an MEMS (micro electro mechanical system) process, wherein the temperature measuring resistor (232), the heating resistor (233) and the grounding resistor (234) are all electrically connected with the switching PCB (21) through the gold wire (24).
2. The hot film mars surface wind field measurement sensor of claim 1, wherein: the temperature measuring resistor (232), the heating resistor (233) and a rear end signal conditioning circuit form closed loop temperature control, the grounding resistor (234) is electrically connected with a machine, and the grounding resistor (234) is used for reducing the noise level of the wind field measuring sensor;
the method for measuring the wind speed by the wind field measuring sensor comprises the following steps: heating power is applied to the heating resistor (233), closed-loop temperature control is performed through the temperature measuring resistor (232), so that the sensing chip (23) has constant temperature difference delta T with the ambient temperature, and wind speed information is obtained according to the heating power required by the sensing chip (23) to maintain the constant temperature difference delta T with the ambient.
3. The hot film mars surface wind field measurement sensor of claim 2, wherein: the heat insulation base (22) and the sensitive chips (23) are in four groups to form a 2 x 2 array, and the distances between every two adjacent sensitive chips (23) are the same;
the method for measuring the wind direction by the wind field measuring sensor comprises the following steps: applying heating power to the heating resistor (233), and performing closed-loop temperature control through the temperature measuring resistor (232) to enable the sensitive chip (23) to have a constant temperature difference delta T with the ambient temperature;
wind of the wind field to be measured flows through the four sensitive chips (23), and wind direction information is obtained according to the difference relation of power required by maintaining the constant temperature difference delta T of each sensitive chip (23).
4. The hot film mars surface wind field measurement sensor of claim 1, wherein: the included angle between the sensitive chip (23) and the ground is 0-20 degrees.
5. The hot film mars surface wind field measurement sensor of claim 1, wherein: the sensitive chip (23) is made of monocrystalline silicon, the thickness of the sensitive chip is 0.3-0.4 mu m, the surface size of the sensitive chip is 1.5 multiplied by 1.5mm, and the temperature measuring resistor (232), the heating resistor (233) and the grounding resistor (234) are all thin-film platinum resistors and are prepared on the upper surface of the sensitive chip (23) by sputtering, photoetching and corrosion.
6. The hot film mars surface wind field measurement sensor of claim 1, wherein: al is deposited on the surface of the sensitive chip (23)2O3Or SiO2A film.
7. The hot film mars surface wind field measurement sensor of claim 1, wherein: the shell (1) is of an aluminum alloy cylindrical structure, the top surface of the shell is grooved, the switching PCB (21) is arranged in the groove, the upper surface of the switching PCB is flush with the top surface of the shell (1), and the edge of the upper surface of the shell (1) is chamfered.
8. The hot film mars surface wind field measurement sensor of claim 1, wherein: the heat insulation base (22) comprises four support columns and is made of polyimide, the bottom of the heat insulation base (22) is fixed to the through connection PCB (21) through low-temperature glue, and the sensitive chip (23) is fixed to the upper surface of the heat insulation base (22) through low-temperature glue.
9. The hot film mars surface wind field measurement sensor of claim 1, wherein: the gold wire (24) is connected with the adapting PCB (21) and the sensitive chip (23) through a ball bonding method, and each bonding pad adopts double-point double-line.
10. The hot film mars surface wind field measurement sensor of claim 1, wherein: the signal cable (4) is fixed on the inner wall of the shell (1) through low-temperature glue.
CN202111318225.8A 2021-11-09 2021-11-09 Hot film type mars surface wind field measuring sensor Pending CN114113674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111318225.8A CN114113674A (en) 2021-11-09 2021-11-09 Hot film type mars surface wind field measuring sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111318225.8A CN114113674A (en) 2021-11-09 2021-11-09 Hot film type mars surface wind field measuring sensor

Publications (1)

Publication Number Publication Date
CN114113674A true CN114113674A (en) 2022-03-01

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ID=80377982

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111318225.8A Pending CN114113674A (en) 2021-11-09 2021-11-09 Hot film type mars surface wind field measuring sensor

Country Status (1)

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