CN114111844A - MEMS inertial device test system - Google Patents
MEMS inertial device test system Download PDFInfo
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- CN114111844A CN114111844A CN202111482047.2A CN202111482047A CN114111844A CN 114111844 A CN114111844 A CN 114111844A CN 202111482047 A CN202111482047 A CN 202111482047A CN 114111844 A CN114111844 A CN 114111844A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
- G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
Abstract
The invention provides a MEMS inertial device test system, comprising: the device comprises a rotating module, a first acquisition module, a slip ring line, a second acquisition module and a control module; the rotating module comprises a rotating shaft and a rotating shaft 2 arranged around the rotating shaftnA test port for corresponding to test 2nLess than one MEMS inertial device to be tested; the first acquisition module comprises at least one decoder; the first acquisition module comprises n input ends and 2nA circuit output terminal; 2nThe output end of the circuit is used for connecting 2nA test port; the slip ring line comprises n slip ring connecting lines; one end of the n-path slip ring connecting line is connected with the input end of the first acquisition module; the second acquisition module is provided with n chip selection signal ends; the n chip selection signal ends are connected with the other end of the slip ring connecting wire; the invention can realize n slip ring line control 2 by adopting chip selection signal ends and decoders at two ends of the slip ring linenThe problem that the number of the slip ring wires is limited to calibrate the number of the pieces to be tested in batches is solved, and the testing efficiency is improved.
Description
Technical Field
The invention relates to the technical field of MEMS (micro-electromechanical systems) testing, in particular to a MEMS inertial device testing system.
Background
The MEMS inertial device comprises two products of an MEMS gyroscope and an accelerometer, measures the angular velocity and the linear acceleration of the movement of an object respectively, and has the advantages of small volume, light weight, low power consumption, high reliability, low cost and the like. MEMS inertial devices are playing a greater and greater role in military fields such as weaponry, navigation measurement and control, and civil fields such as industry and Internet.
The calibration test of the MEMS inertial device is an important means for obtaining device error parameters, calibrating errors and improving the device precision. At present, the system integration pre-calibration of most MEMS inertial devices is limited to normal-temperature scale factor normalization and normal-temperature zero offset calibration. When the MEMS inertial device is used in a system, a zero offset temperature coefficient, a scale factor temperature coefficient and scale factor nonlinearity which need to be calibrated are all put into the system for integration, and then calibration test is carried out along with the system. Due to the limitation of factors such as volume and power consumption after system integration, mass and automation of the MEMS inertial device along with system calibration test are difficult to realize, and the requirement of mass use of the device cannot be met. When the MEMS inertial device system is in a single-chip state before integration, batch automatic calibration and testing of zero offset temperature coefficient, scale factor temperature coefficient and scale factor nonlinearity are performed, and the efficiency of using the MEMS inertial device is greatly improved.
In the testing method in the prior art, the number of the slip ring lines corresponds to the number of the testing pieces, and the number of the slip ring lines of the rotary table is limited, generally dozens of rings, so that the number of the slip rings is limited by the number of single batch calibration, and the testing efficiency is low.
Disclosure of Invention
The embodiment of the invention provides a MEMS inertial device testing system, which aims to solve the problems that the number of slip ring lines in the prior art is limited to the number of pieces to be tested in batch calibration at a time, and the testing efficiency is low.
The embodiment of the invention provides a MEMS inertial device testing system, which comprises: the device comprises a rotating module, a first acquisition module, a slip ring line, a second acquisition module and a control module.
The rotating module comprises a rotating shaft and a rotating shaft surrounding 2nA test port for corresponding setting 2nTo-be-tested MEMS inertial device within and to be testedMeasuring the MEMS inertial device;
the first acquisition module comprises at least one decoder; the first acquisition module comprises n input ends and 2nA circuit output terminal; 2 is describednThe output end of the circuit is used for connecting 2nAnd a test port.
The slip ring line comprises n slip ring connecting lines; one end of the n-way slip ring connecting line is connected with the n-way input end of the first acquisition module.
The second acquisition module is provided with n chip selection signal ends; and the n chip selection signal ends are connected with the other ends of the n slip ring connecting lines.
The control module is connected with the rotating module and used for sending a test instruction to control the rotating shaft to rotate;
the control module is connected with the second acquisition module and used for acquiring measurement data transmitted by each test port through the first acquisition module, the slip ring line and the second acquisition module and analyzing the measurement data to obtain a test result of the MEMS inertial device.
In a possible implementation manner, the second acquisition module includes m first chip select signal terminals and n second chip select signal terminals, m is greater than 1, and n is greater than 1.
The slip ring lines comprise m paths of first slip ring connecting lines and n paths of second slip ring connecting lines; one end of the first slip ring connecting wire is connected with a first chip selection signal end of the second acquisition module; one end of the second slip ring connecting wire is connected with a second chip selection signal end of the second acquisition module.
The first acquisition module comprises m decoders, and each decoder comprises an enabling end, n input ends and 2nA circuit output terminal; the other end of the first slip ring connecting wire is connected with an enabling end of the decoder; the other end of the second slip ring connecting line is connected with the input ends of the decoders, and the n input ends of each decoder share the other end of the second slip ring connecting line.
The output end of each decoder is connected with 2nThe test port.
The control module is specifically configured to obtain m x 2nAnd the test port transmits the measurement data through the first acquisition module, the slip ring line and the second acquisition module, and analyzes the measurement data to obtain the test result of the MEMS inertial device.
In a possible implementation manner, the second acquisition module includes m first chip select signal terminals and n second chip select signal terminals, m is greater than 1, and n is greater than 1.
The slip ring lines comprise m paths of first slip ring connecting lines and n paths of second slip ring connecting lines; one end of the first slip ring connecting wire is connected with a first chip selection signal end of the second acquisition module; one end of the second slip ring connecting wire is connected with a second chip selection signal end of the second acquisition module.
The first acquisition module comprises at least one first decoder and 2mA second decoder.
The first decoder comprises m input terminals and 2mAn output terminal; and the input end of the first decoder is connected with the other end of the first slip ring connecting wire.
Each second decoder comprises an enabling end; the output end of the first decoder is connected with the enabling end of each second decoder;
each of the second decoders includes n input terminals and 2nA circuit output terminal; the input end of the second decoder is connected with the other end of the second slip ring connecting wire; the n input ends of each second decoder share the other end of the second slip ring connecting line;
the output end of each second decoder is connected with 2nEach of the test ports;
the control module is specifically configured to obtain 2m*2nAnd the test port transmits the measurement data through the first acquisition module, the slip ring line and the second acquisition module, and analyzes the measurement data to obtain the test result of the MEMS inertial device.
In a possible implementation manner, the second acquisition module further includes a master device data input end, a master device data output end, a clock signal end, a power end, and a ground end.
The slip ring line further comprises 5 paths of third slip ring connecting lines, and one end of each third slip ring connecting line is connected with the data input end of the main equipment, the data output end of the main equipment, the clock signal end, the power supply end and the grounding end; and the other end of the third slip ring connecting line is connected with each test port.
In one possible implementation, m is 8 and n is 4; the decoder is the 4/16 decoder.
In one possible implementation, the distance from the spindle to each of the test ports is equal.
In a possible implementation manner, multiple layers of the test ports are arranged on the rotating shaft.
In one possible implementation mode, when the rotating shaft is vertically placed, the rotating shaft rotates to provide an angular velocity test for the MEMS inertial device to be tested; when the rotating shaft is horizontally placed, the rotating shaft rotates to provide acceleration test for the MEMS inertial device to be tested.
In one possible implementation, the system further includes a box; a rotating module, a slip ring line and a first acquisition module are arranged in the box body; the box body also comprises a temperature control module; the temperature control module is used for adjusting the environmental temperature of the MEMS inertial device to be measured.
In one possible implementation, the system is configured to test the scale factor of the MEMS inertial device by rotating the shaft at different ambient temperatures.
The embodiment of the invention provides a MEMS inertial device testing system, which comprises: the device comprises a rotating module, a first acquisition module, a slip ring line, a second acquisition module and a control module; the rotating module comprises a rotating shaft and a rotating shaft surrounding 2nA test port for corresponding setting 2nMeasuring the MEMS inertial devices to be measured within the range; the first acquisition module comprises at least one decoder; the first acquisition module comprises n input ends and 2nA circuit output terminal; 2 is describednThe output end of the circuit is used for connecting 2nA test port; the slip ring line comprises n slip ring connecting lines; one end of the n-path slip ring connecting line is connected with n-path input ends of the first acquisition module; the second acquisitionThe module is provided with n chip selection signal ends; the n chip selection signal ends are connected with the other ends of the n slip ring connecting lines; the control module is connected with the rotating module and used for sending a test instruction to control the rotating shaft to rotate; the control module is connected with the second acquisition module and used for acquiring measurement data transmitted by each test port through the first acquisition module, the slip ring line and the second acquisition module and analyzing the measurement data to obtain a test result of the MEMS inertial device. The n slip ring lines are controlled by adopting chip selection signal ends and decoders at two ends of the slip ring lines 2nThe problem that the number of the to-be-tested pieces is limited by the number of the slip ring lines in the prior art and is calibrated in batch at a single time, and the number of the to-be-tested pieces is smaller than the number of the slip ring lines is solved, the number of the to-be-tested pieces calibrated in batch at a single time is increased, and the testing efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of a MEMS inertial device testing system provided by an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an acquisition module provided in an embodiment of the present invention;
FIG. 3 is a schematic circuit diagram of an acquisition module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an acquisition module of a dual decoder according to an embodiment of the present invention.
Detailed Description
In order to make the technical solution better understood by those skilled in the art, the technical solution in the embodiment of the present invention will be clearly described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is a part of the embodiment of the present invention, and not a whole embodiment. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present disclosure without any creative effort shall fall within the protection scope of the present disclosure.
The terms "include" and any other variations in the description and claims of this document and the above-described figures, mean "include but not limited to", and are intended to cover non-exclusive inclusions and not limited to the examples listed herein. Furthermore, the terms "first" and "second," etc. are used to distinguish between different objects and are not used to describe a particular order.
The following detailed description of implementations of the invention refers to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a MEMS inertial device testing system according to an embodiment of the present invention.
Referring to fig. 1, the MEMS inertial device test system includes: the device comprises a rotating module, a first acquisition module 3, a slip ring wire 4, a second acquisition module 5 and a control module 6.
The rotating module comprises a rotating shaft 1 and a rotating shaft 2 arranged around the rotating shaft 1n A test port 2 for corresponding to the setting 2nAnd measuring the MEMS inertial devices to be measured within the unit.
The first acquisition module 3 comprises at least one decoder 31; the first acquisition module 3 comprises n input ends and 2nA circuit output terminal; 2nThe output end of the circuit is used for connecting 2nAnd a test port 2.
The slip ring line 4 comprises n slip ring connecting lines; one end of the n-way slip ring connecting line is connected with the n-way input end of the first acquisition module 3.
The second acquisition module 5 is provided with n chip selection signal ends; and the n chip selection signal ends are connected with the other ends of the n slip ring connecting lines.
The control module 6 is connected with the rotating module and used for sending a test instruction to control the rotation of the rotating shaft 1.
The control module 6 is connected with the second acquisition module 5 and used for acquiring measurement data transmitted by the test port 2 through the first acquisition module 3, the slip ring wire 4 and the second acquisition module 5 and analyzing the measurement data to obtain a test result of the MEMS inertial device.
The single-chip MEMS inertial device mostly adopts a four-wire serial interface communication protocol, and if n MEMS inertial devices are tested in batch, 4 × n slip ring lines 4 are required to be connected to the MEMS inertial devices to be tested.
The slip ring wire 4 is a rotatable connector, and is a part which is specially communicated with a rotating body and used for transmitting power and signal electricity. The slip ring line 4 consists of a rotating part and a static part, and the rotating part is connected with the rotating shaft 1 and rotates along with the rotating shaft; the stationary portion is connected to a fixed structure. Since the number of slip ring lines 4 is limited, typically several tens of rings, the number of slip ring lines 4 severely limits the number of batch calibration tests.
Illustratively, the second acquisition module 5 may employ a serial peripheral interface.
MEMS inertial device systems typically include application specific integrated circuits in a single chip state prior to integration.
Illustratively, the control module 6 is further configured to control the first acquisition module 3 and the second acquisition module 5 to write the initial setting data and the compensation parameter after the calibration test into the asic.
When the MEMS inertial device system is in a single-chip state before integration, batch automatic calibration test is carried out, and compensation parameters are written into the special integrated circuit after calibration, so that the efficiency of the MEMS inertial device system during integration is greatly improved.
Fig. 2 is a schematic structural diagram of an acquisition module provided in an embodiment of the present invention; referring to fig. 2:
in an alternative embodiment, the second acquisition module 5 comprises m first chip select signal terminals 56 and n second chip select signal terminals 57, m being greater than 1 and n being greater than 1.
The slip ring line 4 comprises m lines of first slip ring connection lines 41 and n lines of second slip ring connection lines 42; one end of the first slip ring connecting wire 41 is connected with the first chip selection signal end 56 of the second acquisition module 5; one end of the second slip ring connection line 42 is connected to the second chip selection signal end 57 of the second acquisition module 5.
The first acquisition module 3 comprises m decoders 31, each decoder 31 comprises an enabling end, n input ends and 2nA circuit output terminal; the other end of the first slip ring connecting line 41 is connected with an enabling end of the decoder 31; each path of the first slip ring connection lines 41 corresponds to one decoder 31。
The other end of the second slip ring connecting line 42 is connected with the input end of the decoder 31, and the n input ends of each decoder 31 share the other end of the second slip ring connecting line 42; each of the second slipring connections 42 corresponds to a plurality of decoders 31.
The output of each decoder 31 is connected to 2nAnd a test port 2.
The control module 6 is specifically adapted to obtain m x 2nThe test port 2 transmits measurement data through the first acquisition module 3, the slip ring wire 4 and the second acquisition module 5, and analyzes the measurement data to obtain a test result of the MEMS inertial device.
In an alternative embodiment, the second collecting module 5 further comprises a master data input terminal 55, a master data output terminal 54, a clock signal terminal 53, a power terminal and a ground terminal.
The slip ring line 4 further comprises 5 paths of third slip ring connecting lines, and one end of each third slip ring connecting line is connected with a main equipment data input end 55, a main equipment data output end 54, a clock signal end 53, a power supply end and a ground end; the other end of the third slip ring connection line is connected with each test port 2.
Illustratively, a channel dividing module 7 is further included between the first acquisition module 3 and each test port 2; the channel splitting module 7 is used to re-split the common lines so that each test port 2 is connected to the other end of the third slipring connection line.
Illustratively, the channel dividing module 7 is further configured to connect the output end of the decoder 31 and the test ports 2, so that each test port 2 corresponds to an output end of the decoder 31.
FIG. 3 is a schematic circuit diagram of an acquisition module according to an embodiment of the present invention; referring to fig. 3:
in an alternative embodiment, m is 8 and n is 4; decoder 31 is the 4/16 decoder.
Illustratively, the second acquisition module 5 may comprise an NI USB-8451 acquisition card 51 and a power supply 52.
The NI USB-8451 acquisition card 51 comprises a main device data input end 55, a main device data output end 54, a clock signal end 53, 8 first chip selection signal ends 56 and 4 second chip selection signal ends 57; the power supply 52 includes a power terminal and a ground terminal.
Correspondingly, the slip ring lines 4 include 8 first slip ring connection lines 41, 4 second slip ring connection lines 42, and 5 third slip ring connection lines, totaling 17 lines.
By adopting an NI USB-8451 acquisition card 51 and 8 4/16 decoders, calibration tests of 128 MEMS inertial devices can be realized.
Fig. 4 is a schematic structural diagram of an acquisition module of a dual decoder according to an embodiment of the present invention; referring to fig. 4:
in an alternative embodiment, the second acquisition module 5 comprises m first chip select signal terminals 56 and n second chip select signal terminals 57, m being greater than 1 and n being greater than 1.
The slip ring line 4 comprises m lines of first slip ring connection lines 41 and n lines of second slip ring connection lines 42; one end of the first slip ring connecting wire 41 is connected with the first chip selection signal end 56 of the second acquisition module 5; one end of the second slip ring connection line 42 is connected to the second chip selection signal end 57 of the second acquisition module 5.
The first acquisition module 3 comprises at least one first decoder 33 and 2mA second decoder 32.
The first decoder 33 comprises m inputs and 2mAn output terminal; the input end of the first decoder 33 is connected to the other end of the first slip ring connection line 41.
Each second decoder 32 includes an enable terminal; the output end of the first decoder 33 is connected with the enabling end of each second decoder 32; an output of the first decoder 33 corresponds to a second decoder 32.
Each second decoder 32 comprises n inputs and 2nA circuit output terminal; the input end of the second decoder 32 is connected with the other end of the second slip ring connecting line 42; the n inputs of each second decoder 32 share the other end of the second slipring connection 42; each of the second slipring connections 42 corresponds to a plurality of second decoders 32.
The output of each second decoder 32 is connected to 2nAnd a test port 2.
The control module 6 is specifically adapted to obtain 2m*2nA test port 2 is connected with a first acquisition module 3, a slip ring wire 4 andand the second acquisition module 5 transmits the measurement data and analyzes the measurement data to obtain a test result of the MEMS inertial device.
By using a dual decoder configuration, the number of first slip ring connection lines 41 is reduced, and control 2 can be achieved using m + n slip ring lines 4m*2nAnd the MEMS inertial device to be tested. The efficiency of batch test has been improved.
In an alternative embodiment, the spindle 1 is equidistant from each test port 2. The test ports 2 correspond to the MEMS inertial devices to be tested one by one, namely, the distances from the rotating shaft 1 to each MEMS inertial device to be tested are equal. So that the angular velocity or acceleration of each MEMS inertial device to be measured is equal when the rotating shaft 1 rotates.
In an optional embodiment, when the rotating shaft 1 is vertically arranged, the rotating shaft rotates to provide an angular velocity test for the MEMS inertial device to be tested; when the rotating shaft 1 is horizontally placed, the rotating shaft rotates to provide acceleration test for the MEMS inertial device to be tested.
Illustratively, when the device under test is a MEMS gyroscope, the shaft 1 may be vertically disposed and the shaft 1 rotated to provide an angular rate input to the gyroscope.
For example, when the device under test is a MEMS accelerometer, the shaft 1 may be horizontally positioned and the shaft 1 rotated to provide an acceleration input of ± 1g to the accelerometer.
In an alternative embodiment, a plurality of layers of test ports 2 are provided on the spindle 1.
Illustratively, may be set to 2nA layer;
illustratively, each layer is provided with 2nA test port 2; the number of the MEMS inertial devices to be tested in each layer is 2nAnd (4) respectively.
In an alternative embodiment, the system further comprises a tank; a rotating module, a slip ring wire 4 and a first acquisition module 3 are arranged in the box body; the box body also comprises a temperature control module; the temperature control module is used for adjusting the environmental temperature of the MEMS inertial device to be measured; the control module 6 is specifically used for controlling the temperature control module to regulate the temperature in the box body.
Illustratively, the static part of the slip ring wire 4 is connected with the box body, and the rotating part of the slip ring wire 4 is connected with the rotating shaft 1;
different key temperature points can be selected for testing according to the characteristics of different MEMS inertia devices.
Illustratively, the temperature control module controls the change range of the environmental temperature to be-45 ℃ to 85 ℃;
illustratively, the temperature control module controls the ambient temperature to change at a gradient of 10 ℃, i.e., the temperature changes by 10 ℃ each time during the test.
In an alternative embodiment, the system described above is used to test the scale factor of a MEMS inertial device by rotating the shaft 1 at different ambient temperatures.
The calibration factor is the ratio of the output quantity to the input quantity of the MEMS inertial device; the rotation of the rotating shaft 1 provides angular velocity or acceleration input quantity for the MEMS inertial device, and the output quantity is obtained by collecting the measured value of the MEMS inertial device.
For example, the scale factor may be measured at ambient temperature of 25 ℃.
Illustratively, the above system can be used to test for zero offset temperature coefficient, calibration factor temperature coefficient, and scale factor non-linearity.
The zero offset temperature coefficient is the variation of the test zero offset with temperature.
The calibration factor temperature coefficient represents the change of the calibration factor at different temperatures; the environmental temperature of the piece to be measured is adjusted through the box body, and the scale factor change under different temperatures is obtained.
The scale factor non-linearly characterizes the degree of deviation of the actual input from the output.
Illustratively, the calibration test procedure includes: calibration test, calculation after calibration and test after calibration.
The calibration test comprises a normal temperature linearity test, a scale factor and a zero offset test at different temperature points, and simultaneously the output of a temperature sensor carried by the MEMS inertial device at the temperature point needs to be tested for calculating the parameters of the temperature sensor. Different key temperature points can be selected for the test according to the characteristics of different MEMS inertia devices.
And calculating after calibration, and calculating calibration parameters according to the selected calculation model and the existing test data, wherein the calibration parameters mainly comprise a scale factor temperature polynomial coefficient, a zero-bias temperature polynomial coefficient and a temperature sensor calibration coefficient. A fourth-order polynomial model is generally adopted to calculate the scale and the zero-bias polynomial coefficient, and a first-order linear model is adopted to calculate the calibration coefficient of the temperature sensor. The system can select different calculation models according to different characteristics of the MEMS inertial device, and write the calculated polynomial coefficients into the MEMS inertial device.
And testing after calibration, wherein the purpose is to test whether the effect after calibration meets the index requirement. The test items mainly include: scale factor, linearity, zero offset temperature coefficient, scale factor temperature coefficient. The system can also add other test items such as: zero bias stability, angle random walk, zero bias repeatability, scale factor repeatability, etc. After the test is finished, the system can automatically calculate the test result and generate a test report.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A MEMS inertial device testing system, comprising: the device comprises a rotating module, a first acquisition module, a slip ring line, a second acquisition module and a control module;
the rotating module comprises a rotating shaft and a rotating shaft surrounding 2nA test port for corresponding setting 2nMeasuring the MEMS inertial devices to be measured within the range;
the first acquisition module comprises at least one decoder; the first acquisition module comprises n input ends and 2nA circuit output terminal; 2 is describednThe output end of the circuit is used for connecting 2nA test port;
the slip ring line comprises n slip ring connecting lines; one end of the n-path slip ring connecting line is connected with n-path input ends of the first acquisition module;
the second acquisition module is provided with n chip selection signal ends; the n chip selection signal ends are connected with the other ends of the n slip ring connecting lines;
the control module is connected with the rotating module and used for sending a test instruction to control the rotating shaft to rotate;
the control module is connected with the second acquisition module and used for acquiring measurement data transmitted by each test port through the first acquisition module, the slip ring line and the second acquisition module and analyzing the measurement data to obtain a test result of the MEMS inertial device.
2. The MEMS inertial device test system of claim 1, wherein the second acquisition module comprises m first chip select signal terminals and n second chip select signal terminals, m being greater than 1, n being greater than 1;
the slip ring lines comprise m paths of first slip ring connecting lines and n paths of second slip ring connecting lines; one end of the first slip ring connecting wire is connected with a first chip selection signal end of the second acquisition module; one end of the second slip ring connecting wire is connected with a second chip selection signal end of the second acquisition module;
the first acquisition module comprises m decoders, and each decoder comprises an enabling end, n input ends and 2nA circuit output terminal; the other end of the first slip ring connecting wire is connected with an enabling end of the decoder; the other end of the second slip ring connecting line is connected with the input ends of the decoders, and n input ends of each decoder share the other end of the second slip ring connecting line;
the output end of each decoder is connected with 2nEach of the test ports;
the control module is specifically configured to obtain m x 2nAnd the test port transmits the measurement data through the first acquisition module, the slip ring line and the second acquisition module, and analyzes the measurement data to obtain the test result of the MEMS inertial device.
3. The MEMS inertial device test system of claim 1, wherein the second acquisition module comprises m first chip select signal terminals and n second chip select signal terminals, m being greater than 1, n being greater than 1;
the slip ring lines comprise m paths of first slip ring connecting lines and n paths of second slip ring connecting lines; one end of the first slip ring connecting wire is connected with a first chip selection signal end of the second acquisition module; one end of the second slip ring connecting wire is connected with a second chip selection signal end of the second acquisition module;
the first acquisition module comprises at least one first decoder and 2mA second decoder;
the first decoder comprises m input terminals and 2mAn output terminal; the input end of the first decoder is connected with the other end of the first slip ring connecting wire;
each second decoder comprises an enabling end; the output end of the first decoder is connected with the enabling end of each second decoder;
each of the second decoders includes n input terminals and 2nA circuit output terminal; the input end of the second decoder is connected with the other end of the second slip ring connecting wire; the n input ends of each second decoder share the other end of the second slip ring connecting line;
the output end of each second decoder is connected with 2nEach of the test ports;
the control module is specifically configured to obtain 2m*2nAnd the test port transmits the measurement data through the first acquisition module, the slip ring line and the second acquisition module, and analyzes the measurement data to obtain the test result of the MEMS inertial device.
4. A MEMS inertial device test system according to claim 2 or 3,
the second acquisition module further comprises a master device data input end, a master device data output end, a clock signal end, a power supply end and a grounding end;
the slip ring line further comprises 5 paths of third slip ring connecting lines, and one end of each third slip ring connecting line is connected with the data input end of the main equipment, the data output end of the main equipment, the clock signal end, the power supply end and the grounding end; and the other end of the third slip ring connecting line is connected with each test port.
5. The MEMS inertial device test system of claim 2, wherein m is 8, n is 4; the decoder is the 4/16 decoder.
6. A MEMS inertial device test system according to claim 1, wherein said pivot axis is equidistant from each of said test ports.
7. A MEMS inertial device test system as claimed in claim 6 wherein said spindle is provided with a plurality of said test ports.
8. The MEMS inertial device testing system of claim 7, wherein the rotation axis, when vertically oriented, provides angular velocity testing for the MEMS inertial device under test;
when the rotating shaft is horizontally placed, the rotating shaft rotates to provide acceleration test for the MEMS inertial device to be tested.
9. The MEMS inertial device test system of claim 8, further comprising a case;
a rotating module, a slip ring line and a first acquisition module are arranged in the box body;
the box body also comprises a temperature control module; the temperature control module is used for adjusting the environmental temperature of the MEMS inertial device to be measured.
10. A MEMS inertial device test system according to claim 9, wherein said system is adapted to test the scale factor of a MEMS inertial device by rotating said shaft at different said ambient temperatures.
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| CN202111482047.2A CN114111844B (en) | 2021-12-06 | 2021-12-06 | MEMS inertial device test system |
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