CN114105943A - 3-substituted thioxanthone compound, preparation method thereof and application of photopolymerization system - Google Patents
3-substituted thioxanthone compound, preparation method thereof and application of photopolymerization system Download PDFInfo
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- CN114105943A CN114105943A CN202010912443.3A CN202010912443A CN114105943A CN 114105943 A CN114105943 A CN 114105943A CN 202010912443 A CN202010912443 A CN 202010912443A CN 114105943 A CN114105943 A CN 114105943A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- -1 3-substituted thioxanthone compound Chemical class 0.000 title abstract description 17
- 150000001875 compounds Chemical class 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 24
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000003847 radiation curing Methods 0.000 claims abstract description 6
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000000460 chlorine Substances 0.000 claims description 13
- 229910052801 chlorine Inorganic materials 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 125000001309 chloro group Chemical group Cl* 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 9
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 claims description 8
- 238000009472 formulation Methods 0.000 claims description 7
- 238000005863 Friedel-Crafts acylation reaction Methods 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 229910001507 metal halide Inorganic materials 0.000 claims description 6
- 239000007800 oxidant agent Substances 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 6
- 238000007363 ring formation reaction Methods 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 125000002252 acyl group Chemical group 0.000 claims description 5
- 230000026030 halogenation Effects 0.000 claims description 5
- 238000005658 halogenation reaction Methods 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
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- 229920005989 resin Polymers 0.000 claims description 4
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 150000004945 aromatic hydrocarbons Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 230000002140 halogenating effect Effects 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 2
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- 238000007766 curtain coating Methods 0.000 claims description 2
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 2
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- 125000005843 halogen group Chemical group 0.000 claims description 2
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- 238000010146 3D printing Methods 0.000 claims 1
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- 238000006467 substitution reaction Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 7
- 239000012847 fine chemical Substances 0.000 abstract description 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 30
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- 239000000047 product Substances 0.000 description 15
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 9
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- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 7
- 238000005160 1H NMR spectroscopy Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
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- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 6
- 238000000016 photochemical curing Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
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- 239000007858 starting material Substances 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000012265 solid product Substances 0.000 description 3
- 238000009987 spinning Methods 0.000 description 3
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 2
- KVNYFPKFSJIPBJ-UHFFFAOYSA-N 1,2-diethylbenzene Chemical compound CCC1=CC=CC=C1CC KVNYFPKFSJIPBJ-UHFFFAOYSA-N 0.000 description 2
- AFZZYIJIWUTJFO-UHFFFAOYSA-N 1,3-diethylbenzene Chemical compound CCC1=CC=CC(CC)=C1 AFZZYIJIWUTJFO-UHFFFAOYSA-N 0.000 description 2
- AXJZBGQZEBRRKB-UHFFFAOYSA-N 1,3-diethylthioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=C(CC)C=C(CC)C=C3SC2=C1 AXJZBGQZEBRRKB-UHFFFAOYSA-N 0.000 description 2
- LBEMXJWGHIEXRA-UHFFFAOYSA-N 2-[(2-carboxyphenyl)disulfanyl]benzoic acid Chemical compound OC(=O)C1=CC=CC=C1SSC1=CC=CC=C1C(O)=O LBEMXJWGHIEXRA-UHFFFAOYSA-N 0.000 description 2
- FBKCIXGXXJOPJS-UHFFFAOYSA-N 3-propan-2-ylthioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=C(C(C)C)C=C3SC2=C1 FBKCIXGXXJOPJS-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 230000010933 acylation Effects 0.000 description 2
- 238000005917 acylation reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
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- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
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- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
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- 238000010521 absorption reaction Methods 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 150000001263 acyl chlorides Chemical class 0.000 description 1
- 150000001266 acyl halides Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium chloride Substances Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- HTMQZWFSTJVJEQ-UHFFFAOYSA-N benzylsulfinylmethylbenzene Chemical compound C=1C=CC=CC=1CS(=O)CC1=CC=CC=C1 HTMQZWFSTJVJEQ-UHFFFAOYSA-N 0.000 description 1
- AWHNUHMUCGRKRA-UHFFFAOYSA-N benzylsulfonylmethylbenzene Chemical compound C=1C=CC=CC=1CS(=O)(=O)CC1=CC=CC=C1 AWHNUHMUCGRKRA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000012952 cationic photoinitiator Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- JNGZXGGOCLZBFB-IVCQMTBJSA-N compound E Chemical compound N([C@@H](C)C(=O)N[C@@H]1C(N(C)C2=CC=CC=C2C(C=2C=CC=CC=2)=N1)=O)C(=O)CC1=CC(F)=CC(F)=C1 JNGZXGGOCLZBFB-IVCQMTBJSA-N 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- AJQLEJAVGARHGQ-UHFFFAOYSA-N dithiosalicylic acid Chemical compound OC1=CC=CC=C1C(S)=S AJQLEJAVGARHGQ-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- 239000013538 functional additive Substances 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- VHILIAIEEYLJNA-UHFFFAOYSA-N methyl p-tolyl sulfide Chemical compound CSC1=CC=C(C)C=C1 VHILIAIEEYLJNA-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- LCEDQNDDFOCWGG-UHFFFAOYSA-N morpholine-4-carbaldehyde Chemical compound O=CN1CCOCC1 LCEDQNDDFOCWGG-UHFFFAOYSA-N 0.000 description 1
- 239000000206 moulding compound Substances 0.000 description 1
- VMOWKUTXPNPTEN-UHFFFAOYSA-N n,n-dimethylpropan-2-amine Chemical compound CC(C)N(C)C VMOWKUTXPNPTEN-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical compound OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 description 1
- 125000005499 phosphonyl group Chemical group 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D335/00—Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom
- C07D335/04—Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom condensed with carbocyclic rings or ring systems
- C07D335/10—Dibenzothiopyrans; Hydrogenated dibenzothiopyrans
- C07D335/12—Thioxanthenes
- C07D335/14—Thioxanthenes with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached in position 9
- C07D335/16—Oxygen atoms, e.g. thioxanthones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
Abstract
The invention relates to the field of organic functional new material chemicals, and discloses a novel 3-substituted thioxanthone new-structure compound, a preparation method thereof, a radiation curing formula material system containing the compound and application thereof for the first time. These thioxanthone species are important photoinitiators for photopolymerization of ethylenically unsaturated systems as key fine chemicals.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the field of organic functional new material chemicals, and discloses a novel 3-substituted thioxanthone new-structure compound, a preparation method thereof, a radiation curing formula material system containing the compound and application thereof for the first time. These thioxanthone substances are important photoinitiators (Photo-initiators) key fine chemicals for photopolymerization processes of ethylenically unsaturated systems.
[ background of the invention ]
Some thioxanthone compounds are known to be widely used photoinitiator compounds and/or photosensitizer (sensizer) compounds due to their excellent broad absorption properties of ultraviolet and visible light, and representative products are, for example, commercially available brands ITX or DETX, whose corresponding chemical structural features are 2-or 4-isopropyl substituted thioxanthone, and 2-and 4-ethyl substituted thioxanthone, respectively.
To date, 3-substituted thioxanthone-type compounds have not been reported in the literature and have never been used as photoinitiators. This is a new class of compounds with novel structures and is predicted by theory to possess higher photoinitiating activity than other thioxanthone isomers (e.g., 2-and 4-position isomers) [ n.s. allen, et.al j.oil.colour.chem.assoc.1987, 70 (11): 332 ].
It is obvious to the skilled practitioner that the 3-position substituted thioxanthone-type compounds are not used because the existing literature methods for preparing thioxanthone-type compounds disclose that electrophilic aromatic ring addition and oxidative ring closure techniques typically occur in strong protic acid media using dithiosalicylic acid starting materials and alkylbenzenes, whereas the rules of chemical selectivity for the positioning of the alkyl group in electrophilic aromatic rings dictate that only the 2-and associated 4-position thioxanthone isomers can be produced, and that 3-position substituted thioxanthone isomers cannot be produced therefrom; the synthesis of the latter and the exploration of unknown properties thereof are among the important issues that are desired but not yet solved by the skilled practitioner.
[ summary of the invention ]
The application realizes the preparation of the 3-substituted thioxanthone compound shown in the general formula (I) for the first time, and simultaneously discovers that the compound is a photosensitizer and photoinitiator compound with excellent performance. Definition of R0Is a compound having 1 to 24 carbon atoms (denoted as C)1-C24) Branched or straight chain or cyclic alkane or substituted or unsubstituted (hetero) arene group, R in the 3-position of the thioxanthone ring system1The radicals being OH, SH, halogen atoms, R0,OR0,SR0,NHR0Or N (R)0)2;R2-R8The radical values being, independently of one another, R1Or hydrogen;
an exemplary, but non-limiting, structure of a compound conforming to the definition of formula (I) is as follows:
one of the processes for the preparation of the compounds of formula (I) is disclosed below, which involves acyl halogenation (from A to B), Friedel-crafts acylation (B and C react to form D), oxidation (from D to E), and cyclization in four steps to produce the desired product (I). Due to R1Electron-donating Effect of the group, during which the acylation of the key intermediate compound D is accurately located at R1Para position of the group, the product thus exhibiting a 3-position R1Novel compound structures with precisely substituted groups.
Wherein R is hydrogen, C1-C24A linear or branched or cyclic alkyl group, or a substituted or unsubstituted aryl group; x and Y are independently of each other chlorine or bromine; the acid halogenating agent is phosphorus trihalide (PX)3) Thionyl chloride, chlorine, oxalyl chloride, or in the form of Q-CX3Trihalide of (reaction formula RCO)2H+Q-CX3(o) X + Q-C (o) X + HX), wherein Q is C1-C16An alkyl or aryl group; the oxidant is chlorine, thionyl chloride, sulphuryl chloride, metal halide salt.
The second process for the preparation of the compounds of formula (I) is disclosed below, which involves acyl halogenation (from F to G), Friedel-crafts acylation (G and C react to form E), oxidation (from E to H), and cyclization in four steps to produce the target product (I). During the process, the acylation of the same key intermediate compound E is accurately positioned at R1Para position of the group, the product thus exhibiting a 3-position R1Novel compound structures with precisely substituted groups.
Wherein T is R or C (O) R; acyl halogenation testThe agent being phosphorus trihalide, thionyl chloride, chlorine, or in the form of Q-CX3The trihalide of (a); the oxidant is chlorine, thionyl chloride, sulphuryl chloride, metal halide salt.
A third process for the preparation of compounds of formula (I) is disclosed below, which involves Friedel-crafts acylation (L and M react to form N), oxidation (from N to P), and cyclization in four steps to produce the desired product (I). In the process, because the raw material of the para-position substituted acyl halide L is used in advance, the reaction product naturally presents 3-position R1Novel compound structures with precisely substituted groups.
Wherein R' is as defined for R; y is chlorine;
the oxidant is chlorine, thionyl chloride, sulphuryl chloride, metal halide salt.
The reaction solvent is selected from substituted or unsubstituted aromatic hydrocarbon containing 1-24 carbon atoms, straight-chain or branched-chain aliphatic hydrocarbon, (sulfoxide), amide, ether, ester, ketone, nitrile, carboxylic acid, water, amine, ionic liquid, supercritical carbon dioxide, or a mixed solvent consisting of any two or more of the above solvents; preferred solvents are dimethyl sulfoxide, dimethyl sulfone, benzyl sulfoxide, benzyl sulfone, cyclobutane sulfoxide, sulfolane, trichlorosilane, dichloromethane, dichloroethane, chloroform, carbon tetrachloride, benzene, toluene, xylene, trimethylbenzene, tetramethylbenzene, acetonitrile, ethylbenzene, diethylbenzene, chlorobenzene, dichlorobenzene, anisole, nitrobenzene, heptane, hexane, petroleum ether, dioxane, tetrahydrofuran, methyl tert-butyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, propylene glycol methyl ether acetate, triethylamine, tributylamine, dimethyl isopropylamine, pyridine, N, N-tetramethylethylenediamine, N-alkylmorpholine, N-alkylpyrrole, N, N-dimethylformamide, formylmorpholine, N, N-diethylformamide, N-methylpyrrolidone, or a mixture of any two or more of these solvents. The reaction can also be carried out with little or no conventional "solvent" and with solid phase heating and/or grinding of the starting materials and/or with promotion by ultrasound and/or microwave irradiation.
The reaction temperature involved in the process is selected from-70 ℃ to 200 ℃, preferably from-30 ℃ to 180 ℃, and more preferably from-20 ℃ to 150 ℃. The "pressure" of the reaction involved in the process is selected from between 0.001 and 200 atm, preferably from between 0.1 and 100 atm, more preferably from between 0.1 and 20 atm.
The disclosed 3-substituted thioxanthone compounds of the present invention have been found in practice to be excellent performance photosensitizers and photoinitiators.
We disclose a new material formula system for radiation curing, which is characterized in that:
(3) at least one photoinitiator disclosed by the general formula (I) of the invention or a mixture thereof;
(4) contains at least one ethylenically (C ═ C) unsaturated compound (monomer or resin).
Preferably, the "at least one of the photoinitiators disclosed herein or mixtures thereof" is included in the formulation in an amount of from 0.001 to 50% by mass, more preferably from 0.01 to 20% by mass.
Preferably, the formulation contains other photoinitiator species known from the literature.
The "photoinitiator substances known in the literature" are any one of the following photoinitiator compounds or a compounded mixture of any two or more of the following photoinitiator compounds: included are photoinitiator substances of the hydroxyketone type (Hydroxyketones), aminoketone type (Aminoketones), phosphonyl type (Acylphosphine Oxides), Oxime ester type (Oxime Esters), benzophenone type (Benzophenones), benzoylformate type (phenylglyoyles), thioxanthone type (Thioxanthones), onium salt type cationic photoinitiators (sulfoninums or iodonium or Photo-Acid Generators, so-called PAGs), or dyes as substantive photosensitizers (Dye Sensitizers). Examples of photoinitiators are Darocur 1173, Irgacure 184, API-180 (Shenzhen, Inc. of technical holdstocks, Inc.), API-307 (Shenzhen, Inc. of technical holdstocks, Inc.), API-308 (Shenzhen, Inc. of technical holdstocks, Inc.), API-1206 (Shenzhen, product of technical holdstocks, Inc.), API-1207 (Shenzhen, product of technical holdstocks, Inc., Irgacure 2959, Irgacure MBF, Irgacure 127, Irgacure 651, Esacure KIP-150, Esacure KIP-160, Esacure KIP-1001, Esacure 01, Irgacure 907, Irgacure 500, Irgacure 2200, Irgacure 2022, Irgacure 4500, Irgacure 369, Irgacure 379, Irgacure 819, Irgacure TPO, Irgacure TMP, Irgacure 754, Irgacure Xcure 19, Irgacure Xcure 19, Irgacure 19, Irgacure IRgacure, Irgacure 19, Irgacure or Irgacure 19, irgacure OXE-03, Irgacure OXE-03, Tronly 304 (Changzhou powerful new electronic materials Co., Ltd.), Tronly 305 (Changzhou powerful new electronic materials Co., Ltd.), Irgacure 250, ADEKA NCI-831 (Idiaceae, Japan), ADEKA N-1414 (Idiaceae, Japan), Irgacure 290, Irgacure 270, and coumarin-type dye photosensitizers, etc., which may also be compounded with a corresponding Co-initiator (Co-initiator), such as an active amine, and/or a hydrosilane-based active hydrogen donor-type Co-initiator.
The ethylenically (C ═ C) unsaturated compound (monomer) is any ethylenically polymerizable monomer, including but not limited to (meth) acrylates, acrolein, olefins, conjugated dienes, styrene, maleic anhydride, fumaric anhydride, vinyl acetate, vinyl pyrrolidone, vinyl imidazole, (meth) acrylic acid derivatives such as (meth) acrylamide, vinyl halides, vinylidene halides, and the like. The ethylenically (C ═ C) unsaturated compound (resin) is any ethylenically-containing prepolymer and oligomer, including but not limited to (meth) acryl-functional (meth) acrylic copolymers, urethane (meth) acrylates, polyester (meth) acrylates, unsaturated polyesters, polyether (meth) acrylates, silicone (meth) acrylates, epoxy (meth) acrylates, and the like, as well as water-soluble or water-dispersible analogs of the foregoing.
The functional additives are suitable various types of additives, and known to those skilled in the art are various types of additives including, but not limited to, polymerization inhibitors, active amine co-initiators, leveling agents, antifoaming agents, anti-sagging agents, thickeners, tackifiers, dispersants, antistatic agents, solubilizers, diluents, water or organic solvents, antibacterial agents, flame retardants, inorganic or organic fillers (e.g., nano alumina, silica, calcium carbonate, barium sulfate, etc.) and/or colorants (e.g., pigments or dyes, etc.), ultraviolet absorbers or/and light stabilizers to enhance weatherability of coating inks, and suitable aqueous dispersions or water-soluble products of the above components.
The novel radiation curing material formula system disclosed by the invention comprises a photo-curing coating or ink material, and has very wide application value in downstream markets such as spraying, rolling, curtain coating, wiping, dip-coating and the like and/or construction processes (such as putty, base coating, coloring, middle coating, top coating and the like) in cooperation with various construction modes, PCB (printed circuit board) ink, Laser Direct Imaging (LDI) ink, printing and packaging ink, wood furniture, plastic products, printing and packaging, ink-jet printing, electronic consumer goods, interior and exterior decorations of motor vehicles, pipeline profiles, industrial terraces, building curtain walls, 3D (three-dimensional) printing additive manufacturing, ships or container bodies and the like.
Exemplary, but non-limiting, applications of particular value are, for example, the use of such coatings or inks for the preparation of pigmented and unpigmented paints and varnishes, powder coatings, PCB inks, LDI inks, printing plates, adhesives, pressure-sensitive adhesives, dental compositions, gel coats, photoresists for electronics, electrographic resists, etch resists, both liquid and dry films, solder resists, resists for the manufacture of color filters for various display applications, resists for the manufacture of structures in the manufacturing process of plasma display panels, electroluminescent displays and LCDs, for LCDs, holographic data storage, compositions for encapsulating electronic components, for the manufacture of magnetic recording materials, micromechanical parts, waveguides, optical switches, forge masks, etch masks, color proofing systems, glass fiber cable coatings, screen printing stencils, for the production of three-dimensional objects by means of stereolithography, as image recording materials for holographic recording, microelectronic circuits, decolorizing materials for image recording materials, for image recording materials using microcapsules, as photoresist materials for UV and visible laser direct imaging systems, as photoresist materials for forming dielectric layers in sequentially built layers of printed circuit boards; in particular, the photopolymerizable compositions described above are used for the preparation of pigmented and unpigmented paints and varnishes, powder coatings, printing inks (e.g. screen printing inks, inks for offset, flexo or inkjet printing), printing plates, adhesives, sealings, potting components, dental compositions, foams, moulding compounds, composite material compositions, glass fibre cable coatings, screen printing stencils for the production of three-dimensional objects by means of stereolithography, and as image recording materials, photoresist compositions, decolorizing materials for image recording materials, image recording materials using microcapsules.
In the examples we will further illustrate.
[ detailed description ] embodiments
Example (b): 3-isopropyl-7-methyl-thioxanthone
5 g of 4-methylthiophenol was weighed into a 100 ml single-neck flask, and after 20 ml of ethanol was added to dissolve it, 0.23 g of NaOH and 3.4 ml of methyl iodide were added. After stirring at room temperature for 3 hours TLC monitored the end of the consumption of starting material. After the solvent was spin-dried, 100 ml of 1M NaOH solution and 100 ml of ethyl acetate were added, shaken, and the organic phase was spin-dried by liquid separation to obtain a pale yellow solid with a yield of 95%.1H NMR(400MHz,CDCl3):δ=7.25(d,J=7.9Hz,2H),7.16(d,J=7.9,2H),2.51(s,3H),2.38(s,3H)。
5 g of 4-isopropylbenzoic acid was weighed into a 100 ml flask, 20 ml of dichloroethane was added and dissolved, 4.3 ml of thionyl chloride was added and stirred at room temperature for 6 hours, and then the end of the consumption of the raw material was monitored by TLC. The solvent was evaporated under reduced pressure to give a colorless oily liquid with a yield of 98%.
Under the protection of nitrogen, 8 g of 4-isopropylbenzoyl chloride is added into a 100 ml flask, 20 ml of dichloroethane is added and stirred to be dissolved, and 0.64 g of anhydrous AlCl is added at 0 DEG C3After 30 minutes of reaction, 4-methyl-thioanisole is added to react for 6 hours at room temperature, the reaction is quenched by 5% hydrochloric acid and then extracted by dichloroethane for three times, organic phases are combined, and yellow oily liquid is obtained by column chromatography with the yield of 75%.1H NMR(400MHz,CDCl3):δ=7.73(d,J=4.0Hz,2H),7.34-7.24(m,4H),7.16(br s,1H),3.01-2.93(m,1H),2.38(s,3H),2.34(s,3H),1.28(d,J=3.2Hz,6H)。
6 g of the acylated product was added to a 100 ml three-neck flask, 30 ml of dichloroethane was added to dissolve the product, and then sulfonyl chloride was slowly added dropwise thereto, followed by stirring at room temperature for 3 hours, followed by TLC to monitor disappearance of the starting material, and the solvent was then dried by purging with nitrogen gas, resulting in a yield of 95%.
The intermediate was dissolved in 30 ml of dichloromethane with stirring, and 3.5 g of anhydrous ZnCl2 powder was added under ice-bath to react for 4 hours with stirring. After the solvent was spin dried, 100 ml of 15% HCl and 100 ml of dichloromethane were added, the organic phase was spin dried by liquid separation and column chromatography was performed to obtain a white solid with a yield of 74%.1H NMR(400MHz,CDCl3):δ=8.46(d,J=20Hz,2H),7.53-7.41(m,4H),3.10-3.02(m,1H),2.49(s,3H),1.33(d,J=3.8Hz,6H)。
Example (b): 3-isopropyl-thioxanthones
Weighing 20 g of 2, 2-dithiosalicylic acid, adding into a 250 ml single-neck flask, adding 150 ml of glacial acetic acid for dissolution, adding 13.5 g of zinc powder, refluxing and stirring at 120 ℃ overnight, adding 100 ml of 1M HCl solution into the reaction solution after TLC detection of raw material consumption, adding 100 ml of ethyl acetate, stirring for 2 hours, separating, and spin-drying the organic phase to obtain a light yellow solid, wherein the yield is quantitative.
20 g of thiosalicylic acid is added into a 250 ml single-neck flask, 100 ml of methanol is added to dissolve the thiosalicylic acid, 12.5 g of NaOH is added to the mixture, the mixture is stirred for 30 minutes, and 8.5 ml of methyl iodide is added dropwise. Stirring at room temperature for 6 hours, and detecting the completion of the raw material reaction by TLC. After the solvent was spin-dried, 100 ml of 1M HCl solution was added, 100 ml of ethyl acetate was added, the reaction was stirred for 2h, and the organic phase was spin-dried by liquid separation to obtain a white solid with a yield of 87%.1H NMR(400MHz,CDCl3):δ=8.15(dd,J=7.9,1.2Hz,1H),7.55-7.51(m,1H),7.30(d,J=7.9Hz,1H),7.20(t,J=3.8Hz,1H),2.48(s,3H)。
Under the protection of nitrogen, 10 g of the compound and 100 ml of dichloromethane are sequentially added into a 250 ml flask, stirred and dissolved, 40 ml of oxalyl chloride is added at normal temperature, stirred and reacted for 6 hours, and the reaction is completed, and the solvent is dried by spinning to obtain a light yellow solid product.
2 g of o-methylmercaptosalicyl chloride freshly prepared by the action of thionyl chloride as described above were added to a 100 ml one-neck flask, dissolved by adding 10 ml of dichloromethane, and then 1.9 g of anhydrous A1C1 were added3After stirring for 30 minutes, 1.24 ml of cumene was added dropwise. After stirring in ice bath for 6 hours, TLC detection shows that the material is completely consumed. After the solvent was spin dried, 100 ml of 1M HCl (1mol/L) solution was added, 100 ml of ethyl acetate was added and stirred for 2 hours, and the organic phase was spin dried by liquid separation to obtain a white solid with a yield of 92%.1H NMR(400MHz,CDCl3):δ=7.73(d,J=3.9,2H),7.47-7.28(m,5H),7.23-7.19(m,1H),3.00-2.94(m,1H),2.42(s,3H),1.27(d,J=3.4,6H)。
Placing 2 g of the compound in a 100 ml flask, adding 30 ml of dichloromethane to dissolve the compound, then dropwise adding 2 equivalents of sulfonyl chloride, stirring at room temperature for 6 hours, monitoring the reaction by TLC, and performing spin-drying on the solvent to obtain a crude product with the yield of 95%.
Into a 100 ml single-neck flask N2Adding 2 g of the raw materials under protection, adding 30 ml of dichloromethane, stirring and dissolving, and adding 3.5 g of anhydrous ZnCl under ice bath2Stirring the mixtureThe reaction was allowed to proceed for 6 hours and TLC monitored for complete consumption of starting material. After the solvent is dried by spinning, 100 ml of 5% HCl solution is added, 100 ml of dichloromethane is added for stirring for 30 minutes, the organic phase is dried by spinning through liquid separation to obtain a light yellow solid, and a white solid product is obtained through column chromatography, wherein the yield is 68%.1H NMR(400MHz,CDCl3):δ=8.63(d,J=7.8,1H),8.50(s,1H),7.63-7.45(m,5H),3.11-3.02(m,1H),1.33(d,J=7.2,6H)。
Example (b): 1, 3-diethyl-thioxanthones
Weighing 12.6 g of 2, 2-dithio salicylic acid and 30 ml of thionyl chloride, mixing, refluxing and reacting for 3 hours, directly diluting the concentrated acyl chloride crude product with 120 ml of dichloroethane, and sequentially adding 9 g of m-diethylbenzene and 8.5 g of anhydrous AlCl3After stirring the reaction mixture for 6 hours, the mixture was decomposed with 150 ml of 1M HCl solution, the organic phase was filtered and concentrated, and then recrystallized from ethanol to give 7.4 g of diacylated product.
5.5 g of the diacylated product was placed in a 100 ml three-neck flask, 30 ml of dichloroethane was added to dissolve the diacylated product, and then chlorine gas was slowly introduced thereto, and the mixture was stirred at room temperature for 3 hours, and then the solvent was spin-dried by purging with nitrogen gas.
The intermediate was dissolved in 50 ml dichloromethane with stirring again and 2.7 g anhydrous AlCl was added under ice-bath3The powder was stirred for 4 hours. After the solvent was spin-dried, 120 ml of 5% HCl and 100 ml of dichloromethane were added, the organic phase was spin-dried by liquid separation and then subjected to column chromatography to obtain 2.8 g of a pale yellow solid product.
Example (b): photopolymerization initiation Activity Properties
Samples of the ethylenically (acrylate) containing UV radiation curable material formulation system were prepared according to the following formulation (in weight percent): bisphenol a epoxy acrylate (Ebecryl 605): 20 percent; amine-modified acrylate: 12% (reactive amine resin); aminoacrylate (Ebecryl 7100): 10 percent; acryloyl morpholine: 55 percent; photoinitiator (2): 3 percent.
Evaluation of photocuring performance: the above samples were applied to cardboard to form a coating of about 20-25 microns using a UV high pressure mercury lamp (about 20 cm from the substrate) as the source of radiation and a variable speed conveyor test. The criterion for completing photopolymerization curing is that repeated nail scratching and scratching can not generate marks.
The results are as follows: when the photoinitiator is 3 percent of 3-isopropyl-7-methyl-thioxanthone, the maximum linear speed of complete photocuring is 48 m/min; when the photoinitiator is 3 percent of 3-isopropyl-thioxanthone, the maximum linear speed of complete photocuring is 45 m/min; when the photoinitiator was 3% 1, 3-diethyl-thioxanthone, the photocuring completion maximum line speed was 50 m/min. The above tests demonstrate the excellent photopolymerization initiation activity of the disclosed compounds.
Samples of the ethylenic radiation curable PCB ink material system were prepared according to the following formulation (in weight percent): in the component A, o-cresol formaldehyde epoxy acrylate oligomer: 55 percent; DBE solvent: 20 percent; photoinitiator (2): 4 percent; silicon dioxide: 1.5 percent; barium sulfate: 11.5 percent; titanium dioxide: 8 percent; in the component B, DPHA acrylate monomer: 35 percent; epoxy resin: 35 percent; DBE solvent: 20 percent; barium sulfate: 10 percent. Mixing the above materials, adding into a dispersing barrel, dispersing with a high-speed disperser, grinding with a hydraulic three-roller machine for 5 times, filtering with a filter element filter, and spray-printing the obtained ink on PCB board at 80m/min with an ink-jet printer with XAAR nozzle, wherein the linear power of the curing light source is about 200W/cm. Photoinduced activity was quantified using a Stouffer-type exposure standard 21-step gray scale.
Evaluation of photocuring performance: when the photoinitiator is Irgacure 907 of 3.5 percent and 2-ITX of 0.5 percent, the exposure gray scale is 9 grades; when the photoinitiator was Irgacure 907 at 3.5% and 3-ITX at 0.5%, the exposure gray scale was of order 10. The above tests demonstrate the higher photosensitivity performance of the disclosed compounds.
It should be emphasized that the above-described embodiments are merely illustrative and not restrictive, and that any adjustments or variations, such as reaction conditions or parameters, which may be commonly employed by a person skilled in the art based on the disclosure of this application do not depart from the gist of the present invention, and the scope of protection of this patent shall be governed by the terms of the relevant claims.
Claims (7)
1. Novel thioxanthone compounds having 3-position substitution characteristics represented by general formula (I). Definition of R0Is a compound having 1 to 24 carbon atoms (denoted as C)1-C24) Branched or straight chain or cyclic alkane or substituted or unsubstituted (hetero) arene group, R in the 3-position of the thioxanthone ring system1The radicals being OH, SH, halogen atoms, R0,OR0,SR0,NHR0Or N (R)0)2;R2-R8The radical values being, independently of one another, R1Or hydrogen;
2. a process for the preparation of compounds of formula (I) involving four steps of acyl halogenation (from A to B), Friedel-crafts acylation (B and C react to form D), oxidation (from D to E), and cyclization to produce the desired product. Wherein R is hydrogen, C1-C24A linear or branched or cyclic alkyl group, or a substituted or unsubstituted aryl group; x and Y are independently of each other C1 or Br; the acid halogenating agent is PX3,SOCl2,C12Or of the form Q-CX3Of a trihalide of (A), Q is C1-C16An alkyl or aryl group; the oxidant is chlorine, thionyl chloride, sulfuryl chloride, metal halide salt;
3. a process for the preparation of compounds of formula (I) involving four steps of acyl halogenation (from F to G), Friedel-crafts acylation (G and C react to form E), oxidation (from E to H), and cyclization to produce the desired product. Wherein T is R or C (O) R; y is chlorine; the acid halogenating agent is PX3,SOCl2,Cl2Or of the form Q-CX3III of (2)A halide; the oxidizing agent is chlorine, thionyl chloride, sulfuryl chloride, metal halide salt:
4. a process for the preparation of a compound of formula (I) which involves four steps of Friedel-crafts acylation (L and M react to form N), oxidation (from N to P), and cyclization to produce the desired product. Wherein R' is as defined for R; y is chlorine; the oxidant is chlorine, thionyl chloride, sulfuryl chloride, metal halide salt;
6. a novel radiation curing new material formula system is characterized in that:
(1) at least one photoinitiator disclosed by the general formula (I) of the invention or a mixture thereof;
(2) contains at least one ethylenically (C ═ C) unsaturated compound (monomer or resin).
Preferably, the "at least one of the photoinitiators disclosed herein or mixtures thereof" is included in the formulation in an amount of from 0.001 to 50% by mass, more preferably from 0.01 to 20% by mass.
7. According to the claims (1) and (6), the photoinitiator and radiation curing formulation system, i.e. the photocurable coating or ink material, is used in combination with various construction methods (spraying, rolling, curtain coating, wiping, dip coating, etc.) and/or construction procedures (putty, base coating, coloring, middle coating, top coating, etc.), in PCB ink, Laser Direct Imaging (LDI) ink, printing and packaging ink, wood furniture, plastic products, printing and packaging, ink-jet printing, electronic consumer goods, interior and exterior trim of motor vehicles, pipeline profiles, industrial terraces, building curtain walls, 3D printing additive manufacturing, and applications in downstream markets such as ships or container bodies.
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